Temperature controller calibration method and system based on taylor series approximation

Abstract

The application provides a temperature controller calibration method based on Taylor series approximation, applied to a chip test handler, the temperature controller calibration method comprising: controlling the temperature controller to sequentially output control parameters according to a plurality of different preset initial temperatures; obtaining sample data; performing nonlinear approximation on the sample data by Taylor series to obtain a temperature calibration function; and calibrating the control parameters output by the temperature controller according to an expected temperature and the temperature calibration function. In addition, the application also provides a temperature controller calibration system based on Taylor series approximation. The application sequentially outputs different control parameters by controlling the temperature controller to correspondingly obtain the initial temperature and the initial heating temperature of the temperature control carrier, thereby reducing manual operation and error introduction. The application obtains the temperature calibration function by performing nonlinear approximation by Taylor series, accurately describes the nonlinear characteristics of the temperature controller, and is then applied to temperature calibration of different temperature controllers in the test handler, thereby enhancing the universality and flexibility of the system.

Description

Technical Field

[0001] This application relates to the field of semiconductor testing technology, and in particular to a temperature controller calibration method and system based on Taylor series approximation. Background Technology

[0002] In semiconductor chip testing, multiple temperature controllers on the test sorting machine often require temperature calibration. Traditional calibration methods rely on manual adjustments, necessitating multiple measurements of each temperature controller and linear estimation based on adjacent points to determine compensation values. However, this method is time-consuming and labor-intensive, and manual operation easily introduces errors, resulting in low calibration efficiency. Furthermore, this method struggles to cover the non-linear characteristics of the temperature controllers, leading to accumulated temperature control errors and affecting temperature control accuracy. Over time, this will adversely impact the reliability of chip testing. Summary of the Invention

[0003] In view of this, it is necessary to provide a temperature controller calibration method and system based on Taylor series approximation.

[0004] In a first aspect, embodiments of this application provide a temperature controller calibration method based on Taylor series approximation. This method is applied to a chip testing and sorting machine. The temperature controller calibration method includes: controlling the temperature controller to sequentially output adjustment parameters according to multiple preset different initial temperatures. These adjustment parameters are used to regulate the temperature of a temperature-controlled carrier, causing the carrier to sequentially exhibit multiple stable initial heating temperatures; acquiring sample data, which includes multiple different initial temperatures and corresponding initial heating temperatures; obtaining a temperature calibration function by performing nonlinear approximation on the sample data using a Taylor series; and calibrating the adjustment parameters output by the temperature controller according to the desired temperature and the temperature calibration function.

[0005] Secondly, embodiments of this application provide a temperature controller calibration system based on Taylor series approximation. This temperature controller calibration system is applied to a chip testing and sorting machine. The system includes a temperature controller, a temperature control carrier, and a temperature controller calibration module. The temperature control carrier is used to conduct a stable initial heating temperature to the chip. The temperature control carrier is equipped with a heating element electrically connected to the temperature controller for heating the carrier. The temperature controller calibration module includes a memory and a processor. The memory stores a computer program, and the processor executes the computer program to implement the aforementioned temperature controller calibration method based on Taylor series approximation.

[0006] The aforementioned temperature controller calibration method and system based on Taylor series approximation obtains the initial temperature and the initial heating temperature of the temperature control vehicle by controlling the temperature controller to output different adjustment parameters in sequence, thereby reducing manual operation and error introduction. The temperature calibration function is obtained by nonlinear approximation using Taylor series, which accurately describes the nonlinear characteristics of the temperature controller and can then be applied to the temperature calibration of different temperature controllers in the test sorting machine, enhancing the system's versatility and flexibility. Attached Figure Description

[0007] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0008] Figure 1 The first flowchart of the temperature controller calibration method based on Taylor series approximation provided in the embodiments of this application is shown.

[0009] Figure 2 A flowchart of step S101 provided for an embodiment of this application.

[0010] Figure 3 A flowchart of step S102 provided in the embodiments of this application.

[0011] Figure 4 A flowchart of step S104 provided in the embodiments of this application.

[0012] Figure 5 A flowchart of sub-step S1043 provided for embodiments of this application.

