一种PCB激光钻孔路径控制方法及系统
By identifying and generating supplementary cleaning paths and matching laser energy parameters, the problem of material residue and overlap at sharp concave corners in traditional laser drilling technology is solved, achieving high-quality hole processing and product reliability.
CN120619640BActive Publication Date: 2026-07-17YANGZHOU LINGTU INTELLIGENT TECH CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- YANGZHOU LINGTU INTELLIGENT TECH CO LTD
- Filing Date
- 2025-08-07
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
Traditional laser drilling technology is prone to material residue and path overlap when dealing with sharp concave corners, which affects the hole processing quality and product reliability.
Method used
By identifying sharp concave angles in the hole contour, an independent supplementary cleaning path is generated. Based on material properties and volume matching laser energy parameters, laser processing parameters are applied in stages to ensure complete material removal and avoid repeated energy injection.
Benefits of technology
It effectively solves the problems of material residue and path overlap at sharp concave corners, ensuring the integrity and quality of hole processing and improving product reliability.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN120619640B_ABST
Abstract
本申请涉及激光加工技术领域，具体涉及一种PCB激光钻孔路径控制方法及系统。方法包括：接收孔洞几何数据；基于孔洞几何数据，识别孔洞轮廓中的尖锐内凹角，并计算因常规路径生成缺陷而遗留的残余材料区域的几何形状和体积；基于孔洞几何数据，生成孔洞主体区域的主填充路径，并针对残余材料区域生成补充清扫路径，补充清扫路径与主填充路径空间上相互分离；基于残余材料区域的材料特性和体积，为补充清扫路径匹配激光能量参数；在加工过程中，分别对应主填充路径与补充清扫路径，分阶段应用匹配的激光加工参数。能够有效解决含尖锐内凹角的激光钻孔中材料残余和过量能量注入导致的碳化分层问题，确保加工质量和产品可靠性。
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