Heat dissipation device, charging pile and liquid cooling equipment

Abstract

The embodiment of the application provides a heat dissipation device, a charging pile and a liquid cooling equipment, and relates to the technical field of liquid cooling heat dissipation. The heat dissipation device comprises a heat exchanger, a buffer tank and a controller. The heat exchanger is used for containing cooling liquid, the cooling liquid is insulating cooling liquid, the buffer tank is communicated with the heat exchanger, and the buffer tank is used for containing the cooling liquid and gas. The controller is used for controlling the cooling capacity provided by the heat dissipation device, the controller is arranged in the buffer tank, and the controller is used for being immersed in the cooling liquid. In this way, the size of the heat dissipation device can be reduced.

Description

Technical Field

[0001] This application relates to the field of liquid cooling technology, and more particularly to a heat dissipation device, a charging pile, and a liquid cooling equipment. Background Technology

[0002] Liquid cooling, as a highly efficient heat dissipation method, is widely used in charging, data centers, and other scenarios. A liquid cooling device is any device capable of liquid cooling. It includes a heat-generating component and a liquid-cooled heat exchanger for dissipating heat from the heat-generating component. The liquid-cooled heat exchanger and the heat dissipation device form a coolant circulation loop. The heat generated by the heat-generating component is absorbed by the coolant within the liquid-cooled heat exchanger and then carried by the coolant to the heat dissipation device for further cooling.

[0003] In related technologies, heat dissipation devices used for liquid cooling are often quite large. Therefore, how to reduce the size of heat dissipation devices has become an urgent problem to be solved in the field of liquid cooling technology. Summary of the Invention

[0004] This application provides a heat dissipation device, a charging pile, and a liquid cooling device, which can make the heat dissipation device smaller in size.

[0005] A first aspect of this application provides a heat dissipation device, which includes a heat exchanger, a buffer tank, and a controller. The heat exchanger contains coolant, and the buffer tank is connected to the heat exchanger and contains both coolant and gas. The controller controls the cooling capacity provided by the heat dissipation device; the controller is located within the buffer tank and is immersed in the coolant. The coolant is an insulating coolant. This design prevents the controller from easily short-circuiting due to contact with the coolant.

[0006] The heat exchanger is used to form a coolant circulation loop with the liquid cooling heat exchange components of the liquid cooling equipment, allowing the coolant to circulate.

[0007] The heat dissipation device provided in this application embodiment integrates the controller within a buffer tank, allowing the buffer tank to both house and protect the controller. This eliminates the need for an external electrical control box for controller housing and protection, resulting in a high degree of integration. This allows for a reduction in the overall size of the heat dissipation device while maintaining the same buffer tank size, and conversely, allows for a larger buffer tank while maintaining the same overall size, thus improving the buffering and replenishment efficiency. Furthermore, the elimination of the need for an external electrical control box reduces the number of structural components in the heat dissipation device, thereby lowering its cost.

[0008] By immersing the controller in the coolant, that is, by submerging the controller, the size of the buffer tank can be reduced. Furthermore, because the controller is submerged, dust accumulation on its surface is less likely, improving its reliability. Additionally, the reduced dust accumulation eliminates the need for a protective layer on the controller's surface, thus reducing costs. Moreover, immersion in the coolant allows for more efficient heat transfer, from the controller's generated heat to the coolant itself, and then to the buffer tank walls for further dissipation, resulting in better heat dissipation performance.

[0009] For example, the heat dissipation device further includes a return liquid connector and a supply liquid connector, with the heat exchanger connected in series between the return liquid connector and the supply liquid connector. The inlet of the heat exchanger is connected to the return liquid connector, which is used to connect to the outlet of the liquid-cooled heat exchange component, so that the inlet of the heat exchanger is connected to the outlet of the liquid-cooled heat exchange component through the return liquid connector. The outlet of the heat exchanger is connected to the supply liquid connector, which is used to connect to the inlet of the liquid-cooled heat exchange component, so that the outlet of the heat exchanger is connected to the inlet of the liquid-cooled heat exchange component through the supply liquid connector. This facilitates the assembly and disassembly of the heat dissipation device and the liquid-cooled heat exchange component.

[0010] In some possible implementations, the controller is fixedly connected to the buffer tank via a connecting component, with the controller and the tank wall spaced apart. This minimizes mutual interference between the controller and components or devices mounted on the buffer tank, allowing for more flexible placement of components or devices on the buffer tank, as well as flexible placement of the controller within the buffer tank. This, in turn, allows for greater flexibility in the shape and dimensions of the buffer tank in all directions. Furthermore, the presence of an assembly gap between the buffer tank and the controller facilitates the easy assembly of the controller into the buffer tank.

[0011] In some possible implementations, the distance between the controller and the bottom wall of the buffer tank is smaller than the distance between the controller and the top wall of the buffer tank. This allows for easier immersion of the controller with less coolant. Furthermore, while the controller is submerged in coolant, a larger space can be left above the buffer tank to accommodate gas, thus enabling the buffer tank to have better cushioning performance.

[0012] In some possible implementations, the buffer tank wall is provided with an electrical connection connector, and the controller is electrically connected to the electrical connection connector. This facilitates the electrical connection between the controller inside the buffer tank and devices outside the buffer tank. Furthermore, by providing an electrical connection connector that passes through the buffer tank wall, the sealing at the connection point between the electrical connection connector and the buffer tank wall is easier and less prone to failure, thus improving the sealing of the buffer tank.

[0013] For example, the electrical connection is located on the top wall of the buffer tank, so that the coolant inside the buffer tank is not easily leaked from the connection between the electrical connection and the tank wall of the buffer tank.

[0014] In some possible implementations, the buffer tank has a communication port on its wall, through which the buffer tank connects to the heat exchanger. A controller is fixedly installed inside the buffer tank, spaced apart from the communication port. This design minimizes the likelihood of the controller interfering with the connection between the buffer tank and the heat exchanger, facilitating the connection between the buffer tank and the heat exchanger with an internal controller.

[0015] In some possible implementations, the buffer tank wall has a filling port. The projection of the controller lies on the projection of the filling port along the extension direction of the centerline of the filling port. This prevents the controller from shifting or malfunctioning due to the impact of the added coolant when coolant is added through the filling port.

[0016] For example, a plug is provided at the injection port, and the plug is detachably connected to the buffer tank to seal the injection port.

[0017] In some possible implementations, the buffer tank includes a shell and a plate. The shell has an opening, the plate is detachably connected to the shell, the plate covers the opening, and the shell and plate enclose an inner cavity of the buffer tank. This facilitates maintenance of devices such as controllers housed within the buffer tank.

[0018] In some possible implementations, the controller is fixedly connected to the board. This allows the controller to be lifted when the board is opened from the opening, facilitating maintenance.

[0019] In some possible implementations, the electrical connection connector of the heat dissipation device is located on the board body. In this way, when the board body is opened from the opening, the electrical connection connector and the controller are less likely to shift, which facilitates a stable connection between the electrical connection connector and the controller.

[0020] In some possible implementations, the controller is fixedly connected to the board via a connecting component, with the controller and the board spaced apart. This makes it less likely for the controller and the components or devices mounted on the board to interfere with each other.

[0021] In some possible implementations, the controller and the housing are spaced apart. This makes it less likely for the controller and components or devices mounted on the housing to interfere with each other. Furthermore, the presence of an assembly gap between the housing and the controller facilitates the assembly of the controller, which is fixedly connected to the board, into the housing.

[0022] A second aspect of this application provides a charging pile, which includes a pile body and a heat dissipation device as described in any of the above embodiments, the heat dissipation device being disposed within the pile body. The heat exchanger of the heat dissipation device contains coolant, the buffer tank of the heat dissipation device contains coolant and gas, and the controller of the heat dissipation device is immersed in the coolant. The cooling medium is an insulating cooling medium.

