A spectral detector and particle analyzer

Abstract

The embodiment of the application provides a kind of spectrum detector and particle analyzer, including base, optical module, control module and temperature control module, optical module includes side light optical assembly and at least one photoelectric conversion module;Control module is electrically connected with side light optical assembly, photoelectric conversion module respectively;Temperature control module includes temperature control component and cooling fin, cooling fin is connected with base, temperature control component is set in base, and is electrically connected with control module, one end of temperature control component is respectively with photoelectric conversion module, the bottom side of side light optical assembly abuts, and other end is in heat conduction communication with cooling fin;Along the top and bottom direction of spectrum detector, optical module, base, cooling fin are sequentially arranged.The spectrum detector of the application forms upper and lower layered design, each part structure is clear, will not cause interference, integration is high, temperature control component and photoelectric conversion module, side light optical assembly are directly contacted, and heat is dissipated through cooling fin, can carry out accurate temperature control, increase detection stability.

Description

Technical Field

[0001] This application relates to the field of optical instruments, and more particularly to a spectrometer detector and a particle analyzer. Background Technology

[0002] Taking the application of spectral detectors in the biological and medical fields as an example, spectral detectors can be used as part of flow cytometers to count and classify different cells. Since the fluorescence spectra generated by multiple lasers of different wavelengths exciting the same specific fluorescent dye will overlap, it is necessary to collimate, disperse, and filter the light to separate the fluorescence signals into different wavelengths, which are then received by the photodetector in the photoelectric conversion module. Computer software then analyzes the fluorescence signals of different wavelengths one by one to count the types and quantities of particles in the sample.

[0003] The structural and temperature stability of photodetectors have a significant impact on detection accuracy. Therefore, it is necessary to optimize the structure of the spectral detector to increase its operational stability while meeting the requirements of multi-channel detection. Summary of the Invention

[0004] In view of this, the embodiments of this application aim to provide a spectral detector and a particle analyzer that increases the working stability of the photodetector while satisfying multi-channel detection.

[0005] To achieve the above objectives, the technical solution of this application embodiment is implemented as follows: This application provides a spectral detector, including: abutment; An optical module is disposed on the base. The optical module includes a lateral optic component and at least one photoelectric conversion module. The lateral optic component is used to convert the side-scattered light signal generated by the sample under test into an electrical signal, and the photoelectric conversion module is used to convert the fluorescence signal generated by the sample under test into an electrical signal. A control module is connected to the top side of the base, and the control module is electrically connected to the lateral optics component and the photoelectric conversion module respectively; A temperature control module includes a temperature control component and a heat sink. The heat sink is connected to the base. The temperature control component is disposed inside the base and electrically connected to the control module. One end of the temperature control component abuts against the bottom side of the photoelectric conversion module and the lateral scattering optical component, respectively, and the other end is thermally connected to the heat sink. Along the top-bottom direction of the spectral detector, the optical module, the base, and the heat sink are arranged in sequence.

[0006] In some embodiments, the spectral detector includes a dichroic mirror assembly disposed on the base, a first optical path adjustment device, and at least one second optical path adjustment device. The dichroic mirror assembly includes at least two dichroic mirrors, the first optical path adjustment device includes a collimating lens, and the second optical path adjustment device includes a reflecting mirror. The first optical path adjustment device is used to connect to the optical fiber. The collimating lens collimates the light generated by the optical fiber from the sample under test. One of the dichroic mirrors transmits the fluorescence signal in the light collimated by the collimating lens to another dichroic mirror and transmits the side-scattered light signal in the collimated light to the side-scattering optical component. The other dichroic mirror reflects the fluorescence signal to the photoelectric conversion module via the reflector.

[0007] In some embodiments, the number of photoelectric conversion modules is multiple, each photoelectric conversion module includes a filter component and at least two photoelectric detection components connected to different sides of the filter component, each photoelectric detection component includes a mounting base and multiple photodetectors disposed on the mounting base, the filter component is used to filter and reflect the fluorescence signal and then transmit it to each of the photodetectors, the photodetectors convert the fluorescence signal into an electrical signal and transmit it to the control module; And / or, the spectral detector includes a collimating positioning element, the base is provided with a plurality of mounting grooves, the collimating positioning element is movably disposed in the mounting grooves, the first optical path adjustment device is capable of moving relative to the base on the collimating positioning element according to the position of the light emitted from the collimating lens; the second optical path adjustment device is capable of moving relative to the base on the collimating positioning element according to the position of the light emitted from the reflector; And / or, the base is provided with a positioning groove, and the photoelectric conversion module, the lateral dispersion optical component, the dichroic mirror component, the first optical path adjustment device, and the second optical path adjustment device are respectively disposed in the positioning groove and connected to the base.

[0008] In some embodiments, the temperature control component is exposed on the bottom surface of the base, and the spectral detector includes a connector that connects the base and the heat sink, and abuts the temperature control component against the bottom side of the photoelectric conversion module and the lateral optics component.

[0009] In some embodiments, the heat sink is in surface contact with the base and abuts against the temperature control component; or, the spectral detector includes a reinforcing plate connected between the base and the heat sink, and the heat sink abuts against the temperature control component through the reinforcing plate.

[0010] In some embodiments, the connector passes through the heat sink and is spaced apart from the temperature control component along the top-bottom direction. The spectral detector includes an elastic element, which is sleeved on the outside of the connector and abuts against the temperature control component. The temperature control component is kept in contact with the photoelectric conversion module and the lateral scattering optical component under the elastic force of the elastic element.

[0011] In some implementations, the temperature control component includes a first cooling chip and a second cooling chip, which are not connected to each other. The cold side of the first cooling chip is attached to the bottom side of the photoelectric conversion module, and the cold side of the second cooling chip is attached to the bottom side of the lateral optics component. The hot side of the first cooling chip and the hot side of the second cooling chip are respectively thermally connected to the heat sink.

[0012] In some implementations, the temperature control component further includes multiple heat dissipation adapters disposed within the base; The heat dissipation adapter block is disposed between the hot surface of the first cooling chip and the heat sink, and / or, the heat dissipation adapter block is disposed between the hot surface of the second cooling chip and the heat sink.

[0013] In some implementations, the spectral detector includes a heat insulation cover surrounding the photoelectric conversion module and the lateral diffraction optical component. The control module is located outside the heat insulation cover, and the heat insulation cover has wiring ports to enable electrical connection between the photoelectric conversion module, the lateral diffraction optical component, and the control module.

