Curved two-phase liquid variable temperature plate and radiator

Abstract

The application discloses a curved-surface two-phase liquid variable temperature plate and a radiator, and relates to the technical field of heat dissipation. The variable temperature plate comprises a first evaporation-condensation end and a second evaporation-condensation end. The first evaporation-condensation end comprises a lower shell, an evaporation-condensation plate and a first capillary structure. The lower shell is fixedly connected with the evaporation-condensation plate to form a first cavity. The second evaporation-condensation end comprises an upper shell, an evaporation-condensation plate and a second capillary structure. The upper shell is fixedly connected with the evaporation-condensation plate to form a second cavity. The middle section of the evaporation-condensation plate is arranged in a curved surface. The first cavity and the second cavity are independent of each other. The first evaporation-condensation end and the second evaporation-condensation end are connected through the evaporation-condensation plate. The second evaporation-condensation end continues to dissipate heat after the first evaporation-condensation end dissipates heat. The heat dissipation space is significantly improved. Therefore, the heat dissipation power and the temperature equalization performance of the whole variable temperature plate are improved.

Description

Technical Field

[0001] This invention relates to the field of radiator technology, and more particularly to a curved two-phase liquid-modulated heat exchanger and radiator. Background Technology

[0002] A vapor chamber is a fast heat-conducting element that utilizes the capillary structure to absorb water, rapidly transferring heat from the chip to the heat sink for dissipation. With technological advancements, while the size of a single chip remains constant, its power consumption and heat flux density increase exponentially. Given that the heat dissipation space and the chip's temperature requirements remain unchanged, a significant increase in the heat dissipation power of the heat sink is necessary. Currently, the thermal power consumption of a single chip has exceeded 1000W, and existing vapor chambers can no longer meet the heat dissipation demands.

[0003] Furthermore, the height of existing vapor chambers is within 10mm, generally 5-8mm. The inside of the vapor chamber is a vacuum cavity. Generally, the higher the vacuum level, the better the heat dissipation effect. The liquid inside is more likely to vaporize into gas. During the gas rise, the internal air pressure increases, which can cause the outer shell of the vapor chamber to bulge or crack. Therefore, the manufacturing requirements of existing vapor chambers are high, the yield rate is not high, and the heat dissipation power within the existing heat dissipation space has already reached the design limit. Summary of the Invention

[0004] To address the aforementioned problems, the present invention aims to provide a curved two-phase liquid-modulated heat exchanger and radiator. This heat exchanger utilizes a first evaporation-condensation end for basic heat dissipation, a second evaporation-condensation end for enhanced heat dissipation, and a specially shaped middle section of the evaporation-condensation plate to improve temperature uniformity. Furthermore, the first and second reflux mechanisms effectively increase the speed and volume of liquid reflux, thereby enhancing the heat dissipation power of the heat exchanger and significantly improving its heat transfer efficiency and temperature uniformity.

[0005] To achieve the above objectives, the present invention provides a curved two-phase liquid temperature-changing plate, comprising a first evaporation-condensation end and a second evaporation-condensation end; The first evaporation-condensation end includes a lower shell, an evaporation-condensation plate, and a first capillary structure. The first capillary structure is located on the inner surface of the lower shell and the lower surface of the evaporation-condensation plate. The lower shell and the evaporation-condensation plate are fixedly connected to form a first cavity, and a first working medium is provided in the first cavity. The second evaporation-condensation end includes an upper shell, an evaporation-condensation plate, and a second capillary structure. The second capillary structure is located on the inner surface of the upper shell and the upper surface of the evaporation-condensation plate. The upper shell and the evaporation-condensation plate are fixedly connected to form a second cavity, and a second working medium is provided in the second cavity. The middle section of the evaporator condenser plate is curved, the upper end of the first cavity is provided with multiple protrusions, and the lower end of the second cavity is provided with multiple grooves. The first cavity and the second cavity are independent of each other.

[0006] Preferably, the pressure in the first cavity is less than or equal to the pressure in the second cavity, and under the same pressure, the boiling point of the first working medium is higher than or equal to the boiling point of the second working medium; in the working state, the first working medium changes from liquid to gas at the lower shell and from gas to liquid at the evaporation and condensation plate, and the second working medium changes from liquid to gas at the evaporation and condensation plate and from gas to liquid at the upper shell.