[0023] A third aspect of this application provides a liquid cooling device, which includes a liquid cooling heat exchange assembly and a heat dissipation device as described in any of the above embodiments. The heat exchanger of the heat dissipation device forms a coolant circulation loop with the liquid cooling heat exchange assembly. The coolant circulation loop contains coolant, the buffer tank of the heat dissipation device contains coolant and gas, and the controller of the heat dissipation device is immersed in the coolant. The coolant is an insulating coolant.

[0024] The liquid cooling equipment also includes a heat-generating component, which is used to dissipate heat from the heat-generating component. For example, the heat-generating component can be in direct contact with the liquid cooling heat exchanger or through a heat-conducting medium, allowing the coolant in the liquid cooling heat exchanger to absorb the heat generated by the heat-generating component. Alternatively, the heat-generating component can be disposed within the liquid cooling heat exchanger, with at least a portion of it immersed in the coolant within the liquid cooling heat exchanger, allowing the coolant in the liquid cooling heat exchanger to absorb the heat generated by the heat-generating component.

[0025] For example, a liquid-cooled heat exchange assembly includes a liquid-cooled heat exchange component, which has a liquid supply channel and a liquid return channel. Coolant is contained within the liquid-cooled heat exchange component, the liquid supply channel, and the liquid return channel. The inlet of the liquid-cooled heat exchange component is connected to the outlet of the liquid supply channel, and the outlet of the liquid-cooled heat exchange component is connected to the inlet of the liquid return channel. The inlet of the heat exchanger is connected to the outlet of the liquid return channel via a liquid return connector, and the outlet of the heat exchanger is connected to the inlet of the liquid supply channel via a liquid supply connector. The liquid-cooled heat exchange component, the liquid return channel, the heat exchanger, and the liquid supply channel form a coolant circulation loop.

[0026] In some examples, the coolant within the liquid-cooled heat exchange component can be used to dissipate heat from at least a portion of the heat-generating component.

[0027] In some examples, the coolant in the supply channel can be used to dissipate heat from parts of the heat-generating components.

[0028] In some examples, the coolant in the return channel can be used to dissipate heat from parts of the heat-generating components.

[0029] In some possible implementations, the liquid cooling device is a server, and the heat-generating components include at least one of a processor and memory. The liquid cooling heat exchange components are used to dissipate heat from at least one of the processor and memory. For example, the processor may be a central processing unit.

[0030] In some examples of servers where liquid cooling equipment is used, the coolant within the liquid cooling heat exchange components can be used to dissipate heat from at least one of the processor and memory.

[0031] In some possible implementations, the liquid cooling device is the charging host, the heat-generating component is the charging module, and the liquid cooling heat exchange component is used to dissipate heat from the charging module.

[0032] In some examples where the liquid-cooled device is the charging host, the coolant within the liquid-cooled heat exchange component can be used to dissipate heat from the charging module.

[0033] In some possible implementations, the liquid cooling device is a charging terminal, the heat-generating component includes at least one of a power terminal and a power line, and the liquid cooling heat exchange component is used to dissipate heat from at least one of the power terminal and the power line.

[0034] In some examples of liquid-cooled devices used as charging terminals, the coolant within the liquid-cooled heat exchange components can be used to dissipate heat from the power terminals, and the coolant in at least one of the supply and return channels can be used to dissipate heat from the power lines. Attached Figure Description

[0035] Figure 1 A schematic diagram of a liquid cooling device provided in an embodiment of this application;

[0036] Figure 2 A schematic diagram of another liquid cooling device provided in an embodiment of this application;

[0037] Figure 3 A schematic diagram of a heat dissipation device provided in an embodiment of this application;

[0038] Figure 4 A schematic diagram from one perspective of another heat dissipation device provided in an embodiment of this application;

[0039] Figure 5 for Figure 4 A schematic diagram of the heat dissipation device provided in the image from another perspective;

[0040] Figure 6 for Figure 5 A cross-sectional view of the AA plane;

[0041] Figure 7 for Figure 4 A schematic diagram of the buffer tank of the heat dissipation device provided in the diagram;

[0042] Figure 8 for Figure 4 A schematic diagram of one side wall of the buffer tank of the heat dissipation device provided in the diagram after it has been removed;

[0043] Figure 9 for Figure 4A top view of the buffer tank of the heat dissipation device provided in the diagram;

[0044] Figure 10 for Figure 9 A cross-sectional view of the BB plane;

[0045] Figure 11 for Figure 4 A schematic diagram of the buffer tank of the heat dissipation device provided in the diagram from another perspective;

[0046] Figure 12 for Figure 11 An explosion diagram.

[0047] Explanation of reference numerals in the attached figures:

[0048] 10. Charging pile; 11. Pile body; 12. Heat dissipation device; 13. Power supply components;

[0049] 20. Heating element; 21. Power terminal; 22. Power wire;

[0050] 30. Liquid-cooled heat exchange assembly; 31. Liquid-cooled heat exchange component; 32. Liquid supply channel; 33. Liquid return channel;

[0051] 100. Heat exchanger; 110. First liquid collection component; 111. First liquid collection chamber; 111a. First sub-chamber; 111b. Second sub-chamber; 112. Baffle plate; 120. Heat dissipation component; 130. Second liquid collection component; 131. Second liquid collection chamber; 140. Drain port;

[0052] 200. Buffer tank; 210. Shell; 211. Connecting port; 212. Injection port; 213. Plug; 214. Safety valve; 215. Level sensor; 216. Level gauge; 217. Opening; 218. Pressure relief port; 220. Plate; 221. Electrical connection connector;

[0053] 300. Controller; 310. Connecting components;

[0054] 400, Framework;

[0055] 500, Fan;

[0056] 600. Drive pump;

[0057] 710. Return connector; 720. Discharge connector; 730. Supply connector; 740. First connecting pipe; 750. Second connecting pipe;

[0058] 810, First temperature sensor; 820, Pressure sensor; 830, Second temperature sensor;

[0059] x, first direction; y, second direction; z, third direction. Detailed Implementation

[0060] The terminology used in the implementation section of this application is only for explaining specific embodiments of this application and is not intended to limit this application. The implementation of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0061] This application provides a liquid cooling device, which may include, but is not limited to, devices that can perform liquid cooling heat dissipation such as charging terminals, charging hosts, and servers. In other words, the liquid cooling device may include, but is not limited to, liquid-cooled charging terminals, liquid-cooled charging hosts, and liquid-cooled servers.

[0062] Figure 1 This is a schematic diagram of a liquid cooling device provided in an embodiment of this application. Figure 1 In the diagram, the solid arrow points in the direction of coolant flow.

[0063] like Figure 1 As shown, the liquid cooling device includes a heating element 20, a liquid cooling heat exchange component 30, and a heat dissipation device 12. The liquid cooling heat exchange component 30 is used to cool the heating element 20. The inlet of the liquid cooling heat exchange component 30 is connected to the outlet of the heat dissipation device 12, and the outlet of the liquid cooling heat exchange component 30 is connected to the inlet of the heat dissipation device 12. The liquid cooling heat exchange component 30 and the heat dissipation device 12 form a coolant circulation loop. The coolant circulation loop contains coolant, which can circulate within the loop. In other words, both the liquid cooling heat exchange component 30 and the heat dissipation device 12 contain coolant, which can circulate between them. The heat generated by the heating element 20 can be absorbed by the coolant in the liquid cooling heat exchange component 30. After absorbing the heat generated by the heating element 20, the coolant in the liquid cooling heat exchange component 30 can flow into the heat dissipation device 12 for heat dissipation.

[0064] In some examples, the liquid-cooled heat exchange component 30 can be in direct contact with the heating component 20, or the liquid-cooled heat exchange component 30 can be in contact with the heating component 20 through a heat-conducting medium. In this case, the heating component 20 can be located outside the liquid-cooled heat exchange component 30.

