A gold finger connection structure and method with centroid compensation

Abstract

The application relates to a gold finger connection structure and method with a mass center compensation, the gold finger connection structure comprising a bearing substrate provided with a conductive connecting part for plugging with a mainboard PCB, a mass center regulating groove arranged on the back surface of the substrate, an elastic restraint mechanism mounting part arranged on the side edge of the substrate, and a multidirectional elastic restraint mechanism connecting the mounting part with the mainboard PCB; the mass center regulating groove is configured to change the mass center distribution of the connection structure, so that the mass center is offset to the direction of the elastic restraint mechanism mounting part; the multidirectional elastic restraint mechanism generates an axial pre-tightening force along the plugging direction and a compensation torque perpendicular to the plugging direction during assembly, thereby forming multidimensional dynamic restraint on the connection structure. Through the synergistic effect of the mass center regulating groove and the multidirectional elastic restraint mechanism, the mechanical defects of the traditional gold finger connection structure are fundamentally improved, the self-balancing of the connection structure in the three-dimensional space is realized, and the mechanical stability and electrical reliability are improved.

Description

Technical Field

[0001] This invention relates to the field of electronic device connection technology, specifically to a gold finger connection structure and method with centroid compensation, aiming to solve the shortcomings of traditional gold finger connection structures in terms of mechanical performance and improve the mechanical stability and electrical reliability of the connection structure under complex working conditions. Background Technology

[0002] In electronic devices, gold finger connections are a common electrical connection method widely used for signal transmission and power supply between various circuit boards. However, existing gold finger connections have some obvious mechanical defects.

[0003] On the one hand, under the influence of environmental factors such as temperature cycling and mechanical vibration, the contact pressure between the conductive connector of the traditional gold finger connection structure and the motherboard PCB slot is prone to change, leading to fluctuations in contact resistance. This not only affects the stability of signal transmission but may also cause problems such as local overheating, and in severe cases, even damage electronic components.

[0004] On the other hand, when the equipment is subjected to impact or high-frequency vibration, the connection interface lacks effective resistance to lateral disturbances. Due to insufficient constraints to counteract external torque, the contact surface is prone to slippage or fretting wear, further reducing the reliability of the connection and shortening the connector's service life.

[0005] Furthermore, traditional gold finger connection structures exhibit poor self-balancing capabilities under combined loads, making it difficult to maintain a stable connection in complex dynamic application scenarios. Therefore, there is an urgent need for an innovative connection structure to address these issues and meet the demands of modern electronic devices for high reliability and long-lifespan connections. Summary of the Invention

[0006] In view of this, the present invention provides a gold finger connection structure with centroid compensation. Through the synergistic effect of the centroid adjustment groove and the multi-directional elastic constraint mechanism, the mechanical defects of the traditional gold finger connection structure are fundamentally improved, the connection structure is self-balanced in three-dimensional space, and its mechanical stability and electrical reliability are improved.

[0007] The objective of this invention is achieved through the following technical solution:

[0008] A gold finger connection structure with centroid compensation includes a carrier substrate with a conductive connection part on the bottom surface for insertion into a motherboard PCB, a centroid adjustment groove on the back of the substrate, an elastic constraint mechanism mounting part on the side of the substrate, and a multi-directional elastic constraint mechanism connecting the mounting part and the motherboard PCB. The centroid adjustment groove is configured to change the centroid distribution of the connection structure, causing the centroid to shift towards the elastic constraint mechanism mounting part. The multi-directional elastic constraint mechanism generates an axial preload along the insertion direction and a compensation torque perpendicular to the insertion direction during assembly, forming a multi-dimensional dynamic constraint on the connection structure.

[0009] The synergistic effect of the center-of-gravity adjustment groove and the multi-directional elastic constraint mechanism fundamentally improves the mechanical defects of traditional gold finger connection structures. In terms of axial preload, the elastic constraint mechanism maintains a constant contact pressure between the conductive connector and the motherboard PCB slot, effectively overcoming contact resistance fluctuations caused by temperature cycling and mechanical vibration. The introduction of compensating torque gives the connection interface resistance to lateral disturbances. When the device is subjected to impact or high-frequency vibration, the restoring torque generated by the deformation of the elastic constraint mechanism can offset the external torque, preventing slippage or fretting wear on the contact surface. The center-of-gravity offset design, by adjusting the structural mass distribution, forms a mechanical fulcrum in the direction of the elastic constraint mechanism's mounting section, significantly improving the system's resistance to overturning moments. This multi-dimensional dynamic constraint mechanism enables the connection structure to achieve self-balancing in three-dimensional space, making it particularly suitable for dynamic application scenarios with composite loads. Compared to traditional rigid connection solutions, this structure simultaneously improves mechanical stability and electrical reliability, significantly extending the connector's mating life and operational adaptability.

