A processing device for a quartz support for chip manufacturing processes and a method for processing the same

Abstract

The application discloses a processing device for a quartz support for a chip manufacturing process and a processing method thereof, and belongs to the technical field of quartz support processing devices. The technical scheme points of the application are that the processing device comprises a base, and further comprises a supporting rod, a driving assembly, a bearing and a grinding assembly. The grinding assembly comprises a rotating disc, a charging disc, a clamping device, a lifting device, a supporting frame and a grinding device. The clamping device is arranged on the charging disc and is used for clamping and fixing processing materials. The lifting device is arranged on the supporting rod, and the supporting frame is installed on the lifting device. An installation plate is arranged on the supporting frame at a position corresponding to the charging disc. The grinding device is installed on the supporting frame. The rotating disc is driven to rotate by the driving assembly, so that the materials are rapidly converted between loading, grinding and unloading stations. The grinding device is driven to move up and down by the lifting device to perform grinding. The processing of the quartz support can be efficiently and stably completed, and the automation degree and the processing efficiency of the processing are improved.

Description

Technical Field

[0001] This application belongs to the technical field of quartz bracket processing equipment, and particularly relates to a processing equipment and method for quartz brackets used in chip manufacturing processes. Background Technology

[0002] Semiconductor chips are the carriers of precision integrated circuits. The fabrication of semiconductor chips requires very high precision, which makes the fabrication process quite difficult. Therefore, higher and higher requirements are constantly being placed on the fabrication equipment and processes. Semiconductor chips are generally made from round silicon wafers, referred to as "wafers". They undergo a series of complex processing techniques, including cleaning, oxidation, photolithography, etching, ion implantation, thin film deposition, chemical mechanical polishing, and dicing, to integrate numerous electronic components such as transistors, resistors, and capacitors, ultimately forming chips with specific functions. Thin film deposition is a process that involves depositing various thin films on the wafer surface using methods such as physical vapor deposition (PVD) and chemical vapor deposition (CVD). Low-end chips, fabricated using vapor deposition, do not require a strict lattice match between the deposited layer (thin film) and the substrate (silicon wafer). The deposited layer can be single-crystal, polycrystalline, or even amorphous. High-end chips, however, employ vapor phase epitaxy (VPE). This involves growing an epitaxial layer with a specific crystal structure and properties along the substrate's crystal orientation through a vapor-phase reaction. This process demands precise control over the crystal structure and composition to obtain a single-crystal thin film with excellent lattice matching and superior performance. Depending on the desired crystal orientation, VPE can be categorized into three methods: growth from the wafer's center towards the edge; growth from the edge towards the center; and diffusion growth from a specific area of ​​the wafer outwards. This necessitates strict design of process conditions, including temperature distribution, gas flow patterns, and substrate surface conditions, for each epitaxial growth method. Currently, the simplest vapor phase epitaxy method involves growing from the center of the wafer outwards. This is achieved by using a quartz nozzle to spray gas from the center of the wafer, which then diffuses outwards while simultaneously heating the wafer to achieve vapor phase epitaxy. To achieve uniform epitaxial growth, the wafer must be placed on a rotating support, such as the quartz support for a semiconductor diffusion furnace disclosed in CN115056369A. In chip manufacturing processes, quartz supports serve as crucial components that carry the chip, and their precision, purity, and stability significantly impact chip manufacturing quality. However, existing quartz support processing equipment and methods suffer from insufficient processing precision and low production efficiency, failing to meet the ever-increasing demands of chip manufacturing. Therefore, this invention aims to provide a processing equipment and method for quartz supports used in chip manufacturing processes, thereby improving processing precision and increasing production efficiency. Summary of the Invention

[0003] The purpose of this application is to address the aforementioned technical problems by providing a processing equipment and method for quartz supports used in chip manufacturing processes, thereby resolving the issues raised in the background art.

