A method for applying a sizing to a shoe sole and upper bonding surface

Abstract

This invention relates to the field of shoe gluing methods, providing a method for gluing the bonding surface between the sole and upper of a shoe. The method includes: an elastic film is fixed on a fixing base, forming a cavity between the fixing base and the upper of the elastic film; adhesive is applied to the elastic film; the upper or sole is molded with a shoe mold; the elastic film is located between the shoe mold and the upper or sole and deforms; the top surface of the elastic film coated with adhesive is the gluing surface, and the bottom surface is the pressing surface; the adhesive on the elastic film is applied to the upper or sole, forming a uniformly thick adhesive layer on the upper or sole; after gluing is completed, the upper or sole is demolded from the shoe mold for the next round of gluing. This invention enables stable and precise gluing, with uniform adhesive layer thickness and minimal fluctuation in bonding strength, reducing the risk of product delamination or separation. It achieves stable and precise gluing of the bonding surface of shoe upper materials with various splicing styles, solving the technical problems of poor shoe gluing effect, high cost, and low efficiency.

Description

Technical Field

[0001] This invention relates to the field of shoe gluing methods, and more particularly to a method for gluing the adhesive surfaces of shoe soles and uppers. Background Technology

[0002] The traditional handmade shoemaking industry and the automated shoemaking production line industry have the following defects and problems: 1. Among the existing shoe upper materials with various materials and styles, the application of glue is uneven, inconsistent, uneven, jagged, and unstable, resulting in problems such as glue separation, high glue level, and low glue level.

[0003] 2. Manual operation is easily affected by factors such as experience and physical strength, resulting in uneven adhesive layer thickness, which leads to fluctuations in bonding strength and increases the risk of product delamination or separation.

[0004] 3. Manual glue application is much slower than automated equipment, making it difficult to meet the needs of large-scale production and becoming a bottleneck in the production line.

[0005] 4. Glue contains volatile organic compounds (VOCs) such as benzene and formaldehyde. Long-term exposure can easily cause respiratory diseases, skin allergies, and even cancer risks.

[0006] 5. Manual glue application relies on skilled workers, requiring long-term training and with labor costs rising year by year. This increases the burden on enterprises, as different workers have different techniques, resulting in inconsistent product quality within the same batch and affecting brand reputation.

[0007] 6. In automated shoe manufacturing production lines, glue clogging often occurs inside the glue spraying valve during the glue spraying process, frequently causing glue leakage and insufficient glue on the shoe material bonding surface.

[0008] 7. Manual control of glue quantity has low precision, which can easily lead to over-application or missed application, resulting in glue waste or increased rework costs.

[0009] 8. Reliance on traditional processes hinders technological upgrades, makes it difficult to adapt to the trend of intelligent manufacturing, and restricts the improvement of industry competitiveness.

[0010] 9. In automated shoe manufacturing production lines, when using high-viscosity oil-based glue in the glue spray valve, problems arise such as uneven glue lines, jagged edges, insufficient spread, and unevenness.

[0011] 10. In automated shoe manufacturing production lines, the speed and efficiency of changing shoe styles and adjusting production equipment are low, making it difficult to adapt to the production of multiple shoe styles. 11. In automated shoe manufacturing production lines, when applying water-based adhesives via spraying, the adhesive may exhibit a fogged edge at the bottom and flow downwards, extending beyond the bonding surface of the shoe upper.

[0012] 12. In automated shoe manufacturing production lines, when applying glue to shoe uppers made of various splicing materials, the different adhesive absorption properties of different materials can easily cause the glue line to be higher or lower than the bonding surface in some areas, resulting in shoes with high or low glue levels and thus scrapping them.

[0013] In summary, existing shoe gluing methods suffer from poor results, high costs, and low efficiency. Summary of the Invention

[0014] Therefore, to address the aforementioned problems, this invention proposes a method for applying adhesive to the bonding surfaces of the shoe sole and upper. This method solves the technical problems of poor adhesive application, high cost, and low efficiency in shoe manufacturing.

[0015] To achieve the above objectives, the present invention adopts the following technical solution: A method for applying adhesive to the bonding surfaces of a shoe sole and an upper, comprising the following steps: The elastic film is fixed on the fixing base, and the fixing base and the upper part of the elastic film form a cavity. Glue is applied to the elastic film. The upper or sole of the shoe is molded with the shoe mold. The elastic film is located between the shoe mold and the upper or sole and deforms. The top surface of the elastic film with glue is the glue application surface, and the bottom surface is the pressing surface. The glue on the elastic film is applied to the upper or sole, forming a layer of glue of uniform thickness on the upper or sole. After the glue application is completed, the upper or sole is demolded from the shoe mold, and the next round of glue application is carried out.