[0065] In some examples, the heating element 20 may be disposed within the liquid-cooled heat exchange assembly 30, and at least a portion of the heating element 20 may be immersed in the coolant within the liquid-cooled heat exchange assembly 30.

[0066] In the example where the liquid cooling device is a server, the heat-generating component 20 may include at least one of the server's central processing unit (CPU), memory, etc., and the liquid cooling heat exchange component 30 is used to dissipate heat from at least one of the central processing unit, memory, etc.

[0067] In the example where the liquid-cooled device is the charging host, the heat-generating component 20 may include the charging module of the charging host, etc., and the liquid-cooled heat exchange component 30 is used to dissipate heat from the charging module, etc.

[0068] In the example where the liquid cooling device is a charging terminal, the heat-generating component 20 may include at least one of the power terminals, power lines, etc. of the charging terminal, and the liquid cooling heat exchange component 30 is used to dissipate heat from at least one of the power terminals, power lines, etc.

[0069] The following explanation uses a liquid-cooled device as the charging terminal as an example.

[0070] Figure 2 This is a schematic diagram of another liquid cooling device provided in an embodiment of this application.

[0071] like Figure 2 As shown, when the liquid cooling device is a charging terminal, the liquid cooling device may include a charging pile 10. The charging pile 10 includes a pile body 11, a power supply component 13 and a heat dissipation device 12. The power supply component 13 and the heat dissipation device 12 are located inside the pile body 11.

[0072] For example, the heating component 20 includes a power terminal 21 and a power line 22. One end of the power line 22 is electrically connected to the power supply component 13, and the other end of the power line 22 is electrically connected to the power terminal 21. That is, the power supply component 13 is electrically connected to the power terminal 21 through the power line 22. The power supply component 13 can be electrically connected to the mains power supply through a charging host. The charging host can convert the current provided by the mains power supply into the current required for charging and deliver it to the power terminal 21 through the power supply component 13 and the power line 22. The power terminal 21 is used to output electrical energy.

[0073] For example, the liquid-cooled heat exchange assembly 30 may include a liquid-cooled heat exchange component 31. The liquid-cooled heat exchange assembly 30 has a liquid supply channel 32 and a liquid return channel 33. The inlet of the liquid supply channel 32 is connected to the outlet of the heat dissipation device 12, and the outlet of the liquid supply channel 32 is connected to the inlet of the liquid-cooled heat exchange component 31, so that the inlet of the liquid-cooled heat exchange component 31 is connected to the outlet of the heat dissipation device 12 through the liquid supply channel 32. The inlet of the liquid return channel 33 is connected to the outlet of the liquid-cooled heat exchange component 31, and the outlet of the liquid return channel 33 is connected to the inlet of the heat dissipation device 12, so that the outlet of the liquid-cooled heat exchange component 31 is connected to the inlet of the heat dissipation device 12 through the liquid return channel 33. The liquid-cooled heat exchange component 31 and the heat dissipation device 12 are connected through the liquid supply channel 32 and the liquid return channel 33 to form a coolant circulation loop. The liquid-cooled heat exchange component 31, the liquid supply channel 32, and the liquid return channel 33 all contain coolant.

[0074] For example, the liquid-cooled heat exchange component 31 is located at the power terminal 21. The coolant provided by the heat dissipation device 12 flows into the liquid-cooled heat exchange component 31 through the liquid supply channel 32. The coolant flowing into the liquid-cooled heat exchange component 31 is used to absorb the heat generated by the power terminal 21. After absorbing the heat generated by the power terminal 21 in the liquid-cooled heat exchange component 31, the coolant can flow back to the heat dissipation device 12 through the liquid return channel 33 for heat dissipation, thereby realizing liquid cooling heat dissipation of the power terminal 21. At this time, the inlet of the liquid supply channel 32 can be used as the inlet of the liquid-cooled heat exchange component 30, and the outlet of the liquid return channel 33 can be used as the outlet of the liquid-cooled heat exchange component 30.

[0075] For example, the liquid-cooled heat exchange component 31 can be in direct contact with the power terminal 21, or the liquid-cooled heat exchange component 31 can be in contact with the power terminal 21 through a heat-conducting medium, so that the heat generated by the power terminal 21 can be transferred to the coolant in the liquid-cooled heat exchange component 31 more efficiently.

[0076] For example, the liquid-cooled heat exchange component 31 may include one or more of the following: liquid cooling plate, liquid cooling pipe, etc.

[0077] For example, the coolant flowing in the supply channel 32 and the return channel 33 can absorb the heat of the power line 22 for heat dissipation of the power line 22.

[0078] When the liquid-cooled device is used as a charging terminal, it includes a charging gun. The charging gun comprises a heating element 20 and a liquid-cooled heat exchange component 30. In other words, the heating element 20 and the liquid-cooled heat exchange component 30 are components used to form the charging gun, which is a liquid-cooled charging gun. The charging gun can be plugged into a vehicle, and after plugging it in, the charging pile 10 can charge the vehicle through the charging gun. In some examples, the liquid-cooled device can be a supercharging device, with a single charging gun having a charging power greater than or equal to 480 kW.

[0079] For example, the charging gun includes a charging head and a cable. A power terminal 21 and a liquid-cooled heat exchange component 31 are disposed on the charging head. The cable includes a power line 22 and has a liquid supply channel 32 and a liquid return channel 33.

[0080] In some examples, the cable includes a supply tube and a return tube, the inner cavity of the supply tube forming a supply channel 32 and the inner cavity of the return tube forming a return channel 33.

[0081] For example, the supply pipe and the return pipe can be in direct contact with the power line 22 or in contact through a heat-conducting medium.

[0082] In other examples, the cable may have a partition 112, which can be used to separate the liquid supply channel 32 and the liquid return channel 33 within the cable.

[0083] In the example where the liquid cooling device is a server, the coolant in the liquid cooling heat exchange component 31 can be used to dissipate heat from at least one of the central processing unit, memory, etc., and the coolant in the liquid cooling heat exchange component 31 can absorb the heat generated by at least one of the central processing unit, memory, etc.

[0084] In the example where the liquid-cooled device is the charging host, the coolant in the liquid-cooled heat exchange component 31 can be used to dissipate heat from the charging module, etc. In other words, the coolant in the liquid-cooled heat exchange component 31 can absorb the heat generated by the charging module, etc.

[0085] Figure 3 This is a schematic diagram of a heat dissipation device provided in an embodiment of this application. Figure 3 In the diagram, solid arrows point in the direction of coolant flow, dashed arrows point in the direction of airflow, and dotted lines connect two components to indicate electrical connection. Figure 3 The diagram only shows the location of each component to illustrate the working principle of the heat dissipation device. Figure 3 The positions of the various components are not limited.

[0086] like Figure 3 As shown, the heat dissipation device 12 includes a heat exchanger 100, which contains coolant. The inlet of the heat exchanger 100 is connected to the outlet of the liquid-cooled heat exchange component 30, and the outlet of the heat exchanger 100 is connected to the inlet of the liquid-cooled heat exchange component 30. The heat exchanger 100 is used to form a coolant circulation loop with the liquid-cooled heat exchange component 30. The coolant can circulate between the heat exchanger 100 and the liquid-cooled heat exchange component 30. The coolant that has absorbed the heat generated by the heat-generating component 20 can flow into the heat exchanger 100 for heat dissipation.

[0087] For example, the inlet of heat exchanger 100 can be connected to the outlet of return channel 33, and the outlet of heat exchanger 100 can be connected to the inlet of supply channel 32. Heat exchanger 100, supply channel 32, liquid-cooled heat exchange component 31, and return channel 33 are used to form a coolant circulation loop.