[0013] Figure 6 The diagram shows the structure of the temperature controller calibration system based on Taylor series approximation provided in the first embodiment of this application.

[0014] Figure 7 The structural block diagram of the temperature controller calibration system based on Taylor series approximation provided in the second embodiment of this application is shown.

[0015] Figure 8 This is a schematic diagram of the internal structure of the temperature controller calibration module provided in an embodiment of this application.

[0016] Figure 9 This is a first schematic diagram of a temperature controller calibration system based on Taylor series approximation provided in an embodiment of this application.

[0017] Figure 10This is a second schematic diagram of a temperature controller calibration system based on Taylor series approximation provided in an embodiment of this application.

[0018] Figure 11 This is a schematic diagram of temperature calibration for a thermostat provided in an embodiment of this application.

[0019] Component designations

[0020]

[0021]

[0022] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0024] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar planned objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data are interchangeable where appropriate; in other words, the described embodiments are implemented according to a sequence other than that illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, may also include other content; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0025] It should be noted that the use of terms such as "first" and "second" in this application is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" and "second" may explicitly or implicitly include one or more of that feature. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0026] Please refer to Figure 6 This is a structural block diagram of a temperature controller calibration system 100 based on Taylor series approximation provided in the first embodiment of this application. This application provides a temperature controller calibration system 100 based on Taylor series approximation. The temperature controller calibration system 100 is applied to a chip test sorting machine 1000. In this application, the test sorting machine 1000 can be a translational test sorting machine used to test semiconductor chips and sort chips 20 with different test results. The temperature controller calibration system 100 includes a temperature controller 1, a temperature control carrier 2, and a temperature controller calibration module 3.

[0027] The temperature controller 1 is located outside the temperature control carrier 2. The temperature control carrier 2 is in direct contact with the chip 20. The temperature controller 1 is used to regulate the temperature of the temperature control carrier 2 so that the temperature control carrier 2 can conduct a stable initial heating temperature to the chip 20 to maintain the chip 20 at the temperature required for normal operation. Specifically, the temperature control carrier 2 is provided with a heating element 21. One end of the heating element 21 is embedded in the temperature control carrier 2, and the other end is electrically connected to the temperature controller 1. The temperature controller 1 is used to control the heating element 21 to heat the temperature control carrier 2, thereby regulating the temperature of the temperature control carrier 2.

[0028] Furthermore, the temperature control carrier 2 is a device used to maintain the temperature required for the normal operation of the chip 20 during testing by the test sorting machine 1000. Specifically, the temperature control carrier 2 is a component that comes into contact with the chip 20 during testing by the test sorting machine 1000, including but not limited to components such as the heating plate 201, the feed shuttle 202, the test arm 203, and the test frame 204. The heating plate 201 heats the chip 20 it contains, the feed shuttle 202 transports the chip 20 to a designated location such as the test station, the test arm 203 holds the chip 20, and the test frame 204 can be set at the test station as the test environment for the chip 20. Correspondingly, there are multiple temperature controllers 1. Different temperature controllers 1 are connected to the heating plate 201, the feed shuttle 202, the test arm 203, and the test frame 204.

[0029] Furthermore, the heating elements 21 provided between the different temperature-controlled carriers 2 are independent of each other. Specifically, the heating plate 201, the feed shuttle 202, the test arm 203, and the test frame 204 can each heat the chip 20 they are in contact with through their respective heating elements 21. For example, as... Figure 9As shown, the heating element 21 provided in the heating plate 201 can be a heating rod embedded in the heating plate 201. Since the test arm 203 needs to hold the chip 20 and can be movably mounted on the test sorting machine 1000, the heating element 21 of the test arm 203 can be a heating plate attached to the test arm 203. Therefore, the heating elements 21 of different temperature control carriers 2 can be different, and the heating temperatures achieved by different heating elements 21 and the methods for controlling the temperature of the chip 20 can be different, to adapt to the process of testing the chip 20 by the test sorting machine 1000.

[0030] Accordingly, such as Figure 10 As shown, since the heating elements 21 of different temperature control carriers 2 have different heating temperatures, heating methods and setting methods, each temperature controller 1 in the multiple temperature controllers 1 can control the temperature control carrier 2 to be heated to a specific temperature as a whole, or it can be used to control a part of the temperature control carrier 2 to be heated to a specific temperature locally. That is, a temperature control carrier 2 can also achieve temperature control of different parts by connecting multiple temperature controllers 1.