[0016] Further: At least one sliding part is slidably provided on the frame. The frame is provided with a driving device for driving the sliding part to move. The sliding part is provided with a moving device, which can fix and move the upper or sole. The sliding part is provided with at least one first telescopic mechanism, and the moving device is located at the telescopic end of the first telescopic mechanism. The driving device drives the sliding part to move above the upper or sole. The first telescopic mechanism drives the moving device to move and fix the upper or sole. The upper or sole is then moved above or downward to close the mold on the elastic film. After the glue is applied, the upper or sole is removed.

[0017] The moving device is a gripping device or a suction cup device, wherein the gripping device can grip the shoe upper or the suction cup device can adhere to the shoe sole.

[0018] The number of sliding parts is at least two, and the frame is provided with guide rails. The sliding parts can slide on the guide rails, and the guide rails form at least one closed loop structure. When one of the sliding parts is applying glue, the other sliding parts can move to other workstations via the guide rails to place or clamp the soles or uppers of the shoes.

[0019] The frame is equipped with a glue application device, which can apply glue to the elastic film at regular intervals and in a quantitative manner.

[0020] When the sole is glued, the shoe mold is the upper mold; when the upper is glued, the shoe mold is the sole mold. A shoe last is installed inside the upper, and the moving device and the shoe last are provided with at least one pair of mating inserts and holes.

[0021] The shoe mold is driven to move upward by the second telescopic mechanism.

[0022] The shoe mold moves upward, lifting the elastic film to form a protrusion. A small amount of glue is placed on the protrusion, while excess glue flows down to the sides. The small amount of glue on the protrusion is used to apply adhesive to the shoe upper or sole.

[0023] The frame is provided with a mounting base, and a reset mechanism is provided between the mounting base and the shoe mold. The second telescopic mechanism is provided with at least one pair of mutually cooperating positioning holes and positioning pins between it and the shoe mold. The reset mechanism is at least one reset spring, and the second telescopic mechanism is a telescopic cylinder. The positioning pin of the second telescopic mechanism is inserted into the positioning hole of the shoe mold, the shoe mold is disengaged from the mounting base, and after the glue application is completed, the shoe mold is reset on the mounting base through the reset mechanism.

[0024] There are multiple shoe molds of different sizes, and the multiple shoe molds are set on a mold device. The mold device can move one of the shoe molds to the glue application station. The mold device includes a mold wheel set on the frame and a first drive mechanism that drives the mold wheel to rotate. The multiple shoe molds are set on the mold wheel.

[0025] By adopting the aforementioned technical solution, the beneficial effects of the present invention are: 1. This invention enables stable and precise adhesive application. The elastic film is located between the shoe mold and the sole or upper. The shoe mold is closed with the sole or upper. The adhesive on the elastic film is applied to the sole or upper. The adhesive layer is of uniform thickness and has small fluctuations in bonding strength, reducing the risk of product delamination or separation. It enables stable and precise adhesive application to the bonding surfaces of shoe upper materials with various materials and styles.

[0026] 2. Avoid glue clogging inside the glue spray valve and in the pipeline when using glue.

[0027] 3. It is suitable for various high-viscosity shoe upper adhesives, avoiding problems such as uneven glue lines, jagged edges, insufficient spread, and unevenness.

[0028] 4. The adhesive has high adaptability and can be used with various high-viscosity oil-based adhesives for bonding various shoe materials, avoiding the problems of glue overflow, fogged edges, and glue running down outside the bonding surface of the shoe upper when using water-based adhesives.

[0029] 5. Utilize automated equipment to improve production efficiency and replace traditional manual production, protecting against the health risks and hazards of human contact with glue during traditional manual glue application.

[0030] 6. The improved glue application process increases the equipment's adoption rate compared to fully automated production lines on the market. Due to its simple structure, it is a single-station device, avoiding the use of industrial robots, industrial cameras, and imported glue spray valves, thus significantly reducing the equipment's manufacturing cost.

[0031] 7. The second telescopic mechanism drives the shoe mold to move upward, lifting the elastic film to form a protrusion. A small amount of glue is located at the protrusion, while excess glue flows to the side, which can control the amount of glue and improve the accuracy and efficiency of glue application. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of the adhesive application device of the present invention.

[0033] Figure 2 This is a partial structural diagram of the adhesive application device.