[0088] For example, the heat dissipation device 12 further includes a return liquid connector 710 and a supply liquid connector 730, with the heat exchanger 100 connected in series between the return liquid connector 710 and the supply liquid connector 730. The inlet of the heat exchanger 100 is connected to the return liquid connector 710, which is used to connect to the outlet of the liquid-cooled heat exchange assembly 30, so that the inlet of the heat exchanger 100 can be connected to the outlet of the liquid-cooled heat exchange assembly 30 through the return liquid connector 710. For example, the inlet of the heat exchanger 100 can be connected to the outlet of the return liquid channel 33 through the return liquid connector 710. The outlet of the heat exchanger 100 is connected to the supply liquid connector 730, which is used to connect to the inlet of the liquid-cooled heat exchange assembly 30, so that the outlet of the heat exchanger 100 can be connected to the inlet of the liquid-cooled heat exchange assembly 30 through the supply liquid connector 730. For example, the outlet of the heat exchanger 100 can be connected to the inlet of the supply liquid channel 32 through the supply liquid connector 730. The return connector 710 can be used as the inlet of the heat dissipation device 12, and the supply connector 730 can be used as the outlet of the heat dissipation device 12, making it easier to assemble and disassemble the heat dissipation device 12 and the liquid cooling heat exchange component 30.

[0089] In some examples, the return connector 710 may be located at the inlet of the heat exchanger 100, that is, the return connector 710 may be located on the heat exchanger 100.

[0090] For example, the heat dissipation device 12 also includes a drive pump 600, which is connected in series with the heat exchanger 100 between the return connector 710 and the supply connector 730. The drive pump 600 is used to drive the coolant to circulate in the coolant circulation loop.

[0091] In some examples, the drive pump 600 can be located between the outlet of the heat exchanger 100 and the liquid supply connector 730. The heat exchanger 100 has an outlet connector 720 at its outlet, which connects to the inlet of the drive pump 600. The outlet of the drive pump 600 is connected to the liquid supply connector 730, and the outlet of the heat exchanger 100 is connected to the liquid supply connector 730 via the outlet connector 720 and the drive pump 600. In this way, the coolant dissipates heat within the heat exchanger 100 before flowing to the drive pump 600. The coolant temperature at the drive pump 600 is lower, reducing the likelihood of leakage at the drive pump 600, outlet connector 720, and supply connector 730, thus ensuring higher reliability of the coolant circulation loop. Furthermore, the lower coolant temperature also allows for higher driving efficiency of the drive pump 600.

[0092] For example, the inlet of the drive pump 600 can be connected to the outlet connector 720 via the first connecting pipe 740, and the outlet of the drive pump 600 can be connected to the supply connector 730 via the second connecting pipe 750. In this case, the outlet of the heat exchanger 100 can be connected to the supply connector 730 via the outlet connector 720, the first connecting pipe 740, the drive pump 600, and the second connecting pipe 750. This makes it convenient to connect the drive pump 600, the heat exchanger 100, and the supply connector 730, facilitating their connection. Furthermore, the relative positions of the drive pump 600, the heat exchanger 100, and the supply connector 730 are less critical, allowing for more flexible arrangement of the drive pump 600 and the supply connector 730.

[0093] For example, both the first connecting pipe 740 and the second connecting pipe 750 can be flexible hoses, making it easier to connect the first connecting pipe 740 and the second connecting pipe 750.

[0094] In other examples, the drive pump 600 may also be located between the inlet of the heat exchanger 100 and the return connector 710. In this case, the return connector 710 is not located at the inlet of the heat exchanger 100, but an inlet connector may be provided at the inlet of the heat exchanger 100. The inlet of the heat exchanger 100 is connected to the inlet connector, and the inlet connector is connected to the outlet of the drive pump 600. The inlet of the drive pump 600 is connected to the return connector 710, so that the inlet of the heat exchanger 100 is connected to the return connector 710 through the inlet connector and the drive pump 600.

[0095] For example, the outlet of the drive pump 600 can be connected to the return connector 710 via a third connecting pipe, and the inlet of the drive pump 600 can be connected to the inlet connector via a fourth connecting pipe.

[0096] The following explanation uses the example of a drive pump 600 located between the outlet of heat exchanger 100 and the liquid supply connector 730.

[0097] like Figure 3 As illustrated, the heat dissipation device 12 also includes a fan 500, which drives airflow at the heat exchanger 100 to improve the heat dissipation efficiency of the heat exchanger 100. In some examples, the fan 500 may blow air toward the heat exchanger 100. In other examples, the fan 500 may draw air away from the heat exchanger 100.

[0098] like Figure 3 As shown, in some examples, the heat dissipation device 12 may also include a controller 300, which can be used to control the cooling capacity provided by the heat dissipation device 12, so that the heat dissipation device 12 can provide the required cooling capacity to the liquid-cooled heat exchange assembly 30.

[0099] For example, the controller 300 is electrically connected to the drive pump 600. The controller 300 can be used to control the drive pump 600 so as to control the flow rate of the coolant flowing through the heat exchanger 100, thereby controlling the cooling capacity provided by the heat dissipation device 12. In other words, the controller 300 can control the cooling capacity provided by the heat dissipation device 12 through the drive pump 600.

[0100] For example, the controller 300 is electrically connected to the fan 500. The controller 300 can be used to control the fan 500 so as to adjust the airflow speed at the heat exchanger 100 by adjusting the speed of the fan 500, thereby controlling the cooling capacity provided by the heat dissipation device 12. In other words, the controller 300 can control the cooling capacity provided by the heat dissipation device 12 through the fan 500.

[0101] For example, the controller 300 can be electrically connected to both the drive pump 600 and the fan 500. The controller 300 can be used to control the drive pump 600 and the fan 500 to control the cooling capacity provided by the heat dissipation device 12 by controlling the speed of the fan 500 and the flow rate of the coolant flowing through the heat exchanger 100. In other words, the controller 300 can control the cooling capacity provided by the heat dissipation device 12 through the fan 500 and the drive pump 600.

[0102] For example, controller 300 can be used to obtain the speed of fan 500 and the speed of drive pump 600.

[0103] To achieve automatic control of the fan 500 and the drive pump 600, the heat dissipation device 12 may further include a first temperature sensor 810 and a second temperature sensor 830. The first temperature sensor 810 is used to collect the temperature of the coolant flowing into the inlet of the heat exchanger 100, and the second temperature sensor 830 is used to collect the temperature of the coolant flowing out of the outlet of the heat exchanger 100. Both the first temperature sensor 810 and the second temperature sensor 830 are electrically connected to the controller 300, which is used to acquire the temperatures collected by the first temperature sensor 810 and the second temperature sensor 830. The controller 300 is also used to control at least one of the fan 500 and the drive pump 600 based on the temperature collected by at least one of the first temperature sensor 810 and the second temperature sensor 830.

[0104] For example, the first temperature sensor 810 can be located at the return connector 710, which is situated at the inlet of the heat exchanger 100. The temperature of the coolant at the return connector 710 is similar to the temperature of the coolant flowing into the inlet of the heat exchanger 100, facilitating a more accurate determination of the cooling demand of the liquid-cooled heat exchange assembly 30. Thus, the fan 500 and the drive pump 600 can be controlled based on the collected coolant temperature at the return connector 710, enabling more precise supply of the required cooling capacity to the liquid-cooled heat exchange assembly 30. Furthermore, the return connector 710 can also house the first temperature sensor 810, making its placement relatively convenient.

[0105] For example, the second temperature sensor 830 can be located at the liquid supply connector 730, which is close to the inlet of the liquid-cooled heat exchange component 30. The temperature of the coolant at the liquid supply connector 730 is similar to the temperature of the coolant flowing into the inlet of the liquid-cooled heat exchange component 30, which facilitates a more accurate determination of the cooling demand of the liquid-cooled heat exchange component 30. Thus, the fan 500 and the drive pump 600 can be controlled based on the collected coolant temperature at the liquid supply connector 730, enabling more precise supply of the required cooling capacity to the liquid-cooled heat exchange component 30. Furthermore, the liquid supply connector 730 can also house the second temperature sensor 830, making its installation relatively convenient.