[0007] Preferably, the curved surface is composed of a plurality of first protrusions and first grooves distributed at intervals, wherein the first protrusions and first grooves are configured as one or more of the following: sine wave, square, trapezoidal, and semi-circular.

[0008] Preferably, the first evaporation-condensation end is further provided with a plurality of first reflux mechanisms. The first reflux mechanism includes a first reflux plate, and a plurality of first reflux channels are provided on both sides of the first reflux plate. The upper end of the first reflux mechanism is fixedly connected to the first protrusion, and its lower end is fixedly connected to the lower shell.

[0009] Preferably, the upper width of the first reflux plate is greater than its lower width, the width of the first reflux channels is the same, and the spacing between adjacent first reflux channels gradually converges from top to bottom. The thickness of the upper end of the first reflux channel is greater than its lower thickness. A third capillary structure is provided on the outer surface of the first reflux mechanism, and the third capillary structure communicates with the first capillary structure.

[0010] Preferably, the second evaporation-condensation end is further provided with a plurality of second reflux mechanisms. The second reflux mechanism includes a second reflux plate, and a plurality of second reflux channels are provided on both sides of the second reflux plate. The second reflux mechanism is fixedly connected between the upper shell and the first groove.

[0011] Preferably, the upper width of the second reflux mechanism is smaller than its lower width, the width of the second reflux channel gradually increases from top to bottom, and the spacing between two adjacent second reflux channels gradually increases from top to bottom. The upper thickness of the second reflux channel is smaller than its lower thickness. A fourth capillary structure is provided on the outer surface of the second reflux mechanism, and the fourth capillary structure communicates with the second capillary structure.

[0012] Preferably, the second evaporator-condenser end further includes multiple heat pipes, each heat pipe including a third cavity formed by a closed end and an open end, a fifth capillary structure on the inner wall of the heat pipe, and a second groove on the upper shell that mates with the open end of the heat pipe. After the upper shell is fixedly connected to the heat pipe, the fifth capillary structure communicates with the second capillary structure, and the third cavity communicates with the second cavity.

[0013] Preferably, the evaporator condenser plate is configured as a hollow heat dissipation tube, and a third working medium is provided inside the heat dissipation tube.

[0014] The present invention provides a heat sink, including a heat spreader.

[0015] The beneficial effects of this invention are as follows: The curved two-phase liquid-modulated heat exchanger provided by this invention can rapidly reduce the temperature of the heat source. The heat from the heat source is dissipated primarily at the first evaporation-condensation end, and further enhanced by the second evaporation-condensation end. The second evaporation-condensation end continues to enhance heat dissipation after the initial dissipation at the first evaporation-condensation end. This significantly increases the vacuum heat dissipation space while reducing the manufacturing difficulty of existing heat dissipation cavities, thereby significantly improving the overall heat dissipation power and temperature uniformity performance of the heat exchanger. By setting multiple phase-alternating first protrusions and first grooves in the middle section of the evaporation-condensation plate, the temperature uniformity of the heat exchanger is improved. By significantly reducing the pressure requirements in the first and second cavities, the heat dissipation power is significantly increased without changing the volume of the heat dissipation space, thereby improving product stability and yield, and reducing manufacturing costs. The first and second reflux mechanisms effectively increase the speed and volume of liquid reflux, thereby improving the heat dissipation power of the heat exchanger. Attached Figure Description

[0016] The accompanying drawings illustrate exemplary embodiments of the invention and, together with the description thereof, serve to explain the principles of the invention. These drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification.

[0017] Figure 1 This is a schematic diagram of the curved two-phase liquid temperature-changing plate in Example 1; Figure 2 This is a schematic diagram of the internal structure of the curved two-phase liquid temperature-changing platen in Example 1; Figure 3 This is a schematic diagram of the first reflux mechanism in Example 1; Figure 4 This is a schematic diagram of the second reflux mechanism in Example 1; Figure 5 This is a schematic diagram of the heat sink structure in Example 2; Figure 6 This is a schematic diagram of the evaporator-condenser plate in Example 3; Figure 7 This is a schematic diagram of the existing heat sink in Comparative Example 4. Detailed Implementation

[0018] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of the invention. Furthermore, it should be noted that, for ease of description, only the parts relevant to the present invention are shown in the accompanying drawings.