[0034] Figure 3 This is a partial structural diagram of the mold device.

[0035] Figure 4 This is a structural diagram of the second telescopic mechanism and the shoe mold.

[0036] Figure 5 This is an exploded view of the shoe mold and mounting base.

[0037] Figure 6 This is a schematic diagram of the structure of the elastic membrane and the fixed base.

[0038] Figure 7 This is a schematic diagram of the structure of the first telescopic mechanism and the clamping device.

[0039] Figure 8 This is a schematic diagram of the shoe last structure.

[0040] Figure 9 This is a schematic diagram of a glue application device having a first conveying device and a second conveying device.

[0041] Figure 10 This is a schematic diagram of the adhesive application device for applying adhesive to the sole of a shoe.

[0042] Figure label: 1. Frame; 11. Sliding part; 12. Drive device; 13. Guide rail; 2. Elastic membrane; 21. Fixed base; 22. Cavity; 3. Shoe mold; 30. Positioning hole; 31. Shoe sole mold; 4. Mold device; 41. Mold wheel; 42. First drive mechanism; 43. Second telescopic mechanism; 430. Positioning pin; 44. Mounting base; 45. Reset mechanism; 5. Moving device; 51. Clamping device; 510. Insert strip; 52. Suction cup device; 6. First telescopic mechanism; 7. Shoe last; 70. Insertion hole; 8. First conveying device; 9. Second conveying device. Detailed Implementation

[0043] The present invention will now be further described in conjunction with the accompanying drawings and specific embodiments.

[0044] refer to Figures 1 to 10 This embodiment provides a method for applying adhesive to the bonding surfaces of the shoe sole and the shoe upper, including the following methods: The elastic film 2 is fixed on the fixing base 21, and the fixing base 21 and the upper part of the elastic film 2 form a cavity 22. Glue is applied to the elastic film 2, and the shoe upper or sole is molded with the shoe mold 3. The elastic film 2 is located between the shoe mold 3 and the shoe upper or sole and deforms. The top surface of the elastic film 2 with glue is the glue application surface, and the bottom surface is the pressing surface. The glue on the elastic film 2 is applied to the shoe upper or sole, forming a layer of glue of uniform thickness on the shoe upper or sole. After the glue application is completed, the shoe upper or sole is demolded from the shoe mold 3, and the next round of glue application is carried out.

[0045] In one embodiment, a sliding part 11 is slidably provided on the frame 1, and a driving device 12 is provided on the frame 1 to drive the sliding part 11 to move. A moving device 5 is provided on the sliding part 11, and the moving device 5 can fix and move the upper or sole. The sliding part 11 is provided with a first telescopic mechanism 6, and the moving device 5 is located at the telescopic end of the first telescopic mechanism 6. The driving device 12 drives the sliding part 11 to move above the upper or sole, and the first telescopic mechanism 6 drives the moving device 5 to move and fix the upper or sole, and moves the upper or sole above or downward to the elastic film 2 for molding. After the glue is applied, the upper or sole is removed.

[0046] In one embodiment, the moving device 5 is a gripping device 51 or a suction cup device 52, wherein the gripping device 51 can grip the upper of the shoe or the suction cup device 52 can adhere to the sole of the shoe.

[0047] In one embodiment, there are at least two sliding parts 11. The frame 1 is provided with a guide rail 13, and the sliding parts 11 can slide on the guide rail 13. The guide rail 13 forms a closed loop structure. When one of the sliding parts 11 is applying glue, the other sliding parts 11 can move to other workstations via the guide rail 13 to place or pick up the sole or upper of the shoe.

[0048] In one embodiment, the frame 1 is provided with a glue application device, which can apply glue to the elastic film 2 at regular intervals and in a quantitative manner.

[0049] In one embodiment, when the sole is glued, the shoe mold 3 is a shoe upper mold; when the shoe upper is glued, the shoe mold 3 is a sole mold 31, and a shoe last 7 is installed inside the shoe upper. The moving device 5 and the shoe last 7 are provided with mutually cooperating inserts 510 and insert holes 70.

[0050] In one embodiment, the shoe mold 3 is driven to move upward by the second telescopic mechanism 43.

[0051] In one embodiment, the shoe mold 3 moves upward to lift the elastic film 2 to form a protrusion. A small amount of glue is located at the protrusion, and excess glue flows down to the surrounding area. The small amount of glue at the protrusion is used to apply glue to the shoe upper or sole.