[0031] The temperature control carrier 2 also has a thermistor 22 embedded within it. Specifically, one end of the thermistor 22 is embedded in the temperature control carrier 2, and the other end is electrically connected to the temperature controller 1. The thermistor 22 is used to obtain a stable initial heating temperature of the temperature control carrier 2. The temperature controller calibration system 100 is provided with a temperature sensor 4. The temperature sensor 4 is communicatively connected to the temperature controller calibration module 3 and is used to obtain the chip temperature of the chip 20. In this application, the temperature sensor 4 can be set in different positions relative to the test sorting machine 1000 based on different implementation scenarios of temperature calibration in the test sorting machine 1000. In the first embodiment, the temperature sensor 4 is integrated into the test sorting machine 1000. More specifically, the temperature sensor 4 is integrated into the temperature control carrier 2 and set at the corresponding position where the chip 20 contacts the temperature control carrier 2.

[0032] like Figure 7 As shown, the difference between the temperature controller calibration system 100' in the second embodiment and the temperature controller calibration system 100 in the first embodiment is that the temperature sensor 4 is located outside the test sorting machine 1000 and can be manually operated by the user to measure the chip temperature of the chip 20. The manual operation by the user in the second embodiment includes, but is not limited to, handheld operation, displaying an operation interface for user input, and voice input.

[0033] Understandably, different embodiments of this application use different temperature sensing components (e.g., thermistor 22 and temperature sensor 4 located at different positions) to sense the temperature of the temperature control carrier 2 and the chip 20 respectively, so as to accurately obtain the temperature of different components in the temperature controller calibration system 100.

[0034] Please refer to Figure 8This is a schematic diagram of the internal structure of the temperature controller calibration module provided in the embodiments of this application.

[0035] like Figure 8 As shown, the thermostat calibration module can be a computer device capable of executing computer programs. Specifically, the thermostat calibration module 3 includes a memory 31 and a processor 32. The memory stores the computer program. The processor executes the computer program in the memory 31 to implement a thermostat calibration method based on Taylor series approximation.

[0036] The memory 31 includes at least one type of readable storage medium, including flash memory, hard disk, multimedia card, card-type memory (e.g., SD or DX memory), magnetic memory, magnetic disk, optical disk, etc. In some embodiments, the memory 31 can be an internal storage unit of a computer device, such as a hard disk. In other embodiments, the memory 31 can be an external storage device of a computer device, such as a plug-in hard disk, Smart Media Card (SMC), Secure Digital (SD) card, Flash Card, etc., configured in the computer device. Furthermore, the memory 31 can include both internal and external storage units of the computer device. The memory 31 can be used not only to store application software and various types of data installed on the computer device, such as code for a temperature controller calibration method based on Taylor series approximation, but also to temporarily store data that has been output or will be output.

[0037] Furthermore, the temperature controller calibration module 3 also includes a bus 33. Bus 33 can be a peripheral component interconnect (PCI) bus or an extended industry standard architecture (EISA) bus, etc. This bus can be divided into an address bus, a data bus, a control bus, etc. For ease of representation, Figure 8 The bus is represented by a single thick line, but this does not mean that there is only one bus or one type of bus.

[0038] Furthermore, the temperature controller calibration module 3 may also include a display component 34. The display component 34 may be an LED display, a liquid crystal display, a touch-screen liquid crystal display, or an organic light-emitting diode (OLED) touchscreen, etc. The display component 34 may also be appropriately referred to as a display device or display unit, used to display information processed in the temperature controller calibration module 3 and to display a user interface for visualization.

[0039] Furthermore, the thermostat calibration module 3 may also include a communication component 35. The communication component 35 may optionally include a wired communication component and / or a wireless communication component (such as a Wi-Fi communication component, a Bluetooth communication component, etc.), which is typically used to establish a communication connection between the thermostat calibration module 3 and other computer devices.