[0106] For example, the controller 300 can be used to control the fan 500 and drive the pump 600 based on the temperature collected by the first temperature sensor 810 and the temperature collected by the second temperature sensor 830, so as to adjust the speed of the fan 500 and the flow rate of the coolant flowing into the liquid cooling heat exchange component 30, thereby adapting to different operating conditions of the liquid cooling equipment.

[0107] The heat dissipation device 12 also includes a pressure sensor 820, which is used to collect the pressure in the coolant circulation loop. The pressure sensor 820 is electrically connected to the controller 300. The controller 300 is used to acquire the pressure collected by the pressure sensor 820 so as to monitor the pressure in the coolant circulation loop and generate corresponding instructions based on the pressure in the coolant circulation loop.

[0108] For example, the pressure sensor 820 can be located at the liquid supply connector 730, which can support the pressure sensor 820, making the installation of the pressure sensor 820 more convenient.

[0109] For example, the controller 300 can be used to form a status command for indicating the working status of the coolant circulation loop based on at least one of the following parameters: the temperature collected by the first temperature sensor 810, the temperature collected by the second temperature sensor 830, the pressure collected by the pressure sensor 820, the speed of the fan 500, and the speed of the drive pump 600. The working status of the coolant circulation loop may include a normal status and a fault status.

[0110] The liquid cooling device also includes a device controller (not shown). For example, the charging pile 10 may include a device controller, which is a device independent of the heat dissipation device 12. The controller 300 of the heat dissipation device 12 is electrically connected to the device controller. The controller 300 of the heat dissipation device 12 is also used to send a status command that indicates the working state of the coolant circulation loop to the device controller. The device controller can generate corresponding control commands based on the acquired status command.

[0111] like Figure 3 As shown, the heat dissipation device 12 also includes a buffer tank 200, which is connected to the heat exchanger 100. The buffer tank 200 contains both coolant and gas; that is, a portion of the inner cavity of the buffer tank 200 contains coolant, and a portion contains gas, with the coolant not completely filling the inner cavity. The gas contained in the buffer tank 200 serves a buffering function, allowing the buffer tank 200 to buffer pressure changes in the coolant circulation loop. The coolant contained in the buffer tank 200 can be used to replenish the coolant in the circulation loop when the coolant level decreases.

[0112] For example, the gas contained in the buffer tank 200 can be air.

[0113] In some examples, the connection point between the heat exchanger 100 and the buffer tank 200 is located between the inlet and outlet of the heat exchanger 100. For example, the heat exchanger 100 is provided with a bypass interface located between the inlet and outlet of the heat exchanger 100, and the buffer tank 200 is connected to the heat exchanger 100 through the bypass interface. In this way, the buffer tank 200, connected to the heat exchanger 100 through the bypass interface, is connected to the coolant circulation loop as a branch. The coolant circulating in the coolant circulation loop is less likely to cause erosion of the buffer tank 200, making the buffer tank 200 less susceptible to corrosion due to erosion by the coolant circulating in the coolant circulation loop, thus extending the service life of the buffer tank 200. Furthermore, since the buffer tank 200 is not prone to corrosion, it is not necessary to increase the wall thickness of the buffer tank 200 to meet the requirements for reliability and service life. After the buffer tank 200 is connected to the coolant circulation loop as a branch, the wall thickness of the buffer tank 200 can be reduced while meeting the requirements for reliability and service life, which helps to reduce the weight and production cost of the buffer tank 200.

[0114] In other examples, the buffer tank 200 can be connected in series in the coolant circulation loop. For example, the buffer tank 200 can be located between the return connector 710 and the inlet of the heat exchanger 100, with the return connector 710 connected to the inlet of the heat exchanger 100 via the buffer tank 200. Alternatively, the buffer tank 200 can be located between the outlet of the drive pump 600 and the supply connector 730, with the outlet of the drive pump 600 connected to the supply connector 730 via the buffer tank 200.

[0115] Figure 4 This is a schematic diagram from one perspective of another heat dissipation device provided in an embodiment of this application. Figure 5 for Figure 4 The diagram shows another perspective of the heat dissipation device provided. In the diagram, the x-direction is the first direction, the y-direction is the second direction, and the z-direction is the third direction. The first direction is the length direction of the heat dissipation device 12, the second direction is the width direction of the heat dissipation device 12, and the third direction is the height direction of the heat dissipation device 12.

[0116] like Figure 4 , Figure 5 As shown, in some examples, the buffer tank 200 can be positioned above the heat exchanger 100. This facilitates opening the buffer tank 200 when coolant is present in the coolant circulation loop, allowing for operations such as filling the buffer tank 200 with coolant and maintaining the components and parts within it. Furthermore, the flow of coolant from the buffer tank 200 into the heat exchanger 100 is relatively easy, promoting efficient utilization of the coolant within the buffer tank 200.

[0117] In other examples, the buffer tank 200 may also be located on the side of the heat exchanger 100 in the second or third direction.

[0118] like Figure 4 , Figure 5 As shown, in some examples, the return connector 710 has multiple ports, allowing it to communicate with multiple return channels 33. For example, the return connector 710 has two ports, and the charging station 10 is equipped with two charging guns. The two ports of the return connector 710 are respectively connected to the outlets of the return channels 33 of the two charging guns.

[0119] In some examples, the liquid supply connector 730 has multiple ports, allowing it to connect to multiple liquid supply channels 32. For instance, the liquid supply connector 730 has two ports, and the charging station 10 is equipped with two charging guns; the two ports of the liquid supply connector 730 are respectively connected to the inlets of the liquid supply channels 32 of the two charging guns.

[0120] like Figure 4 , Figure 5 As shown, the heat dissipation device 12 also includes a frame 400, and the heat exchanger 100, fan 500 and drive pump 600 can all be fixedly connected to the frame 400.

[0121] For example, the buffer tank 200 can be fixedly connected to the heat exchanger 100 or the frame 400, and the heat exchanger 100 or the frame 400 can support the buffer tank 200.

[0122] For example, the fan 500 and the drive pump 600 may be respectively located on both sides of the heat exchanger 100 in the first direction.

[0123] For example, the heat dissipation device 12 may include a plurality of fans 500. For instance, the heat dissipation device 12 may include two fans 500 arranged along a third direction.

[0124] For example, the heat exchanger 100 also has a drain port 140, which is located at the bottom of the heat exchanger 100. When it is necessary to drain the coolant in the heat exchanger 100, the coolant in the heat exchanger 100 can be drained through the drain port 140.

[0125] Figure 6 for Figure 5 A cross-sectional view of plane AA.

[0126] like Figure 6As shown, exemplarily, the heat exchanger 100 includes a first liquid collecting component 110, a second liquid collecting component 130, and a heat dissipation component 120. The first liquid collecting component 110 surrounds and forms a first liquid collecting cavity 111, and the second liquid collecting component 130 surrounds and forms a second liquid collecting cavity 131. The heat dissipation component 120 has a heat dissipation channel, and the two ends of the heat dissipation channel are respectively connected to the first liquid collecting cavity 111 and the second liquid collecting cavity 131. The inlet of the heat exchanger 100 is located in the first liquid collecting component 110 and communicates with the first liquid collecting cavity 111.

[0127] For example, the heat dissipation component 120 has multiple heat dissipation channels arranged side by side. For instance, the heat dissipation component 120 may include multiple heat dissipation pipes arranged side by side. The heat dissipation pipes may be flat pipes. Each heat dissipation pipe may form a heat dissipation channel. Heat dissipation fins may be provided between two adjacent heat dissipation pipes. Two adjacent heat dissipation pipes may be connected by the heat dissipation fins between them.