[0052] In one embodiment, the frame 1 is provided with a mounting base 44, and a reset mechanism 45 is provided between the mounting base 44 and the shoe mold 3. The second telescopic mechanism 43 is provided with a positioning hole 30 and a positioning pin 430 that cooperate with each other between it and the shoe mold 3. The reset mechanism 45 is a reset spring, and the second telescopic mechanism 43 is a telescopic cylinder. The positioning pin 430 of the second telescopic mechanism 43 is inserted into the positioning hole 30 of the shoe mold 3, and the shoe mold 3 is disengaged from the mounting base 44. After the glue application is completed, the shoe mold 3 is reset on the mounting base 44 through the reset mechanism 45.

[0053] In one embodiment, there are multiple shoe molds 3 of different sizes. The multiple shoe molds 3 are arranged on a mold device 4. The mold device 4 can move one of the shoe molds 3 to the glue application station. The mold device 4 includes a mold wheel 41 arranged on the frame 1 and a first drive mechanism 42 for driving the mold wheel 41 to rotate. The multiple shoe molds 3 are arranged on the mold wheel 41.

[0054] refer to Figure 9 In one embodiment, the frame 1 is further provided with a first conveying device 8 and a second conveying device 9, the first conveying device 8 being located at the front end of the elastic film 2 and the second conveying device 9 being located at the rear end of the elastic film 2.

[0055] The first conveying device 8 and the second conveying device 9 mentioned above can be conveyor belt devices or other devices, which are well-known devices and will not be described in detail here.

[0056] refer to Figure 10 In one embodiment, when applying glue to the sole, the shoe mold 3 is the sole mold 31, and the clamping device 51 is replaced by the suction cup device 52. The sole is adsorbed by the suction cup device 52, and the glue application method is the same as the above-mentioned upper glue application method, which will not be described again here.

[0057] The number of shoe molds 3 can also be one, and shoe mold 3 can also be fixed on the frame 1 and cannot be moved, and can be replaced manually.

[0058] Each shoe mold 3 is typically a different size to accommodate different sizes of shoe uppers.

[0059] The aforementioned elastic film 2 can be made of rubber, silicone or other materials to form an elastic film, which are well-known materials and will not be described in detail here.

[0060] The aforementioned mold device 4 can also be a belt device or other devices, which are well-known devices and will not be described in detail here.

[0061] The aforementioned first drive mechanism 42 is a known device and will not be described in detail here.

[0062] The number of the aforementioned sliding parts 11 can be one, two, three, or even more, depending on the specific circumstances.

[0063] When three sliding parts 11 are provided, the three sliding parts 11 can work simultaneously, improving efficiency.

[0064] The aforementioned sliding part 11 is a roller, but it can also be a slide block or other sliding structure. These are well-known structures and will not be described in detail here.

[0065] The aforementioned drive device 12 may be a servo motor device or other devices, which are well-known devices and will not be described in detail here.

[0066] The aforementioned sliding part 11 may also be omitted, and the shoe upper or sole may be placed manually on the clamping device 51 or suction cup device 52, depending on the specific situation.

[0067] A shoe last 7 is usually installed on the shoe upper. The shoe last 7 is provided with a hole 70 corresponding to the insert strip 510 for positioning. The insert strip 510 can also be replaced by the hole 70, that is, the shoe last 7 is provided with an insert strip 510 corresponding to the hole 70, depending on the situation.

[0068] The suction cup device 52 is usually used for better adhesion to the sole, and the suction cup device 52 can also be used for adhesion and fixation to the upper, depending on the specific situation.

[0069] The aforementioned sliding part 11 can be moved to the front end via the annular guide rail 13 to work in a cycle, thereby improving efficiency.

[0070] The second telescopic mechanism 43 can also be configured as a non-movable structure, with the second telescopic mechanism 43 fixed on the frame 1 to drive the shoe mold 3 to move.

[0071] The aforementioned second telescopic mechanism 43 may also be omitted, allowing the shoe mold 3 to be moved closer to the elastic film 2, depending on the specific circumstances.

[0072] The aforementioned reset mechanism 45 can also be a rubber band or other components capable of reset, which are known components and will not be described in detail here.

[0073] The upper or sole of the present invention can also be manually operated, by manually picking up the upper or sole and moving it toward the elastic film 2 and the shoe mold 3.

[0074] The number of shoe molds 3 can also be one. The shoe mold 3 is fixed on the frame 1 or the second telescopic mechanism 43, and the shoe mold 3 is replaced manually; the specific setting depends on the situation.

