Resin composition and article thereof

Abstract

The present application relates to a resin composition and products thereof, the resin composition comprising at least an epoxy resin, a mixed filler and a curing agent, the mixed filler comprising a first filler, a second filler and a third filler; wherein the first filler is a nano filler with a particle size D 50 of 10-100 nm, a thermal conductivity of 10-200 W / mk, and a ratio of the dielectric constant of the first filler to the epoxy resin of 1:3-3:1; the second filler is a spherical filler with a particle size D 50 of 10-40 microns, a thermal conductivity of 50-200 W / mk, and a ratio of the dielectric constant of the second filler to the epoxy resin of 1:3-3:1; and the third filler is a flaky filler with a particle size D 50 of 20-40 microns, a thermal conductivity of greater than or equal to 150 W / mk, and a ratio of the dielectric constant of the third filler to the epoxy resin of 1:3-3:1. The insulating adhesive film and the prepreg made of the resin composition have excellent thermal conductivity, insulation and adhesion, so that the metal substrate and the circuit substrate can meet the use requirements.

Description

Technical Field

[0001] This invention relates to the field of electronic industry technology, and in particular to resin compositions and articles thereof. Background Technology

[0002] As electronic products develop towards being lighter, thinner, shorter, smaller, higher-density, and more multifunctional, the assembly density and integration of components on metal substrates and circuit boards are becoming increasingly higher. The heat generated per unit area during operation is also increasing. If this heat cannot be dissipated in time, the reliability and lifespan of electronic products will decrease. Therefore, the thermal conductivity requirements for insulating films and prepregs are becoming increasingly stringent.

[0003] In traditional technologies, fillers with different morphologies and particle sizes are often used to improve the thermal conductivity of insulating films and prepregs. However, fillers with different morphologies and particle sizes have different distribution effects in the resin. If the selection and dosage of fillers with different morphologies and particle sizes are not within a specific range, the adhesiveness and / or insulation of the insulating film and prepreg will deteriorate, causing the metal substrate and circuit board to fail to meet the application requirements. Summary of the Invention

[0004] Therefore, it is necessary to provide a resin composition and its products to address the above problems. The insulating film and prepreg made from the resin composition have excellent thermal conductivity, insulation and adhesion, so that the metal substrate and circuit board can meet the application requirements.

[0005] A resin composition comprising an epoxy resin, a mixed filler, and a curing agent, wherein the mixed filler comprises a first filler, a second filler, and a third filler;

[0006] The first filler is a nanofiller with a particle size D. 50 The dielectric constant of the first filler is 10nm-100nm, the thermal conductivity is 10W / mk-200W / mk, and the ratio of the dielectric constant of the first filler to that of the epoxy resin is 1:3-3:1.

[0007] The second packing material is a spherical packing material with a particle size D. 50 The filler has a diameter of 10μm-40μm and a thermal conductivity of 50W / mk-200W / mk. The ratio of the dielectric constant of the second filler to that of the epoxy resin is 1:3-3:1.

[0008] The third packing material is a sheet-like packing material with a particle size D. 50 The filler has a diameter of 20μm-40μm and a thermal conductivity greater than or equal to 150W / mk. The ratio of the dielectric constant of the third filler to that of the epoxy resin is 1:3-3:1.

[0009] In one embodiment, the first packing material has a mass fraction of 3%-7% in the mixed packing material, the second packing material has a mass fraction of 20%-40% in the mixed packing material, and the third packing material has a mass fraction of 57%-73% in the mixed packing material.

[0010] In one embodiment, the dielectric constant ratio of the second filler to the epoxy resin is 1:3-2:1;

[0011] And / or, the dielectric constant ratio of the third filler to the epoxy resin is 1:3-4:3.

[0012] In one embodiment, the dielectric constants of the first filler, the second filler, and the third filler are each independently selected from 2 to 9;

[0013] And / or, the ferromagnetic material content of the first packing, the second packing and the third packing is all below 20 ppm.

[0014] In one embodiment, the first filler is selected from at least one of aluminum nitride, silicon nitride, boron nitride, aluminum oxide, crystalline silica powder, fused silica powder, and aluminum hydroxide;

[0015] And / or, the second filler is selected from at least one of boron nitride, silicon micro powder, aluminum nitride, silicon nitride, and silicon carbide;

[0016] And / or, the third filler is selected from at least one of boron nitride, aluminum nitride, and silicon nitride.

[0017] In one embodiment, the epoxy resin has a softening point below 60°C;

[0018] And / or, the dielectric constant of the epoxy resin is 3-6;

[0019] And / or, the content of ferromagnetic substances in the epoxy resin is below 20 ppm;

[0020] And / or, the chloride ion content of the epoxy resin is below 40 ppm.

[0021] In one embodiment, the epoxy resin is selected from at least one of bisphenol type epoxy resin, phenolic epoxy resin, naphthalene type epoxy resin, DCPD type epoxy resin, fluorene type epoxy resin, triphenylmethane type epoxy resin, dimer acid modified bisphenol type epoxy resin, bicyclic epoxy resin, glycidylamine type epoxy resin, crystalline epoxy resin and biphenyl type epoxy resin.

[0022] In one embodiment, the particle size of the curing agent is 5μm-15μm;

[0023] And / or, the curing agent is selected from at least one of phenolic resin, cyanate ester resin, benzoxazine resin, reactive ester resin, amine curing agent, acid anhydride curing agent, diaminophenyl sulfone, and hydroxyl curing agent.

[0024] In one embodiment, the amount of the mixed filler is 200-900 parts by weight and the amount of the curing agent is 2-40 parts by weight, based on 100 parts by weight of epoxy resin.

[0025] In one embodiment, the resin composition further includes a toughening resin, wherein the toughening resin is used in the resin composition in an amount of 5 to 10 parts by weight, based on 100 parts by weight of epoxy resin.