[0014] In some implementations, the control module includes a power board and multiple circuit board assemblies. The multiple circuit board assemblies are respectively electrically connected to the photoelectric conversion module and the lateral optics assembly. The multiple circuit board assemblies surround the outer periphery of the heat insulation cover. The power board is disposed on the top side of the heat insulation cover. The control module also includes a positioning plate, which is disposed on the top side of the heat insulation cover. The bottom ends of the multiple circuit board assemblies are connected to the base, and the top ends are connected to the positioning plate. The multiple circuit board assemblies are connected to the power board through the positioning plate. And / or, the spectral detector further includes an outer cover disposed on the top side of the base and covering the outside of the optical module and the control module; the control module is provided with at least one external interface exposed on the top surface of the outer cover.

[0015] In some implementations, the photoelectric conversion module and the lateral diffusion optical component are each provided with at least one temperature sensor. The temperature sensor is electrically connected to the control module, and the control module is used to control the temperature control component to turn on or off temperature adjustment of the photoelectric conversion module and the lateral diffusion optical component according to the temperature signal of the temperature sensor.

[0016] This application provides a particle analyzer, including a laser excitation device and a spectral detector as described in any embodiment of this application; the laser excitation device is used to emit a laser source to the sample to be tested, and to cause the light signal generated by the sample to be tested to be emitted to the spectral detector.

[0017] The spectral detector provided in this application embodiment has an optical module, a base, and a heat sink arranged sequentially along the top and bottom, forming a layered design. Each part has a clear structure, and the optical module and heat sink can be assembled with the base separately without interference. It has a high degree of integration and is easy to maintain and replace the heat sink. Of course, there is also enough space above the base to arrange the photoelectric conversion module to realize multi-channel detection and multi-parameter detection as much as possible. At the same time, the temperature control component is in direct contact with the photoelectric conversion module and the lateral optical component, and dissipates heat through the heat sink, which can perform precise temperature control and increase the detection stability of the photoelectric conversion module and the lateral optical component. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of a spectral detector according to an embodiment of this application; Figure 2 for Figure 1 A schematic diagram of the structure shown from another perspective; Figure 3 for Figure 1 A schematic diagram of the structure shown from another perspective; Figure 4 for Figure 1 A schematic diagram of the structure shown from another perspective; Figure 5 for Figure 4 A schematic cross-sectional view of the structure shown along the CC direction; Figure 6 for Figure 4 A schematic cross-sectional view of the structure shown along the EE direction; Figure 7 for Figure 6 A cross-sectional view of the structure along the FF direction; Figure 8 This is a schematic diagram showing the interaction between the base station and the control module; Figure 9 for Figure 1 A schematic diagram of the base structure is shown; Figure 10This is a schematic diagram of the structure of a photoelectric conversion module according to an embodiment of this application; Figure 11 This is a schematic diagram of the structure of a lateral dispersion optical component according to an embodiment of this application; Figure 12 This is a schematic diagram of the structure of a dichroic mirror assembly according to an embodiment of this application; Figure 13 This is a schematic diagram of the structure of a first optical path adjustment device according to an embodiment of this application; Figure 14 This is a schematic diagram of the structure of a second optical path adjustment device according to an embodiment of this application; Figure 15 This is a schematic diagram of the structure of a second optical path adjustment device according to another embodiment of this application.

[0019] Explanation of reference numerals in the attached figures 100-Spectral Detector; 10-Base; 10a-Mounting groove; 10b-Positioning groove; 11-Reinforcing plate; 12-Connector; 13-Elastic element; 20 - Photoelectric conversion module; 21 - Filter assembly; 211 - Mounting base; 212 - Filter; 22 - Photoelectric detection assembly; 221 - Fixing base; 222 - Photodetector; 30 - Side-scattering optical component; 31 - Mounting block; 32 - Side-scattering filter; 33 - Lens; 40-Control module; 40a-External interface; 41-Power supply board; 42-Circuit board assembly; 43-Positioning plate; 50 - Temperature control module; 51 - Temperature control component; 511 - First cooling chip; 512 - Second cooling chip; 513 - Heat dissipation adapter block; 52 - Heat sink; 60 - Dichroic mirror assembly; 61 - Mirror mount; 62 - Dichroic mirror; 70 - First optical path adjustment device; 71 - First adjustment component; 72 - Second adjustment component; 73 - First connecting shaft; 74 - Second connecting shaft; 75 - Collimating lens; 80 - Second optical path adjustment device; 81 - Third adjustment component; 82 - Fourth adjustment component; 83 - Third connecting shaft; 84 - Fourth connecting shaft; 85 - Reflector; 90 - Temperature sensor; 91 - Insulation cover; 92 - Outer cover. Detailed Implementation

[0020] In the description of the embodiments of this application, it should be noted that the terms "height direction", "up", "down", "top", "bottom", "left", "right", "front", "back", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0021] Furthermore, it should be noted that, in the description of this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0022] Please see Figures 1 to 15 This application provides a spectral detector 100.

[0023] A spectrometer 100 is a device used to analyze the optical properties of substances, such as absorption, emission, and scattering. It determines the composition and structure of a sample by measuring the intensity of light at different wavelengths. The spectrometer 100 can be applied in fields such as biology and medicine.

[0024] This application uses the application of the spectral detector 100 in a particle analyzer as an example for illustration.

[0025] This application provides a particle analyzer, including a laser excitation device and a spectral detector 100 according to any embodiment of this application.

[0026] The laser excitation device is used to emit a laser light source to the sample under test and to emit the light signal generated by the sample under test to the spectral detector 100.

[0027] Particle analyzers can use a variety of techniques to measure the size, shape, concentration and other physicochemical properties of particles.

[0028] Taking flow cytometry in particle analyzers as an example, after cells are labeled with fluorescent markers, multiple lasers of different wavelengths excite fluorescent dyes with the same characteristics. The resulting fluorescence spectra will overlap. After collimation, spectral dispersion, and filtering by a spectral detector, the fluorescence signals are separated into different wavelengths and converted into electrical signals. Computer software analyzes the fluorescence signals of different wavelengths one by one to count the types and quantities of particles in the sample.

[0029] The laser excitation device can transmit the light signal generated by the sample to the spectrometer detector 100 via an optical fiber. The sample can be a single cell or a biological particle, etc., without limitation.

[0030] The spectral detector 100 includes a base 10, an optical module, a control module 40, and a temperature control module 50.

[0031] An optical module is disposed on a base 10. The optical module includes a lateral scattering optical component 30 and at least one photoelectric conversion module 20. The lateral scattering optical component 30 is used to convert the side-scattered light signal generated by the sample under test into an electrical signal, and the photoelectric conversion module 20 is used to convert the fluorescence signal generated by the sample under test into an electrical signal.

