A switch-spring-based laminated assembly device and an assembly process thereof

Abstract

The application discloses a switch spring-based laminated assembling device and an assembling process thereof. The switch spring-based laminated assembling device is used for laminated assembling of a plurality of switch springs, and the switch spring has a spring body and an annular extension edge, and comprises a base, a three-axis mechanical hand, a rolling device and a laminated jig. The three-axis mechanical hand comprises a cantilever hanger, an X-axis moving assembly used for driving the cantilever hanger to reciprocate along a horizontal X-axis direction, a Y-axis moving assembly used for driving the cantilever hanger to reciprocate along a horizontal Y-axis direction, and a Z-axis moving assembly used for driving the cantilever hanger to reciprocate along a vertical Z-axis direction. The laminated jig is installed on the base, and the rolling device is installed on the cantilever hanger and located above the laminated jig. The switch spring-based laminated assembling device and the assembling process thereof can quickly and accurately laminate a plurality of switch springs on a circuit board.

Description

Technical Field

[0001] This invention relates to the field of switch spring manufacturing technology, and in particular to a stacking assembly equipment and assembly process based on switch springs. Background Technology

[0002] like Figure 1 and Figure 2 The diagram shows a structural diagram and cross-sectional view of a conventional switch spring 10. This type of switch spring 10 is mainly used in the field of electronic circuit technology, utilizing its elasticity to realize the switching on and off of power or signal control. This type of switch spring 10 is approximately 2mm long, approximately 1.5mm wide, and approximately 0.2mm thick, making it very thin and light.

[0003] For example, common side buttons on mobile phones use a switch spring 10 for circuit control. When a finger presses the side button, the switch spring 10 is subjected to force and undergoes elastic deformation, thereby triggering the contacts on the circuit board 20 (such as...). Figure 3 As shown, when the finger stops pressing the side button of the phone, the switch spring 10 returns to its elastic deformation.

[0004] A silver plating layer is formed at the contact point between the switch spring 10 and the circuit board 20. Silver has good electrical conductivity. Figure 3 As shown, when the switch spring 10 is subjected to force and undergoes elastic deformation, the switch spring 10 will slide relative to the circuit board 20 from side to side, generating sliding friction. Since the contact area between the switch spring 10 and the circuit board 20 is very small, the silver plating layer is easily scratched off during long-term use, resulting in poor contact.

[0005] This invention adds an annular extension edge 12 (e.g., on the edge of a traditional switch spring structure) to its traditional structure. Figure 4 and Figure 5 As shown, this can increase the contact area with the circuit board 20, thereby extending the service life of electronic components.

[0006] Furthermore, in conventional technology, only one switch spring is typically placed on the circuit board 20, resulting in insufficient elasticity of the switch spring and poor tactile feedback. In contrast, this invention places several stacked switch springs (such as...) on the circuit board 20. Figure 6 As shown, the overall elastic force is increased by increasing the number of switch reeds.

[0007] As can be seen from the above, on the one hand, the size of the switch spring is very small, and the switch springs are scattered and piled up together, making it difficult to pick up and assemble the switch springs by ordinary robotic arms; on the other hand, if several switch springs are stacked on each other on the circuit board 20, their assembly becomes even more difficult. Summary of the Invention

[0008] The purpose of this invention is to overcome the shortcomings of the prior art and provide a stacking assembly device and assembly process based on switch springs, which can quickly and accurately stack several switch springs on a circuit board.

[0009] The objective of this invention is achieved through the following technical solution:

[0010] A stacking assembly device based on switch springs is used to stack and assemble several switch springs. The switch springs have a spring body and an annular extension edge, and include: a base, a three-axis robot, a rolling device, and a stacking fixture.

[0011] The three-axis manipulator includes: a cantilever bracket, an X-axis moving assembly for driving the cantilever bracket to reciprocate along the horizontal X-axis direction, a Y-axis moving assembly for driving the cantilever bracket to reciprocate along the horizontal Y-axis direction, and a Z-axis moving assembly for driving the cantilever bracket to reciprocate along the vertical Z-axis direction.

[0012] The stacking fixture is mounted on the base, and the rolling device is mounted on the cantilever bracket and located above the stacking fixture.

[0013] In one embodiment, the rolling device is a universal ball bearing structure.

[0014] In one embodiment, the X-axis moving component, the Y-axis moving component, and the Z-axis moving component are all motor lead screw driven structures.