[0026] And / or, the resin composition further includes a dispersant, wherein the amount of the dispersant in the resin composition is 0.5 parts by weight to 2 parts by weight, based on 100 parts by weight of epoxy resin;

[0027] And / or, the resin composition further includes a leveling agent, wherein the leveling agent is used in the resin composition in an amount of 0.5 parts by weight to 2 parts by weight, based on 100 parts by weight of epoxy resin.

[0028] And / or, the resin composition further includes a coupling agent, wherein the amount of the coupling agent in the resin composition is 0.5 parts by weight to 2 parts by weight, based on 100 parts by weight of epoxy resin;

[0029] And / or, the resin composition further includes a flame retardant, wherein the amount of the flame retardant in the resin composition is 0.5 parts by weight to 2 parts by weight, based on 100 parts by weight of epoxy resin.

[0030] And / or, the resin composition further includes a solvent.

[0031] An article made using the aforementioned resin composition, the article comprising a prepreg, an insulating film, a circuit board, a metal substrate, and a printed circuit board.

[0032] In the resin composition of this invention, by using three fillers with different morphologies, particle sizes, and thermal conductivity, thermal conductive pathways can be better formed, improving thermal conductivity. Simultaneously, the combined introduction of these three fillers can both increase the critical electric field triggering overall breakdown and reduce internal defects, thereby simultaneously improving breakdown voltage and peel strength. Furthermore, by limiting the ratio of the dielectric constants of these three fillers to the epoxy resin, electric field distortion at the polymer interface can be reduced, further improving breakdown voltage and peel strength. Therefore, insulating films and prepregs made using the resin composition exhibit excellent thermal conductivity, insulation, and adhesion, enabling metal substrates and circuit boards to meet application requirements. Detailed Implementation

[0033] To facilitate understanding of the present invention, it will be described in more detail below. However, it should be understood that the present invention can be implemented in many different forms and is not limited to the embodiments or examples described herein. Rather, these embodiments or examples are provided to make the disclosure of the present invention more thorough and complete.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the specification of this invention is for the purpose of describing particular embodiments or examples only and is not intended to limit the invention. The optional scope of the term "and / or" as used herein includes any one of two or more of the related listed items, as well as any and all combinations of the related listed items, including any two related listed items, any more related listed items, or a combination of all related listed items.

[0035] In this invention, numerical ranges are involved. Unless otherwise specified, the numerical ranges are considered continuous and include the minimum and maximum values ​​of the range, as well as every value between the minimum and maximum values. Furthermore, when the range refers to integers, it includes every integer between the minimum and maximum values ​​of the range. Additionally, when multiple ranges are provided to describe features or characteristics, the ranges may be merged. In other words, unless otherwise specified, all ranges disclosed herein should be understood to include any and all subranges to which they are included.

[0036] The resin composition provided by the present invention includes at least epoxy resin, mixed filler and curing agent, and is mainly used to prepare insulating film and prepreg, and to prepare metal substrate using the insulating film and to prepare circuit board using the prepreg.

[0037] Specifically, the mixed packing includes a first packing, a second packing, and a third packing; wherein the first packing is a nano-packing with a particle size D. 50 The particle size is 10nm-100nm, and the thermal conductivity is 10W / mk-200W / mk; the second filler is a spherical filler with a particle size D. 50 The particle size is 10μm-40μm, and the thermal conductivity is 50W / mk-200W / mk; the third packing is a sheet-like packing with a particle size D. 50The particle size is 20μm-40μm, and the thermal conductivity is greater than or equal to 150W / mk. Therefore, by using three fillers with different morphologies, particle sizes, and thermal conductivity, thermal conductive pathways can be better formed, improving thermal conductivity. At the same time, the combined introduction of these three fillers can both increase the critical electric field that triggers overall breakdown and reduce internal defects, thereby simultaneously improving the breakdown voltage and peel strength of the insulating film and the prepreg.

[0038] In addition, the ratio of the dielectric constant (Dk) of epoxy resin and filler also affects the adhesion and insulation of insulating film and prepreg. Therefore, the present invention further limits the ratio of the dielectric constant of the first filler, the second filler, the third filler and the epoxy resin to be between 1:3 and 3:1. By limiting the ratio of the dielectric constant of the three fillers and epoxy resin, the electric field distortion at the polymer interface can be reduced, thereby improving the adhesion and insulation of insulating film and prepreg.

[0039] Furthermore, when the dielectric constant ratio of the second filler to the epoxy resin is 1:3-2:1; and / or when the dielectric constant ratio of the third filler to the epoxy resin is 1:3-4:3, the adhesion and insulation properties of the insulating film and the prepreg can be further improved.

[0040] In the mixed filler, the proportions of the first filler, the second filler, and the third filler are different, resulting in slight differences in the adhesion, insulation, and thermal conductivity of the insulating film and the prepreg. Preferably, when the mass fraction of the first filler in the mixed filler is 3%-7%, the mass fraction of the second filler in the mixed filler is 20%-40%, and the mass fraction of the third filler in the mixed filler is 57%-73%, the resin composition has better fluidity and can further improve the adhesion, insulation, and thermal conductivity of the insulating film and the prepreg.

[0041] Furthermore, the Dk values ​​of the first filler, the second filler, and the third filler are each independently selected from 2-9, which is beneficial for improving the insulation properties of the insulating film and the prepreg.

[0042] Meanwhile, during the preparation, transportation, and storage of fillers, ferromagnetic substances will inevitably be introduced. The presence of ferromagnetic substances will reduce the insulation of the insulating film and the prepreg. Therefore, it is preferable that the ferromagnetic substance content of the first filler, the second filler, and the third filler is all below 20 ppm, which is also beneficial to improving the insulation of the insulating film and the prepreg.

[0043] Optionally, the first filler is selected from at least one of aluminum nitride, silicon nitride, boron nitride, alumina, crystalline silicon micro powder, fused silicon micro powder, and aluminum hydroxide; the second filler is selected from at least one of boron nitride, silicon micro powder, aluminum nitride, silicon nitride, and silicon carbide; and the third filler is selected from at least one of boron nitride, aluminum nitride, and silicon nitride.