[0032] The control module 40 is connected to the top side of the base 10, and the control module 40 is electrically connected to the lateral optics component 30 and the photoelectric conversion module 20 respectively.

[0033] The temperature control module 50 includes a temperature control component 51 and a heat sink 52. The heat sink 52 is connected to the base 10. The temperature control component 51 is disposed inside the base 10 and is electrically connected to the control module 40. One end of the temperature control component 51 abuts against the bottom side of the photoelectric conversion module 20 and the lateral optical component 30, respectively, and the other end is thermally connected to the heat sink 52.

[0034] Along the top and bottom direction of the spectral detector 100, the optical module, the base 10, and the heat sink 52 are arranged in sequence.

[0035] The base 10 serves as the basic support platform for the spectral detector 100, providing positioning and installation support for structures such as the photoelectric conversion module 20 and the lateral scattering optical component 30. At the same time, it provides a bridge for the cooperation between the temperature control module 50 and the optical module.

[0036] The base 10 can be made of metal or high-strength plastic to provide sufficient structural strength and thermal stability.

[0037] The photoelectric conversion module 20 and the side-scattered optical component 30 respectively collect fluorescence signals and side-scattered light signals, which can realize high-precision quantitative analysis of fluorescent markers. At the same time, information such as particle size and concentration distribution in the sample can be analyzed, thus expanding the detection range and enabling simultaneous detection of multiple parameters of the sample to be tested.

[0038] It is understandable that the photoelectric conversion module 20 and the lateral scattering optical component 30 are positioned at different locations on the base 10 to reduce interference between the side-scattered light signal and the fluorescence signal.

[0039] For example, in the orthographic projection of the plane perpendicular to the top and bottom direction of the spectral detector 100, the photoelectric conversion module 20 and the lateral diffraction optical component 30 are laid flat on the base 10, that is, the photoelectric conversion module 20 and the lateral diffraction optical component 30 will not be stacked along the top and bottom direction of the spectral detector 100, and can be set relatively flat, which facilitates optical path transmission.

[0040] The number of photoelectric conversion modules 20 can be one or more. It should be noted that a single photoelectric conversion module 20 can include multiple structures for performing photoelectric signal conversion. When there are multiple photoelectric conversion modules 20, they are disposed in different areas of the base 10. This facilitates the synchronous detection of fluorescence signals of different wavelengths and reduces optical path interference. A single photoelectric conversion module 20 can detect fluorescence signals of different wavelengths. The photoelectric conversion module 20 can filter the fluorescence signal before performing photoelectric signal conversion.

[0041] The control module 40 serves as the control center of the spectral detector 100. It is electrically connected to the photoelectric conversion module 20 and the lateral diffraction optical component 30, respectively. This means it can receive the electrical signals generated by the photoelectric conversion module 20 and the lateral diffraction optical component 30, process the signals, and transmit them to external devices for analysis. Furthermore, the control module 40 can also monitor the operating temperatures of the photoelectric conversion module 20 and the lateral diffraction optical component 30 in real time, thereby controlling the temperature control module 50 to adjust the temperatures of these components, ensuring they always operate within the set temperatures.

[0042] The control module 40 is connected to the top side of the base 10, meaning that the control module 40, the photoelectric conversion module 20, and the lateral optics component 30 are all located in the space on the top side of the base 10. This allows for high integration and also increases the compactness of the layout.

[0043] The temperature control component 51 is a structure used to adjust and maintain a specific temperature range. The temperature control component 51 is in contact with the bottom side of the photoelectric conversion module 20 and the lateral diffraction optical component 30, respectively. That is, the temperature control component 51 is in direct contact with the bottom surface of the photoelectric conversion module 20 and the bottom surface of the lateral diffraction optical component 30, so as to directly control the temperature of the photoelectric conversion module 20 and the lateral diffraction optical component 30, exchange heat with the photoelectric conversion module 20 and the lateral diffraction optical component 30, achieve precise temperature control, and keep the operating temperature of the photoelectric conversion module 20 and the lateral diffraction optical component 30 suitable.

[0044] The temperature control component 51 is housed inside the base 10. After the heat sink 52 is engaged with the base 10, the temperature control component 51 is not visible from the outer surface of the spectral detector 100. Its placement inside the base 10 facilitates direct thermal contact with the photoelectric conversion module 20 and the lateral optics component 30, reducing heat loss. Furthermore, its location within the base 10 also minimizes heat loss and allows for precise temperature control within a relatively enclosed space. The base 10 also provides protection for the temperature control component 51, reducing its susceptibility to external environmental factors.

[0045] The specific structure of the temperature control component 51 is not limited; it can be a semiconductor cooling chip, a heating film, etc., and there are no restrictions here.

[0046] The heat sink 52 is a device used to increase surface area to promote heat dissipation. The heat sink 52 is thermally connected to the end of the temperature control component 51 away from the photoelectric conversion module 20 and the lateral optical component 30. Here, the thermal connection can be that the end of the heat sink 52 and the end of the temperature control component 51 away from the photoelectric conversion module 20 and the lateral optical component 30 are in direct contact, or a heat conduction structure can be provided in between to adapt to the installation space. The heat sink 52 can conduct away the heat generated by the temperature control component 51, so as to facilitate the precise temperature control of the temperature control component 51 and reduce data deviation caused by temperature changes.

[0047] The heat sink 52 can improve heat exchange efficiency by increasing the contact area with air, and the heat sink 52 can be used with a fan or other cooling mechanism.

[0048] The heat sink 52 can be made of aluminum alloy, brass, or bronze, etc., and has good thermal conductivity. The heat sink 52 can be in the form of a plate, a sheet, or multiple sheets, etc., and there are no restrictions here.

[0049] For example, the side of the heat sink 52 facing the temperature control component 51 is used to receive heat, and the side away from the temperature control component 51 is used to dissipate heat. The side of the heat sink 52 facing the temperature control component 51 may be coated with thermal grease so that the heat emitted by the temperature control component 51 can be more effectively conducted to the heat sink 52.

[0050] The optical module, base 10, and heat sink 52 are arranged sequentially along the top-bottom direction, forming a vertically stacked structure. In other words, the lateral optical component 30, base 10, and heat sink 52 are arranged sequentially along the top-bottom direction; the photoelectric conversion module 20, base 10, and heat sink 52 are also arranged sequentially along the top-bottom direction. Of course, the control module 40, base 10, and heat sink 52 can also be arranged sequentially along the top-bottom direction.

