1.6T waterproof optical module housing structure and optical module production method

Abstract

The application relates to the field of optical modules, discloses a 1.6T waterproof optical module shell structure and an optical module production method, the optical module shell structure comprises a fixed shell, a heat dissipation structure and an optoelectronic module, the fixed shell is in a cylindrical shape, the heat dissipation structure and the optoelectronic module are arranged in the fixed shell, a first end cover is sealingly connected to a first end of the fixed shell, and an electrical plug-in part of the optoelectronic module sealingly penetrates through the first end cover; a second end cover is sealingly connected to a second end of the fixed shell, and an optical plug-in part of the optoelectronic module sealingly penetrates through the second end cover; the heat dissipation structure extends in a wave shape to the top and the bottom of the optoelectronic module, the heat dissipation structure is a hollow structure, liquid inlets and liquid outlets are arranged at two ends of the heat dissipation structure respectively, the liquid inlets and the liquid outlets are used for feeding cooling liquid into the heat dissipation structure, and the liquid inlets and the liquid outlets sealingly penetrate through the second end cover. The application can guarantee the waterproof performance of the shell and optimize the heat dissipation path.

Description

Technical Field

[0001] This application relates to the field of optical module technology, and more specifically, to a 1.6T waterproof optical module housing structure and an optical module manufacturing method. Background Technology

[0002] In the field of optical communication, optical modules, as core components for photoelectric signal conversion, require their housings to simultaneously meet the dual requirements of waterproof sealing and efficient heat dissipation. With the development of 5G communication and data centers, the power density of optical modules is constantly increasing, making heat generation a more prominent issue. Meanwhile, outdoor or humid environments place stringent demands on waterproof performance. Existing technologies often struggle to strike a balance between these two aspects in traditional housing designs: to achieve waterproofing, methods such as sealant filling, multi-layer sealing rings, or integral injection molding are commonly used. However, these solutions significantly increase thermal resistance, preventing effective heat dissipation, which can easily lead to chip overheating, performance degradation, or even failure, especially in high-power optical modules. Furthermore, to enhance heat dissipation, some designs employ open ventilation holes, heat sinks, or forced air cooling structures. However, these measures compromise the housing's seal, allowing moisture and dust to easily penetrate, affecting the stability of optical components and circuits. This can lead to optical path refraction or short-circuit risks, especially in liquid-cooled environments.

[0003] The shortcomings of existing optical module housing structures are mainly reflected in three aspects: the contradiction between sealing materials and heat dissipation paths. For example, although traditional sealants can isolate liquids, their low thermal conductivity hinders heat conduction to the housing; the weakening of waterproof performance due to heat dissipation design, such as the opening of heat dissipation holes or the introduction of fans, which reduces the protection level of the housing, and even with the addition of dust filters, it is difficult to completely prevent water vapor penetration; and insufficient adaptability to complex environments. For example, liquid cooling technology requires complete isolation between the optical module and the coolant, but traditional packaging processes (such as spot welding and glue sealing) have gaps, which can easily lead to coolant seeping into the optical path and causing abnormal optical transmission. In addition, some structures use multi-layer sealing rings or thermal grease combined with heat pipes to balance both aspects, but such designs not only increase manufacturing complexity and cost, but may also lead to a decrease in sealing performance after long-term use due to mismatched thermal expansion coefficients of materials. Therefore, how to optimize the heat dissipation path while ensuring the waterproof performance of the housing has become a technical challenge that needs to be solved in the current field of optical module design. Summary of the Invention

[0004] The purpose of this application is to provide a 1.6T waterproof optical module housing structure and an optical module manufacturing method, which solves the technical problem of optimizing the heat dissipation path while ensuring the waterproof performance of the housing, and achieves the technical effect of optimizing the heat dissipation path while ensuring the waterproof performance of the housing.

[0005] This application provides a 1.6T waterproof optical module housing structure, including a fixed shell, a heat dissipation structure, and an optoelectronic module. The fixed shell is cylindrical, and the heat dissipation structure and optoelectronic module are disposed inside the fixed shell. A first end cap is sealed to the first end of the fixed shell, and the electrical connector of the optoelectronic module is sealed through the first end cap. A second end cap is sealed to the second end of the fixed shell, and the optical connector of the optoelectronic module is sealed through the second end cap. The heat dissipation structure extends in a wave shape to the top and bottom of the optoelectronic module. The heat dissipation structure is a hollow structure, and both ends of the heat dissipation structure are respectively provided with a liquid inlet and a liquid outlet. The liquid inlet and liquid outlet are used to introduce coolant into the heat dissipation structure, and the liquid inlet and liquid outlet are sealed through the second end cap.

[0006] In one possible implementation, the heat dissipation structure extends from the liquid inlet to the first end cap to form a first wave segment, which makes thermal contact with the top of the optoelectronic module; the heat dissipation structure extends from the first end cap to the liquid outlet to form a second wave segment, which makes thermal contact with the bottom of the optoelectronic module; the heat dissipation structure is made of metal, and the first and second wave segments are plate-shaped wavy curved structures, which provide elastic support for the top and bottom of the optoelectronic module.

[0007] In another possible implementation, soft thermally conductive silicone is provided between the first wave segment, the second wave segment and the optoelectronic module respectively; the top of the first wave segment and the inner wall of the fixed shell are elastically squeezed together, and the bottom of the second wave segment and the inner wall of the fixed shell are elastically squeezed together; an end clearance gap is provided between the end of the heat dissipation structure and the first end cap; and a lateral clearance gap is provided between the sides of the first wave segment, the second wave segment and the inner wall of the fixed shell.

[0008] In another possible implementation, a first diverter plate is provided at one end of the first wave segment near the second end cap. The first diverter plate is used to disperse and guide the coolant, and the inlet is located at the end of the first wave segment.

[0009] In another possible implementation, coolant flows between the first and second wave segments through two flow tubes. The photoelectric module has bayonets on both sides, through which the two flow tubes pass for fixation.