[0044] It should be noted that the morphology of the first filler is at least one of fibrous, flake, angular or spherical. In addition, the particle size of the first filler, the second filler and the third filler refers to the straight-line distance between the two longest points in the projected profile of the filler when it is in a stable position. D50 is the particle size value when the cumulative distribution percentage reaches 50%.

[0045] The present invention preferably uses epoxy resin with a softening point below 60°C, which can improve the fluidity of the resin composition, thereby improving the density of the insulating film and the prepreg, and further improving the thermal conductivity, insulation and adhesion of the insulating film.

[0046] Furthermore, when the Dk of the epoxy resin is 3-6, and / or the ferromagnetic material content of the epoxy resin is below 20 ppm, and / or the chloride ion content of the epoxy resin is below 40 ppm, it is beneficial to improve the insulation of the insulating film and the prepreg.

[0047] Optionally, the epoxy resin is selected from at least one of bisphenol type epoxy resin, phenolic epoxy resin, naphthalene type epoxy resin, DCPD type epoxy resin, fluorene type epoxy resin, triphenylmethane type epoxy resin, dimer acid modified bisphenol type epoxy resin, bicyclic epoxy resin, glycidylamine type epoxy resin, crystalline epoxy resin and biphenyl type epoxy resin.

[0048] Optionally, the curing agent is selected from at least one of phenolic resin, cyanate ester resin, benzoxazine resin, reactive ester resin, amine curing agent, acid anhydride curing agent, diaminophenyl sulfone, and hydroxyl curing agent, more preferably at least one of amine curing agent and diaminophenyl sulfone. Furthermore, the particle size of the curing agent is preferably 5μm-15μm, for example, amine curing agent and / or diaminophenyl sulfone with a particle size of 5μm-15μm are preferred. In this way, the contact area between the curing agent and the system can be optimized, thereby optimizing the reaction rate and curing degree, which is conducive to the formation of a cross-linked network structure and improving the thermal conductivity, adhesiveness, and insulation of the insulating film and prepreg.

[0049] Optionally, based on 100 parts by weight of epoxy resin, the amount of the mixed filler is 200-900 parts by weight, and the amount of the curing agent is 2-40 parts by weight.

[0050] Optionally, the resin composition further includes a toughening resin selected from one or more of hydroxyl-terminated polybutadiene, styrene-butadiene rubber, core-shell rubber, carboxyl-terminated nitrile butadiene rubber, polyacrylate rubber, and epoxy resins modified therewith, SEBS triblock polymers, and phenolic resins. The amount of the toughening resin in the resin composition is 5 to 10 parts by weight based on 100 parts by weight of epoxy resin. By adding the toughening resin, the flexibility of the insulating film and prepreg can be improved, while the elastic modulus of the insulating film and prepreg can be reduced, thereby reducing the warpage of the metal substrate.

[0051] Optionally, the resin composition further includes at least one of a dispersant, a leveling agent, a coupling agent, and a flame retardant. Based on 100 parts by weight of epoxy resin, the amount of the dispersant in the resin composition is 0.5 parts by weight to 2 parts by weight, the amount of the leveling agent in the resin composition is 0.5 parts by weight to 2 parts by weight, the amount of the coupling agent in the resin composition is 0.5 parts by weight to 2 parts by weight, and the amount of the flame retardant in the resin composition is 0.5 parts by weight to 2 parts by weight.

[0052] It should be noted that the resin composition also includes organic solvents such as toluene, acetone, xylene, and methyl ethyl ketone.

[0053] The present invention also provides an article made using the resin composition described above, the article comprising a prepreg, an insulating film, a circuit board, a metal substrate, and a printed circuit board.

[0054] Specifically, the metal substrate generally includes a metal plate and an insulating film layer and a conductive layer sequentially stacked on at least one surface of the metal plate. The metal plate is preferably an aluminum plate, etc. The insulating film layer is formed by pressing one or more layers of insulating film as described above. The conductive layer is selected from conductive materials such as copper foil and aluminum foil, preferably copper foil.

[0055] It is understood that in preparing an insulating film, the resin composition is generally formulated into a slurry, and then the slurry is coated onto the surface of a support film using a coating process. After drying, the support film is removed to obtain the insulating film. The support film is preferably at least one of polyethylene terephthalate (PET) film, polyimide (PI) film, and polypropylene (BOPP) film. In preparing a metal substrate, a metal plate, at least one insulating film, and a conductive layer are sequentially stacked and then pressed together to obtain the metal substrate.

[0056] Specifically, the prepreg includes a reinforcing material and a resin composition as described above attached to the reinforcing material.

[0057] The present invention does not limit the specific method for preparing semi-cured sheets from resin compositions. The resin composition can be formed on the reinforcing material by impregnation and / or coating, and then dried to obtain a semi-cured sheet.

[0058] In this invention, there are no particular limitations on the reinforcing material, which is usually glass fiber cloth.

[0059] Specifically, the circuit board includes an insulating layer and a conductive layer disposed on at least one surface of the insulating layer. The insulating layer is formed by pressing one or more prepregs as described above. The conductive layer is selected from conductive materials such as copper foil and aluminum foil. This invention does not limit the selection of such materials, but copper foil is preferred.

[0060] Specifically, the printed circuit board is made of a circuit board or metal substrate as described above.

[0061] Specifically, printed circuit boards are mainly made from the circuit substrate or metal substrate through processes such as drilling, hole filling, micro-etching, pre-dip, activation, acceleration, chemical copper plating, and copper thickening.

[0062] The technical solution of the present invention will be further described below through specific embodiments. However, those skilled in the art will understand that the following embodiments are only for illustrating the present invention and should not be regarded as limiting the scope of the present invention. Unless otherwise specified, specific conditions in the embodiments are performed under conventional conditions or conditions recommended by the manufacturer. Reagents or instruments used without specified manufacturers are all commercially available conventional products.