[0051] In this way, the spectral detector 100 can present a layered design, with the optical module located above the base 10 and the heat sink 52 located below the base 10. The temperature control component 51 can control the temperature of the photoelectric conversion module 20 and the lateral optical component 30 upwards, and dissipate heat to the heat sink 52 downwards, making the overall thermal management of the spectral detector 100 more reliable.

[0052] It is understandable that the photoelectric conversion module 20 and the lateral diffraction optical component 30 are greatly affected by temperature when detecting signals. The photoelectric conversion module 20 and the lateral diffraction optical component 30 perform best at 25℃±0.3℃ (degrees Celsius). Therefore, it is necessary to precisely control the operating temperature of the photoelectric conversion module 20 and the lateral diffraction optical component 30 so that they always operate at the set temperature, ensuring detection accuracy and stability.

[0053] The spectral detector 100 provided in this application embodiment has an optical module, a base 10, and a heat sink 52 arranged sequentially along the top and bottom direction, forming a layered design with clear structure for each part. The optical module and the heat sink 52 can be assembled with the base 10 respectively without interference, resulting in high integration and easy maintenance and replacement of the heat sink 52. Of course, there is also enough space above the base 10 to arrange more photoelectric conversion modules 20 to achieve multi-channel detection and multi-parameter detection as much as possible. At the same time, the temperature control component 51 is in direct contact with the photoelectric conversion module 20 and the lateral optical component 30, and dissipates heat through the heat sink 52, enabling precise temperature control and increasing the detection stability of the photoelectric conversion module 20 and the lateral optical component 30.

[0054] In some embodiments, please refer to Figure 6 , Figures 12 to 15 The spectral detector 100 includes a dichroic mirror assembly 60, a first optical path adjustment device 70, and at least one second optical path adjustment device 80 disposed on the base 10. The dichroic mirror assembly 60 includes at least two dichroic mirrors 62, the first optical path adjustment device 70 includes a collimating lens 75, and the second optical path adjustment device 80 includes a reflecting mirror 85.

[0055] The first optical path adjustment device 70 is used to connect to the optical fiber. The collimating lens 75 collimates the light generated by the optical fiber from the sample to be tested. One dichroic mirror 62 transmits the fluorescence signal in the light collimated by the collimating lens 75 to another dichroic mirror 62, and transmits the side-scattered light signal in the collimated light to the side-scattering optical component 30. The other dichroic mirror 62 reflects the fluorescence signal to the photoelectric conversion module 20 via the reflector 85.

[0056] Optical fiber is a light-conducting fiber used as a light transmission tool. It can be made of glass or plastic. The light signal generated by the laser excitation device on the sample under test can be transmitted through the optical fiber to the spectrometer detector 100. The first optical path adjustment device 70 is connected to the optical fiber. The light signal transmitted through the optical fiber is collimated by the collimating lens 75, converted into a parallel beam, and transmitted to the dichroic mirror assembly 60. One dichroic mirror 62 can split the light beam, transmitting the side-scattered light signal to the side-scattering optical assembly 30 and the fluorescence signal to the other dichroic mirror 62 for separate detection, enabling multi-parameter measurement. The other dichroic mirror 62 reflects the fluorescence signal through the reflector 85 to the photoelectric conversion module 20.

[0057] There can be one or more second optical path adjustment devices 80, that is, multiple second optical path adjustment devices 80 can be set to reflect the fluorescence signal to multiple photoelectric conversion modules 20 to achieve effective multi-parameter detection.

[0058] It should be noted that the collimating lens 75 can be an aspherical lens, and the reflecting mirror 85 can be a plane mirror, a reflecting prism, etc.

[0059] For example, please refer to Figure 12 The dichroic mirror assembly 60 may also include a mirror base 61, which is connected to the base 10, and two dichroic mirrors 62 are respectively fixed on the mirror base 61.

[0060] In this embodiment, the cooperation of the dichroic mirror assembly 60, the first optical path adjustment device 70, and the second optical path adjustment device 80 facilitates the separation of the fluorescence signal and the side-scattered light signal in the light signal generated by the sample to be tested. At the same time, it collimates and reflects the light, so that the fluorescence signal can be transmitted to the photoelectric conversion module 20 and the side-scattered light signal can be transmitted to the side-scattering optical component 30, thereby increasing the reliability of the optical path.

[0061] It should be noted that the positions of the dichroic mirror assembly 60, the first optical path adjustment device 70, and the second optical path adjustment device 80 on the base 10 can be adjusted so that the actual optical path matches the designed optical path. After the position is adjusted, the dichroic mirror assembly 60, the first optical path adjustment device 70, and the second optical path adjustment device 80 are fixed relative to the base 10.

[0062] In some embodiments, please refer to Figure 6 and Figure 10There are multiple photoelectric conversion modules 20. Each photoelectric conversion module 20 includes a filter component 21 and at least two photoelectric detection components 22 connected to different sides of the filter component 21. Each photoelectric detection component 22 includes a mounting base 221 and multiple photodetectors 222 disposed on the mounting base 221. The filter component 21 is used to filter and reflect the fluorescence signal and then transmit it to each photodetector 222. The photodetectors 222 convert the fluorescence signal into an electrical signal and transmit it to the control module 40.

[0063] At least two photoelectric detection components 22 are connected to different sides of the filter component 21. Here, different sides can be opposite sides or adjacent sides. For example, please refer to [link to relevant documentation]. Figure 10 The number of photoelectric detection components 22 is two, and the two photoelectric detection components 22 are connected to opposite sides of the filter component 21. In this way, a single photoelectric conversion module 20 can integrate at least two photoelectric detection components 22 to form optical path detection on different sides of the filter component 21.

[0064] For example, the photoelectric detection component 22 may also include a focusing lens, which is fixed to the mounting base 221 and located on the side of the photoelectric detector 222 close to the filter 212. The focusing lens can focus the light beam output by the filter 212, reduce scattering loss, and then transmit it to the photoelectric detector 222, thereby improving the photoelectric detection efficiency.

[0065] The specific structure of the filter component 21 is not limited.

[0066] Please see Figure 10 The filter assembly 21 may include a mounting base 211 and multiple filters 212 disposed on the mounting base 211. The filters 212 filter and reflect the light to be tested entering the mounting base 211. Of course, the filter assembly 21 may also be provided with a concave mirror, which focuses and reflects the light to be tested entering the mounting base 211 onto each filter 212 to optimize the filtering effect and improve the detection accuracy.

[0067] The filter 212 can be a bandpass filter, a cutoff filter, a beam splitter, etc. During detection, filters 212 with different wavelength response characteristics can be placed according to requirements.