[0010] In another possible implementation, the top of the first wave segment and the optical connector are in thermal contact, and the bottom of the second wave segment and the optical connector are in thermal contact; the first wave segment and the second wave segment form a positioning part with a bent structure near the first end cap, and the positioning part is provided with a fixing groove that is in thermal contact with the optical connector.

[0011] In another possible implementation, the top of the optoelectronic module is equipped with a top temperature sensor to detect the temperature of the top components of the optoelectronic module, and the bottom of the optoelectronic module is equipped with a bottom temperature sensor to detect the temperature of the bottom components of the optoelectronic module. The optoelectronic module can determine the temperature difference between the top and bottom components. When the top component temperature is greater than or equal to a preset top component temperature, or when the bottom component temperature is greater than or equal to a preset bottom component temperature, or when the temperature difference is greater than or equal to a preset temperature difference, the optoelectronic module sends a heat dissipation control signal to increase the flow rate of the coolant in the heat dissipation structure by a preset value.

[0012] This application also provides a method for manufacturing an optical module housing structure as described in any of the above claims. The method includes: integrally molding a fixed housing, a first end cap, and a second end cap; sealing the electrical connector of the optoelectronic module through the first end cap, and sealing the first end cap at the first end of the fixed housing; sealing the liquid inlet and outlet of the heat dissipation structure through the second end cap, and sealing the optical connector of the optoelectronic module through the second end cap; fixing the top and bottom of the optoelectronic module through the heat dissipation structure, and then installing the heat dissipation structure and the optoelectronic module into the fixed housing, and sealing the second end cap at the second end of the fixed housing.

[0013] In another possible implementation, the method further includes: inserting soft thermally conductive silicone between the first wave segment, the second wave segment, and the optoelectronic module respectively; fixing the top and bottom of the optoelectronic module respectively through a heat dissipation structure, such that the top of the first wave segment and the inner wall of the fixed shell are elastically squeezed together, and the bottom of the second wave segment and the inner wall of the fixed shell are elastically squeezed together; an end clearance gap is provided between the end of the heat dissipation structure and the first end cap; and a lateral clearance gap is provided between the sides of the first wave segment, the second wave segment, and the inner wall of the fixed shell.

[0014] In another possible implementation, the method further includes: detecting the elastic compression amplitude of the first wave segment and the second wave segment when elastic compression occurs between the top of the first wave segment and the inner wall of the fixed shell, and between the bottom of the second wave segment and the inner wall of the fixed shell; detecting the end clearance gap; determining that the optical module shell is qualified when the elastic compression amplitude is within a preset elastic compression amplitude range and the end clearance gap is within a preset end clearance gap range; and determining that the optical module shell is unqualified when the elastic compression amplitude is not within the preset elastic compression amplitude range or the end clearance gap is not within the preset end clearance gap range.

[0015] The beneficial effects of the embodiments in this application compared with the prior art are: This application provides a 1.6T waterproof optical module housing structure, including a fixed shell, a heat dissipation structure, and a photoelectric module. The fixed shell is cylindrical, and the heat dissipation structure and photoelectric module are disposed inside the fixed shell. A first end cap is sealed to the first end of the fixed shell, and the electrical connector of the photoelectric module is sealed through the first end cap. A second end cap is sealed to the second end of the fixed shell, and the optical connector of the photoelectric module is sealed through the second end cap. The heat dissipation structure extends in a wave shape to the top and bottom of the photoelectric module. The heat dissipation structure is hollow, and its two ends are respectively provided with a liquid inlet and a liquid outlet for introducing coolant into the heat dissipation structure. The liquid inlet and liquid outlet are sealed through the second end cap. The optical module housing in this application embodiment can ensure both heat dissipation and waterproofing of the optical module housing, thereby improving the performance of the optical module in a 1.6T high-speed optical module structure. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 A front cross-sectional view of a 1.6T waterproof optical module housing structure provided in this application embodiment; Figure 2 for Figure 1 A partial schematic diagram at point A of a 1.6T waterproof optical module housing structure; Figure 3 A top cross-sectional view of a 1.6T waterproof optical module housing structure provided in this application embodiment; Figure 4 for Figure 3 A partial schematic diagram at point B of a 1.6T waterproof optical module housing structure; Figure 5 A schematic cross-sectional view of a 1.6T waterproof optical module housing structure provided for an embodiment of this application; Figure 6 This is a flowchart illustrating a method for manufacturing an optical module according to an embodiment of this application. In the figure, 1. Fixed shell; 101. Soft thermally conductive silicone; 102. End clearance gap; 103. Lateral clearance gap; 11. First end cap; 12. Second end cap; 2. Heat dissipation structure; 201. First wave segment; 201a. First flow divider; 202. Second wave segment; 203. Flow pipe; 204. Positioning part; 205. Fixing groove; 21. Liquid inlet; 22. Liquid outlet; 3. Photoelectric module; 301. Bayonet; 302. Top temperature sensor; 303. Bottom temperature sensor; 31. Electrical connector; 32. Optical connector. Detailed Implementation

[0018] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0019] It should be noted that when a component or structure is referred to as being "fixed to" or "set on" another component or structure, it can be directly on or indirectly on the other component or structure. When a component or structure is referred to as being "connected to" another component or structure, it can be directly connected to or indirectly connected to the other component or structure.

[0020] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device, component, or structure referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0021] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0022] Existing optical module housing structures make it difficult to optimize heat dissipation paths while ensuring the housing's waterproof performance.