[0004] This application provides a processing apparatus for a quartz holder used in chip manufacturing processes, including a base, and further comprising: Support rod, which is mounted on the base; The drive assembly includes a drive motor, a first rotating shaft, a rotating cylinder, a first gear, and a second gear. The drive motor is mounted on a base. The first rotating shaft is connected to the output shaft of the drive motor via a coupling. The rotating cylinder is sleeved on a support rod and is coaxially mounted on the base with the support rod. The first gear is mounted on the first rotating shaft, and the second gear is mounted on the rotating cylinder. The first gear and the second gear mesh with each other. The bearing has an outer ring connected to a rotating cylinder and an inner ring connected to a support rod. A grinding assembly includes a rotating disk, a loading disk, a clamping device, a lifting device, a support frame, and a grinding device. The rotating disk is mounted on a rotating cylinder. Four loading disks are evenly distributed on the rotating disk, and each of the four loading disks is equipped with a clamping device for clamping and fixing the material to be processed. The lifting device is mounted on a support rod, and the support frame is mounted on the lifting device. An mounting plate is provided on the support frame at a position corresponding to the loading disk. The grinding device is mounted on the support frame and is used to grind the material to be processed.

[0005] The base serves as the fundamental support for the entire equipment, providing a mounting platform for other components. The rotating cylinder is rotatably connected to the base, while the support rod is vertically mounted on the base, providing primary support. In the drive assembly, the drive motor is fixed to the base, and its output shaft is connected to the first rotating shaft via a coupling. When the drive motor operates, it drives the first rotating shaft to rotate synchronously. The first gear is mounted on the first rotating shaft and rotates with it, while the second gear is mounted on the rotating cylinder. The first and second gears mesh, and the rotation of the first gear simultaneously drives the second gear and the rotating cylinder to rotate together. The rotating cylinder is sleeved on the support rod and coaxially mounted on the base. Simultaneously, the outer ring of the bearing is connected to the rotating cylinder, and the inner ring is connected to the support rod. This arrangement ensures both smooth rotation of the rotating cylinder around the support rod and stable support for the rotating cylinder. In the grinding assembly… The rotating disk is mounted on the rotating cylinder and rotates synchronously with it. Four loading trays are evenly distributed on the rotating disk, and each loading tray has a clamping device that can clamp and fix the material to be processed. The lifting device is mounted on the support rod, and the support frame is mounted on the lifting device. The lifting device can use existing structures such as lead screws. The rotation of the lead screw drives the support frame to move up and down. The support frame has mounting plates at positions corresponding to the loading trays. The grinding device is mounted on the support frame. When the lifting device moves the support frame down, the grinding device can grind the clamped and fixed material. This equipment drives the rotating disk to rotate through the drive component, realizing the rapid transfer of material between the loading, grinding, and unloading stations. With the lifting device driving the grinding device to move up and down for grinding, it can efficiently and stably complete the processing of quartz holders, improving the automation level and processing efficiency.

[0006] Furthermore, the grinding apparatus includes: Expansion slots are provided on all four mounting plates; The telescopic frame has four telescopic frames, which are slidably installed in each telescopic slot. The four telescopic frames are a first frame, a second frame, a third frame, and a fourth frame, and are respectively equipped with a first nozzle, a rough grinding head, a fine grinding head, and a second nozzle. A hydraulic rod, the output end of which is connected to a telescopic frame, and the bottom of which is fixedly connected to a mounting plate.