[0068] The focusing lens can be an aspherical lens. The photodetector 222 can be a photodiode, avalanche photodiode, photomultiplier tube, etc.

[0069] For example, the photodetector 222 is an avalanche photodiode, which operates based on the photoelectric effect and the avalanche multiplication effect. When an incident photon strikes a semiconductor material, electron-hole pairs are generated. Under the action of a reverse bias voltage, these charge carriers are accelerated by the electric field and collide to generate new electron-hole pairs, forming a chain reaction, the so-called "avalanche." This self-sustaining collisional ionization process leads to a sharp increase in current, thereby amplifying the optical signal.

[0070] In this embodiment, the photoelectric conversion module 20 is modularly designed, which can improve the overall compactness of the spectrometer detector 100, facilitate multi-channel detection, support the simultaneous acquisition of multiple wavelength signals, and the photoelectric conversion module 20 is installed as a whole on the base 10, eliminating the need to install the filter component 21 and the photoelectric detection component 22 separately, simplifying the assembly process of the spectrometer detector 100 and reducing the risk of optical path misalignment.

[0071] It is understood that the filter assembly 21 and the photoelectric detection assembly 22 can be connected by a combination of screws or bolts and nuts. The mounting base 211 may be provided with a positioning reference surface to achieve positioning and engagement with the fixed base 221, thereby facilitating the connection of the filter assembly 21 and the photoelectric detection assembly 22.

[0072] The specific construction of the lateral optics component 30 is not limited; please refer to [link / reference]. Figure 11 The side-scattering optical component 30 may include a mounting block 31, a side-scattering filter 32, and a lens 33. The mounting block 31 provides a mounting base for the side-scattering filter 32, the lens 33, and the temperature sensor 90. The lens 33 collects and focuses the side-scattered light, and the side-scattering filter 32 filters the collected light.

[0073] In some embodiments, please refer to Figure 9 The spectral detector 100 includes a collimating positioning member. The base 10 is provided with a plurality of mounting grooves 10a. The collimating positioning member is movably disposed in the mounting grooves 10a. The first optical path adjustment device 70 can move relative to the base 10 according to the position of the light emitted from the collimating lens 75 on the collimating positioning member to adjust the position of the collimating lens 75. The second optical path adjustment device 80 can move relative to the base 10 according to the position of the light emitted from the reflector 85 on the collimating positioning member to adjust the position of the reflector 85.

[0074] That is, the first optical path adjustment device 70 can move relative to the base 10 to adjust the position of the collimating lens 75 so that the collimated optical path matches the preset optical path. The second optical path adjustment device 80 can move relative to the base 10 to adjust the position of the reflecting mirror 85 so that the reflected optical path matches the preset optical path.

[0075] A collimator is a structure used to detect or indicate whether an optical path is on an ideal path. A collimator can be a crosshair target with graduations, etc.

[0076] For example, a collimating positioning component is disposed on the base 10 and located on the designed optical path. The collimating positioning component is provided with concentric rings of different diameters. When light emitted from the collimating lens 75 or the reflecting mirror 85 is projected onto the ring surface, a light spot is formed on the ring surface. The size of the ring corresponds to the alignment range of the light spot, thereby determining whether the installation position of the collimating lens 75 or the reflecting mirror 85 is qualified. If it is not qualified, the offset of the light spot is observed through the ring surface, and the first optical path adjustment device 70 or the second optical path adjustment device 80 is adjusted to make the actual optical path conform to the designed optical path.

[0077] The number of mounting grooves 10a can be one or more, and the number of collimating positioning components can be one or more. The relationship between the collimating positioning component and the mounting groove 10a can be one-to-many, that is, one collimating positioning component can be assigned to multiple mounting grooves 10a to detect the collimating lens 75 and the reflector 85 in different positions respectively.

[0078] It is understandable that a positioning edge line can be provided on the mounting groove 10a, and the collimating positioning component is positioned by the positioning edge line. The collimating positioning component can also move along the positioning edge line on the mounting groove 10a in order to adjust the size of the light spot.

[0079] The specific construction of the first optical path adjustment device 70 is not limited; for example, please refer to [reference needed]. Figure 13 The first optical path adjustment device 70 may include a first adjustment member 71 and a second adjustment member 72. A collimating lens 75 is fixed to the second adjustment member 72. The first adjustment member 71 is connected to the base 10 via a first connecting shaft 73 and to the second adjustment member 72 via a second connecting shaft 74. The intersection of the central axis of the first connecting shaft 73 and the central axis of the second connecting shaft 74 coincides with the center of the light-emitting end face of the collimating lens 75. The first adjustment member 71 can drive the second adjustment member 72 to rotate relative to the base 10 around the first connecting shaft 73, and the second adjustment member 72 can rotate relative to the first adjustment member 71 around the second connecting shaft 74. Thus, during adjustment, the collimating lens 75 always rotates around the center of its own light-emitting end face, effectively avoiding light position shift caused by mechanical adjustment and improving the stability and repeatability of the optical path.

[0080] The specific structure of the second optical path adjustment device 80 is not limited.

[0081] For some examples, please refer to Figure 14The second optical path adjustment device 80 may include a third adjustment member 81 and a fourth adjustment member 82. A reflector 85 is fixed to the fourth adjustment member 82. The third adjustment member 81 is connected to the base 10 via a third connecting shaft 83 and a fourth connecting shaft 84. The intersection of the central axis of the third connecting shaft 83 and the central axis of the fourth connecting shaft 84 coincides with the center of the light-emitting end face of the reflector 85. The third adjustment member 81 can drive the fourth adjustment member 82 to rotate relative to the base 10 around the third connecting shaft 83, and the fourth adjustment member 82 can rotate relative to the third adjustment member 81 around the fourth connecting shaft 84. Thus, during adjustment, the reflector 85 always rotates around the center of its own light-emitting end face, effectively avoiding light position shifts caused by mechanical adjustment and improving the stability and repeatability of the optical path.

[0082] For other examples, please refer to Figure 15 The second optical path adjustment device 80 may include a third adjustment member 81 and a fourth adjustment member 82. A reflector 85 is fixed to the fourth adjustment member 82. The third adjustment member 81 is connected to the base 10 via a third connecting shaft 83. The fourth adjustment member 82 is connected to the third adjustment member 81. The intersection of the central axis of the third connecting shaft 83 and the central axis of the fourth adjustment member 82 coincides with the center of the light-emitting end face of the reflector 85. The third adjustment member 81 can drive the fourth adjustment member 82 to rotate relative to the base 10 around the third connecting shaft 83, and the fourth adjustment member 82 can rotate relative to the third adjustment member 81 around itself. Thus, during adjustment, the reflector 85 always rotates around the center of its own light-emitting end face, effectively avoiding light position shifts caused by mechanical adjustment and improving the stability and repeatability of the optical path.