[0019] It should be noted that, unless otherwise specified, the embodiments and features described in the present invention can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments. Example

[0020] Please see Figures 1 to 4 This embodiment 1 includes: A curved two-phase liquid-cooled isothermal plate, comprising a first evaporation-condensation end 1 and a second evaporation-condensation end 2; The first evaporation-condensation end 1 includes a lower shell 11, an evaporation-condensation plate 3, and a first capillary structure 41. The first capillary structure 41 is located on the inner surface of the lower shell 11 and the lower surface of the evaporation-condensation plate 3. After the lower shell 11 and the evaporation-condensation plate 3 are fixedly connected, a first cavity 51 is formed. A first working medium (not shown in the figure) is provided in the first cavity 51. The second evaporation-condensation end 2 includes an upper shell 21, an evaporation-condensation plate 3, and a second capillary structure 42. The second capillary structure 42 is located on the inner surface of the upper shell 21 and the upper surface of the evaporation-condensation plate 3. After the upper shell 21 and the evaporation-condensation plate 3 are fixedly connected, a second cavity 52 is formed. A second working medium is provided in the second cavity 52. The middle section of the evaporator condenser plate 3 is set as a curved surface. The upper end of the first cavity 51 is set as multiple protrusions. The lower end of the second cavity 52 is set as multiple grooves. The first cavity 51 and the second cavity 52 are independent of each other. The first capillary structure 41 and the second capillary structure 42 are also independent of each other and not connected.

[0021] In the non-operating state, the first cavity 51 and the second cavity 52 are independent of each other and each forms a closed cavity. In this embodiment 1, the heat source is the chip 61, located below the lower shell 11. The first evaporation-condensation end 1 contains a first working medium, and the second evaporation-condensation end 2 contains a second working medium. Both the first and second working media are liquid. The first cavity 51 and the second cavity 52 are evacuated. Due to technical limitations, at this stage, only a vacuum can be achieved as much as possible, and an absolute vacuum is impossible. When the pressure in the first cavity 51 and the second cavity 52 is within 0.5 atmospheres, it is considered to be in a vacuum state. In this embodiment, the pressure in the first cavity 51 and the second cavity 52 is 0.4 atmospheres, which meets the heat dissipation requirements of the vapor chamber.

[0022] In operation, since the first cavity 51 is in a vacuum state, the heat on the chip 61 is rapidly conducted to the first evaporation and condensation end 1 through the contact lower shell 11. Under near-vacuum conditions, even a small amount of heat transferred from the chip 61 is sufficient to cause the liquid first working medium to change from a liquid to a gaseous state within the first evaporation and condensation end 1. During this phase change, the first evaporation and condensation end 1 absorbs heat, further reducing the temperature of the chip 61. The gaseous first working medium continuously rises to the evaporation and condensation plate 3, where it changes from a gaseous state to a liquid state upon cooling, releasing heat. This heat is then conducted to the second evaporation and condensation end 2 through the evaporation and condensation plate 3. Simultaneously, capillary action and gravity... Under the action of force, the liquid first working medium returns to the lower shell 11 along the first capillary structure 41. Similarly, the heat transferred causes the second working medium to change from a liquid phase to a gaseous phase, while absorbing heat from the evaporation and condensation plate 3. The gaseous second working medium continues to rise and encounters the lower temperature upper shell 21, changing phase again to liquid. At the same time, the heat released when the gaseous phase changes to liquid is diffused out through the heat sink above the heat spreader plate. Under the action of capillary action and gravity, the liquid second working medium returns to the evaporation and condensation plate 3 along the second capillary structure 42. This cycle repeats, completing the circulation of the second working medium and ultimately achieving heat dissipation for the chip 61.