[0063] Example 1

[0064] 20 parts by weight of nanosheet BN (manufacturer's brand: Beijing Nachen NC-35, D) 50 =35nm, Dk=3.5, thermal conductivity 150W / m·K, ferromagnetic material content 18ppm) were added to 100 parts by weight of bifunctional naphthalene-type epoxy resin (brand name HP-4032D, Dk=3, softening point 25℃, ferromagnetic material content 15ppm, chloride ion content 32ppm), and stirred evenly to obtain a slurry. 150 parts by weight of spherical silica (manufacturer's brand: Jiangsu Lianrui NQ1120D, D...) were then added. 50 =13μm, Dk=4, thermal conductivity 55W / m·K, ferromagnetic material content 8ppm), add to the slurry and stir evenly, then add 350 parts by weight of flake BN (manufacturer's brand: Baitu BBN35, D 50=30μm, Dk=3.8, thermal conductivity 200W / m·K, ferromagnetic material content 17ppm) are added to the slurry and stirred at high speed until homogeneous to obtain a mixed slurry. Then, 3 parts by weight of dicyandiamide (particle size 10μm) are added to the mixed slurry and stirred at high speed until homogeneous to ensure uniform dispersion of resin and filler. Finally, the mixture is stirred at low speed to degas and filtered to obtain a slurry of resin composition.

[0065] The prepared resin composition slurry is coated onto the surface of a PET film, dried, and then the PET film is removed to obtain an insulating film. An aluminum plate, insulating film, and copper foil are then sequentially stacked and pressed together to obtain a metal substrate.

[0066] Example 2

[0067] 30 parts by weight of spherical alumina (manufacturer's brand: Shanghai Supermicro Nano CW-Al2O3-001, D) 50 =10nm, Dk=9, thermal conductivity 40W / m·K, ferromagnetic material content 5ppm) were added to 100 parts by weight of bisphenol type epoxy resin (brand name YX7110, Dk=4, softening point 60℃, ferromagnetic material content 18ppm, chloride ion content 36ppm) and 5 parts by weight of core-shell rubber (brand name MX-150), and stirred evenly to obtain a slurry. 350 parts by weight of spherical silica (manufacturer's brand: Jiangsu Lianrui NQ1120D, D...) were then added. 50 =13μm, Dk=4, thermal conductivity 55W / m·K, ferromagnetic material content 8ppm), added to the slurry and stirred evenly, and then 520 parts by weight of flake BN (manufacturer's brand: Baitu BBN35, D) were added. 50 =30μm, Dk=3.8, thermal conductivity 200W / m·K, ferromagnetic material content 17ppm) are added to the slurry and stirred at high speed until homogeneous to obtain a mixed slurry. Then, 3 parts by weight of dicyandiamide (particle size 5μm) are added to the mixed slurry and stirred at high speed until homogeneous to ensure uniform dispersion of resin and filler. Finally, the mixture is stirred at low speed to degas and filtered to obtain a slurry of resin composition.

[0068] The prepared resin composition slurry is coated onto the surface of a PET film, dried, and then the PET film is removed to obtain an insulating film. An aluminum plate, insulating film, and copper foil are then sequentially stacked and pressed together to obtain a metal substrate.

[0069] Example 3

[0070] 23 parts by weight of nanosheet BN (manufacturer's brand: Beijing Nachen NC-35, D) 50=35nm, Dk=3.5, thermal conductivity 150W / m·K, ferromagnetic material content 18ppm) was added to 100 parts by weight of bisphenol type epoxy resin (brand name PLCLON 830, Dk=4.5, softening point 25℃, ferromagnetic material content 14ppm, chloride ion content 28ppm) and stirred evenly to obtain a slurry. 80 parts by weight of spherical boron nitride (manufacturer's brand: Suzhou Jinyi SN20, Dk=35nm, Dk=3.5, thermal conductivity 150W / m·K, ferromagnetic material content 18ppm) was added to obtain a slurry. 50 =20μm, Dk=3.8, thermal conductivity 180W / m·K, ferromagnetic material content 5ppm), add to the slurry and stir evenly, then add 250 parts by weight of flake BN (manufacturer's brand: Baitu BBN35, D 50 =30μm, Dk=3.8, thermal conductivity 200W / m·K, ferromagnetic material content 17ppm) are added to the slurry and stirred at high speed until homogeneous to obtain a mixed slurry. Then, 3 parts by weight of dicyandiamide (particle size 15μm) are added to the mixed slurry and stirred at high speed until homogeneous to ensure uniform dispersion of resin and filler. Finally, the mixture is stirred at low speed to degas and filtered to obtain a slurry of resin composition.

[0071] The prepared resin composition slurry is coated onto the surface of a PET film, dried, and then the PET film is removed to obtain an insulating film. An aluminum plate, insulating film, and copper foil are then sequentially stacked and pressed together to obtain a metal substrate.

[0072] Example 4

[0073] 15 parts by weight of nanosheet BN (manufacturer's brand: Beijing Nachen NC-35, D) 50 =35nm, Dk=3.5, thermal conductivity 150W / m·K, ferromagnetic material content 18ppm) were added to 100 parts by weight of bifunctional naphthalene-type epoxy resin (brand name HP-4032D, Dk=3, softening point 25℃, ferromagnetic material content 15ppm, chloride ion content 32ppm), and stirred evenly to obtain a slurry. 100 parts by weight of spherical silica (manufacturer's brand: Jiangsu Lianrui NQ1120D, D...) were then added. 50 =13μm, Dk=4, thermal conductivity 55W / m·K, ferromagnetic material content 8ppm), add to the slurry and stir evenly, then add 500 parts by weight of flake BN (manufacturer's brand: Baitu BBN35, D 50 =30μm, Dk=3.8, thermal conductivity 200W / m·K, ferromagnetic material content 17ppm) are added to the slurry and stirred at high speed until homogeneous to obtain a mixed slurry. Then, 3 parts by weight of dicyandiamide (particle size 10μm) are added to the mixed slurry and stirred at high speed until homogeneous to ensure uniform dispersion of resin and filler. Finally, the mixture is stirred at low speed to degas and filtered to obtain a slurry of resin composition.