[0083] In some embodiments, please refer to Figure 9 The base 10 is provided with a positioning groove 10b. The photoelectric conversion module 20, the lateral dispersion optical component 30, the dichroic mirror component 60, the first optical path adjustment device 70, and the second optical path adjustment device 80 are disposed in the positioning groove 10b and connected to the base 10.

[0084] In this embodiment, the photoelectric conversion module 20, the lateral diffraction optical component 30, the dichroic mirror component 60, the first optical path adjustment device 70, and the second optical path adjustment device 80 are disposed in the positioning groove 10b and are positioned and limited by the positioning groove 10b to form a relatively fixed position on the base 10, which facilitates the increase of detection accuracy. The positioning groove 10b may be provided with a positioning edge line to form a positioning reference, so that the position of the photoelectric conversion module 20 and the lateral diffraction optical component 30 is fixed, thereby increasing the detection reliability.

[0085] In some embodiments, please refer to Figure 7The temperature control component 51 is exposed on the bottom surface of the base 10. The spectral detector 100 includes a connector 12 that connects the base 10 and the heat sink 52, and abuts the temperature control component 51 against the bottom side of the photoelectric conversion module 20 and the lateral scattering optical component 30.

[0086] The temperature control component 51 is exposed on the bottom surface of the base 10, that is, the temperature control component 51 can be seen from the bottom surface of the base 10. Of course, the temperature control component 51 is also exposed in the positioning groove 10b so as to facilitate contact with the photoelectric conversion module 20 and the lateral scattering optical component 30.

[0087] The connector 12 connects the base 10 and the heat sink 52, which can increase the structural stability of the spectral detector 100. At the same time, the connector 12 fixes the position of the temperature control component 51, so that the temperature control component 51 can remain in contact with the bottom side of the photoelectric conversion module 20 and the lateral scattering optical component 30, so as to achieve precise temperature control.

[0088] The connector 12 can directly transmit the force to the temperature control component 51, that is, the connector 12 can abut against the temperature control component 51. Of course, the connector 12 can also indirectly transmit the force to the temperature control component 51, that is, there is an intermediate structure between the two.

[0089] The number of connectors 12 is unlimited; there can be one or more.

[0090] The specific construction of the connector 12 is not limited; it can be a screw or a combination of a bolt and a nut.

[0091] In some embodiments, the heat sink 52 is in surface-to-surface contact with the base 10 and abuts against the temperature control component 51. That is, the heat sink 52 is in direct contact with the base 10 and the temperature control component 51. This facilitates the direct reception of heat transferred from the temperature control component 51 and its dissipation to the external environment. At the same time, it also increases the overall structural compactness of the spectral detector 100.

[0092] For other examples, please refer to Figure 4 and Figure 7 The spectral detector 100 includes a reinforcing plate 11, which is connected between the base 10 and the heat sink 52. The heat sink 52 abuts against the temperature control component 51 through the reinforcing plate 11.

[0093] In this embodiment, the reinforcing plate 11 increases the structural strength of the base 10, thereby increasing the overall structural stability of the spectral detector 100. The reinforcing plate 11 is disposed between the base 10 and the heat sink 52, and conducts heat between the heat sink 52 and the temperature control component 51. The connector 12 can pass through the heat sink 52 and the reinforcing plate 11 to directly act on the temperature control component 51, or it can act on the temperature control component 51 through the reinforcing plate 11. The heat generated by the temperature control component 51 can be transferred to the heat sink 52 through the reinforcing plate 11 and dissipated.

[0094] The specific structure of the reinforcing plate 11 is not limited. For example, the reinforcing plate 11 can be a metal part with good thermal conductivity, which can increase the structural strength without affecting heat dissipation.

[0095] In some embodiments, the connector 12 passes through the heat sink 52 and is spaced apart from the temperature control component 51 along the top-bottom direction. The spectral detector 100 includes an elastic element 13, which is sleeved on the outside of the connector 12 and abuts against the temperature control component 51. Under the elastic force of the elastic element 13, the temperature control component 51 remains in contact with the photoelectric conversion module 20 and the lateral scattering optical component 30.

[0096] In other words, the force of the connector 12 will not be directly applied to the temperature control component 51. The force of the connector 12 is transmitted to the temperature control component 51 through the elastic element 13, forming a flexible force. This not only keeps the temperature control component 51 in contact with the photoelectric conversion module 20 and the lateral optical component 30, but also reduces the damage caused by hard contact to the temperature control component 51 and extends the service life of the temperature control component 51.

[0097] The specific structure of the elastic element 13 is not limited; it can be a spring, a sheet, etc., and there are no restrictions here.

[0098] The specific structure of the temperature control component 51 is not limited.

[0099] In some embodiments, please refer to Figure 7 The temperature control component 51 includes a first cooling chip 511 and a second cooling chip 512. The first cooling chip 511 and the second cooling chip 512 are not connected to each other. The cold side of the first cooling chip 511 is attached to the bottom side of the photoelectric conversion module 20, and the cold side of the second cooling chip 512 is attached to the bottom side of the side-scattering optical component 30. The hot side of the first cooling chip 511 and the hot side of the second cooling chip 512 are respectively thermally connected to the heat sink 52.

[0100] The first cooling element 511 and the second cooling element 512 are not connected to each other, meaning that the first cooling element 511 and the second cooling element 512 are set in different positions and will not interfere with each other. There will be no temperature interference between them, which makes it easy to achieve precise temperature control of the photoelectric conversion module 20 and the lateral optical component 30 respectively.

[0101] The first cooler 511 and the second cooler 512 can be formed as semiconductor coolers, which work based on the Peltier effect. When direct current passes through a circuit composed of two different types of semiconductor materials, heat absorption or release will occur at the junction.

[0102] The cold surfaces of the first cooling chip 511 and the second cooling chip 512 respectively come into contact with the photoelectric conversion module 20 and the lateral optical component 30 to cool them down, so that the photoelectric conversion module 20 and the lateral optical component 30 can always work at a preset temperature. The hot surfaces of the first cooling chip 511 and the second cooling chip 512 generate a lot of heat, which is transferred to the heat sink 52 to dissipate the heat.

[0103] In this embodiment, the arrangement of the first cooling chip 511 and the second cooling chip 512 enables efficient operation in a small space and provides precise temperature regulation, so that the photoelectric conversion module 20 and the lateral scattering optical component 30 can always work at the preset temperature, increasing the reliability of detection.