[0015] In one embodiment, the stacking fixture includes a circuit board placement frame and a spring placement frame stacked on the circuit board placement frame;

[0016] The circuit board placement frame includes a bottom frame body and a number of circuit boards arranged within the bottom frame body; the spring placement frame includes a top frame body and a number of spring semi-finished panels that are sequentially stacked and housed within the top frame body in a vertical direction.

[0017] Each of the aforementioned semi-finished reed panels is obtained by stamping, and each of the aforementioned semi-finished reed panels has a scrap mesh frame and a plurality of switch reeds temporarily retained on the scrap mesh frame; the plurality of switch reeds in each of the aforementioned semi-finished reed panels correspond one-to-one with the plurality of the aforementioned circuit boards.

[0018] In one embodiment, a plurality of the circuit boards are arranged in a rectangular array within the underlying frame body, and a plurality of the switch springs are arranged in a rectangular array on the waste mesh frame.

[0019] A stacked assembly process based on switch springs, implemented using the aforementioned stacked assembly equipment based on switch springs, includes the following steps:

[0020] Step 1: Obtain a circuit board placement frame and arrange several circuit boards within the bottom frame body;

[0021] Step 2: Fix the circuit board placement frame onto the base.

[0022] Step 3: Obtain a reed placement frame, and stack several semi-finished reed panels in the vertical direction and house them in the main body of the top frame.

[0023] Step 4: Stack the reed placement frame on top of the circuit board placement frame;

[0024] Step 5: The Z-axis moving assembly drives the cantilever bracket to descend along the vertical Z-axis direction so that the rolling device presses against the spring sheet semi-finished panel.

[0025] Step six: The X-axis moving assembly and the Y-axis moving assembly drive the cantilever bracket to move along the horizontal X-axis and horizontal Y-axis directions, respectively, so that the rolling device moves along the surface of the spring sheet semi-finished panel, thereby pressing all the switch springs on several spring sheet semi-finished panels onto the circuit board at one time.

[0026] The present invention provides a stacking assembly device and assembly process based on switch springs, which rapidly and accurately stacks several switch springs on a circuit board. Attached Figure Description

[0027] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a structural diagram of a traditional switch spring;

[0029] Figure 2 for Figure 1 The image shows a cross-sectional view of a conventional switch reed.

[0030] Figure 3 To be Figure 1 The diagram shows a traditional switch spring mounted on a circuit board.

[0031] Figure 4 This is a structural diagram (I) of the improved switch spring of the present invention;

[0032] Figure 5 The second structural diagram shows the improved switch spring of the present invention.

[0033] Figure 6 To be Figure 4 The diagram shows several stacked switch springs mounted on a circuit board.

[0034] Figure 7 This is a structural diagram of a stacked assembly device based on a switch spring according to an embodiment of the present invention;

[0035] Figure 8 for Figure 7 The diagram shows the structure of the stacked fixture.

[0036] Figure 9 for Figure 8 An exploded view of the stacked fixture shown;

[0037] Figure 10 This is a schematic diagram showing how a rolling device is used to press each set of switch springs into the circuit board.

[0038] Figure 11 This is a schematic diagram showing how each set of switch springs is stamped into the circuit board using a stamping rod. Detailed Implementation

[0039] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0040] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0042] This invention discloses a stacked assembly device 30 based on a switch spring (e.g., Figure 7 As shown), it is used for stacking and assembling several switch springs 10. The switch spring 10 has a spring body 11 and an annular extension edge 12 (as shown). Figure 4and Figure 5 (As shown). Based on the traditional switch spring structure, this invention adds an annular extension edge 12 to its edge, which can increase the contact area with the circuit board 20. During long-term use, the silver plating layer between the switch spring 10 and the circuit board 20 is not easily scratched off, thereby extending the service life of the electronic components.

[0043] like Figure 7 As shown, the stacking assembly equipment 30 based on switch springs includes: a base 100, a three-axis robot 200, a rolling device 300, and a stacking fixture 400.

[0044] like Figure 7 As shown, the three-axis robot 200 includes: a cantilever bracket 210, an X-axis moving assembly 220 for driving the cantilever bracket 210 to reciprocate along the horizontal X-axis direction, a Y-axis moving assembly 230 for driving the cantilever bracket 210 to reciprocate along the horizontal Y-axis direction, and a Z-axis moving assembly 240 for driving the cantilever bracket 210 to reciprocate along the vertical Z-axis direction. In this embodiment, the X-axis moving assembly 220, the Y-axis moving assembly 230, and the Z-axis moving assembly 240 are all motor-driven screw structures.