[0075] The above-mentioned glue-applying device can apply glue to the elastic film 2 at regular intervals and in a quantitative manner. It is not shown in the figure, but is a well-known device and will not be described in detail here. Alternatively, the above-mentioned glue-applying device can be omitted and glue can be applied manually, depending on the specific situation.

[0076] The aforementioned clamping device 51 and suction cup device 52 are known devices and will not be described in detail here.

[0077] Although the invention has been specifically shown and described in conjunction with preferred embodiments, those skilled in the art should understand that various changes in form and detail may be made to the invention without departing from the spirit and scope of the invention as defined in the appended claims, all of which shall be within the scope of protection of the invention.

Claims

1. A method of applying a shoe sole and upper bonding surface sizing, characterized by: Including the following methods: The elastic film is fixed on the fixing base, and the fixing base and the upper part of the elastic film form a cavity. Glue is applied to the elastic film. The upper or sole of the shoe is molded with the shoe mold. The elastic film is located between the shoe mold and the upper or sole and deforms. The top surface of the elastic film with glue is the glue application surface, and the bottom surface is the pressing surface. The glue on the elastic film is applied to the upper or sole, forming a layer of glue with a uniform thickness on the upper or sole. After the glue application is completed, the upper or sole is demolded from the shoe mold and the next round of glue application is carried out. The shoe mold moves upward, lifting the elastic film to form a protrusion. A small amount of glue is placed on the protrusion, while excess glue flows down to the sides. The small amount of glue on the protrusion is used to apply adhesive to the shoe upper or sole.

2. The method for applying adhesive to the bonding surfaces of the sole and upper according to claim 1, characterized in that: It also includes a frame, on which at least one sliding part is slidably provided. The frame is provided with a drive device for driving the sliding part to move. The sliding part is provided with a moving device, which can fix and move the upper or sole. The sliding part is provided with at least one first telescopic mechanism, and the moving device is located at the telescopic end of the first telescopic mechanism. The drive device drives the sliding part to move above the upper or sole. The first telescopic mechanism drives the moving device to move and fix the upper or sole. The drive device drives the sliding part to move the upper or sole above the elastic film. The first telescopic mechanism drives the moving device downward to close the mold. After the glue is applied, the upper or sole is removed.

3. The method for applying adhesive to the bonding surfaces of the sole and upper according to claim 2, characterized in that: The moving device is a gripping device or a suction cup device, wherein the gripping device can grip the shoe upper or the suction cup device can adhere to the shoe sole.

4. The method for applying adhesive to the bonding surfaces of the sole and upper according to claim 2, characterized in that: The number of sliding parts is at least two, and the frame is provided with guide rails. The sliding parts can slide on the guide rails, and the guide rails form at least one closed loop structure. When one of the sliding parts is applying glue, the other sliding parts can move to other workstations via the guide rails to place or clamp the soles or uppers of the shoes.

5. The method for applying adhesive to the bonding surfaces of the sole and upper according to claim 2, characterized in that: The frame is equipped with a glue application device, which can apply glue to the elastic film at regular intervals and in a quantitative manner.

6. The method for applying adhesive to the bonding surfaces of the sole and upper according to claim 2, characterized in that: When the sole is glued, the shoe mold is the upper mold; when the upper is glued, the shoe mold is the sole mold. A shoe last is installed inside the upper, and the moving device and the shoe last are provided with at least one pair of mating inserts and holes.

7. A method for applying adhesive to the bonding surface between the sole and the upper according to any one of claims 2 to 6, characterized in that: The shoe mold is driven to move upward by the second telescopic mechanism.

8. The method for applying adhesive to the bonding surfaces of the sole and upper according to claim 7, characterized in that: The frame is provided with a mounting base, and a reset mechanism is provided between the mounting base and the shoe mold. The second telescopic mechanism is provided with at least one pair of mutually cooperating positioning holes and positioning pins between it and the shoe mold. The reset mechanism is at least one reset spring, and the second telescopic mechanism is a telescopic cylinder. The positioning pin of the second telescopic mechanism is inserted into the positioning hole of the shoe mold, the shoe mold is disengaged from the mounting base, and after the glue application is completed, the shoe mold is reset on the mounting base through the reset mechanism.

9. The method for applying adhesive to the bonding surfaces of the sole and upper according to claim 7, characterized in that: There are multiple shoe molds of different sizes, and the multiple shoe molds are set on a mold device. The mold device can move one of the shoe molds to the glue application station. The mold device includes a mold wheel set on the frame and a first drive mechanism that drives the mold wheel to rotate. The multiple shoe molds are set on the mold wheel.

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