[0104] In some embodiments, please refer to Figure 7 The temperature control component 51 also includes multiple heat dissipation adapter blocks 513, which are disposed within the base 10.

[0105] The heat dissipation adapter block 513 is disposed between the hot surface of the first cooling chip 511 and the heat sink 52, and / or, the heat dissipation adapter block 513 is disposed between the hot surface of the second cooling chip 512 and the heat sink 52.

[0106] Understandably, the heat dissipation adapter block 513 can conduct heat, transferring the heat generated by the first cooling chip 511 and the second cooling chip 512 to the heat sink 52.

[0107] In this embodiment, the heat dissipation adapter block 513 is designed to fit the installation space of the first cooling chip 511 and the second cooling chip 512 on the base 10, so that the first cooling chip 511 and the second cooling chip 512 will not move along the top and bottom direction, and can maintain contact with the photoelectric conversion module 20 and the side-scattering optical component 30 as much as possible, without moving due to the assembly gap, thus increasing the assembly reliability.

[0108] In some embodiments, please refer to Figure 4 The spectral detector 100 includes a heat insulation cover 91, which surrounds the photoelectric conversion module 20 and the lateral diffraction optical component 30. The control module 40 is located on the outside of the heat insulation cover 91. The heat insulation cover 91 is provided with a wiring port to realize the electrical connection between the photoelectric conversion module 20, the lateral diffraction optical component 30 and the control module 40.

[0109] In this embodiment, the heat insulation cover 91 can provide heat insulation for the photoelectric conversion module 20 and the lateral optical component 30, so that the photoelectric conversion module 20 and the lateral optical component 30 can work in a relatively stable temperature environment, reduce the influence of external temperature factors, and increase the reliability of detection.

[0110] The control module 40 is located on the outside of the insulation cover 91, which can reduce the influence of the temperature of the temperature control component 51 and at the same time reduce the working pressure of the temperature control component 51.

[0111] The insulation cover 91 can be a one-piece structure or a layered design; there are no restrictions on this.

[0112] In some embodiments, please refer to Figure 8 The control module 40 includes a power board 41 and multiple circuit board assemblies 42. The multiple circuit board assemblies 42 are used to electrically connect to the photoelectric conversion module 20 and the lateral scattering optical assembly 30, respectively. The multiple circuit board assemblies 42 are arranged around the outer periphery of the heat insulation cover 91. The power board 41 is arranged on the top side of the heat insulation cover 91. The control module 40 also includes a positioning plate 43. The bottom end of the multiple circuit board assemblies 42 is connected to the base 10, and the top end is connected to the positioning plate 43. The multiple circuit board assemblies 42 are connected to the power board 41 through the positioning plate 43.

[0113] For example, the positioning plate 43 is disposed on the top side of the heat insulation cover 91, and the power board 41 is connected to the top side of the positioning plate 43.

[0114] The circuit board assembly 42 may include, but is not limited to, a preamplifier circuit, a signal processing circuit, etc., to amplify, filter, and perform digital-to-analog conversion on the electrical signal received from the photoelectric detection assembly 22.

[0115] The power board 41 can serve as the main control board of the spectral detector 100, centralizing the management of all electrical connections. The power board 41 can provide power to each circuit board assembly 42, facilitating the stable operation of the photoelectric detection assembly 22 corresponding to each circuit board assembly 42. The power board 41 can also integrate the electrical signals transmitted from each circuit board assembly 42 to transmit to an external control system, or serve as a communication bridge between different circuit board assemblies 42.

[0116] Multiple circuit board assemblies 42 can be fixed around the outer periphery of the positioning plate 43. The multiple circuit board assemblies 42 are connected to the power board 41 through the positioning plate 43. That is, the multiple circuit board assemblies 42 can be connected to the base 10 first, and then to the positioning plate 43. The base 10 and the positioning plate 43 are used to fix them, and the installation accuracy of the circuit board assemblies 42 is transferred to the positioning plate 43. When the power board 41 and the positioning plate 43 are connected in the top and bottom direction, the electrical connection pins of each circuit board assembly 42 can also be plugged into the power board 41 respectively, without the need for separate alignment connection, reducing the difficulty of operation and increasing the reliability of installation.

[0117] For example, the number of circuit board assemblies 42 can be five, with four circuit board assemblies 42 electrically connected to four photoelectric detection assemblies 22 and one circuit board assembly 42 electrically connected to a lateral optics assembly 30.

[0118] In some embodiments, please refer to Figure 1 , Figure 4 and Figure 7 The spectral detector 100 also includes an outer cover 92, which is disposed on the top side of the base 10 and outside the optical module and the control module 40. The control module 40 is provided with at least one external interface 40a, which is exposed on the top surface of the outer cover 92.

[0119] In this embodiment, the outer cover 92, together with the base 10, can protect the optical module and the control module 40, reduce the influence of external dust and moisture, and increase the overall structural stability of the spectral detector 100.

[0120] The external interface 40a is exposed on the outer surface of the spectrometer detector 100, meaning that the external interface 40a can be seen from the outer surface of the spectrometer detector 100. The external interface 40a can be one or more of a power interface and a USB interface.

[0121] For example, please refer to Figure 8 The external interface 40a is formed on the power board 41.

[0122] With the external interface 40a, the signals from each circuit board assembly 42 can be transmitted to external devices via the power board 41, so as to analyze optical signals of different wavelengths and obtain detection results.

[0123] In some embodiments, please refer to Figure 10 and Figure 11 The photoelectric conversion module 20 and the lateral diffusion optical component 30 are each equipped with at least one temperature sensor 90. The temperature sensor 90 is electrically connected to the control module 40. The control module 40 is used to control the temperature control component 51 to start or stop temperature adjustment of the photoelectric conversion module 20 and the lateral diffusion optical component 30 according to the temperature signal of the temperature sensor 90.

[0124] For example, please refer to photoelectric conversion module 20. Figure 10 The photoelectric conversion module 20 can be equipped with two temperature sensors 90. One temperature sensor 90 is located on the filter assembly 21, and the first cooling chip 511 abuts against the bottom surface of the filter assembly 21. The temperature sensor 90 is used to detect the temperature of the filter assembly 21 and transmit the temperature data to the control module 40 so that the control module 40 can determine whether temperature adjustment is needed based on the temperature. The heat of the first cooling chip 511 can be transferred to the photoelectric detection assembly 22. The other temperature sensor 90 can be located on the photoelectric detection assembly 22 to monitor whether the operating temperature of the photoelectric detection assembly 22 is within a suitable range, thereby ensuring the overall working stability of the photoelectric conversion module 20.