[0023] Existing vapor chambers are generally within 10mm in height, typically 5-8mm. Increasing the height of the vapor chamber places higher demands on the vacuuming operation, and the pressure generated during the gaseous rise process can cause deformation and cracking of the vapor chamber shell. In this embodiment 1, both the first evaporation-condensation end 1 and the second evaporation-condensation end 2 can be controlled within the existing height, while increasing the vacuum heat dissipation space and improving the heat transfer length of the vapor chamber, thereby enhancing the heat dissipation power and temperature uniformity performance of the vapor chamber. Furthermore, by connecting the first evaporation-condensation end 1 and the second evaporation-condensation end 2 through the evaporation-condensation plate 3, the second evaporation-condensation end 2 can continue to enhance heat dissipation after the initial heat dissipation of the first evaporation-condensation end 1. This significantly increases the vacuum heat dissipation space while reducing the manufacturing difficulty of existing heat dissipation chambers, thus significantly improving the overall heat dissipation power and temperature uniformity performance of the vapor chamber.

[0024] During the heat dissipation process of the vapor chamber plate, the middle section of the evaporator condenser plate 3 is designed as a curved surface. Unlike a flat surface, the curved surface allows for greater temperature differences between adjacent nodes on the same horizontal plane due to varying distances from the chip 61, thus increasing heat conduction and improving the temperature uniformity of the vapor chamber plate. The curved surface of the middle section of the evaporator condenser plate 3 can be composed of multiple spaced-apart first protrusions 31 and first grooves 32. This design creates multiple protrusions at the upper end of the first cavity 51 and multiple grooves at the lower end of the second cavity 52. ​​The presence of these protrusions and grooves further increases the temperature difference between adjacent nodes on the same height plane from the chip 61, thereby increasing heat conduction and improving the temperature uniformity of the vapor chamber plate.

[0025] The pressure inside the first chamber 51 is less than or equal to the pressure inside the second chamber 52. Under the same pressure, the boiling point of the first working medium is higher than or equal to the boiling point of the second working medium. For the same substance, generally, the higher the gas pressure, the higher the boiling point. Thus, the pressure requirement inside the second chamber 52 is lower than that inside the first chamber 51. By selecting appropriate first and second working media, the pressure requirements inside the first chamber 51 and the second chamber 52 can be greatly reduced. Without changing the volume of the heat dissipation space, the heat dissipation power can be greatly improved, and the stability and yield of the product can be improved. In addition, the evaporator condenser plate 3 can be integrally formed by stamping. The first protrusion 31 and the first groove 32 are distributed at intervals. During the heat dissipation process, the gas in the first chamber 51 rises and exerts upward pressure on the evaporator condenser plate 3, and the gas in the second chamber 52 rises and exerts downward pressure on the evaporator condenser plate 3. Therefore, the evaporator condenser plate 3 can offset part of the pressure and effectively reduce the risk of bulging or cracking after the effective height of heat dissipation is increased.

[0026] The first working medium is preferably one of acetic acid, toluene, or water. The second working medium is preferably one of acetone, methanol, or ethanol. Since the first evaporator-condenser end 1 is closer to the heat source and has a higher internal temperature, a liquid with a higher boiling point is chosen as the first working medium. The second evaporator-condenser end 2 is farther from the heat source, and its internal temperature is lower than that of the first evaporator-condenser end 1. Therefore, its internal vacuum requirement can be lower, and its internal pressure can be higher. Choosing a liquid with a lower boiling point as the second working medium better ensures the normal heat dissipation of the vapor chamber, improves the heat dissipation power of the vapor chamber, reduces the manufacturing requirements of the vapor chamber, and increases the finished product qualification rate of the vapor chamber. The selection of the working medium and the second working medium depends on the heat dissipation of the chip 61 and the temperature to be reduced. The heat of the chip 61 is first conducted through the first evaporation and condensation end 1, and then through the second evaporation and condensation end 2. Therefore, the temperature is highest at the lower shell 11, followed by the evaporation and condensation plate 3, and then the upper shell 21. It is only necessary to meet the following conditions: under the working state, the first working medium changes from liquid to gas at the temperature of the lower shell 11 and from gas to liquid at the temperature of the evaporation and condensation plate 3; the second working medium changes from liquid to gas at the temperature of the evaporation and condensation plate 3 and from gas to liquid at the temperature of the upper shell 21.

[0027] The curved surface is composed of multiple first protrusions 31 and first grooves 32 that are spaced apart. The first protrusions 31 and first grooves 32 are configured as one or more of the following: sine wave, square, trapezoid, and semicircle. In this embodiment 1, the first protrusions 31 and first grooves 32 are configured as trapezoids.