[0023] Based on the above reasons, this application provides a 1.6T waterproof optical module housing structure, including a fixed shell, a heat dissipation structure, and a photoelectric module. The fixed shell is cylindrical, and the heat dissipation structure and photoelectric module are disposed inside the fixed shell. A first end cap is sealed to the first end of the fixed shell, and the electrical connector of the photoelectric module is sealed through the first end cap. A second end cap is sealed to the second end of the fixed shell, and the optical connector of the photoelectric module is sealed through the second end cap. The heat dissipation structure extends in a wave shape to the top and bottom of the photoelectric module. The heat dissipation structure is a hollow structure, and both ends of the heat dissipation structure are respectively provided with a liquid inlet and a liquid outlet for introducing coolant into the heat dissipation structure. The liquid inlet and the liquid outlet are sealed through the second end cap. The optical module housing in this application embodiment can ensure both heat dissipation and waterproof performance of the optical module housing, thereby improving the performance of the optical module in the 1.6T high-speed optical module structure.

[0024] In some scenarios, the 1.6T waterproof optical module housing structure of this application embodiment can be applied to the 1.6T high-speed optical module housing, which can ensure the waterproof and heat dissipation effects of the 1.6T waterproof optical module housing and improve the performance of the 1.6T high-speed optical module housing.

[0025] The following describes in detail a 1.6T waterproof optical module housing structure provided in the embodiments of this application, using specific examples.

[0026] Figure 1 This is a front cross-sectional view of a 1.6T waterproof optical module housing structure provided in an embodiment of this application. Figure 2 for Figure 1 A partial schematic diagram at point A of a 1.6T waterproof optical module housing structure. Figure 3 This is a top cross-sectional view of a 1.6T waterproof optical module housing structure provided in an embodiment of this application. Figure 4 for Figure 3 A partial schematic diagram at point B of a 1.6T waterproof optical module housing structure. Figure 5 A cross-sectional structural diagram of a 1.6T waterproof optical module housing structure provided in this application embodiment is shown below. Figures 1 to 5 As shown, the housing structure of this 1.6T waterproof optical module includes a fixed shell 1, a heat dissipation structure 2, and a photoelectric module 3. The fixed shell 1 is cylindrical, and the heat dissipation structure 2 and the photoelectric module 3 are disposed inside the fixed shell 1. A first end cap 11 is sealed to the first end of the fixed shell 1, and the electrical connector 31 of the photoelectric module 3 is sealed through the first end cap 11. A second end cap 12 is sealed to the second end of the fixed shell 1, and the optical connector 32 of the photoelectric module 3 is sealed through the second end cap 12.

[0027] like Figures 1 to 5As shown, the 1.6T waterproof optical module housing structure in this implementation consists of a fixed shell 1, a heat dissipation structure 2, and an optoelectronic module 3. The fixed shell 1 is cylindrical in shape, providing a robust protective frame and facilitating its manufacture.

[0028] Structurally, the heat dissipation structure 2 and the optoelectronic module 3 are jointly arranged inside the fixed shell 1. The first end of the fixed shell 1 is sealed to the first end cover 11. This connection method can ensure the waterproofness of the first end cover 11.

[0029] Structurally, the electrical connector 31 of the optoelectronic module 3 passes through the first end cover 11 in a sealed manner, which can effectively prevent external moisture from seeping in.

[0030] Structurally, the second end of the fixed shell 1 is sealed to the second end cover 12, and the optical connector 32 of the optoelectronic module 3 also passes through the second end cover 12 in a sealed manner, so that the second end of the fixed shell 1 is sealed and the entire optical module can maintain airtightness.

[0031] like Figures 1 to 5 As shown, the heat dissipation structure 2 extends in a wave shape to the top and bottom of the optoelectronic module 3. The heat dissipation structure 2 is a hollow structure, and the two ends of the heat dissipation structure 2 are respectively provided with a liquid inlet 21 and a liquid outlet 22. The liquid inlet 21 and the liquid outlet 22 are used to introduce coolant into the heat dissipation structure 2. The liquid inlet 21 and the liquid outlet 22 are sealed through the second end cover 12.

[0032] like Figures 1 to 5 As shown, the heat dissipation structure 2 adopts a wave-shaped design, which can extend to the top and bottom areas of the optoelectronic module 3. This wave shape can increase the contact area with the optoelectronic module 3. At the same time, the wave-shaped structure of the heat dissipation structure 2 can provide elastic support for the optoelectronic module 3, and can have deformation space when the optoelectronic module 3 and the heat dissipation structure 2 undergo thermal expansion and contraction.

[0033] Structurally, the heat dissipation structure 2 has a hollow interior and is provided with an inlet 21 and an outlet 22 at both ends. These openings are used to introduce coolant into the heat dissipation structure 2. The coolant can absorb heat through circulation, thereby dissipating heat from the inside of the optical module.

[0034] Structurally, the inlet 21 and outlet 22 are sealed when passing through the second end cap 12. This sealing treatment prevents coolant leakage, thereby maintaining the waterproof integrity of the entire system.

[0035] For example, when the optical module is running, the coolant enters the heat dissipation structure 2 from the inlet 21, flows through the hollow structure of the heat dissipation structure 2 to carry away the heat generated by the optoelectronic module 3, and then flows out from the outlet 22, thereby achieving efficient heat management.

[0036] The beneficial effect of the above implementation method is that the fixed shell is cylindrical in shape, and the sealed connection with the end caps and the sealed protrusion of key components can ensure the waterproof reliability of the entire shell in a humid environment and prevent internal components from being damaged by water ingress.

[0037] The beneficial effect of the above implementation method is that the wave-shaped shape of the heat dissipation structure extends and covers the upper and lower areas of the optoelectronic module. Combined with the hollow structure and coolant circulation, it can improve heat dissipation efficiency and reduce the impact of heat accumulation on the performance of the optoelectronic module.

[0038] The beneficial effect of the above implementation method is that the inlet and outlet are sealed through the second end cap, which can realize the closed circulation of coolant, thereby maintaining the overall sealing of the system during heat dissipation.

[0039] The beneficial effect of the above implementation method is that the combination of the fixed shell and the end caps can provide a compact protective structure, which is convenient for stable operation in high-density application scenarios.