[0045] The stacking fixture 400 is mounted on the base 100, and the rolling device 300 is mounted on the cantilever bracket 210 and located above the stacking fixture 400. In this embodiment, the rolling device 300 is a universal ball bearing structure.

[0046] The specific structure of the stacked fixture 400 is described below:

[0047] like Figure 8 As shown, the stacked fixture 400 includes a circuit board placement frame 410 and a spring placement frame 420 stacked on the circuit board placement frame 410.

[0048] like Figure 9 As shown, the circuit board placement frame 410 includes a bottom frame body 411 and a plurality of circuit boards 412 arranged in the bottom frame body 411; the spring placement frame 420 includes a top frame body 421 and a plurality of spring semi-finished panels 422 that are stacked in sequence along the vertical direction and housed in the top frame body 421.

[0049] like Figure 9 As shown, each spring semi-finished panel 422 is obtained by stamping, and each spring semi-finished panel 422 has a scrap mesh frame 423 and a plurality of switch springs 10 temporarily retained on the scrap mesh frame 423; the plurality of switch springs 10 in each spring semi-finished panel 422 correspond one-to-one with a plurality of circuit boards 20.

[0050] In this embodiment, a number of circuit boards 20 are arranged in a rectangular array within the bottom frame body 411, and a number of switch springs 10 are arranged in a rectangular array on the waste wire mesh frame 423.

[0051] The working principle of the above-mentioned stacking assembly equipment 30 based on switch springs will be explained below:

[0052] A circuit board placement frame 410 is obtained, and a number of circuit boards 20 are arranged in the bottom frame body 411. Preferably, the number of circuit boards 20 are arranged in a rectangular array in the bottom frame body 411.

[0053] Fix the circuit board placement frame 410 onto the base 100;

[0054] A spring placement frame 420 is obtained, and several spring semi-finished panels 422 are stacked in sequence along the vertical direction and housed in the top frame body 421. Preferably, three layers of spring semi-finished panels 422 are stacked in sequence along the vertical direction and housed in the top frame body 421.

[0055] The reed placement frame 420 is stacked on top of the circuit board placement frame 410;

[0056] The three-axis robot arm 200 is started, and the Z-axis moving component 240 drives the cantilever bracket 210 to descend along the vertical Z-axis direction so that the rolling device 300 presses against the spring sheet semi-finished panel 420.

[0057] Next, the X-axis moving assembly 220 and the Y-axis moving assembly 230 respectively drive the cantilever bracket 210 to move along the horizontal X-axis and the horizontal Y-axis, so that the rolling device 300 moves along the surface of the spring sheet semi-finished panel 420, thereby pressing all the switch springs 10 on the spring sheet semi-finished panels 420 onto the circuit board 20 at once; specifically, the rolling device 300 first moves forward along the horizontal X-axis to press all the switch springs 10 in one column onto the circuit board 20, then the rolling device 300 moves along the horizontal Y-axis to the next adjacent column of switch springs 10, and then the rolling device 300 moves in the opposite direction along the horizontal X-axis to press all the switch springs 10 in the next column onto the circuit board 20. It can be seen that the rolling device 300 moves along a tortuous route to press all the switch springs 10 on the spring sheet semi-finished panel 420 onto the circuit board 20 at once;

[0058] like Figure 10As shown, it is worth noting that when the rolling device 300 approaches each group of switch springs 10 (for example, three stacked switch springs 10 are referred to as a group), during the process of the rolling device 300 pressing each group of switch springs 10, based on the elastic deformation of the switch springs 10, one end of the switch spring 10 will first sink into the groove 21 of the circuit board 20 under the guidance of the annular extension edge 12. Then, during the movement of the rolling device 300, the remaining part of the switch spring 10 will gradually sink into the groove 21 of the circuit board 20 under the guidance of the annular extension edge 12. Thus, the switch spring 10 can be completely pressed into the groove 21 of the circuit board 20.

[0059] like Figure 11 As shown, if a top-down stamping rod is used to press each set of switch springs 10 into the groove 21 of the circuit board 20, the following problems will occur: On the one hand, before the switch springs 10 fall into the groove 21 of the circuit board 20, the annular extension edge 12 of the switch springs 10 will tightly abut against the edge of the groove 21 of the circuit board 20. The entire groove 21 is sealed by the annular extension edge 12 and cannot quickly and effectively release air, forming a bulging phenomenon inside the groove 21, making it difficult for the switch springs 10 to fall into the groove 21 of the circuit board 20; on the other hand, before the switch springs 10 fall into the groove 21 of the circuit board 20, the annular extension edge 12 of the switch springs 10 is completely abutted against the edge of the groove 21 of the circuit board 20. This requires a greater stamping force to cause the switch springs 10 to deform and enter the groove 21, and the greater stamping force will cause the switch springs 10 to be severely deformed.