[0028] The first evaporation-condensation end 1 is also provided with a plurality of first reflux mechanisms 7. The first reflux mechanism 7 includes a first reflux plate 71. Both sides of the first reflux plate 71 are provided with a plurality of first reflux channels 72. The upper end of the first reflux mechanism 7 is fixedly connected to the first protrusion 31, and its lower end is fixedly connected to the lower shell 11. The upper width of the first reflux plate 71 is greater than its lower width. The widths of the first reflux channels 72 are the same, and the spacing between adjacent first reflux channels 72 gradually converges from top to bottom. The thickness of the upper end of the first reflux channel 72 is greater than its lower thickness. A third capillary structure 43 is provided on the outer surface of the first reflux mechanism 7. The third capillary structure 43 communicates with the first capillary structure 41. Multiple second protrusions 73 are provided on both sides of the first reflux plate 71, and a first reflux channel 72 is formed between adjacent second protrusions 73. The liquid working medium condensed below the first protrusion 71 flows from top to bottom onto the lower shell 11 under the combined action of capillary action and gravity along the third capillary structure 43. The first reflux channel 72 can increase the speed of liquid reflux. The first reflux mechanism 7 and the third capillary structure 43 can effectively increase the speed and volume of liquid reflux, thereby allowing the liquid working medium on the evaporator condenser plate 3 to reflux back onto the lower shell 11 faster and in greater quantities, thus improving the heat dissipation power of the heat spreader plate. The purpose of the first reflux mechanism 7 is to increase the liquid reflux speed and volume, while minimizing the weight and volume of the first reflux mechanism 7 itself. Therefore, the upper width of the first reflux plate 71 is greater than its lower width, so that more liquid is collected at the upper end. In other words, more liquid at the upper end is allowed to flow back to the lower shell 11 through the first reflux plate 71. The construction of the first reflux channel 72 can increase the liquid reflux speed. The width of the first reflux channel 72 is the same, and the interval between adjacent first reflux channels 72 gradually converges from top to bottom. The thickness of the upper end of the first reflux channel 72 is greater than the thickness of its lower end, so that the liquid reflux speed is faster, thereby increasing the heat dissipation power of the heat exchange plate.

[0029] Similarly, the second evaporator-condenser end 2 is also provided with multiple second reflux mechanisms 8. The second reflux mechanism 8 includes a second reflux plate 81, and multiple second reflux channels 82 are provided on both sides of the second reflux plate 81. The second reflux mechanism 8 is fixedly connected between the upper shell 21 and the first groove 32. The upper width of the second reflux mechanism 8 is smaller than its lower width. The width of the second reflux channel 82 gradually increases from top to bottom, and the spacing between two adjacent second reflux channels 82 also gradually increases from top to bottom. The upper thickness of the second reflux channel 82 is smaller than its lower thickness. A fourth capillary structure 44 is provided on the outer surface of the second reflux mechanism 8. The fourth capillary structure 44 communicates with the second capillary structure 42 and has the same function as the first reflux mechanism 7. The second reflux channel 82 can increase the speed of liquid reflux. The second reflux mechanism 8 and the fourth capillary structure 44 can effectively increase the speed and volume of liquid reflux, so that the liquid working medium on the upper shell 21 can return to the evaporator-condenser plate 3 faster and more, thereby improving the heat dissipation power of the heat exchange plate.

[0030] Both the first cavity 51 and the second cavity 52 are equipped with multiple staggered support columns 62. The outer surface of the support column 62 is provided with a sixth capillary structure 46 made of copper powder. The support column 62 and the sixth capillary structure 46 have the same function and principle in the first cavity 51 and the second cavity 52. ​​Taking the first evaporation and condensation end 1 as an example, when the first working medium is heated and changes from a liquid phase to a gaseous phase, the gaseous working medium will rise. The support column 62 strengthens the outer wall of the first cavity 51, supports the evaporation and condensation plate 3 and the lower shell 11 of the first cavity 51, protects the first cavity 51, and reduces the impact of increased internal pressure on the evaporation and condensation plate 3 and the lower shell 11. At the same time, the sixth capillary structure 46 on the outer surface of the support column 62 can quickly diffuse heat upward and quickly return the condensed liquid working medium to the lower shell 11, thereby improving the strength of the first cavity 51, effectively preventing the first cavity 51 from bulging or breaking, and also improving the heat dissipation power of the entire heat spreader.