[0040] In some implementations, the heat dissipation structure 2 extends from the liquid inlet 21 toward the first end cap 11 to form a first wave segment 201, which makes thermal contact with the top of the photoelectric module 3. The heat dissipation structure 2 extends from the first end cap 11 toward the liquid outlet 22 to form a second wave segment 202, which makes thermal contact with the bottom of the photoelectric module 3.

[0041] like Figures 1 to 5 As shown, structurally, the heat dissipation structure 2 has a wave-like structure. The heat dissipation structure 2 extends from the liquid inlet 21 to the first end cap 11 to form a first wave segment 201. In this way, the first wave segment 201 can closely abut against the top of the optoelectronic module 3 to achieve efficient heat conduction.

[0042] When the heat dissipation structure 2 and the optoelectronic module 3 undergo thermal expansion and contraction, the wave structure of the first wave segment 201 can expand and contract along the length of the first wave segment 201 to change the height of the first wave segment 201, which facilitates the repositioning of the optoelectronic module 3 and can provide repositioning protection for the optoelectronic module 3, thereby maintaining the relative stability of the internal structure of the optical module and avoiding damage to the internal structure of the optical module due to thermal expansion and contraction.

[0043] At the same time, the first wave segment 201 can also buffer and protect the optical module when it is impacted.

[0044] like Figures 1 to 5As shown, the heat dissipation structure 2 extends from the first end cap 11 to the liquid outlet 22 to form a second wave segment 202. In this way, the second wave segment 202 can fit against the bottom of the optoelectronic module 3 for heat conduction and contact, ensuring that both the upper and lower surfaces of the optoelectronic module 3 are covered. Similarly, the second wave segment 202 can provide clearance protection for the optoelectronic module 3. At the same time, the second wave segment 202 can also buffer and protect the optoelectronic module when it is subjected to impact.

[0045] Through the aforementioned optical module housing structure, the coolant flows from the inlet 21 through the first wave section 201, then to the second wave section 202, and finally exits from the outlet 22, achieving uniform heat absorption across the entire area of ​​the optoelectronic module 3. For example, during operation of the optical module, the curved path of the wave section can extend the coolant flow time, enhance heat exchange efficiency, and prevent localized overheating.

[0046] Structurally, the heat dissipation structure 2 is made of metal. The first wave segment 201 and the second wave segment 202 are plate-shaped wave-shaped curved structures. The first wave segment 201 and the second wave segment 202 are used to provide elastic support for the top and bottom of the optoelectronic module 3.

[0047] Structurally, the heat dissipation structure 2 is made of a metal material, which provides excellent thermal conductivity, ensuring that heat is quickly transferred from the optoelectronic module 3 to the coolant. For example, the first wave segment 201 can be made of a softer metal material, such as copper, to further reduce the difficulty of deformation of the first wave segment 201.

[0048] Structurally, such as Figures 1 to 4 As shown, both the first wave segment 201 and the second wave segment 202 adopt a plate-like wave-shaped bending structure. This shape allows the wave segment itself to have a certain degree of elasticity, thereby providing flexible support for the top and bottom of the optoelectronic module 3.

[0049] Structurally, the support method of this optical module can absorb shocks during installation or vibration, maintaining the stable fixation of the optoelectronic module 3.

[0050] For example, during equipment assembly, the elasticity of the wave structure can be adjusted to fit the module position, ensuring tight contact without damaging the optoelectronic components of the optical module.

[0051] The beneficial effect of the above implementation method is that the wave-shaped curved structure of the first and second wave segments extends to cover the top and bottom of the optoelectronic module. Combined with the heat-conducting contact design, it can improve the uniformity and efficiency of heat dissipation and reduce the risk of temperature rise of the optoelectronic module when it is under high load.

[0052] The beneficial effects of the above implementation method are that the heat dissipation structure is made of metal, and combined with the bending shape of the wave segment, it can achieve good thermal conductivity and mechanical elasticity, support the stable installation of the optoelectronic module 3, and prevent the module from loosening or being damaged due to vibration.

[0053] In some implementations, soft thermally conductive silicone 101 is provided between the first wave segment 201, the second wave segment 202 and the photoelectric module 3, respectively.

[0054] Structurally, a soft thermally conductive silicone 101 is provided between the first wave segment 201 and the second wave segment 202 and the optoelectronic module 3. This ensures that the contact surface between the wave segment of the heat dissipation structure 2 and the optoelectronic module 3 has good thermal conductivity, while also providing a certain degree of elasticity and buffering effect.

[0055] Within the optical module housing, the soft thermally conductive silicone 101 fills minute gaps, ensuring efficient heat transfer and absorbing stress caused by temperature changes or vibrations, thus protecting the optoelectronic module 3 from damage due to compression. During operation, the soft thermally conductive silicone 101 conforms to the bending shape of the wave section, evenly distributing heat pressure and preventing the formation of high-temperature areas.

[0056] In some implementations, the top of the first wave segment 201 and the inner wall of the fixed shell 1, and the bottom of the second wave segment 202 and the inner wall of the fixed shell 1 are elastically compressed and abutted.

[0057] Structurally, the top of the first wave segment 201 and the inner wall of the fixed shell 1, as well as the bottom of the second wave segment 202 and the inner wall of the fixed shell 1, are elastically compressed and abutted together. This design allows the heat dissipation structure 2 to form a tight contact with the inner wall of the fixed shell 1, and the elastic compression enhances the fixing effect and heat conduction efficiency. The elastic compression abutment can generate a pre-compression force during assembly, ensuring the stable positioning of the heat dissipation structure 2. At the same time, utilizing the elasticity of metal, under the premise that the first wave segment 201 and the second wave segment 202 stably support the optoelectronic module 3, when the heat dissipation structure 2 and the optoelectronic module 3 undergo thermal expansion and contraction, the wave structure of the first wave segment 201 can expand and contract along the length of the first wave segment 201 to change the height of the first wave segment 201, maintaining the stability of the internal structure of the optical module and avoiding damage to the internal structure of the optical module due to thermal expansion and contraction.