[0010] Preferably, the front side of the carrier substrate integrates a chip and a collaborative heat dissipation module, the collaborative heat dissipation module including an air-cooled heat sink or a liquid-cooled heat dissipation device.

[0011] The air-cooled or liquid-cooled heat sink becomes the thick plate area, while the remaining areas become the thin plate areas, forming an L-shaped stepped gold finger overall.

[0012] Preferably, the multi-directional elastic constraint mechanism is composed of a disc spring assembly or a shape memory alloy spring sheet.

[0013] The stacked structure of the disc spring assembly exhibits nonlinear stiffness characteristics, automatically adjusting the preload gradient according to the insertion depth to create a progressive contact pressure in the axial direction. The phase change characteristics of the shape memory alloy spring sheet endow the mechanism with temperature adaptability; when the ambient temperature changes, the additional stiffness generated by the shape memory effect of the spring sheet can compensate for the preload attenuation caused by thermal expansion. The unique load-displacement curve characteristics of these two elastic elements enable the constraint mechanism to absorb high-frequency micro-amplitude vibration energy and respond to low-frequency large displacement deformation. Compared with traditional elastic elements, the disc spring assembly significantly improves space utilization, making it particularly suitable for plate-to-plate connection scenarios with limited installation space. The shape memory alloy material exhibits excellent fatigue resistance in cyclic testing, ensuring the performance stability of the elastic constraint mechanism over a wide temperature range.

[0014] Preferably, the conductive connection portion forms a stepped discontinuity structure, and its metal contact surface is configured to form an electromagnetic connection interface that matches the motherboard PCB slot.

[0015] Commonly known as gold fingers, they are a common connection structure used in PCBs.

[0016] Preferably, the center of mass adjustment groove and the elastic constraint mechanism mounting part are at the same height.

[0017] The highly coplanar structural design eliminates the spatial difference between the center of mass adjustment unit and the constraint mechanism in traditional schemes, allowing the line of action of the compensating torque to pass directly through the center of the lever arm generated by the center of mass offset. This coplanar layout reduces the eccentricity of the mechanical system to zero, avoiding the generation of additional torque and ensuring that the deformation energy of the elastic constraint mechanism is completely converted into effective compensating torque. Compared to non-coplanar structures, this scheme significantly improves energy conversion efficiency and reduces mechanism deformation under the same disturbance conditions. The highly consistent design also simplifies the assembly process, controlling the cumulative errors of machining and installation through a unified positioning reference surface, ensuring highly consistent performance of mass-produced products.

[0018] Preferably, the machining process of the centroid adjustment groove includes controlled depth milling or laser microstructure machining.

[0019] Deep milling achieves high-precision shaping of grooves with gradual depth changes through multi-axis linkage machining, while fine surface treatment ensures accurate centroid calculation. Laser microstructure machining employs ultrashort pulse technology to create biomimetic surface textures on the inner wall of the groove. This non-contact machining avoids microscopic defects in the material and significantly improves fatigue strength. The combined application of these two processes fully leverages their respective advantages, simultaneously optimizing macroscopic contour accuracy and microstructural performance. Specially designed toolpaths create process-specific chamfers, avoiding stress concentration and creating favorable conditions for surface treatment, resulting in coating adhesion at an industry-leading level.

[0020] Preferably, the shape of the anchoring part of the elastic constraint mechanism is a protrusion or a groove.

[0021] The raised anchoring section improves stress distribution and significantly enhances tensile strength through its hemispherical contact design. The grooved structure utilizes a mechanical interlocking principle, exhibiting excellent anti-loosening characteristics in vibration environments. These two anchoring types cater to different installation needs: the raised type is suitable for surface mount processes, while the grooved type facilitates embedded installation. The microgrooving treatment on the anchoring surface increases the coefficient of friction, and when used with specialized conductive adhesive, significantly reduces interfacial contact resistance.

[0022] A method for dynamically stabilizing a gold finger connection structure includes the following steps:

[0023] S1. A centroid adjustment groove is provided on the back of the support substrate, and the spatial distribution of the groove is constructed such that the centroid of the connecting structure is offset toward the mounting part of the elastic constraint mechanism.