[0031] Example 2, a radiator, reference Figure 5The heat exchanger includes a heat exchange plate and multiple heat sinks 10. The heat exchanger differs from the heat exchanger in Embodiment 1 in that: (1) the first protrusion 31 and the first groove 32 are set in a semi-circular shape; (2) the second evaporation and condensation end 2 also includes multiple heat pipes 9. The heat pipe 9 includes a third cavity 53 formed by a closed end and an open end. A fifth capillary structure 45 is provided on the inner wall of the heat pipe 9. A second groove 22 that cooperates with the open end of the heat pipe 9 is provided on the upper shell 21. After the upper shell 21 and the heat pipe 9 are fixedly connected through the second groove 22, the fifth capillary structure 45 communicates with the second capillary structure 42, and the third cavity 53 communicates with the second cavity 52. The heat pipe 9 is a circular or elliptical hollow tube with one end closed. In this embodiment 2, the second cavity 52 and the third cavity 53 are connected and closed, and are evacuated at the same time during evacuation. Of course, due to the setting of the first evaporation-condensation end 1 and the second evaporation-condensation end 2 in this embodiment 2, the pressure requirement in the second cavity 52 and the third cavity 53 is significantly lower than that of the current heat spreader, and the heat dissipation power is significantly improved.

[0032] The heat sink in this embodiment 2 includes a vapor chamber and multiple heat sinks 10. The multiple heat sinks 10 are vertically distributed and connected to the heat pipe 9. The heat dissipation principle of the vapor chamber in this embodiment 2 is basically the same as that of the vapor chamber in embodiment 1. The heat of the chip 61 is conducted from the first evaporation and condensation end 1 to the evaporation and condensation plate 3, and then conducted to the heat sinks 10 through the second evaporation and condensation end 2 and the heat pipe 9. The heat of the chip 61 is finally diffused out through the heat sinks 10. The heat conduction in the first evaporation and condensation end 1 is the same, and will not be described again here.

[0033] Example 3 differs from Example 1 in that: (Refer to...) Figure 6The evaporative condenser plate 3 is configured as a hollow heat dissipation tube 33, and a third working medium is provided inside the heat dissipation tube 33. The evaporative condenser plate 3 can be formed by welding multiple heat dissipation round tubes in sequence, or by welding multiple heat dissipation plates together. It only needs to have a hollow space inside, and its internal pressure can be normal atmospheric pressure. Its function is to evenly conduct the heat from the first evaporative condenser end 1 to the second evaporative condenser end 2, thereby improving the temperature uniformity of the heat spreader plate. Due to the different distances from the chip 61, the temperature of the heat conducted through the first evaporative condenser end 1 to the evaporative condenser plate 3 is also different. Within the temperature range of the lower end of the first evaporative condenser end 1 and the upper end of the second evaporative condenser end 2, the third working medium is preferably selected as liquid. Due to the fluidity of liquid, it is easier for the temperature to tend to be the same inside the heat dissipation tube 33, thereby improving the temperature uniformity of the heat spreader plate. Meanwhile, since the heat dissipation pipe 33 is equipped with a third working medium, when the pressure inside the first evaporation and condensation end 1 and the second evaporation and condensation end 2 increases, the third working medium can play a buffering role, effectively preventing the first evaporation and condensation end 1 and the second evaporation and condensation end 2 from rupturing. In addition, since the heat dissipation pipe 33 is at normal atmospheric pressure, and the surface temperature of the first evaporation and condensation end 1 after heat dissipation generally does not exceed 100 degrees Celsius, in this embodiment 3, the third working medium can be liquid water. Its heat dissipation principle is the same as that of the heat spreader in embodiment 1, and will not be repeated here.