[0058] In addition, this contact method can buffer vibrations and maintain the integrity of internal components when the optical module is subjected to external impact.

[0059] In some implementations, an end clearance gap 102 is provided between the end of the heat dissipation structure 2 and the first end cover 11.

[0060] Structurally, an end clearance gap 102 is provided between the end of the heat dissipation structure 2 and the first end cover 11, and a lateral clearance gap 103 is provided between the side of the first wave segment 201 and the second wave segment 202 and the inner sidewall of the fixed shell 1. The end clearance gap 102 can provide space for axial displacement of the heat dissipation structure 2 when it expands or contracts thermally, preventing excessive stress caused by temperature changes. Under high-temperature working conditions, these gaps can absorb the length changes of the heat dissipation structure 2 and maintain the sealing integrity of the entire shell.

[0061] In some implementations, a lateral clearance gap 103 is provided between the sides of the first wave segment 201 and the second wave segment 202 and the inner wall of the fixed shell 1.

[0062] Structurally, the lateral clearance 103 allows the wave segment to move slightly in the lateral direction, accommodating assembly errors or operational vibrations, thereby avoiding structural deformation or internal interference.

[0063] The beneficial effect of the above implementation method is that the soft thermally conductive silicone placed between the heat dissipation wave section and the optoelectronic module can optimize heat transfer efficiency and provide flexible buffer, reducing the impact of thermal stress when the optoelectronic module is working.

[0064] The beneficial effect of the above implementation method is that the elastic compression between the top and bottom of the wave segment and the inner wall of the fixed shell can enhance the stability and thermal conductivity of the heat dissipation structure and adapt to environmental changes.

[0065] The beneficial effects of the above implementation method are that the setting of end and lateral clearance gaps can accommodate thermal expansion and manufacturing tolerances, ensuring that the optical module maintains structural integrity and waterproof sealing during long-term use, while maintaining the stability of the internal structure of the optical module and avoiding damage caused by thermal expansion and contraction of the internal structure of the optical module.

[0066] In some implementations, a first diverter plate 201a is provided at one end of the first wave segment 201 near the second end cap 12. The first diverter plate 201a is used to disperse and guide the coolant, and the inlet 21 is located at the end of the first wave segment 201.

[0067] Structurally, a first diverter plate 201a is provided at the end of the first wave section 201 near the second end cap 12, so that the first diverter plate 201a can disperse and guide the coolant entering the heat dissipation structure 2. The liquid inlet 21 is located at the end of the first wave section 201, so that the coolant can directly contact the first diverter plate 201a after flowing in, and the first diverter plate 201a can guide the coolant to be evenly dispersed in the wave-shaped channel of the entire first wave section 201.

[0068] For example, when the coolant enters the heat dissipation structure 2 from the inlet 21, the guiding effect of the first diverter plate 201a can quickly fill the curved path of the first wave section 201 with the coolant, avoid local flow obstruction, and achieve a more balanced heat dissipation effect.

[0069] Similarly, a diverter plate can also be installed near the second end cap of the second wave section 202 to improve the heat dissipation effect within the second wave section 202.

[0070] The beneficial effects of the above implementation method are that, with the first diverter plate positioned near the end cap of the first wave section, efficient dispersion and guidance of the coolant can be achieved, improving the uniformity of fluid distribution within the heat dissipation channel. The diversion and guidance design can prevent the formation of stagnant areas within the heat dissipation channel, enhancing the overall heat dissipation efficiency of the wave section.

[0071] The beneficial effect of the above implementation method is that the matching of the end positions of the liquid inlet and the first distributor plate can optimize the initial flow state of the coolant and reduce fluid resistance.

[0072] In some implementations, coolant flows between the first wave segment 201 and the second wave segment 202 through two flow pipes 203. The photoelectric module 3 has bayonets 301 on both sides, and the two flow pipes 203 pass through the bayonets 301 for fixation.

[0073] Structurally, coolant flows between the first wave segment 201 and the second wave segment 202 through two flow pipes 203, and the two flow pipes 203 can form a continuous coolant circulation path between the two wave segments.

[0074] Structurally, the photoelectric module 3 has special bayonet slots 301 on both sides, and two flow tubes 203 pass through these bayonet slots 301 to be fixed. This design can ensure that the flow tubes 203 are stably connected to the wave section, and at the same time, they are reliably positioned on both sides of the photoelectric module 3.

[0075] For example, during the heat dissipation process, when the coolant flows from the first wave section 201 to the second wave section 202, the fixing function of the clamp 301 can prevent the flow pipe 203 from shaking and maintain the stability of the cooling channel.

[0076] The beneficial effects of the above implementation method are that, by connecting the two wave segments and passing through the bayonet of the optoelectronic module, the coolant can flow smoothly and the overall heat dissipation structure can be stabilized. The dual-flow-through-tube configuration, combined with the bayonet of the optoelectronic module, ensures a symmetrical distribution of the cooling path and enhances the uniformity of heat dissipation.

[0077] The beneficial effect of the above implementation method is that the precise positioning of the flow pipe by the bayonet can improve the vibration resistance of the heat dissipation system and avoid the risk of coolant leakage.

[0078] In some implementations, the top of the first wave segment 201 and the optical connector 32 are in thermal contact, and the bottom of the second wave segment 202 and the optical connector 32 are in thermal contact.

[0079] Structurally, the first wave segment 201 can closely fit the top of the optical plug 32 for heat conduction and contact, while the second wave segment 202 can fit the bottom of the optical plug 32 for heat conduction and contact. Through this bidirectional contact design, the heat generated by the optical plug 32 during operation can be transferred to the wave segment of the heat dissipation structure 2 through the top and bottom, forming a three-dimensional heat dissipation channel.