[0007] In the grinding device, four mounting plates are each equipped with telescopic grooves. Four telescopic frames are slidably installed in each of these grooves. These four frames are designated as a first frame, a second frame, a third frame, and a fourth frame. A first nozzle, a roughing head, a fine grinding head, and a second nozzle are respectively mounted on each of the four frames. Both the first and second nozzles are connected to an external air source. The output end of a hydraulic rod is connected to the telescopic frame, while its bottom is fixed to the mounting plate. When the hydraulic rod operates, it drives the telescopic frames to slide within the telescopic grooves, thereby adjusting the positions of the first nozzle, the roughing head, the fine grinding head, and the second nozzle. The first nozzle blows air onto the clamping plate containing the pre-loaded material to remove debris and impurities, preventing these impurities from affecting the accuracy of subsequent clamping. The rough grinding head is used for preliminary rough grinding of the material, while the fine grinding head performs fine grinding based on the rough grinding to ensure the processing accuracy of the material. The second nozzle blows air onto the surface of the ground material to remove residual debris. The position of each component is adjusted by driving the telescopic frame through a hydraulic rod, which can adapt to the processing needs of materials of different sizes, improving the versatility of the equipment. Furthermore, the setting of multiple grinding and cleaning processes can effectively ensure the processing quality of the quartz holder.

[0008] Furthermore, the loading tray is provided with a feeding trough for feeding materials.

[0009] The feeding tray is equipped with a feeding chute. When the feeding process is in progress, the quartz parts, after being cleaned by the second nozzle, will fall from the feeding chute after the clamping device is released, thus achieving automatic feeding. The feeding chute allows the finished quartz parts to be accurately and quickly removed from the processing station, solving the problem of low unloading efficiency caused by manual feeding, further improving the automation level and production efficiency of the equipment, and ensuring that the equipment can feed materials in an orderly manner during the workflow.

[0010] Furthermore, the clamping device includes: A clamping plate, which is mounted on a loading plate; The four drive slots are arranged in a circular array on the clamping plate; An electric telescopic rod is provided in each of the aforementioned drive slots; The clamping claw is installed at the output end of the electric telescopic rod and is arc-shaped.

[0011] The clamping device is mounted on the loading tray via a clamping plate. Four drive slots are arranged in a circular array on the clamping plate, and each drive slot contains an electric telescopic rod. Clamping claws are mounted on the output end of the electric telescopic rods and are arc-shaped. When material needs to be clamped, the output end of the electric telescopic rod extends, driving the clamping claws to move towards the center of the clamping plate. Through the combined action of the four arc-shaped clamping claws, the material is clamped and fixed. When the material needs to be removed, the output end of the electric telescopic rod retracts, driving the clamping claws away from the center and releasing the clamping of the material. This clamping method, powered by the electric telescopic rod, provides stable and controllable clamping force, ensuring that the material will not shift during processing and guaranteeing processing accuracy. At the same time, the arc-shaped clamping claws can better conform to the surface of round materials, improving clamping stability.

[0012] Furthermore, each of the clamping claws is provided with a clamping groove, which is used to clamp square materials.

[0013] Each clamping jaw is equipped with a clamping groove specifically designed for holding square materials. When processing a square quartz holder, the square material is placed on the clamping plate, with its four corners respectively locked into the clamping grooves of the four clamping jaws. Then, the electric telescopic rod is driven to move the clamping jaws. Through the cooperation between the clamping grooves and the square material, the square material can be securely clamped. The clamping grooves allow the clamping device to not only accommodate round materials but also reliably clamp square materials, expanding the applicability of the equipment and improving its flexibility and practicality.

[0014] Furthermore, each of the clamping claws is equipped with a rubber pad.

[0015] Rubber pads are installed on the clamping jaws. When the clamping jaws hold the quartz material, the rubber pads directly contact the surface of the material. The rubber pads are soft and have a certain degree of elasticity, which can avoid hard contact between the clamping jaws and the material, thereby preventing scratches and damage to the surface of the material during the clamping process, protecting the surface quality of the material, and ensuring that the processed quartz holder meets the surface precision requirements of the chip manufacturing process.

[0016] Furthermore, it also includes a feeding assembly, which comprises: A feeding hopper is placed on a base, and the opening of the feeding hopper corresponds to the position of the feeding trough. A damper, which is fixedly connected inside the hopper; The buffer pad is fixedly connected and installed on top of the damper; A spring, which is sleeved on a damper.