[0128] In some examples, a partition 112 is provided in the first liquid collection chamber 111, which divides the first liquid collection chamber 111 into a first sub-chamber 111a and a second sub-chamber 111b. Part of the heat dissipation channel connects the first sub-chamber 111a and the second liquid collection chamber 131, and part of the heat dissipation channel connects the second sub-chamber 111b and the second liquid collection chamber 131. The inlet of the heat exchanger 100 is connected to the first sub-chamber 111a, and the outlet of the heat exchanger 100 is located in the first liquid collection component 110 and connected to the second sub-chamber 111b. After the coolant enters the heat exchanger 100, it first flows into the first sub-chamber 111a, and then flows to the second liquid collection chamber 131 through the heat dissipation channel connected to the first sub-chamber 111a. The coolant in the second liquid collection chamber 131 flows to the second sub-chamber 111b through the heat dissipation channel connected to the second sub-chamber 111b, and then flows out of the heat exchanger 100 from the outlet. This allows for a longer flow path of the coolant within the heat exchanger 100, facilitating sufficient heat dissipation. Furthermore, it also allows for a faster flow rate of the coolant in the coolant circulation loop, promoting efficient heat dissipation from the heat-generating components 20.

[0129] For example, the first sub-cavity 111a and the second sub-cavity 111b are arranged along a second direction. In the second direction, a portion of the heat dissipation channel and the first sub-cavity 111a are located on the same side of the partition 112 and communicate with the first sub-cavity 111a, and a portion of the heat dissipation channel and the second sub-cavity 111b are located on the same side of the partition 112 and communicate with the second sub-cavity 111b.

[0130] In other examples, the outlet of the heat exchanger 100 is located at the second liquid collection component 130 and communicates with the second liquid collection chamber 131. After the coolant enters the first liquid collection chamber 111 from the inlet of the heat exchanger 100, it flows to the second liquid collection chamber 131 through the heat dissipation channel, and then flows out of the heat exchanger 100 through the outlet of the heat exchanger 100.

[0131] like Figure 6 As shown, for example, the first liquid collection component 110 is located above the heat dissipation component 120, and the second liquid collection component 130 is located below the heat dissipation component 120. The two ends of the heat dissipation flow channel extend in the third direction. At this time, the drain port 140 can be located on the second liquid collection component 130 and communicate with the second liquid collection chamber 131.

[0132] Figure 7 for Figure 4 A schematic diagram of the buffer tank of the heat dissipation device provided in the diagram.

[0133] like Figure 7 As shown, for example, the buffer tank 200 has a communication port 211 in its tank wall, and the buffer tank 200 is connected to the heat exchanger 100 through the communication port 211.

[0134] For example, the connection port 211 can be connected to the bypass interface to enable the connection between the buffer tank 200 and the heat exchanger 100.

[0135] For example, the connection port 211 can be located at the bottom of the buffer tank 200. For instance, the connection port 211 can be located on the bottom wall of the buffer tank 200, making it easier for the coolant in the buffer tank 200 to flow into the heat exchanger 100, which is beneficial for making full use of the coolant in the buffer tank 200.

[0136] When the buffer tank 200 is located above the heat exchanger 100, the bypass port can be located at the top of the heat exchanger 100. For example, the bypass port can be located on the top wall of the first liquid collection component 110 so as to facilitate the connection between the communication port 211 and the bypass port.

[0137] For example, the buffer tank 200 is connected to the first liquid collection chamber 111.

[0138] For example, the buffer tank 200 can be connected to the first sub-cavity 111a or the second sub-cavity 111b.

[0139] like Figure 7 As shown, for example, a level gauge 216 is provided on the outside of the buffer tank 200. The level gauge 216 is connected to the inner cavity of the buffer tank 200. The level gauge 216 is used to display the liquid level in the buffer tank 200 so as to make it easier to know the liquid level in the buffer tank 200.

[0140] For example, the level gauge 216 may include an upper connector, a lower connector, and a transparent tube. The upper connector is located at the top of the buffer tank 200 and communicates with the top space inside the buffer tank 200. The lower connector is located at the bottom of the buffer tank 200 and communicates with the bottom space inside the buffer tank 200. The two ends of the transparent tube are connected to the upper connector and the lower connector, respectively. One end of the transparent tube communicates with the top space inside the buffer tank 200 through the upper connector, and the other end of the transparent tube communicates with the bottom space inside the buffer tank 200 through the lower connector. Utilizing the principle of communicating vessels, the liquid level inside the buffer tank 200 can be displayed through the transparent tube.

[0141] For example, the buffer tank 200 is also equipped with a liquid level sensor 215 on its wall. The liquid level sensor 215 is electrically connected to the controller 300. The liquid level sensor 215 generates a first signal when the liquid level in the buffer tank 200 is lower than a preset liquid level, and generates a second signal when the liquid level in the buffer tank 200 is higher than or equal to the preset liquid level. The controller 300 acquires the first and second signals and generates a status command to indicate the status of the buffer tank 200 based on the first and second signals. The status of the buffer tank 200 may include a normal status and a low-liquid status. This facilitates the detection of low-liquidity conditions in the buffer tank 200.

[0142] For example, the level sensor 215 may be located on the bottom or top wall of the buffer tank 200.

[0143] Figure 8 for Figure 4 A schematic diagram of one side wall of the buffer tank of the heat dissipation device provided in the diagram after it has been removed.

[0144] like Figure 8 As shown in the embodiment of this application, the controller 300 is disposed inside the buffer tank 200.

[0145] In this way, the buffer tank 200 can serve as both a container and a protector for the controller 300. In other words, besides its buffering function, the buffer tank 200 also functions as an electrical control box. This eliminates the need for an additional electrical control box outside the buffer tank 200 to accommodate and protect the controller 300, resulting in a higher degree of integration for the heat dissipation device 12. This allows for a reduction in the size of the heat dissipation device 12 while keeping the size of the buffer tank 200 constant, and vice versa, thereby improving the buffering and replenishment effects of the buffer tank 200. Furthermore, eliminating the need for an additional electrical control box outside the buffer tank 200 reduces the number of structural components in the heat dissipation device 12, thus lowering its cost.

[0146] The coolant is an insulating coolant such as cooling oil or fluorinated liquid, which makes the controller 300 less prone to short circuits due to contact with the coolant.

[0147] For example, the controller 300 is submerged in coolant, meaning it is completely submerged, which helps reduce the size of the buffer tank. Furthermore, because the controller 300 is submerged, dust accumulation on its surface is less likely, improving its reliability. Additionally, the lack of dust accumulation eliminates the need for a protective layer, reducing costs. Moreover, submersion allows for efficient heat transfer from the controller 300 to the coolant and then to the buffer tank walls for further cooling, resulting in better heat dissipation performance.

[0148] For example, controller 300 can be a control board.

[0149] For example, the controller 300 is fixedly mounted inside the buffer tank 200, making the assembly of the controller 300 more stable and reducing the likelihood of damage to components inside the buffer tank 200 due to movement of the controller 300 relative to the buffer tank 200. Furthermore, the controller 300 is less likely to malfunction due to collisions with the buffer tank 200 or components inside the buffer tank 200. Additionally, it facilitates a stable electrical connection for the controller 300.

[0150] For example, the distance between the bottom wall of the controller 300 and the buffer tank 200 is smaller than the distance between the top wall of the controller 300 and the buffer tank 200, making it easier to completely submerge the controller 300 with less coolant. Furthermore, while the controller 300 is submerged in coolant, a larger space can be left above the buffer tank 200 to accommodate gas, thus allowing the buffer tank 200 to have better buffering performance.

[0151] The drive pump 600, fan 500, first temperature sensor 810, pressure sensor 820 and second temperature sensor 830 are all located outside the buffer tank 200.