[0125] In this embodiment, the temperature sensor 90 can sense and confirm the temperature of the photoelectric conversion module 20 and the lateral diffraction optical component 30, so as to determine whether temperature adjustment is needed, thereby ensuring that the photoelectric conversion module 20 and the lateral diffraction optical component 30 always operate in a suitable temperature environment, increasing the reliability of detection.

[0126] In the description of this application, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the embodiments of this application. In this application, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Furthermore, without contradiction, those skilled in the art can combine different embodiments or examples described in this application, as well as features of different embodiments or examples.

[0127] The above description is merely a preferred embodiment of this application and is not intended to limit the application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A spectral detector, characterized in that, include: abutment; An optical module is disposed on the base. The optical module includes a lateral optic component and at least one photoelectric conversion module. The lateral optic component is used to convert the side-scattered light signal generated by the sample under test into an electrical signal, and the photoelectric conversion module is used to convert the fluorescence signal generated by the sample under test into an electrical signal. A control module is connected to the top side of the base, and the control module is electrically connected to the lateral optics component and the photoelectric conversion module respectively; A temperature control module includes a temperature control component and a heat sink. The heat sink is connected to the base. The temperature control component is disposed inside the base and electrically connected to the control module. One end of the temperature control component abuts against the bottom side of the photoelectric conversion module and the lateral scattering optical component, respectively, and the other end is thermally connected to the heat sink. Along the top-bottom direction of the spectral detector, the optical module, the base, and the heat sink are arranged in sequence; The temperature control component is exposed on the bottom surface of the base. The spectral detector includes a connector that connects the base and the heat sink, and abuts the temperature control component against the bottom side of the photoelectric conversion module and the lateral optics component. The connector passes through the heat sink and is spaced apart from the temperature control component along the top and bottom direction. The spectral detector includes an elastic element, which is sleeved on the outside of the connector and abuts against the temperature control component. The temperature control component is kept in contact with the photoelectric conversion module and the lateral dispersion optical component under the elastic force of the elastic element. The temperature control component includes a first cooling chip and a second cooling chip, which are not connected to each other. The cold side of the first cooling chip is attached to the bottom side of the photoelectric conversion module, and the cold side of the second cooling chip is attached to the bottom side of the lateral optics component. The hot side of the first cooling chip and the hot side of the second cooling chip are respectively thermally connected to the heat sink.

2. The spectral detector according to claim 1, characterized in that, The spectral detector includes a dichroic mirror assembly disposed on the base, a first optical path adjustment device, and at least one second optical path adjustment device. The dichroic mirror assembly includes at least two dichroic mirrors, the first optical path adjustment device includes a collimating lens, and the second optical path adjustment device includes a reflecting mirror. The first optical path adjustment device is used to connect to the optical fiber. The collimating lens collimates the light generated by the optical fiber from the sample under test. One of the dichroic mirrors transmits the fluorescence signal in the light collimated by the collimating lens to another dichroic mirror and transmits the side-scattered light signal in the collimated light to the side-scattering optical component. The other dichroic mirror reflects the fluorescence signal to the photoelectric conversion module via the reflector.

3. The spectral detector according to claim 2, characterized in that, The number of photoelectric conversion modules is multiple. Each photoelectric conversion module includes a filter component and at least two photoelectric detection components connected to different sides of the filter component. Each photoelectric detection component includes a mounting base and multiple photoelectric detectors disposed on the mounting base. The filter component is used to filter and reflect the fluorescence signal and then transmit it to each of the photoelectric detectors. The photoelectric detectors convert the fluorescence signal into an electrical signal and transmit it to the control module. And / or, the spectral detector includes a collimating positioning element, the base is provided with a plurality of mounting grooves, the collimating positioning element is movably disposed in the mounting grooves, the first optical path adjustment device is capable of moving relative to the base on the collimating positioning element according to the position of the light emitted from the collimating lens; the second optical path adjustment device is capable of moving relative to the base on the collimating positioning element according to the position of the light emitted from the reflector; And / or, the base is provided with a positioning groove, and the photoelectric conversion module, the lateral dispersion optical component, the dichroic mirror component, the first optical path adjustment device, and the second optical path adjustment device are respectively disposed in the positioning groove and connected to the base.

4. The spectral detector according to claim 1, characterized in that, The heat sink is in contact with the surface of the base and abuts against the temperature control component; Alternatively, the spectral detector may include a reinforcing plate connected between the base and the heat sink, with the heat sink abutting against the temperature control component via the reinforcing plate.

5. The spectral detector according to claim 1, characterized in that, The temperature control component also includes multiple heat dissipation adapter blocks, which are disposed within the base. The heat dissipation adapter block is disposed between the hot surface of the first cooling chip and the heat sink, and / or, the heat dissipation adapter block is disposed between the hot surface of the second cooling chip and the heat sink.

6. The spectral detector according to claim 1, characterized in that, The spectral detector includes a heat insulation cover surrounding the photoelectric conversion module and the lateral diffraction optical component. The control module is located outside the heat insulation cover. The heat insulation cover has wiring ports to enable electrical connection between the photoelectric conversion module, the lateral diffraction optical component, and the control module.

7. The spectral detector according to claim 6, characterized in that, The control module includes a power board and multiple circuit board assemblies. The multiple circuit board assemblies are respectively electrically connected to the photoelectric conversion module and the lateral optics component. The multiple circuit board assemblies surround the outer periphery of the heat insulation cover. The power board is disposed on the top side of the heat insulation cover. The control module also includes a positioning plate, which is disposed on the top side of the heat insulation cover. The bottom ends of the multiple circuit board assemblies are connected to the base, and the top ends are connected to the positioning plate. The multiple circuit board assemblies are connected to the power board through the positioning plate. And / or, the spectral detector further includes an outer cover disposed on the top side of the base and covering the outside of the optical module and the control module; the control module is provided with at least one external interface exposed on the top surface of the outer cover.

8. The spectral detector according to claim 1, characterized in that, The photoelectric conversion module and the lateral diffusion optical component are each equipped with at least one temperature sensor. The temperature sensor is electrically connected to the control module. The control module is used to control the temperature control component to turn on or off temperature adjustment of the photoelectric conversion module and the lateral diffusion optical component according to the temperature signal of the temperature sensor.

9. A particle analyzer, characterized in that, It includes a laser excitation device and a spectral detector as described in any one of claims 1-8; the laser excitation device is used to emit a laser light source to the sample to be tested and to emit the light signal generated by the sample to the spectral detector.

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