[0024] S2. A multi-directional elastic constraint mechanism is connected between the side of the substrate and the positioning structure of the motherboard PCB to establish a mechanical connection;

[0025] S3. The elastic constraint mechanism is generated by the assembly preload:

[0026] The axial constraint component along the gold finger insertion direction maintains continuous contact pressure between the conductive connector and the PCB slot;

[0027] The torque compensation component perpendicular to the insertion direction uses the lever arm formed by the centroid offset to balance the external disturbance load;

[0028] S4. Under dynamic working conditions, the stress distribution at the connection interface is adaptively adjusted by absorbing and releasing the deformation energy of the elastic constraint mechanism.

[0029] This dynamic stabilization method constructs a complete technical closed loop from center of mass design to adaptive adjustment. Through structural topology optimization, the center of mass offset is precisely matched with the stiffness characteristics of the elastic constraint mechanism, forming a stable mechanical equilibrium point. The innovative bidirectional constraint mechanism decouples axial pressure and lateral moment control, achieving effective attenuation over a wide frequency range of vibrations. The adaptive adjustment function, based on the nonlinear deformation characteristics of the elastic element, can compensate for displacement deviations in real time, maintaining stable contact pressure. The entire method, verified through systematic simulation and experiments, forms a standardized design process and has wide applicability in fields with stringent dynamic operating conditions.

[0030] The advantages of this invention compared to the prior art are:

[0031] This invention presents a gold finger connection structure with centroid compensation. The synergistic effect of the centroid adjustment groove and the multi-directional elastic constraint mechanism fundamentally improves the mechanical defects of traditional gold finger connection structures. In terms of axial preload, the elastic constraint mechanism maintains a constant contact pressure between the conductive connector and the motherboard PCB slot, effectively overcoming contact resistance fluctuations caused by temperature cycling and mechanical vibration. The introduction of compensation torque gives the connection interface resistance to lateral disturbances. When the device is subjected to impact or high-frequency vibration, the restoring torque generated by the deformation of the elastic constraint mechanism can offset the external torque, preventing slippage or fretting wear on the contact surface. The centroid offset design, by adjusting the structural mass distribution, forms a mechanical fulcrum in the direction of the elastic constraint mechanism mounting part, significantly improving the system's ability to resist overturning moments. This multi-dimensional dynamic constraint mechanism enables the connection structure to achieve self-balancing in three-dimensional space, making it particularly suitable for dynamic application scenarios with composite loads. Compared to traditional rigid connection solutions, this structure simultaneously improves mechanical stability and electrical reliability, significantly extending the connector's mating life and adaptability to various operating conditions. Attached Figure Description

[0032] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 This is a cross-sectional view of a gold finger connection structure with centroid compensation according to an embodiment of the present invention.

[0034] Figure 2 This is a rear view of a gold finger connection structure with centroid compensation according to an embodiment of the present invention.

[0035] Labeling explanation: substrate (1), chip and co-heating module (2), center of mass adjustment groove (3), elastic constraint mechanism mounting part (4), multi-directional elastic constraint mechanism (5), motherboard PCB (6). Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0037] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0038] It should be noted that similar reference numerals and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. In the description of the embodiments of this application, it should be understood that the terms "upper," "lower," "left," "right," "vertical," "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the figures, or the orientation or positional relationship commonly used when the product of this application is in use, or the orientation or positional relationship commonly understood by those skilled in the art. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0039] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0040] The technical solutions in this application will now be described with reference to the accompanying drawings.

[0041] This embodiment provides a gold finger connection structure with centroid compensation, including a carrier substrate 1 with a conductive connection part on the bottom surface that is inserted into the motherboard PCB 6, a centroid adjustment groove 3 on the back of the substrate, an elastic constraint mechanism mounting part 4 on the side of the substrate, and a multi-directional elastic constraint mechanism 5 connecting the mounting part and the motherboard PCB 6; the centroid adjustment groove 3 is configured to change the centroid distribution of the connection structure, so that the centroid is offset towards the elastic constraint mechanism mounting part 4; the multi-directional elastic constraint mechanism 5 generates an axial preload along the insertion direction and a compensation torque perpendicular to the insertion direction during assembly, forming a multi-dimensional dynamic constraint on the connection structure.