[0152] In some possible implementations, the buffer tank 200 has an electrical connection connector 221 on its tank wall. The controller 300 is electrically connected to the electrical connection connector 221, and the electrical connection connector 221 is electrically connected to a device outside the buffer tank 200, so that the controller 300 can be electrically connected to a device outside the buffer tank 200 through the electrical connection connector 221.

[0153] This facilitates the electrical connection between the controller 300 inside the buffer tank 200 and devices such as the drive pump 600 and fan 500 outside the buffer tank 200. In addition, by providing an electrical connection connector 221 that passes through the tank wall of the buffer tank 200, the sealing at the connection between the electrical connection connector 221 and the tank wall of the buffer tank 200 is easier and less prone to failure, which is beneficial to the sealing of the buffer tank 200.

[0154] For example, the buffer tank 200 has an assembly hole in its wall, and an electrical connector 221 passes through the assembly hole. The electrical connector 221 is fixed to and sealed to the wall of the buffer tank 200. Part of the electrical connector 221 is located inside the buffer tank 200 and is electrically connected to the controller 300, while another part of the electrical connector 221 is located outside the buffer tank 200 and is electrically connected to devices such as the drive pump 600 and the fan 500 outside the buffer tank 200.

[0155] For example, the controller 300 can be connected to the electrical connection connector 221 via a connection cable.

[0156] In some examples, the electrical connection 221 is located on the top wall of the buffer tank 200, so that the coolant in the buffer tank 200 is not easily leaked from the connection between the electrical connection 221 and the tank wall of the buffer tank 200.

[0157] In other examples, the electrical connection 221 may also be located on the side wall or bottom wall of the buffer tank 200.

[0158] In some other possible embodiments, the buffer tank 200 has a wire hole in its wall, through which an electrical connection wire is threaded. The electrical connection wire is sealed to the wall of the buffer tank 200. Part of the electrical connection wire is located inside the buffer tank 200 and is electrically connected to the controller 300, while another part of the electrical connection wire is located outside the buffer tank 200 and is electrically connected to a device outside the buffer tank 200. This allows the controller 300 to be electrically connected to a device outside the buffer tank 200 via the electrical connection wire.

[0159] In some other possible implementations, the controller 300 may include a wireless communication module, and the controller 300 inside the buffer tank 200 may be wirelessly connected to devices such as the drive pump 600 and fan 500 outside the buffer tank 200 via the wireless communication module.

[0160] like Figure 8 As shown, in some examples, the buffer tank 200 has an injection port 212 on its wall (e.g., Figure 12As shown in the diagram, a plug 213 is provided at the injection port 212. The plug 213 is detachably connected to the buffer tank 200, and the plug 213 seals the injection port 212. Thus, when it is necessary to inject liquid into the buffer tank 200, liquid can be injected into the buffer tank 200 by opening the plug 213, making liquid injection into the buffer tank 200 relatively convenient. After the liquid injection into the buffer tank 200 is completed, the injection port 212 can be sealed by the plug 213 to achieve a seal for the buffer tank 200.

[0161] For example, the injection port 212 can be located at the top of the buffer tank 200. For instance, the injection port 212 can be located on the top wall of the buffer tank 200, so that the liquid in the buffer tank 200 is not likely to leak from the injection port 212.

[0162] For example, the controller 300 is spaced apart from the injection port 212, so that the controller 300 is less likely to affect the injection through the injection port 212.

[0163] For example, the controller 300 and the plug 213 are spaced apart, so that the installation of the controller 300 and the plug 213 is less likely to affect each other.

[0164] For example, the controller 300 and the buffer tank 200 are spaced apart on the tank wall on the side where the injection port 212 and the plug 213 are located.

[0165] In some possible implementations, the projection of the controller 300 is located outside the projection of the injection port 212 in the direction of extension of the center line of the injection port 212, so that when coolant is added through the injection port 212, the controller 300 is less likely to be displaced or malfunction due to the impact of the added coolant.

[0166] For example, when the injection port 212 is located on the top wall of the buffer tank 200, the projection of the controller 300 is outside the projection of the injection port 212 along the height direction of the heat dissipation device 12.

[0167] In some examples, the tank wall of buffer tank 200 has a pressure relief port 218 (e.g. Figure 12 As shown in the diagram, a safety valve 214 is provided at the pressure relief port 218. In this way, when the pressure inside the buffer tank 200 is too high, the safety valve 214 can be opened, and the pressure can be relieved through the pressure relief port 218 and the safety valve 214, making the use of the buffer tank 200 safer.

[0168] For example, the pressure relief port 218 can be located at the top of the buffer tank 200. For instance, the pressure relief port 218 can be located on the top wall of the buffer tank 200, so that when the pressure inside the buffer tank 200 is under normal conditions, the coolant inside the buffer tank 200 is not likely to leak at the pressure relief port 218.

[0169] For example, the controller 300 and the pressure relief port 218 are spaced apart, so that the controller 300 is less likely to affect the pressure relief through the pressure relief port 218.

[0170] For example, the controller 300 and the safety valve 214 are spaced apart, so that the installation of the controller 300 and the safety valve 214 does not easily affect each other.

[0171] For example, the controller 300 and the buffer tank 200 are spaced apart on the tank wall on the side where the pressure relief port 218 and the safety valve 214 are located.

[0172] In some possible implementations, the projection of the controller 300 is located outside the projection of the pressure relief port 218 in the direction of extension of the centerline of the pressure relief port 218, so that the installation of the safety valve 214 and the controller 300 does not easily affect each other.

[0173] For example, when the pressure relief port 218 is located on the top wall of the buffer tank 200, the projection of the controller 300 is outside the projection of the pressure relief port 218 along the height direction of the heat dissipation device 12.

[0174] For example, the controller 300 and the liquid level sensor 215 are spaced apart, so that the installation of the controller 300 and the liquid level sensor 215 is less likely to interfere with each other.

[0175] For example, the controller 300 and the buffer tank 200 are spaced apart on the side of the tank wall where the level sensor 215 is located.

[0176] For example, on a horizontal plane, the level sensor 215 is staggered with the controller 300, so that the level sensor 215's detection of the level in the buffer tank 200 is not easily affected by the controller 300.

[0177] Figure 9 for Figure 4 A top view of the buffer tank of the heat dissipation device provided in the diagram. Figure 10 for Figure 9 A cross-sectional view of the BB plane.

[0178] like Figure 9 , Figure 10 As shown, in some possible implementations, the controller 300 and the connection port 211 are spaced apart. In this way, the controller 300 is less likely to affect the connection between the buffer tank 200 and the heat exchanger 100, facilitating the connection between the buffer tank 200, which has an internal controller 300, and the heat exchanger 100.

[0179] For example, the controller 300 and the buffer tank 200 are spaced apart on the side of the communication port 211 to facilitate communication between the communication port 211 and various parts inside the buffer tank 200, so as to make full use of the inner cavity of the buffer tank 200.

[0180] In some examples, the controller 300 is fixedly connected to the buffer tank 200 via a connecting member 310, so that the controller 300 and the buffer tank 200 are spaced apart by the tank wall on one side of the controller 300 via the connecting member 310.

[0181] For example, one end of the connecting component 310 is fixedly connected to the controller 300, and the other end of the connecting component 310 is fixedly connected to the tank wall of the buffer tank 200.

[0182] For example, the controller 300 is fixedly connected to the top wall of the buffer tank 200 via the connecting member 310, and the controller 300 is suspended inside the buffer tank 200.

[0183] For example, the connecting component 310 may include a plurality of connecting posts spaced apart, and the controller 300 may be fixedly connected to the buffer tank 200 through the plurality of connecting posts spaced apart.

[0184] For example, the controller 300 and the electrical connection connector 221 are spaced apart, so that the installation of the controller 300 and the electrical connection connector 221 are less likely to interfere with each other.