[0074] The prepared resin composition slurry is coated onto the surface of a PET film, dried, and then the PET film is removed to obtain an insulating film. An aluminum plate, insulating film, and copper foil are then sequentially stacked and pressed together to obtain a metal substrate.

[0075] Example 5

[0076] 20 parts by weight of nanosheet BN (manufacturer's brand: Beijing Nachen NC-35, D) 50 =35nm, Dk=3.5, thermal conductivity 150W / m·K, ferromagnetic material content 18ppm) were added to 100 parts by weight of bifunctional naphthalene-type epoxy resin (brand name HP-4032D, Dk=3, softening point 25℃, ferromagnetic material content 15ppm, chloride ion content 32ppm), and stirred evenly to obtain a slurry. 150 parts by weight of spherical alumina (manufacturer's brand: Suzhou Jinyi QY10, D) were added. 50 =13μm, Dk=9, thermal conductivity 70W / m·K, ferromagnetic material content 8ppm), add to the slurry and stir evenly, then add 350 parts by weight of flake BN (manufacturer's brand: Baitu BBN35, D 50 =30μm, Dk=3.8, thermal conductivity 200W / m·K, ferromagnetic material content 17ppm) are added to the slurry and stirred at high speed until homogeneous to obtain a mixed slurry. Then, 3 parts by weight of dicyandiamide (particle size 10μm) are added to the mixed slurry and stirred at high speed until homogeneous to ensure uniform dispersion of resin and filler. Finally, the mixture is stirred at low speed to degas and filtered to obtain a slurry of resin composition.

[0077] The prepared resin composition slurry is coated onto the surface of a PET film, dried, and then the PET film is removed to obtain an insulating film. An aluminum plate, insulating film, and copper foil are then sequentially stacked and pressed together to obtain a metal substrate.

[0078] Example 6

[0079] 20 parts by weight of nanosheet BN (manufacturer's brand: Beijing Nachen NC-35, D) 50 =35nm, Dk=3.5, thermal conductivity 150W / m·K, ferromagnetic material content 18ppm) were added to 100 parts by weight of bifunctional naphthalene-type epoxy resin (brand name HP-4032D, Dk=3, softening point 25℃, ferromagnetic material content 15ppm, chloride ion content 32ppm), and stirred evenly to obtain a slurry. 150 parts by weight of spherical boron nitride (manufacturer's brand: Suzhou Jinyi SN20, D) were added. 50 =20μm, Dk=3.8, thermal conductivity 180W / m·K, ferromagnetic material content 5ppm), added to the slurry and stirred evenly, and then 350 parts by weight of flake silicon nitride (manufacturer's brand: Qingdao Cixing CX-N30, D50 =30μm, Dk=8.5, thermal conductivity 160W / m·K, ferromagnetic material content 17ppm) are added to the slurry and stirred at high speed until homogeneous to obtain a mixed slurry. Then, 3 parts by weight of dicyandiamide (particle size 10μm) are added to the mixed slurry and stirred at high speed until homogeneous to ensure uniform dispersion of resin and filler. Finally, the mixture is stirred at low speed to degas and filtered to obtain a slurry of resin composition.

[0080] The prepared resin composition slurry is coated onto the surface of a PET film, dried, and then the PET film is removed to obtain an insulating film. An aluminum plate, insulating film, and copper foil are then sequentially stacked and pressed together to obtain a metal substrate.

[0081] Example 7

[0082] 20 parts by weight of nanosheet BN (manufacturer's brand: Beijing Nachen NC-35, D) 50 =35nm, Dk=3.5, thermal conductivity 150W / m·K, ferromagnetic material content 18ppm) were added to 100 parts by weight of dicyclopentadiene phenol epoxy resin (brand name XD1000, Dk=3.1, softening point 74℃, ferromagnetic material content 18ppm, chloride ion content 35ppm) and stirred evenly to obtain a slurry. 150 parts by weight of spherical silica (manufacturer's brand: Jiangsu Lianrui NQ1120D, D...) were then added. 50 =13μm, Dk=4, thermal conductivity 55W / m·K, ferromagnetic material content 8ppm), add to the slurry and stir evenly, then add 350 parts by weight of flake BN (manufacturer's brand: Baitu BBN35, D 50 =30μm, Dk=3.8, thermal conductivity 200W / m·K, ferromagnetic material content 17ppm) are added to the slurry and stirred at high speed until homogeneous to obtain a mixed slurry. Then, 3 parts by weight of dicyandiamide (particle size 10μm) are added to the mixed slurry and stirred at high speed until homogeneous to ensure uniform dispersion of resin and filler. Finally, the mixture is stirred at low speed to degas and filtered to obtain a slurry of resin composition.

[0083] The prepared resin composition slurry is coated onto the surface of a PET film, dried, and then the PET film is removed to obtain an insulating film. An aluminum plate, insulating film, and copper foil are then sequentially stacked and pressed together to obtain a metal substrate.