[0040] Figure 8 Only a partial view of the thermostat calibration module 3, which implements a thermostat calibration method based on Taylor series approximation, is shown. Those skilled in the art will understand that... Figure 8 The structure shown does not constitute a limitation on the thermostat calibration module 3, and may include fewer or more components than shown, or combine certain components, or have different component arrangements.

[0041] Please refer to Figure 1 This is a first flowchart of a temperature controller calibration method based on Taylor series approximation provided in an embodiment of this application. This application also provides a temperature controller calibration method based on Taylor series approximation. The temperature controller calibration method is applied to a test and sorting machine 1000 for chip 20 and can be executed by a temperature controller calibration module 3 controlling a temperature controller calibration system 100. The temperature controller calibration method includes steps S101-S104.

[0042] Step S101: Control the temperature controller to output adjustment parameters sequentially according to multiple preset initial temperatures.

[0043] In step S101, the preset multiple different initial temperatures are partial or complete temperatures that different temperature-controlled carriers 2 can reach when heated by the heating element 21 during the testing of the chip 20 in the test sorting machine 1000. The adjustment parameter is the corresponding initial temperature, used to regulate the temperature of the temperature-controlled carrier 2, so that the temperature-controlled carrier 2 sequentially reaches multiple stable initial heating temperatures. In this application, the control controller 1 outputs the adjustment parameter to the heating element 21 set on the temperature-controlled carrier 2, so that the heating element 21 heats the temperature-controlled carrier 2 according to the adjustment parameter, and then obtains the heating temperature of the temperature-controlled carrier 2 through the thermistor 22 to obtain a stable initial heating temperature.

[0044] Please refer to the following: Figure 2 This is a flowchart of step S101 provided in the embodiments of this application. The control temperature controller outputs regulation parameters sequentially according to multiple preset different initial temperatures, including steps S1011-S1013.

[0045] Step S1011: The temperature controller outputs the corresponding adjustment parameters according to any one of the preset initial temperatures, so that the temperature-controlled vehicle reaches a stable initial heating temperature.

[0046] In step S1011, the temperature controller 1 outputs corresponding control parameters to the heating element 21 according to any initial temperature, causing the heating element 21 to heat the temperature-controlled carrier 2 according to the corresponding control parameters, thereby achieving a stable initial heating temperature for the temperature-controlled carrier 2. The initial temperature can be randomly selected from a set of preset initial temperatures, or it can be set sequentially by arranging the preset initial temperatures in a specific order. This specific order can be based on the different temperatures reached by the temperature-controlled carrier 2 during normal operation, the frequency of temperatures reached by the temperature-controlled carrier 2 during normal operation, or the performance of different chips 20 at different temperatures. The initial temperatures in this specific order can be arranged non-linearly to accommodate the non-linear temperature control characteristics of the temperature controller 1. This application does not limit the specific order; the above example is merely an illustration of a specific order.

[0047] Step S1012: Control the heating element to heat the temperature-controlled carrier according to the adjustment parameters so that the temperature-controlled carrier reaches a stable initial heating temperature.

[0048] Step S1013: Based on any one of the remaining multiple different initial temperatures, control the temperature controller to output the corresponding adjustment parameters to the heating element until the temperature control vehicle sequentially reaches the initial heating temperature corresponding to all the initial temperatures.

[0049] In step S1013, each time the temperature controller 1 outputs an initial temperature corresponding adjustment parameter to make the temperature control carrier 2 reach a stable initial heating temperature, the currently output adjustment parameter of the temperature controller 1 is cleared, and the temperature controller 1 is controlled to reselect any initial temperature from the remaining preset initial temperatures to output the corresponding adjustment parameter, until the temperature control carrier 2 sequentially reaches the initial heating temperature corresponding to the adjustment parameters output in a specific order. This can realize the automatic acquisition of the initial heating temperature, avoid the time-consuming manual adjustment and the situation that is prone to introducing temperature data errors, and improve the accuracy of subsequent verification of temperature control precision.