[0042] The synergistic effect of the center-of-gravity adjustment groove 3 and the multi-directional elastic constraint mechanism 5 fundamentally improves the mechanical defects of traditional gold finger connection structures. In terms of axial preload, the elastic constraint mechanism 5 maintains a constant contact pressure between the conductive connector and the motherboard PCB 6 slot, effectively overcoming contact resistance fluctuations caused by temperature cycling and mechanical vibration. The introduction of compensating torque gives the connection interface resistance to lateral disturbances. When the device is subjected to impact or high-frequency vibration, the restoring torque generated by the deformation of the elastic constraint mechanism 5 can offset the external torque, preventing slippage or fretting wear on the contact surface. The center-of-gravity offset design, by adjusting the structural mass distribution, forms a mechanical fulcrum in the direction of the elastic constraint mechanism mounting part 4, significantly improving the system's resistance to overturning moments. This multi-dimensional dynamic constraint mechanism enables the connection structure to achieve self-balancing in three-dimensional space, making it particularly suitable for dynamic application scenarios with composite loads. Compared to traditional rigid connection solutions, this structure simultaneously improves mechanical stability and electrical reliability, significantly extending the connector's mating life and operational adaptability.

[0043] In this embodiment, the front side of the substrate 1 is integrated with a chip and a collaborative heat dissipation module 2, which includes an air-cooled heat sink or a liquid-cooled heat dissipation device.

[0044] The air-cooled or liquid-cooled heat sink becomes the thick plate area, while the remaining areas become the thin plate areas, forming an L-shaped stepped gold finger overall.

[0045] In this embodiment, the multi-directional elastic constraint mechanism 5 is composed of a disc spring assembly or a shape memory alloy spring sheet.

[0046] The stacked structure of the disc spring assembly exhibits nonlinear stiffness characteristics, automatically adjusting the preload gradient according to the insertion depth to create a progressive contact pressure in the axial direction. The phase change characteristics of the shape memory alloy spring sheet endow the mechanism with temperature adaptability; when the ambient temperature changes, the additional stiffness generated by the shape memory effect of the spring sheet can compensate for the preload attenuation caused by thermal expansion. The unique load-displacement curve characteristics of these two elastic elements enable the constraint mechanism 5 to absorb high-frequency micro-amplitude vibration energy and respond to low-frequency large displacement deformation. Compared with traditional elastic elements, the disc spring assembly significantly improves space utilization, making it particularly suitable for plate-to-plate connection scenarios with limited installation space. The shape memory alloy material exhibits excellent fatigue resistance in cyclic testing, ensuring the performance stability of the elastic constraint mechanism 5 over a wide temperature range.

[0047] In this embodiment, the conductive connection part forms a stepped discontinuity structure, and its metal contact surface is configured to form an electromagnetic connection interface that matches the motherboard PCB6 slot.

[0048] Commonly known as gold fingers, they are a common connection structure used in PCBs.

[0049] In this embodiment, the center of mass adjustment groove 3 and the elastic constraint mechanism mounting part 4 are at the same height.

[0050] The highly coplanar structural design eliminates the spatial difference between the center of mass adjustment unit and the constraint mechanism in traditional schemes, allowing the line of action of the compensating torque to pass directly through the center of the lever arm generated by the center of mass offset. This coplanar layout reduces the eccentricity of the mechanical system to zero, avoiding the generation of additional torque and ensuring that the deformation energy of the elastic constraint mechanism 5 is completely converted into effective compensating torque. Compared to non-coplanar structures, this scheme significantly improves energy conversion efficiency and reduces mechanism deformation under the same disturbance conditions. The highly consistent design also simplifies the assembly process, controlling the cumulative errors of machining and installation through a unified positioning reference surface, ensuring highly consistent performance of mass-produced products.

[0051] In this embodiment, the machining process of the centroid adjustment groove 3 includes controlled depth milling or laser microstructure machining.

[0052] Deep milling achieves high-precision shaping of grooves with gradual depth changes through multi-axis linkage machining, while fine surface treatment ensures the accuracy of centroid calculation. Laser microstructure machining employs ultra-short pulse technology to create biomimetic surface textures on the inner wall of groove 3. This non-contact machining avoids microscopic defects in the material and significantly improves fatigue strength. The combined application of these two processes fully leverages their respective advantages, simultaneously optimizing macroscopic contour accuracy and microstructural performance. A specially designed toolpath creates a process-specific chamfer, avoiding stress concentration and creating favorable conditions for surface treatment, resulting in coating adhesion at an industry-leading level.

[0053] In this embodiment, the anchoring part of the elastic constraint mechanism 5 is shaped as a protrusion or a groove.

[0054] The raised anchoring section improves stress distribution and significantly enhances tensile strength through its hemispherical contact design. The grooved structure utilizes a mechanical interlocking principle, exhibiting excellent anti-loosening characteristics in vibration environments. These two anchoring types cater to different installation needs: the raised type is suitable for surface mount processes, while the grooved type facilitates embedded installation. The microgrooving treatment on the anchoring surface increases the coefficient of friction, and when used with specialized conductive adhesive, significantly reduces interfacial contact resistance.