[0084] Example 8

[0085] 20 parts by weight of nanosheet BN (manufacturer's brand: Beijing Nachen NC-35, D) 50=35nm, Dk=3.5, thermal conductivity 150W / m·K, ferromagnetic material content 18ppm) were added to 100 parts by weight of bisphenol type epoxy resin (brand name YX7110, Dk=4, softening point 60℃, ferromagnetic material content 18ppm, chloride ion content 36ppm), and stirred evenly to obtain a slurry. 150 parts by weight of spherical silicon carbide (manufacturer's brand: Xi'an Boer BESC-T14, Dk=35nm, Dk=3.5, thermal conductivity 150W / m·K, ferromagnetic material content 18ppm, chloride ion content 36ppm) were added to obtain a slurry. 50 =14μm, Dk=9.5, thermal conductivity 85W / m·K, ferromagnetic material content 12ppm), added to the slurry and stirred evenly, and then 350 parts by weight of flake aluminum nitride (manufacturer's grade: Baitu TA-S30, D) were added. 50 =34μm, Dk=9.5, thermal conductivity 170W / m·K, ferromagnetic material content 19ppm) are added to the slurry and stirred at high speed until homogeneous to obtain a mixed slurry. Then, 3 parts by weight of dicyandiamide (particle size 5μm) are added to the mixed slurry and stirred at high speed until homogeneous to ensure uniform dispersion of resin and filler. Finally, the mixture is stirred at low speed to degas and filtered to obtain a slurry of resin composition.

[0086] The prepared resin composition slurry is coated onto the surface of a PET film, dried, and then the PET film is removed to obtain an insulating film. An aluminum plate, insulating film, and copper foil are then sequentially stacked and pressed together to obtain a metal substrate.

[0087] Example 9

[0088] 20 parts by weight of nanosheet-like BN (manufacturer's brand: Shanghai Supermicro Nano CW-BN-001, D) 50 =35nm, Dk=3.5, thermal conductivity 150W / m·K, ferromagnetic material content 55ppm) were added to 100 parts by weight of bifunctional naphthalene-type epoxy resin (brand name HP-4032D, Dk=3, softening point 25℃, ferromagnetic material content 15ppm, chloride ion content 32ppm), and stirred evenly to obtain a slurry. 150 parts by weight of spherical silica (manufacturer's brand: Yixin Technology YQ1120, D) were added. 50 =13μm, Dk=4, thermal conductivity 55W / m·K, ferromagnetic material content 22ppm), add to the slurry and stir evenly, then add 350 parts by weight of flake BN (manufacturer's brand: Suzhou Jinyi BN0200, D 50 =30μm, Dk=3.8, thermal conductivity 200W / m·K, ferromagnetic material content 28ppm) are added to the slurry and stirred at high speed until homogeneous to obtain a mixed slurry. Then, 3 parts by weight of dicyandiamide (particle size 10μm) are added to the mixed slurry and stirred at high speed until homogeneous to ensure uniform dispersion of resin and filler. Finally, the mixture is stirred at low speed to degas and filtered to obtain a slurry of resin composition.

[0089] The prepared resin composition slurry is coated onto the surface of a PET film, dried, and then the PET film is removed to obtain an insulating film. An aluminum plate, insulating film, and copper foil are then sequentially stacked and pressed together to obtain a metal substrate.

[0090] Example 10

[0091] 20 parts by weight of nanosheet BN (manufacturer's brand: Beijing Nachen NC-35, D) 50 =35nm, Dk=3.5, thermal conductivity 150W / m·K, ferromagnetic material content 18ppm) were added to 100 parts by weight of biphenyl-type epoxy resin (brand name NC-3000L, Dk=3.2, softening point 51℃, ferromagnetic material content 27ppm, chloride ion content 31ppm), and stirred evenly to obtain a slurry. 150 parts by weight of spherical silica (manufacturer's brand: Jiangsu Lianrui NQ1120D, D...) were then added. 50 =13μm, Dk=4, thermal conductivity 55W / m·K, ferromagnetic material content 8ppm), add to the slurry and stir evenly, then add 350 parts by weight of flake BN (manufacturer's brand: Baitu BBN35, D 50 =30μm, Dk=3.8, thermal conductivity 200W / m·K, ferromagnetic material content 17ppm) are added to the slurry and stirred at high speed until homogeneous to obtain a mixed slurry. Then, 3 parts by weight of dicyandiamide (particle size 10μm) are added to the mixed slurry and stirred at high speed until homogeneous to ensure uniform dispersion of resin and filler. Finally, the mixture is stirred at low speed to degas and filtered to obtain a slurry of resin composition.

[0092] The prepared resin composition slurry is coated onto the surface of a PET film, dried, and then the PET film is removed to obtain an insulating film. An aluminum plate, insulating film, and copper foil are then sequentially stacked and pressed together to obtain a metal substrate.

[0093] Example 11

[0094] 20 parts by weight of nanosheet BN (manufacturer's brand: Beijing Nachen NC-35, D) 50 =35nm, Dk=3.5, thermal conductivity 150W / m·K, ferromagnetic material content 18ppm) were added to 100 parts by weight of biphenyl-type epoxy resin (brand name NC-2000L, Dk=3.2, softening point 55℃, ferromagnetic material content 18ppm, chloride ion content 55ppm), and stirred evenly to obtain a slurry. 150 parts by weight of spherical silica (manufacturer's brand: Jiangsu Lianrui NQ1120D, D...) were then added. 50 =13μm, Dk=4, thermal conductivity 55W / m·K, ferromagnetic material content 8ppm), add to the slurry and stir evenly, then add 350 parts by weight of flake BN (manufacturer's brand: Baitu BBN35, D50 =30μm, Dk=3.8, thermal conductivity 200W / m·K, ferromagnetic material content 17ppm) are added to the slurry and stirred at high speed until homogeneous to obtain a mixed slurry. Then, 3 parts by weight of styrene maleic anhydride are added to the mixed slurry and stirred at high speed until homogeneous to ensure uniform dispersion of resin and filler. Finally, the mixture is stirred at low speed to degas and filtered to obtain a slurry of resin composition.

[0095] The prepared resin composition slurry is coated onto the surface of a PET film, dried, and then the PET film is removed to obtain an insulating film. An aluminum plate, insulating film, and copper foil are then sequentially stacked and pressed together to obtain a metal substrate.