[0034] Comparative Example 1 is a heat sink composed of a heat spreader and heat sink 10 in Example 1, with multiple heat sinks 10 vertically connected to the upper housing 21; Comparative Example 2 is the heat sink in Example 2; Comparative Example 3 is a heat sink composed of a heat spreader and heat sink 10 as in Example 3; Comparative Example 4 shows an existing heat sink: such as Figure 7 As shown, it includes a heat spreader 101, a heat pipe 102, and a heat sink 10. The heat pipe 102 is a direct heat pipe and has a capillary structure inside. The heat spreader 101 also has a capillary structure inside. The interior of the heat spreader 101 and the interior of the heat pipe 102 form a connected closed cavity. The pressure inside the cavity is basically the same as the pressure inside the first cavity 51 in Comparative Examples 1-3. The bottom of the heat spreader 101 contacts the chip 61. The heat generated by the chip 61 is transferred to the capillary structure and finally diffused out by the heat sink 10. Its heat dissipation principle is basically the same as that of the heat sink in Comparative Examples 1-3.

[0035] The total volume of the heat sinks in Comparative Examples 1-3 and 4 is basically the same. The heights of the first evaporation-condensation end 1 and the second evaporation-condensation end 2 in Comparative Examples 1-3 are basically the same. The height of the first evaporation-condensation end 1 is basically the same as the height of the heat spreader 101 in Comparative Example 4. The pressure inside the first cavity 51 in Comparative Examples 1-3 is basically the same as the pressure inside the heat spreader in Comparative Example 4. The heat dissipation power of Comparative Examples 1-3 and Comparative Examples 4 is compared under similar external temperature, environment, and chip 61 operating conditions. The specific comparison data is shown in Table 1.

[0036] Table 1 Comparison Data Comparative Example 1 1 0.0723 75.81 25.2 50.61 Comparative Example 2 1 0.0638 69.76 25.1 44.66 Comparative Example 3 1 0.0695 73.95 25.3 48.65 Comparative Example 4 (Existing Heatsink) 1 0.0862 85.84 25.5 60.34 Table 1 shows the comparative data between Comparative Examples 1-3 and Comparative Example 4. The heat sink volume is approximately 20cm x 15cm x 10cm, the heat source chip power consumption is 700W, and the heat dissipation performance of the heat sink is measured under the condition that the ambient temperature and working environment are basically the same. In the table, TC is the temperature at the center of the chip 61 shell, TA is the ambient temperature, ΔT is the heat sink's heat dissipation capacity temperature, and RCA refers to the thermal resistance from the shell to the air. Its full name is Rca (Shell-to-Air Thermal Resistance). In the calculation of thermal resistance, Rca represents the thermal resistance between the package shell and the surrounding air. Under the same conditions, the smaller the thermal resistance, the greater the heat dissipation power of the heat sink and the better the heat dissipation effect. Obviously, the heat dissipation power of the heat sink in Comparative Example 1-3 is significantly higher than that of Comparative Example 4, that is, significantly higher than the heat dissipation power of the existing heat sink.

[0037] The vapor chamber and heat sink provided by this invention can rapidly reduce the temperature of a heat source (chip). By connecting the first and second evaporation condensation ends through an evaporation condensation plate, the second evaporation condensation end can continue to enhance heat dissipation after the first evaporation condensation end has already dissipated heat. This significantly increases the vacuum heat dissipation space while reducing the manufacturing difficulty of existing heat dissipation cavities, thereby significantly improving the overall heat dissipation power and temperature uniformity performance of the vapor chamber. By setting multiple phase-separated first protrusions and first grooves in the middle section of the evaporation condensation plate, the temperature uniformity of the vapor chamber is improved. By significantly reducing the pressure requirements in the first and second cavities, the heat dissipation power is significantly increased without changing the volume of the heat dissipation space, thereby improving product stability and yield, and reducing manufacturing costs. The setting of the first and second reflux mechanisms effectively increases the speed and volume of liquid reflux, thereby improving the heat dissipation power of the vapor chamber.

[0038] In summary, the curved two-phase liquid-modulated heat exchange plate and radiator provided by the present invention dissipate heat through the first evaporation-condensation end, enhance heat dissipation through the second evaporation-condensation end, improve temperature uniformity by setting the shape of the middle section of the evaporation-condensation plate, and effectively increase the speed and volume of liquid reflux through the first and second reflux mechanisms, thereby improving the heat dissipation power of the heat exchange plate, significantly improving its heat transfer efficiency and temperature uniformity.

[0039] Those skilled in the art should understand that the above embodiments are merely for illustrating the present invention and are not intended to limit the scope of the invention. Those skilled in the art can make other changes or modifications based on the above invention, and these changes or modifications still fall within the scope of the present invention.