[0060] To address this, the present invention employs a rolling device 300 in conjunction with a three-axis robotic arm 200. The rolling device 300, moving in a rolling motion, flexibly presses each set of switch springs 10 into the groove 21 of the circuit board 20, thus avoiding the various drawbacks associated with using a stamping rod. Furthermore, the rolling device 300's meandering movement allows it to press all the switch springs from several semi-finished spring panels onto the circuit board in a single operation, resulting in very high efficiency.

[0061] This invention also discloses a stacked assembly process based on switch springs, implemented using the aforementioned stacked assembly equipment 30 based on switch springs, comprising the following steps:

[0062] Step 1: Obtain a circuit board placement frame 410 and arrange several circuit boards 20 within the bottom frame body 411.

[0063] Step 2: Fix the circuit board placement frame 410 onto the base 100;

[0064] Step 3: Obtain a reed placement frame 420, and stack several reed semi-finished panels 422 in the vertical direction and house them in the top frame body 421.

[0065] Step 4: Stack the reed placement frame 420 on top of the circuit board placement frame 410;

[0066] Step 5: The Z-axis moving assembly 240 drives the cantilever bracket 210 to descend along the vertical Z-axis direction so that the rolling device 300 presses against the spring sheet semi-finished panel 420.

[0067] Step six: The X-axis moving assembly 220 and the Y-axis moving assembly 230 drive the cantilever bracket 210 to move along the horizontal X-axis and horizontal Y-axis directions, respectively, so that the rolling device 300 moves along the surface of the spring semi-finished panel 420, thereby pressing all the switch springs 10 on the spring semi-finished panel 420 onto the circuit board 20 at one time.

[0068] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A stacking assembly device based on switch springs, used for stacking and assembling a plurality of switch springs, wherein the switch springs have a spring body and an annular extended edge, characterized in that, include: Base, three-axis robot, rolling device, stacked fixture; The three-axis manipulator includes: a cantilever bracket, an X-axis moving assembly for driving the cantilever bracket to reciprocate along the horizontal X-axis direction, a Y-axis moving assembly for driving the cantilever bracket to reciprocate along the horizontal Y-axis direction, and a Z-axis moving assembly for driving the cantilever bracket to reciprocate along the vertical Z-axis direction. The stacking fixture is mounted on the base platform, and the rolling device is mounted on the cantilever bracket and located above the stacking fixture. The rolling device is a universal ball bearing structure. The stacking fixture includes a circuit board placement frame and a spring placement frame stacked on the circuit board placement frame. The circuit board placement frame includes a bottom frame body and a plurality of circuit boards arranged within the bottom frame body. The spring placement frame includes a top frame body and a plurality of spring semi-finished panels stacked vertically and housed within the top frame body. Each spring semi-finished panel is obtained by stamping, and each spring semi-finished panel has a scrap mesh frame and a plurality of switch springs temporarily held on the scrap mesh frame. Each of the plurality of switch springs in each spring semi-finished panel corresponds one-to-one with a plurality of circuit boards. Several circuit boards are arranged in a rectangular array within the bottom frame body, and several switch springs are arranged in a rectangular array on the waste wire mesh frame.

2. The stacked assembly equipment based on switch springs according to claim 1, characterized in that, The X-axis moving assembly, Y-axis moving assembly, and Z-axis moving assembly are all driven by motors and lead screws.

3. A stacked assembly process based on switch springs, characterized in that, The method described in claim 1, using a stacked assembly device based on a switch spring, comprises the following steps: Step 1: Obtain a circuit board placement frame and arrange several circuit boards within the bottom frame body; Step 2: Fix the circuit board placement frame onto the base. Step 3: Obtain a reed placement frame, and stack several semi-finished reed panels in the vertical direction and house them in the main body of the top frame. Step 4: Stack the reed placement frame on top of the circuit board placement frame; Step 5: The Z-axis moving assembly drives the cantilever bracket to descend along the vertical Z-axis direction so that the rolling device presses against the spring sheet semi-finished panel. Step six: The X-axis moving assembly and the Y-axis moving assembly drive the cantilever bracket to move along the horizontal X-axis and horizontal Y-axis directions, respectively, so that the rolling device moves along the surface of the spring sheet semi-finished panel, thereby pressing all the switch springs on several spring sheet semi-finished panels onto the circuit board at one time.

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