[0050] In this application, to ensure that the initial heating temperature corresponding to different initial temperatures is not affected by the historical initial heating temperature, a preset pause time interval exists between the processes in which the temperature controller 1 outputs different control parameters to regulate the heating temperature of the temperature-controlled carrier 2 based on different initial temperatures. The preset pause time interval allows the temperature-controlled carrier 2 to return to its initial carrier temperature, thereby eliminating the influence of the historical initial heating temperature. Each time the temperature controller 1 outputs a control parameter corresponding to an initial temperature to achieve a stable initial heating temperature in the temperature-controlled carrier 2, after the preset pause time interval, the process resumes, controlling the temperature controller 1 to output the corresponding control parameter to the heating element based on any of the remaining multiple different initial temperatures.

[0051] Step S102: Obtain sample data.

[0052] In step S102, the sample data includes multiple different initial temperatures and corresponding initial heating temperatures. Each initial temperature corresponds to an initial heating temperature. This application obtains a stable initial heating temperature by controlling the thermistor 22 provided in the temperature control carrier 2. The multiple different initial temperatures are arranged in a specific order. For example, in this application, the multiple different initial temperatures are arranged in order of temperature value, more specifically, multiple initial temperatures arranged in order of temperature value from low to high.

[0053] Please refer to the following: Figure 3 This is a flowchart of step S102, a sub-step provided in the embodiments of this application. Obtaining sample data includes steps S1021-S1022.

[0054] Step S1021: Control the thermistor to sense the temperature of the temperature-controlled vehicle after it has been heated by the heating element in real time to obtain the real-time vehicle temperature.

[0055] In step S1021, the real-time vehicle temperature is a plurality of temperatures sensed by the thermistor 22.

[0056] Step S1022: When multiple temperatures sensed by the thermistor are equal, the real-time vehicle temperature is determined to be a stable initial heating temperature.

[0057] In some feasible embodiments, the heating element 21 can heat the temperature-controlled carrier to a preset time according to the corresponding initial temperature, obtain the corresponding initial heating temperature, and after a preset pause time interval, control the temperature controller 1 to output the corresponding adjustment parameters to the heating element 21 based on any one of the remaining multiple different initial temperatures, until the temperature-controlled carrier 2 sequentially reaches the initial heating temperature corresponding to all the initial temperatures. The preset time is used to ensure uniform heating of the temperature-controlled carrier 2, thereby improving the accuracy of subsequent temperature calibration.

[0058] Step S103: Obtain the temperature calibration function by nonlinearly approximating the sample data using Taylor series.

[0059] In step S103, the quantities of the corresponding initial temperature and initial heating temperature in the sample data are determined by the calculation accuracy of nonlinear approximation using Taylor series. The temperature calibration function reflects the correlation between the initial temperature corresponding to the control parameters output by temperature controller 1 and the initial heating temperature obtained by the temperature-controlled carrier 2 via thermistor 22. The expression for the temperature calibration function is as follows: Where A represents the preset initial temperature, B represents the stable initial heating temperature, and c krepresents the fitting coefficient, and n represents the number of corresponding initial temperatures and initial heating temperatures.

[0060] For example, in this application, n=5. That is, this application can control the temperature controller 1 to execute five times according to multiple preset different initial temperatures through the temperature controller calibration module 3, and sense the stable initial heating temperature of the temperature control carrier 2 five times through the thermistor 22, and then obtain the temperature calibration function by nonlinear approximating the five sets of corresponding initial temperatures and initial heating temperatures through Taylor series.

[0061] Step S104: Calibrate the control parameters output by the temperature controller according to the desired temperature and the temperature calibration function.

[0062] In step S104, the temperature control carrier 2 transmits a stable initial heating temperature to the chip 20, causing the chip 20 to reach a stable chip temperature. The chip temperature of the chip 20 is obtained through the temperature sensor 4. In this application, the desired temperature is the expected chip temperature of the chip 20. The expected chip temperature is one or more chip temperatures corresponding to good chip performance during testing. In this application, the temperature control carrier 2 heats the chip 20 it contacts to regulate the temperature of the chip 20.