Claims

1. A curved two-phase liquid-cooled homogenizing plate, characterized in that: First evaporation-condensation end and second evaporation-condensation end; The first evaporation-condensation end includes a lower shell, an evaporation-condensation plate, and a first capillary structure. The first capillary structure is located on the inner surface of the lower shell and the lower surface of the evaporation-condensation plate. The lower shell and the evaporation-condensation plate are fixedly connected to form a first cavity, and a first working medium is provided in the first cavity. The second evaporation-condensation end includes an upper shell, an evaporation-condensation plate, and a second capillary structure. The second capillary structure is located on the inner surface of the upper shell and the upper surface of the evaporation-condensation plate. The upper shell and the evaporation-condensation plate are fixedly connected to form a second cavity, and a second working medium is provided in the second cavity. The middle section of the evaporator condenser plate is curved, the upper end of the first cavity is provided with multiple protrusions, and the lower end of the second cavity is provided with multiple grooves. The first cavity and the second cavity are independent of each other. The pressure in the first cavity is less than or equal to the pressure in the second cavity. Under the same pressure, the boiling point of the first working medium is higher than or equal to the boiling point of the second working medium. In operation, the first working medium changes from a liquid phase to a gaseous phase at the lower shell and from a gaseous phase back to a liquid phase at the evaporation and condensation plate; the second working medium changes from a liquid phase to a gaseous phase at the evaporation and condensation plate and from a gaseous phase to a liquid phase at the upper shell. The evaporator condenser plate is configured as a hollow heat dissipation tube, and a third working medium is provided inside the heat dissipation tube.

2. The curved two-phase liquid-cooled homogenizing plate according to claim 1, characterized in that: The curved surface is composed of a plurality of first protrusions and first grooves distributed at intervals, wherein the first protrusions and first grooves are configured as one or more of the following: sine wave, square, trapezoidal, and semi-circular.

3. The curved two-phase liquid-cooled homogenizing plate according to claim 2, characterized in that: The first evaporation and condensation end is also provided with a plurality of first reflux mechanisms. The first reflux mechanism includes a first reflux plate. Both sides of the first reflux plate are provided with a plurality of first reflux channels. The upper end of the first reflux mechanism is fixedly connected to the first protrusion, and its lower end is fixedly connected to the lower shell.

4. The curved two-phase liquid-cooled homogenizing plate according to claim 3, characterized in that: The upper width of the first reflux plate is greater than its lower width, the width of the first reflux channels is the same, and the spacing between adjacent first reflux channels gradually converges from top to bottom. The thickness of the upper end of the first reflux channel is greater than its lower thickness. A third capillary structure is provided on the outer surface of the first reflux mechanism, and the third capillary structure is connected to the first capillary structure.

5. The curved two-phase liquid-cooled homogenizing plate according to claim 2, characterized in that: The second evaporation and condensation end is also provided with a plurality of second reflux mechanisms. The second reflux mechanism includes a second reflux plate, and a plurality of second reflux channels are provided on both sides of the second reflux plate. The second reflux mechanism is fixedly connected between the upper shell and the first groove.

6. The curved two-phase liquid-cooled homogenizing plate according to claim 5, characterized in that: The upper width of the second reflux mechanism is smaller than its lower width. The width of the second reflux channel gradually increases from top to bottom, and the spacing between two adjacent second reflux channels gradually increases from top to bottom. The upper thickness of the second reflux channel is smaller than its lower thickness. A fourth capillary structure is provided on the outer surface of the second reflux mechanism, and the fourth capillary structure communicates with the second capillary structure.

7. The curved two-phase liquid-cooled homogenizing plate according to claim 1, characterized in that: The second evaporation-condensation end also includes multiple heat pipes. Each heat pipe includes a third cavity formed by a closed end and an open end. A fifth capillary structure is provided on the inner wall of the heat pipe. A second groove is provided on the upper shell to cooperate with the open end of the heat pipe. After the upper shell is fixedly connected to the heat pipe, the fifth capillary structure communicates with the second capillary structure, and the third cavity communicates with the second cavity.

8. A radiator, characterized in that: Includes a heat exchanger, wherein the heat exchanger is the curved two-phase liquid-varying heat exchanger as described in any one of claims 1-7.

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