[0080] For example, when the optical module is working at high speed, the coolant can carry away the heat from the upper and lower surfaces of the optical connector 32 as it flows through the wave section, thus preventing excessive local temperature rise in the optical interface area.

[0081] In some implementations, the first wave segment 201 and the second wave segment 202 form a positioning part 204 with a bent structure near the first end cap 11. The positioning part 204 is provided with a fixing groove 205 that conducts heat against the light insertion part 32.

[0082] Structurally, the first wave segment 201 and the second wave segment 202 extend to form a positioning part 204 with a bent structure near the first end cap 11. The positioning part 204 with the bent structure can be bent, so that the positioning part 204 with the bent structure can provide deformation space when the optical connector 32, the first wave segment 201 and the second wave segment 202 are deformed.

[0083] Structurally, the positioning part 204 has a fixing groove 205 that matches the shape of the optical plug part 32. The inner wall of the fixing groove 205 can precisely fit the surface of the optical plug part 32 for heat conduction and contact. After the optical plug part 32 is embedded in the fixing groove 205, the integrity of the heat conduction path can be maintained through the fixing groove 205.

[0084] The beneficial effects of the above implementation method are that the wave segment covers the top and bottom of the optical connector in both directions, which can significantly enhance the heat dissipation efficiency of the high-speed interface area; the bending positioning part matches the shape of the optical connector, which can ensure that the optical connector maintains a stable thermal coupling state in a vibration environment.

[0085] The beneficial effect of the above implementation method is that the positioning part of the bent structure can be bent, so that the positioning part of the bent structure can provide deformation space when the optical insertion part, the first wave segment and the second wave segment are deformed.

[0086] In some implementations, a top temperature sensor 302 is provided on the top of the photoelectric module 3 to detect the temperature of the top components of the photoelectric module 3, and a bottom temperature sensor 303 is provided on the bottom of the photoelectric module 3 to detect the temperature of the bottom components of the photoelectric module 3.

[0087] Structurally, a top temperature sensor 302 is installed on the top of the optoelectronic module 3, which can monitor the operating temperature of the components in the top area of ​​the optoelectronic module 3 in real time. At the same time, a bottom temperature sensor 303 is installed on the bottom of the optoelectronic module 3, which can monitor the operating temperature of the components in the bottom area simultaneously.

[0088] Structurally, the dual sensors are arranged in the key area covered by the heat dissipation structure 2, which can comprehensively reflect the thermal distribution status of the optoelectronic module 3. For example, when the optoelectronic module is working at high speed, the top and bottom temperature sensors can respectively capture the temperature rise data of the components on the upper and lower sides of the optoelectronic module 3 by the first wave segment 201 and the second wave segment 202.

[0089] In some implementations, the photoelectric module 3 can determine the temperature difference between the top component and the bottom component. When the temperature of the top component is greater than or equal to a preset top component temperature, or when the temperature of the bottom component is greater than or equal to a preset bottom component temperature, or when the temperature difference is greater than or equal to a preset component temperature difference, the photoelectric module 3 sends a heat dissipation control signal to increase the flow rate of the coolant in the heat dissipation structure 2 by a preset amount.

[0090] When the optical module is working, the optoelectronic module 3 has the ability to process temperature data and can calculate the temperature difference between the top component temperature value and the bottom component temperature value.

[0091] When the optical module is operating, if the temperature of the top component exceeds or reaches a preset safety threshold, or if the temperature of the bottom component exceeds or reaches a preset safety threshold, or if the temperature difference between the top and bottom exceeds a preset temperature difference tolerance, it indicates that the heat inside the optical module is out of control. At this time, the optoelectronic module 3 can automatically generate a heat dissipation control signal. The heat dissipation control signal can control the flow rate of the coolant inside the heat dissipation structure 2 to increase by a preset amount, thereby rapidly improving the heat dissipation intensity. For example, in non-uniform heat generation scenarios with excessive temperature differences, the above control mechanism can automatically trigger targeted cooling adjustments.

[0092] The beneficial effects of the above implementation method are that the dual temperature sensors cover the key areas of the optoelectronic module, which can realize the fine monitoring and early warning of heat dissipation conditions; the intelligent flow control strategy triggered by multiple conditions can dynamically optimize cooling efficiency and prevent the risk of local overheating.

[0093] The beneficial effects of the above implementation method are that the temperature difference monitoring function can identify abnormal heat distribution and actively improve the system reliability in high-power scenarios; the synergistic effect of closed-loop heat dissipation control and wave-shaped heat dissipation channel can significantly enhance the continuous operation stability of the 1.6T optical module.

[0094] Figure 6 This is a flowchart illustrating a method for manufacturing an optical module according to an embodiment of this application, as shown below. Figure 6 As shown in the embodiments of this application, an optical module manufacturing method is also provided for manufacturing the 1.6T waterproof optical module housing structure described in any of the above claims. This method includes steps S110 to S120, which are described in detail below.

[0095] S110, a fixed shell 1, a first end cap 11, and a second end cap 12, which are integrally formed.

[0096] In the production of optical modules, this optical module production method can first integrally mold the fixed shell 1, the first end cap 11, and the second end cap 12. The integral molding process can ensure the structural integrity and dimensional accuracy of each component. For example, the cylindrical outline of the fixed shell 1 and the sealing surface of the end cap can be precisely formed in one go by a mold. Compared with the optical module shell made by powder metallurgy casting, the fixed shell 1, the first end cap 11, and the second end cap 12 in this implementation are easier to manufacture and process.

[0097] S120. Seal the electrical connector 31 of the optoelectronic module 3 through the first end cover 11, and seal the first end cover 11 at the first end of the fixed housing 1. Seal the liquid inlet 21 and liquid outlet 22 of the heat dissipation structure 2 through the second end cover 12, and seal the optical connector 32 of the optoelectronic module 3 through the second end cover 12. After fixing the top and bottom of the optoelectronic module 3 through the heat dissipation structure 2, install the heat dissipation structure 2 and the optoelectronic module 3 into the fixed housing 1, and seal the second end cover 12 at the second end of the fixed housing 1.