[0096] Example 12

[0097] 20 parts by weight of nanosheet BN (manufacturer's brand: Beijing Nachen NC-35, D) 50 =35nm, Dk=3.5, thermal conductivity 150W / m·K, ferromagnetic material content 18ppm) were added to 100 parts by weight of bifunctional naphthalene-type epoxy resin (brand name HP-4032D, Dk=3, softening point 25℃, ferromagnetic material content 15ppm, chloride ion content 32ppm), and stirred evenly to obtain a slurry. 150 parts by weight of spherical silica (manufacturer's brand: Jiangsu Lianrui NQ1120D, D...) were then added. 50 =13μm, Dk=4, thermal conductivity 55W / m·K, ferromagnetic material content 8ppm), add to the slurry and stir evenly, then add 350 parts by weight of flake BN (manufacturer's brand: Baitu BBN35, D 50 =30μm, Dk=3.8, thermal conductivity 200W / m·K, ferromagnetic material content 17ppm) are added to the slurry and stirred at high speed until homogeneous to obtain a mixed slurry. Then, 3 parts by weight of dicyandiamide (particle size 17μm) are added to the mixed slurry and stirred at high speed until homogeneous to ensure uniform dispersion of resin and filler. Finally, the mixture is stirred at low speed to degas and filtered to obtain a slurry of resin composition.

[0098] The prepared resin composition slurry is coated onto the surface of a PET film, dried, and then the PET film is removed to obtain an insulating film. An aluminum plate, insulating film, and copper foil are then sequentially stacked and pressed together to obtain a metal substrate.

[0099] Comparative Example 1

[0100] The only difference between Comparative Example 1 and Example 1 is that the amount of nanosheet BN used is 0, and the amount of spherical silica used is 150 parts by weight. 50 The amount of 370 parts by weight of 30 μm flake-shaped BN was used.

[0101] Comparative Example 2

[0102] The only difference between Comparative Example 2 and Example 1 is that the amount of nanosheet BN used is 20 parts by weight, and the amount of spherical silica used is 0. 50 The amount of 30μm flake-shaped BN used is 500 parts by weight.

[0103] Comparative Example 3

[0104] The only difference between Comparative Example 3 and Example 1 is that the amount of nanosheet BN used is 20 parts by weight, and the amount of spherical silica used is 500 parts by weight. 50 The amount of 30μm sheet-like BN used was 0.

[0105] Comparative Example 4

[0106] The only difference between Comparative Example 4 and Example 1 is that nano-titanium dioxide (manufacturer's grade: Suzhou Jinyi TC200, D) was used. 50 =28nm, Dk=80, thermal conductivity 10W / m·K, ferromagnetic material content 18ppm) to replace nanosheet BN.

[0107] Comparative Example 5

[0108] The only difference between Comparative Example 5 and Example 1 is that spherical silicon carbide (manufacturer's grade: Xi'an Boer BESC-T14, D) was used. 50 =14nm, Dk=9.5, thermal conductivity 85W / m·K, ferromagnetic material content 12ppm) to replace spherical silicon oxide.

[0109] Comparative Example 6

[0110] The only difference between Comparative Example 6 and Example 1 is that sheet-like silicon carbide (manufacturer's brand: Xi'an Boer BESC-T30, D) was used. 50 =30nm, Dk=9.5, thermal conductivity 90W / m·K, ferromagnetic material content 12ppm) replace D 50 =30μm sheet-like BN.

[0111] Comparative Example 7

[0112] The only difference between Comparative Example 7 and Example 1 is that the manufacturer's grade of the nanosheet BN is: Beijing Nachen NC-150, D. 50 =150nm, Dk=3.5, thermal conductivity 150W / m·K, ferromagnetic material content 18ppm; Manufacturer's grade of spherical silica: Guoci Filler HSO-50, D 50 =50μm, Dk=4, thermal conductivity 60W / m·K, ferromagnetic material content 8ppm; Manufacturer's brand of sheet-like BN: Baitu BBN55, D 50=50μm, Dk=3.8, thermal conductivity 200W / m·K, ferromagnetic material content 17ppm.

[0113] Comparative Example 8

[0114] The only difference between Comparative Example 8 and Example 1 is that the manufacturer's grade of the nanosheet BN is: Beijing Nachen NC-05, D. 50 =5nm, Dk=3.5, thermal conductivity 150W / m·K, ferromagnetic material content 18ppm; Manufacturer's grade of spherical silicon dioxide: Yixin Technology YQ1045, D 50 =5μm, Dk=4, thermal conductivity 50W / m·K, ferromagnetic material content 8ppm; Manufacturer's grade of sheet-like BN: Suzhou Jinyi BN203, D 50 =10μm, Dk=3.8, thermal conductivity 180W / m·K, ferromagnetic material content 17ppm.

[0115] Comparative Example 9

[0116] 30 parts by weight of spherical alumina (manufacturer's brand: Hubei Huifu ALUNA-100, D) 50 =10nm, Dk=9, thermal conductivity 40W / m·K, ferromagnetic material content 5ppm) were added to 100 parts by weight of bifunctional naphthalene-type epoxy resin (brand name HP-4032D, Dk=3, softening point 25℃, ferromagnetic material content 15ppm, chloride ion content 32ppm), and stirred evenly to obtain a slurry. 350 parts by weight of angular silica (manufacturer's brand: Jiangsu Lianrui DC1080, Dk=9, thermal conductivity 40W / m·K, ferromagnetic material content 5ppm, chloride ion content 32ppm) were added. 50 =10μm, Dk=4, thermal conductivity 60W / m·K, ferromagnetic material content 17ppm), add to the slurry and stir evenly, then add 520 parts by weight of BN fiber (manufacturer's brand: Beijing Nachen NC-20, D 50 =20μm, Dk=3.8, thermal conductivity 150W / m·K, ferromagnetic material content 19ppm) are added to the slurry and stirred at high speed until homogeneous to obtain a mixed slurry. Then, 3 parts by weight of dicyandiamide (particle size 10μm) are added to the mixed slurry and stirred at high speed until homogeneous to ensure uniform dispersion of resin and filler. Finally, the mixture is stirred at low speed to degas and filtered to obtain a slurry of resin composition.