[0185] For example, the controller 300 and the buffer tank 200 are spaced apart on the side of the tank wall where the electrical connection connector 221 is located.

[0186] Figure 11 for Figure 4 Another perspective view of the buffer tank of the heat dissipation device provided. Figure 12 for Figure 11 An explosion diagram.

[0187] like Figures 10-12 As shown, in some possible embodiments, the buffer tank 200 includes a shell 210 and a plate 220. The shell 210 has an opening 217. The plate 220 is detachably connected to the shell 210 and covers the opening 217. The shell 210 and the plate 220 enclose the cavity forming the inner cavity of the buffer tank 200.

[0188] This makes it easier to maintain the controllers and other devices installed inside the buffer tank 200.

[0189] For example, a seal is provided between the housing 210 and the plate 220, and the housing 210 and the plate 220 are sealed together by the seal. For example, the seal can be a sealing ring.

[0190] For example, the housing 210 and the plate 220 can be fixedly connected by fasteners such as bolts, so that the housing 210 and the plate 220 are fixed more securely.

[0191] For example, the opening 217 is located at the top of the housing 210, and the plate 220 is disposed at the top of the housing 210. The housing 210 is used to form the bottom wall and at least part of the side wall of the buffer tank 200, and the plate 220 is used to form at least part of the top wall of the buffer tank 200, so that the buffer tank 200 is not prone to leakage at the opening 217, and it is also convenient to open the plate 220 when there is coolant in the buffer tank 200.

[0192] For example, the connection port 211 of the buffer tank 200 is located in the housing 210.

[0193] For example, the level gauge 216 is located in the housing 210, so that the level gauge 216 does not easily affect the disassembly and assembly of the plate 220 and the housing 210.

[0194] For example, the buffer tank 200 can be a cuboid structure.

[0195] In some examples, the housing 210 has a liquid inlet 212 and a plug 213 is provided on the housing 210. In other examples, the plate 220 has a liquid inlet 212 and a plug 213 is provided on the plate 220.

[0196] In some examples, housing 210 has a pressure relief port 218 and safety valve 214 is provided in housing 210. In other examples, plate 220 has a pressure relief port 218 and safety valve 214 is provided in plate 220.

[0197] For example, the plate 220 forms part of the tank wall of the buffer tank 200 with the opening 217, and the shell 210 forms part of the tank wall of the buffer tank 200 with the opening 217, so that the size of the opening 217 is small, which is beneficial to the sealing of the buffer tank 200. For example, the plate 220 forms part of the top wall of the buffer tank 200, and the shell 210 forms part of the top wall of the buffer tank 200.

[0198] like Figures 10-12 As shown, in some possible embodiments, the controller 300 is fixedly connected to the board 220. In this way, when the board 220 is opened from the opening 217, the controller 300 can be lifted up, making it easier to maintain the controller 300.

[0199] For example, the controller 300 is fixedly connected to the board 220 via the connecting component 310. The controller 300 and the board 220 are spaced apart, so that the components or devices installed on the controller 300 and the board 220 are less likely to interfere with each other.

[0200] For example, the controller 300 and the housing 210 are spaced apart, so that the components or devices on the controller 300 and the housing 210 are less likely to interfere with each other. In addition, there is an assembly gap between the housing 210 and the controller 300, which makes it easier to assemble the controller 300, which is fixedly connected to the plate 220, into the housing 210.

[0201] In some examples, the orthographic projection of the controller 300 onto the plate 220 lies within the orthographic projection of the opening 217 onto the plate 220.

[0202] In this way, the controller 300 can be removed from the opening 217 when the board 220 is opened, which facilitates the maintenance of the controller 300.

[0203] In some possible implementations, the electrical connection connector 221 of the heat dissipation device 12 is located on the plate 220.

[0204] In this way, when the plate 220 is opened from the opening 217, the electrical connector 221 and the controller 300 are less likely to shift, which is conducive to the stable connection between the electrical connector 221 and the controller 300.

[0205] In some possible implementations, the controller 300 and the buffer tank 200 are spaced apart from each other, meaning that the controller 300 and each side wall of the buffer tank 200 are spaced apart. This provides assembly gaps between the controller 300 and the buffer tank 200, making assembly of the controller 300 within the buffer tank 200 easier. Furthermore, devices or components mounted on the side walls of the buffer tank 200 are less affected by the controller 300, allowing for more flexible placement of devices or components on the buffer tank 200. This also facilitates flexible placement of the controller 300 within the buffer tank 200, thereby allowing for greater flexibility in the shape and dimensions of the buffer tank 200 in all directions.

[0206] In some examples where the controller 300 and the buffer tank 200 are spaced apart from each other, and the buffer tank 200 includes a plate 220 and a housing 210, the controller 300 is spaced apart from both the plate 220 and the housing 210.

[0207] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0208] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0209] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them. Although the embodiments of this application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A heat dissipation device (12), characterized in that, include: A heat exchanger (100) for containing coolant, the heat exchanger (100) having an inlet, an outlet and a bypass interface, the bypass interface being located between the inlet and the outlet; A buffer tank (200) is disposed above the heat exchanger (100). The buffer tank (200) is connected to the heat exchanger (100) through the bypass interface. The buffer tank (200) is used to contain the coolant and gas. A controller (300) is disposed inside the buffer tank (200). The controller (300) is used to be immersed in the coolant. The distance between the controller (300) and the bottom wall of the buffer tank (200) is smaller than the distance between the controller (300) and the top wall of the buffer tank (200). The controller (300) is used to control the cooling capacity provided by the heat dissipation device (12). The coolant is an insulating coolant.

2. The heat dissipation device (12) according to claim 1, characterized in that, The controller (300) is fixedly connected to the buffer tank (200) via a connecting component (310), and the controller (300) and the tank wall of the buffer tank (200) are spaced apart.

3. The heat dissipation device (12) according to claim 1 or 2, characterized in that, The buffer tank (200) is provided with an electrical connection connector (221) on its tank wall, and the controller (300) is electrically connected to the electrical connection connector (221).

4. The heat dissipation device (12) according to any one of claims 1-3, characterized in that, The buffer tank (200) has a liquid injection port (212) on its tank wall. In the direction of extension of the centerline of the injection port (212), the projection of the controller (300) is located outside the projection of the injection port (212).

5. The heat dissipation device (12) according to any one of claims 1-4, characterized in that, The buffer tank (200) includes a shell (210) and a plate (220); The housing (210) has an opening (217), the plate (220) is detachably connected to the housing (210), the plate (220) covers the opening (217), and the housing (210) and the plate (220) enclose the cavity forming the buffer tank (200).

6. The heat dissipation device (12) according to claim 5, characterized in that, The controller (300) is fixedly connected to the plate (220).

7. The heat dissipation device (12) according to claim 5 or 6, characterized in that, The electrical connection connector (221) of the heat dissipation device (12) is located on the plate (220).

8. A charging pile (10), characterized in that, It includes a pile body (11) and a heat dissipation device (12) as described in any one of claims 1-7, wherein the heat dissipation device (12) is disposed within the pile body (11); The heat exchanger (100) of the heat dissipation device (12) contains coolant, the buffer tank (200) of the heat dissipation device (12) contains coolant and gas, and the controller (300) of the heat dissipation device (12) is immersed in coolant. The coolant is an insulating coolant.

9. A liquid cooling device, characterized in that, It includes a liquid-cooled heat exchange assembly (30) and a heat dissipation device (12) as described in any one of claims 1-7. The heat exchanger (100) of the heat dissipation device (12) is used to form a coolant circulation loop with the liquid-cooled heat exchange assembly (30); The coolant circulation loop contains coolant, the buffer tank (200) of the heat dissipation device (12) contains coolant and gas, and the controller (300) of the heat dissipation device (12) is immersed in the coolant; The coolant is an insulating coolant.

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