[0098] When assembling the optical module housing, in the assembly process, the electrical connector 31 of the optoelectronic module 3 can first be passed through the reserved hole of the first end cover 11 and sealed. Then, the first end cover 11 is sealed and connected to the first end of the fixed housing 1.

[0099] For example, when the electrical connector 31 of the optoelectronic module 3 passes through the reserved hole of the first end cover 11, the reserved hole of the first end cover 11 can be sealed with sealing silicone.

[0100] During assembly, the liquid inlet 21 and liquid outlet 22 of the heat dissipation structure 2 can be passed through the corresponding holes of the second end cover 12 and sealed and fixed, while the optical connector 32 of the optoelectronic module 3 passes through the sealing hole of the second end cover 12.

[0101] For example, when the inlet 21 and outlet 22 pass through the corresponding holes of the second end cap 12 and the optical connector 32 passes through the sealing hole of the second end cap 12, the through hole on the second end cap 12 can be sealed with sealing silicone.

[0102] During assembly, in the integration of the heat dissipation structure 2 and the optoelectronic module 3, the first wave segment 201 and the second wave segment 202 of the heat dissipation structure 2 can be attached and fixed to the top and bottom of the optoelectronic module 3 respectively, and mechanical locking is achieved by positioning the flow pipe 203 through the bayonet 301.

[0103] During assembly, the heat dissipation structure 2 and the optoelectronic module 3 can be installed as a whole into the fixed shell 1, and finally the second end cover 12 is sealed and connected to the second end of the fixed shell 1 to realize the overall assembly of the optical module.

[0104] The beneficial effects of the above implementation method are that the phased sealing and integrated assembly of this optical module can ensure the waterproof reliability of the electro-optical interface and coolant channel; the pre-integrated design of the heat dissipation structure and optoelectronic module can improve the assembly accuracy and maintain the heat conduction efficiency.

[0105] In some implementations, the above method also includes S130 to S140, which are described in detail below.

[0106] S130, soft thermally conductive silicone 101 is inserted between the first wave segment 201, the second wave segment 202 and the optoelectronic module 3 respectively.

[0107] Structurally, in this production method, soft thermally conductive silicone 101 can be inserted between the first wave segment 201 and the second wave segment 202 of the heat dissipation structure 2 and the optoelectronic module 3, so that the soft thermally conductive silicone 101 fully fills the gap between the contact surface between the wave segment and the optoelectronic module 3, and ensures the uniform distribution of the thermal interface material during the assembly process.

[0108] S140. The top and bottom of the photoelectric module 3 are fixed by the heat dissipation structure 2, so that the top of the first wave segment 201 and the inner wall of the fixed shell 1, and the bottom of the second wave segment 202 and the inner wall of the fixed shell 1 are elastically pressed together. An end clearance gap 102 is provided between the end of the heat dissipation structure 2 and the first end cover 11. A lateral clearance gap 103 is provided between the sides of the first wave segment 201 and the second wave segment 202 and the inner wall of the fixed shell 1.

[0109] In this implementation, when the top and bottom of the optoelectronic module 3 are fixed by the heat dissipation structure 2, in order to provide space for thermal expansion and contraction between the optoelectronic module 3 and the heat dissipation structure 2, an elastic compression contact state can be formed between the top of the first wave segment 201 and the inner wall of the fixed shell 1, and between the bottom of the second wave segment 202 and the inner wall of the fixed shell 1.

[0110] During assembly, a clearance 102 is provided between the end of the heat dissipation structure 2 and the first end cover 11. At the same time, a lateral clearance 103 is provided between the side of the first wave segment 201 and the second wave segment 202 and the inner wall of the fixed shell 1. This allows the heat dissipation structure 2 to undergo thermal expansion displacement under high temperature working conditions, ensuring the normal operation of the optical module under sealed conditions.

[0111] The advantages of the above implementation method are that the snap-in soft thermally conductive silicone installation process can optimize the integrity of the thermal interface and the ease of assembly; the end and lateral gap design can avoid the accumulation of structural stress caused by thermal expansion, ensuring the normal operation of the optical module under sealed conditions.

[0112] In some implementations, the method also includes S150 to S160, which are described in detail below.

[0113] S150, during elastic compression between the top of the first wave segment 201 and the inner wall of the fixed shell 1, and between the bottom of the second wave segment 202 and the inner wall of the fixed shell 1, the elastic compression amplitude of the first wave segment 201 and the second wave segment 202 is detected. The end clearance gap 102 is also detected.

[0114] In this production method, key parameters can also be inspected during the assembly process. When the top of the first wave segment 201 and the inner wall of the fixed shell 1, and the bottom of the second wave segment 202 and the inner wall of the fixed shell 1 form an elastic compression contact state, the actual elastic compression amplitude values ​​of the first wave segment 201 and the second wave segment 202 can be detected.

[0115] At the same time, the actual size of the end clearance gap 102 between the end of the heat dissipation structure 2 and the first end cover 11 can also be detected. During the detection, non-contact measuring devices such as laser displacement sensors can be used to collect the above parameters in real time.

[0116] S160. When the elastic compression amplitude is within the preset elastic compression amplitude range, and the end clearance 102 is within the preset end clearance range, the optical module housing is deemed qualified. When the elastic compression amplitude is not within the preset elastic compression amplitude range, or the end clearance 102 is not within the preset end clearance range, the optical module housing is deemed unqualified.

[0117] When inspecting the gap, the system can automatically determine the quality based on preset quality standards: when the detected elastic compression amplitude value is within the preset elastic compression amplitude allowable range, and the end clearance gap 102 size is also within the preset end clearance gap allowable range, the system automatically determines that the optical module housing assembly is qualified.