[0117] The prepared resin composition slurry is coated and dried to obtain an insulating film. Then, an aluminum plate, an insulating film, and a copper foil are sequentially stacked and pressed together to obtain a metal substrate.

[0118] The metal substrates prepared in the above embodiments and comparative examples were subjected to performance tests, and the results are shown in Table 1.

[0119] Thermal conductivity: Tested according to ASTM D5470 standard at a test temperature of 80℃.

[0120] Breakdown voltage: Tested according to GB / T 4722-2017 standard.

[0121] Peel strength: The peel strength of the copper foil on one side of the metal substrate was tested according to the IPC-TM-650 2.4.8 standard. The test conditions were normal peel strength, the width of the copper foil strip was 3 mm, and the tensile tilt angle was 90°±5° with the plane of the dielectric layer.

[0122] Table 1

[0123]

[0124] As can be seen from the table, the resin compositions of Examples 1-12 are used to make insulating films, and the metal substrates made from these insulating films have a thermal conductivity of over 6 W / m·K, a breakdown voltage of over 6 kV, and a peel strength of over 1.3 N / mm, which enables the metal substrates to meet the application requirements.

[0125] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0126] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A resin composition, characterized in that, The resin composition includes epoxy resin, mixed filler and curing agent. Based on 100 parts by weight of epoxy resin, the amount of mixed filler is 200 parts by weight to 900 parts by weight, and the amount of curing agent is 2 parts by weight to 40 parts by weight. The mixed filler includes a first filler, a second filler and a third filler. The first filler is a nanofiller with a particle size D. 50 The dielectric constant of the first filler is 10nm-100nm, the thermal conductivity is 10W / mk-200W / mk, and the ratio of the dielectric constant of the first filler to that of the epoxy resin is 1:3-3:

1. The second packing material is a spherical packing material with a particle size D. 50 The filler has a diameter of 10μm-40μm and a thermal conductivity of 50W / mk-200W / mk. The ratio of the dielectric constant of the second filler to that of the epoxy resin is 1:3-3:

1. The third packing material is a sheet-like packing material with a particle size D. 50 The filler has a diameter of 20μm-40μm and a thermal conductivity greater than or equal to 150W / mk. The ratio of the dielectric constant of the third filler to that of the epoxy resin is 1:3-3:

1. The first packing material has a mass fraction of 3%-7% in the mixed packing material, the second packing material has a mass fraction of 20%-40% in the mixed packing material, and the third packing material has a mass fraction of 57%-73% in the mixed packing material.

2. The resin composition according to claim 1, characterized in that, The dielectric constant ratio of the second filler to the epoxy resin is 1:3-2:1; And / or, the dielectric constant ratio of the third filler to the epoxy resin is 1:3-4:

3.

3. The resin composition according to claim 1, characterized in that, The dielectric constants of the first filler, the second filler, and the third filler are each independently selected from 2-9; And / or, the ferromagnetic material content of the first packing, the second packing and the third packing is all below 20 ppm.

4. The resin composition according to claim 1, characterized in that, The first filler is selected from at least one of aluminum nitride, silicon nitride, boron nitride, aluminum oxide, crystalline silica powder, fused silica powder, and aluminum hydroxide; And / or, the second filler is selected from at least one of boron nitride, silicon micro powder, aluminum nitride, silicon nitride, and silicon carbide; And / or, the third filler is selected from at least one of boron nitride, aluminum nitride, and silicon nitride.

5. The resin composition according to claim 1, characterized in that, The epoxy resin has a softening point below 60°C; And / or, the dielectric constant of the epoxy resin is 3-6; And / or, the content of ferromagnetic substances in the epoxy resin is below 20 ppm; And / or, the chloride ion content of the epoxy resin is below 40 ppm.

6. The resin composition according to claim 1, characterized in that, The epoxy resin is selected from at least one of bisphenol type epoxy resin, phenolic epoxy resin, naphthalene type epoxy resin, DCPD type epoxy resin, fluorene type epoxy resin, triphenylmethane type epoxy resin, dimer acid modified bisphenol type epoxy resin, glycidylamine type epoxy resin, crystalline epoxy resin and biphenyl type epoxy resin.

7. The resin composition according to claim 1, characterized in that, The particle size of the curing agent is 5μm-15μm; And / or, the curing agent is selected from at least one of phenolic resin, cyanate ester resin, benzoxazine resin, reactive ester resin, amine curing agent, acid anhydride curing agent, and hydroxyl curing agent.

8. The resin composition according to claim 1, characterized in that, The resin composition further includes a toughening resin, wherein the toughening resin is used in the resin composition in an amount of 5 to 10 parts by weight, based on 100 parts by weight of epoxy resin. And / or, the resin composition further includes a dispersant, wherein the amount of the dispersant in the resin composition is 0.5 parts by weight to 2 parts by weight, based on 100 parts by weight of epoxy resin; And / or, the resin composition further includes a leveling agent, wherein the leveling agent is used in the resin composition in an amount of 0.5 parts by weight to 2 parts by weight, based on 100 parts by weight of epoxy resin. And / or, the resin composition further includes a coupling agent, wherein the amount of the coupling agent in the resin composition is 0.5 parts by weight to 2 parts by weight, based on 100 parts by weight of epoxy resin; And / or, the resin composition further includes a flame retardant, wherein the amount of the flame retardant in the resin composition is 0.5 parts by weight to 2 parts by weight, based on 100 parts by weight of epoxy resin. And / or, the resin composition further includes a solvent.

9. An article made using the resin composition according to any one of claims 1-8, characterized in that, The products include prepreg, insulating film, circuit board, metal substrate, and printed circuit board.

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