[0063] Understandably, the theoretical chip temperature of chip 20 should be fully provided by the temperature control carrier 2, meaning the expected chip temperature should be equal to the initial heating temperature of the temperature control carrier 2. However, in the actual testing of the test sorter 1000, the temperature control carrier 2 experiences heat loss when transferring heating temperature to the heated chip 20. This means that when chip 20 needs to reach the expected chip temperature, the heating temperature that the temperature control carrier 2 should reach is greater than the theoretically calculated initial heating temperature. Therefore, this application can verify the ideal initial temperature obtained by the temperature calibration function by considering the expected chip temperature of chip 20 as the initial heating temperature of the temperature control carrier 2, and then obtain the actual chip temperature of chip 20 by the temperature sensor 4, thereby verifying whether the temperature calibration function can be applied to the temperature controller 1. In other words, this application uses the temperature sensor 4 to distinguish it from the thermistor 22 used to sense the temperature of the temperature control carrier 2, thus obtaining the temperatures of different components separately, to avoid the influence of the heat from the temperature control carrier 2 on the accuracy verification of the temperature calibration function.

[0064] Please refer to the following: Figure 4 The flowchart below shows step S104, a sub-step provided in the embodiments of this application. According to the desired temperature and temperature calibration function, calibrating the control parameters output by the temperature controller includes steps S1041-S1044.

[0065] Step S1041: Obtain the ideal initial temperature of the temperature controller based on the expected chip temperature and the temperature calibration function.

[0066] In step S1041, the ideal initial heating temperature of the temperature control carrier 2 is equal to the expected chip temperature of the chip 20. Therefore, the expected chip temperature of the chip 20 can be substituted into the temperature calibration function to verify the ideal initial temperature of the temperature controller 1. That is, in order for the chip 20 to reach the expected chip temperature, the ideal initial temperature set by the temperature controller 1 needs to be determined so that the temperature control carrier 2 can reach the ideal initial heating temperature.

[0067] Step S1042: Control the temperature controller to output actual control parameters according to the ideal initial temperature, so that the temperature-controlled vehicle reaches the actual initial heating temperature.

[0068] Step S1043: When the temperature control carrier transmits the actual initial heating temperature to the chip, causing the chip to reach a stable chip temperature, the actual chip temperature is obtained, and the temperature calibration function is judged to meet the requirements based on the actual chip temperature and the expected chip temperature.

[0069] In step S1043, the requirement is that the temperature calibration function obtained in step S103 can be applied to the temperature controller 1 to achieve subsequent temperature calibration.

[0070] Please refer to the following: Figure 5 The flowchart below shows step S1043, which is a sub-step provided in the embodiments of this application. Steps S10431-S10432 involve calibrating the corresponding control parameters based on the actual chip temperature and the expected chip temperature.

[0071] Step S10431: When the difference between the actual chip temperature and the expected chip temperature is less than or equal to a preset difference, it is determined that the temperature calibration function meets the requirements.

[0072] In step S10431, when the difference is less than or equal to the preset difference, the accuracy of the temperature calibration function obtained in step S103 is sufficient to be applied to the temperature controller 1 to achieve subsequent temperature calibration.

[0073] Step S10432: When the difference between the actual chip temperature and the expected chip temperature is greater than the preset difference, the controller outputs adjustment parameters sequentially according to multiple updated initial temperatures until the updated temperature calibration function meets the requirements.

[0074] In step S10432, the updated initial temperatures differ from the preset initial temperatures. When the difference is greater than the preset difference, the accuracy of the temperature calibration function obtained in step S103 is insufficient to be applied to the temperature controller 1 for subsequent temperature calibration. In this case, it is necessary to obtain a new temperature calibration function with different initial temperatures, that is, to re-execute steps S1041-S1043 and verify the updated temperature calibration function.

[0075] Understandably, different temperature controllers 1 use different temperature calibration functions. Accordingly, different temperature calibration functions can pre-adjust multiple different initial temperatures, as well as the corresponding number of initial temperatures and initial heating temperatures, based on the temperature control accuracy of different temperature controllers 1. Therefore, for different temperature controllers 1, the corresponding temperature calibration function can also be obtained by executing the above-described temperature controller calibration method based on Taylor series approximation, and then a sufficiently accurate temperature calibration function can be applied to the temperature controller 1 for subsequent temperature calibration.

[0076] Please refer to Figure 11 This is a schematic diagram of temperature calibration of the thermostat provided in the embodiments of this application.