[0118] Structurally, when the elastic compression amplitude exceeds the preset range, or the end clearance gap 102 deviates from the preset range, the optical module is determined to be a defective product, thus realizing the quality inspection of the thermal expansion and contraction deformation allowance of the optical module.

[0119] The beneficial effects of the above implementation method are that the dual-parameter synchronous detection mechanism can ensure that the elastic contact force and thermal expansion space of the wave segment meet the design requirements at the same time, realizing the quality detection of the thermal expansion and contraction deformation allowance of the optical module; the quality inspection process can effectively prevent the risk of heat dissipation failure or structural damage caused by assembly deviation.

[0120] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A 1.6T waterproof optical module housing structure, characterized in that, It includes a fixed shell, a heat dissipation structure, and an optoelectronic module. The fixed shell is cylindrical, and the heat dissipation structure and optoelectronic module are located inside the fixed shell. A first end cover is sealed to the first end of the fixed shell, and the electrical connector of the optoelectronic module is sealed through the first end cover. A second end cover is sealed to the second end of the fixed shell, and the optical connector of the optoelectronic module is sealed through the second end cover. The heat dissipation structure extends in a wave shape to the top and bottom of the optoelectronic module. The heat dissipation structure is hollow, and the two ends of the heat dissipation structure are respectively provided with a liquid inlet and a liquid outlet. The liquid inlet and liquid outlet are used to introduce coolant into the heat dissipation structure. The liquid inlet and liquid outlet are sealed through the second end cap. The heat dissipation structure extends from the liquid inlet to the first end cap to form the first wave section, and the first wave section makes thermal contact with the top of the optoelectronic module. The heat dissipation structure extends from the first end cap to the liquid outlet to form a second wave section, and the second wave section makes thermal contact with the bottom of the optoelectronic module. The heat dissipation structure is made of metal. The first and second wave sections are plate-shaped, wave-shaped curved structures. The first and second wave sections are used to provide elastic support for the top and bottom of the optoelectronic module. The top of the optoelectronic module is equipped with a top temperature sensor, which is used to detect the temperature of the top components of the optoelectronic module. The bottom of the optoelectronic module is equipped with a bottom temperature sensor, which is used to detect the temperature of the bottom components of the optoelectronic module. The photoelectric module can determine the temperature difference between the top and bottom components. When the temperature of the top component is greater than or equal to the preset top component temperature, or when the temperature of the bottom component is greater than or equal to the preset bottom component temperature, or when the temperature difference is greater than or equal to the preset component temperature difference, the photoelectric module sends a heat dissipation control signal to increase the flow rate of the coolant in the heat dissipation structure by a preset value.

2. The 1.6T waterproof optical module housing structure as described in claim 1, characterized in that, Soft thermally conductive silicone is provided between the first wave segment and the second wave segment and the optoelectronic module, respectively; The top of the first wave segment and the inner wall of the fixed shell are abutted by elastic compression, and the bottom of the second wave segment and the inner wall of the fixed shell are abutted by elastic compression. An end clearance gap is provided between the end of the heat dissipation structure and the first end cover; Lateral clearance gaps are provided between the sides of the first wave segment and the second wave segment and the inner wall of the fixed shell.

3. The 1.6T waterproof optical module housing structure as described in claim 2, characterized in that, The first wave section is provided with a first flow divider plate at the end near the second end cap. The first flow divider plate is used to disperse and guide the coolant. The inlet is located at the end of the first wave section.

4. The 1.6T waterproof optical module housing structure as described in claim 3, characterized in that, Coolant flows between the first and second wave segments through two flow tubes. The photoelectric module has bayonets on both sides, through which the two flow tubes pass for fixation.

5. The 1.6T waterproof optical module housing structure as described in claim 4, characterized in that, The first wave segment and the top of the optical connector are in thermal conductive contact, and the second wave segment and the bottom of the optical connector are in thermal conductive contact. The first wave segment and the second wave segment form a positioning part with a bent structure near the first end cap. The positioning part is provided with a fixing groove for heat conduction and contact with the light insertion part.

6. A method for manufacturing an optical module, characterized in that, The method for manufacturing the 1.6T waterproof optical module housing structure according to any one of claims 1 to 5 includes: The fixing shell, the first end cap, and the second end cap are integrally molded; The electrical connector of the optoelectronic module is sealed through the first end cover, and the first end cover is sealed and connected to the first end of the fixed shell. The liquid inlet and outlet of the heat dissipation structure are sealed through the second end cover, and the optical connector of the optoelectronic module is sealed through the second end cover. After the top and bottom of the optoelectronic module are fixed by the heat dissipation structure, the heat dissipation structure and the optoelectronic module are installed into the fixed shell, and the second end cover is sealed and connected to the second end of the fixed shell.

7. The optical module manufacturing method as described in claim 6, characterized in that, The method further includes: Soft thermally conductive silicone is inserted between the first wave segment, the second wave segment, and the optoelectronic module, respectively. The top and bottom of the optoelectronic module are fixed by heat dissipation structures, so that the top of the first wave segment and the inner wall of the fixed shell are elastically squeezed together, and the bottom of the second wave segment and the inner wall of the fixed shell are elastically squeezed together; there is an end clearance gap between the end of the heat dissipation structure and the first end cover; there is a lateral clearance gap between the sides of the first wave segment and the second wave segment and the inner wall of the fixed shell.

8. The optical module manufacturing method as described in claim 7, characterized in that, The method further includes: During elastic compression between the top of the first wave segment and the inner wall of the fixed shell, and between the bottom of the second wave segment and the inner wall of the fixed shell, the elastic compression amplitude of the first wave segment and the second wave segment is detected; the end clearance gap is detected. When the elastic compression range is within the preset elastic compression range and the end clearance is within the preset end clearance range, the optical module housing is deemed qualified; when the elastic compression range is not within the preset elastic compression range, or the end clearance is not within the preset end clearance range, the optical module housing is deemed unqualified.

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