[0055] A method for dynamically stabilizing a gold finger connection structure includes the following steps:

[0056] S1. A center of mass adjustment groove 3 is provided on the back of the support substrate 1, and the spatial distribution of the groove is constructed to shift the center of mass of the connecting structure toward the elastic constraint mechanism mounting part 4.

[0057] S2. A multi-directional elastic constraint mechanism 5 is connected between the side of the substrate and the positioning structure of the motherboard PCB6 to establish a mechanical connection;

[0058] S3. The elastic constraint mechanism 5 is generated by the assembly preload:

[0059] The axial constraint component along the gold finger insertion direction maintains continuous contact pressure between the conductive connector and the PCB slot;

[0060] The torque compensation component perpendicular to the insertion direction uses the lever arm formed by the centroid offset to balance the external disturbance load;

[0061] S4. Under dynamic working conditions, the stress distribution at the connection interface is adaptively adjusted by absorbing and releasing the deformation energy of the elastic constraint mechanism 5.

[0062] This dynamic stabilization method constructs a complete technical closed loop from center of mass design to adaptive adjustment. Through structural topology optimization, the center of mass offset is precisely matched with the stiffness characteristics of the elastic constraint mechanism 5, forming a stable mechanical equilibrium point. The bidirectional constraint mechanism innovatively decouples axial pressure and lateral moment control, achieving effective attenuation over a wide frequency range of vibrations. The adaptive adjustment function, based on the nonlinear deformation characteristics of the elastic element, can compensate for displacement deviations in real time, maintaining stable contact pressure. The entire method, verified through systematic simulation and experiments, forms a standardized design process and has wide applicability in fields with stringent dynamic operating conditions.

[0063] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A gold finger connection structure with centroid compensation, characterized in that, include: The substrate (1) has a conductive connection part on its bottom surface that is inserted into the motherboard PCB (6); A centroid adjustment groove (3) is provided on the back of the substrate. The elastic constraint mechanism mounting part (4) is provided on the side of the substrate. A multi-directional elastic constraint mechanism (5) connects the mounting part to the motherboard PCB (6); The centroid adjustment groove (3) is constructed to change the centroid distribution of the connection structure, so that the centroid shifts towards the direction of the elastic constraint mechanism mounting part (4); The multi-directional elastic constraint mechanism (5) generates an axial preload along the insertion direction and a compensating torque perpendicular to the insertion direction during assembly, forming a multi-dimensional dynamic constraint on the connection structure.

2. The gold finger connection structure with centroid compensation according to claim 1, characterized in that, The front side of the substrate (1) is integrated with a chip and a collaborative heat dissipation module (2), which includes an air-cooled heat sink or a liquid-cooled heat dissipation device.

3. The gold finger connection structure with centroid compensation according to claim 1, characterized in that, The multi-directional elastic constraint mechanism (5) is composed of disc springs or shape memory alloy springs.

4. The gold finger connection structure with centroid compensation according to claim 1, characterized in that, The conductive connection part forms a stepped discontinuity structure, and its metal contact surface is configured to form an electromagnetic connection interface that matches the motherboard PCB (6) slot.

5. The gold finger connection structure with centroid compensation according to claim 1, characterized in that, The centroid adjustment groove (3) and the elastic constraint mechanism mounting part (4) are at the same height.

6. The gold finger connection structure with centroid compensation according to claim 1, characterized in that, The processing technology of the centroid adjustment groove (3) includes controlled depth milling or laser microstructure processing.

7. The gold finger connection structure with centroid compensation according to claim 1, characterized in that, The anchoring part of the elastic constraint mechanism (5) is shaped as a protrusion or a groove.

8. A method for dynamically stabilizing a gold finger connection structure, characterized in that, Includes the following steps: S1. A centroid adjustment groove (3) is provided on the back of the support substrate (1), and the spatial distribution of the groove is constructed so that the centroid of the connecting structure is offset towards the elastic constraint mechanism mounting part (4). S2. A multi-directional elastic constraint mechanism (5) is connected between the side of the substrate and the positioning structure of the motherboard PCB (6) to establish a mechanical connection; S3. The elastic constraint mechanism (5) is generated by the assembly preload: The axial constraint component along the gold finger insertion direction maintains continuous contact pressure between the conductive connector and the PCB slot; The torque compensation component perpendicular to the insertion direction uses the lever arm formed by the centroid offset to balance the external disturbance load; S4. Under dynamic working conditions, the stress distribution at the connection interface is adaptively adjusted by absorbing and releasing the deformation energy of the elastic constraint mechanism (5).

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