[0077] like Figure 11 As shown, Figure 11 The temperature performance of different temperature-controlled carriers 2 under the settings of different temperature controllers 1 connected to them is demonstrated. A, B, C, and D represent different temperature controllers 1 installed on each temperature-controlled carrier 2. Specifically, the heating plate 201 has two temperature controllers 1, namely heating plate A and heating plate B. Similarly, the feed shuttle 202, test arm 203, and test frame 204 have two, four, and two temperature controllers 1 respectively, namely feed shuttle A and feed shuttle B; test arm A, test arm B, test arm C, and test arm D; and test frame A and test frame B. Figure 11 The data in the first row of the table shows the different initial heating temperatures of each temperature-controlled vehicle 2 under different initial temperatures (e.g., 70℃, 90℃, 110℃, 130℃, 150℃). According to... Figure 11 The table shown provides the temperature calibration function for each temperature controller 1, which can be used to verify the accuracy of the subsequent temperature calibration function and determine whether it can be applied to the corresponding temperature controller 1. For example, suppose the chip 20 in contact with the heating plate A needs to reach 95°C, meaning the heating temperature of the heating plate 201 theoretically needs to reach 95°C. Then, according to... Figure 11 After obtaining the temperature calibration function of heating plate A from the data shown, the corresponding A value is calculated by substituting 95℃ into B, and the A value is set as the initial temperature of heating plate A to output the corresponding control parameters. Then, the actual chip temperature of chip 20 is sensed by temperature sensor 4 to determine whether the temperature calibration function can be applied to heating plate A.

[0078] In the above embodiments, the implementation can be achieved, in whole or in part, through software, hardware, or any combination thereof. When implemented using software, it can be implemented, in whole or in part, in the form of a computer program product.

[0079] The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the flow or function according to embodiments of the present invention is generated. The computer device may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions may be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions may be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via wired (e.g., coaxial cable, fiber optic, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium may be any available medium that a computer can store or a data storage device such as a server or data center that integrates one or more available media. The available medium may be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium (e.g., a solid-state disk (SSD)).

[0080] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0081] In the several embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection between devices or units through some interfaces, and may be electrical, mechanical, or other forms.

[0082] The unit described as a separate component may or may not be physically separate. The component shown as a unit may or may not be a physical unit; that is, it may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0083] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist independently, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0084] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard disks, read-only storage media (ROM), random access storage media (RAM), magnetic disks, or optical disks.

[0085] In the above embodiments, the initial temperature and the initial heating temperature of the temperature control vehicle are obtained by controlling the temperature controller to output different adjustment parameters in sequence, which reduces manual operation and error introduction; the temperature calibration function is obtained by nonlinear approximation through Taylor series, which accurately describes the nonlinear characteristics of the temperature controller, and then applied to the temperature calibration of different temperature controllers in the test sorting machine, thereby enhancing the versatility and flexibility of the system.

[0086] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

[0087] It should be understood that although the steps in the flowcharts of the accompanying figures are shown sequentially as indicated by the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the accompanying figures may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily completed at the same time, but can be executed at different times, and their execution order is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the sub-steps or stages of other steps.

[0088] The above-listed embodiments are merely preferred embodiments of this application and should not be construed as limiting the scope of this application. Therefore, any equivalent variations made in accordance with the claims of this application shall still fall within the scope of this application.

Claims

1. A temperature controller calibration method based on Taylor series approximation, wherein the temperature controller calibration method is applied to a chip testing and sorting machine, characterized in that, The temperature controller calibration method includes: The temperature controller outputs adjustment parameters sequentially according to multiple preset initial temperatures. The adjustment parameters are used to regulate the temperature of the temperature control carrier, so that the temperature control carrier sequentially reaches multiple stable initial heating temperatures. The temperature control carrier is also used to conduct the stable initial heating temperature to the chip, so that the chip reaches a stable chip temperature. Acquire sample data, which includes multiple different initial temperatures and corresponding initial heating temperatures; The temperature calibration function is obtained by nonlinearly approximating the sample data using Taylor series. According to the desired temperature and the temperature calibration function, the control parameters output by the temperature controller are calibrated, including: obtaining the ideal initial temperature of the temperature controller based on the expected chip temperature of the chip and the temperature calibration function; controlling the temperature controller to output actual control parameters according to the ideal initial temperature so that the temperature control carrier reaches the actual initial heating temperature; when the temperature control carrier transmits the actual initial heating temperature to the chip, so that the chip reaches a stable chip temperature, obtaining the actual chip temperature of the chip, and judging whether the temperature calibration function meets the requirements based on the actual chip temperature and the expected chip temperature, wherein the desired temperature is the expected chip temperature of the chip.

2. The temperature controller calibration method as described in claim 1, characterized in that, The control parameter is the corresponding initial temperature; the temperature controller outputs the control parameter sequentially according to multiple preset different initial temperatures, including: The temperature controller outputs a corresponding adjustment parameter based on any one of the preset multiple different initial temperatures, so that the temperature-controlled vehicle reaches a stable initial heating temperature. The temperature controller outputs a corresponding adjustment parameter based on any one of the remaining preset initial temperatures until the temperature-controlled vehicle sequentially reaches the initial heating temperature corresponding to all the initial temperatures.

3. The temperature controller calibration method as described in claim 2, characterized in that, The multiple different initial temperatures are multiple initial temperatures arranged in order of their numerical values. The temperature control carrier is equipped with a heating element and a thermistor. The heating element is used to heat the temperature control carrier, and the thermistor is used to obtain the stable initial heating temperature. Obtain sample data, including: The real-time temperature of the vehicle is obtained by controlling the thermistor to sense the temperature of the temperature-controlled vehicle after being heated by the heating element. The real-time temperature of the vehicle is a plurality of temperatures sensed by the thermistor. When multiple temperatures sensed by the thermistor are equal, the real-time vehicle temperature is determined to be the stable initial heating temperature.

4. The temperature controller calibration method as described in claim 1, characterized in that, The expression for the temperature calibration function is as follows: ,in, This indicates the preset initial temperature. This indicates a stable initial heating temperature. Represents the fitting coefficient. This indicates the quantity of the corresponding initial temperature and initial heating temperature.

5. The temperature controller calibration method as described in claim 1, characterized in that, Determining whether the temperature calibration function meets the requirements based on the actual chip temperature and the expected chip temperature includes: When the difference between the actual chip temperature and the expected chip temperature is less than or equal to a preset difference, it is determined that the temperature calibration function meets the requirements; When the difference between the actual chip temperature and the expected chip temperature is greater than the preset difference, the controller outputs adjustment parameters sequentially according to multiple updated different initial temperatures until the updated temperature calibration function meets the requirements. The multiple updated different initial temperatures are different from the multiple preset different initial temperatures.

6. The temperature controller calibration method as described in claim 5, characterized in that, The chip temperature is obtained through a temperature sensor, which is integrated into the test sorting machine or located outside the test sorting machine, so that the user can measure the chip temperature.

7. A temperature controller calibration system based on Taylor series approximation, wherein the temperature controller calibration system is applied to a chip testing and sorting machine, characterized in that, The temperature controller calibration system includes: Thermostat; A temperature-controlled carrier is used to conduct a stable initial heating temperature to the chip. The temperature-controlled carrier is provided with a heating element, which is electrically connected to the temperature controller for heating the temperature-controlled carrier. Thermostat calibration module, including: Memory, used to store computer programs; A processor for executing the computer program to implement the temperature controller calibration method based on Taylor series approximation as described in any one of claims 1-6.

8. The temperature controller calibration system as described in claim 7, characterized in that, The temperature controller calibration system is equipped with a thermistor and a temperature sensor. The thermistor is embedded in the temperature control carrier and electrically connected to the temperature controller to obtain a stable initial heating temperature of the temperature control carrier. The temperature sensor is used to obtain the chip temperature of the chip. The temperature sensor is integrated into the test sorting machine or located outside the test sorting machine for user operation to measure the chip temperature.

9. The temperature controller calibration system as described in claim 7, characterized in that, The number of temperature controllers is multiple. The temperature control carrier is a device used to maintain the temperature required for the normal operation of the chip when the chip is tested by the test sorting machine. It includes a heating plate, a feed shuttle, a test arm, and a test frame. The heating plate, the feed shuttle, the test arm, and the test frame are respectively connected to different temperature controllers.

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