[0017] The hopper of the feeding assembly is placed on the base, with its opening corresponding to the position of the feeding trough. Quartz pieces falling from the feeding trough can accurately fall into the hopper. The damper is fixedly connected inside the hopper, and a buffer pad is installed on top of the damper. A spring is sleeved on the damper. When the quartz piece falls from the feeding trough, it will first contact the buffer pad, which provides initial cushioning. The hopper has a side opening, through which the operator can remove the processed quartz piece. At the same time, the damper and spring work together to provide good cushioning and shock absorption for the falling quartz piece. This design can effectively prevent the quartz piece from being damaged by the impact of falling, ensuring the integrity and quality of the processed quartz piece.

[0018] Furthermore, a processing method for a quartz substrate processing equipment for chip manufacturing processes, applicable to the quartz substrate processing equipment for chip manufacturing processes as described in claims 1-7, the processing method comprising the following steps: Step 1: The first nozzle is driven to work, and the first nozzle blows the clamping plate corresponding to the position of the first frame to remove the debris and impurities on the clamping plate of the pre-loaded material at this station. Then, the quartz material (round or square) to be processed is placed on the clamping plate corresponding to the position of the first frame. The output ends of the four electric telescopic rods are driven to extend at the same time, driving the four clamping claws to move towards the center of the clamping plate at the same time until the quartz material is clamped and fixed. When clamping and fixing the square quartz material, ensure that it is stuck in the four clamping slots of the clamping claw. Step Two: After the quartz material is fixed in position on the loading tray corresponding to the first frame, the drive motor drives the first rotating shaft to rotate. The rotation of the first rotating shaft drives the first gear to rotate. The first gear drives the second gear meshing with it to rotate. The rotation of the second gear drives the rotating cylinder to rotate clockwise around the axis of the rotating cylinder until the clamping tray carrying the quartz material is aligned with the position of the rough grinding head and stops. Then the drive lifting device drives the support frame to move down, and the support frame drives the rough grinding head to move down for rough grinding. Step 3: After the rough grinding is completed, the lifting device drives the support frame to reset and move upward. Then, the drive motor is driven to work again to drive the rotating cylinder to rotate clockwise around its axis until the clamping plate containing the rough-ground quartz material is aligned with the fine grinding head and then stops. Then, the lifting device is driven to move the support frame downward, and the downward movement of the support frame drives the fine grinding head downward to perform fine grinding. Step Four: After the precision grinding head completes the precision grinding of the quartz material, the lifting device drives the support frame to reset and move upward. Then, the drive motor is driven to work again, driving the rotating cylinder to rotate around its axis until the clamping plate containing the precision-ground quartz material is aligned with the position of the second nozzle and stops. At this time, the second nozzle blows away the debris on the surface of the quartz part after grinding. After cleaning, the four electric telescopic rods retract simultaneously, driving the clamping claws to reset and releasing the clamping of the quartz part. The quartz part falls from the feeding trough into the feeding hopper. The quartz part makes flexible contact with the buffer pad, and at the same time, the damper and spring work together to provide a buffering and shock absorption effect for the falling quartz part. Step 5: After the processed quartz parts fall into the hopper, the drive motor drives the rotating drum to rotate again. The rotation of the rotating drum causes the rotating disk and the gripping disk to rotate clockwise to the position corresponding to the first frame. The first nozzle is then driven to blow air onto the gripping disk. After the blowing is completed, unprocessed quartz parts can be loaded again.

[0019] The beneficial effects of this application are: 1. This equipment drives the rotating disc to rotate through the drive component, enabling the material to be quickly transferred between the loading, grinding, and unloading stations. In conjunction with the lifting device, it drives the grinding device to move up and down for grinding, which can efficiently and stably complete the processing of quartz brackets, improving the degree of automation and processing efficiency. 2. During operation, the first nozzle can blow air onto the clamping plate of the pre-loaded material to remove debris and impurities, preventing these impurities from affecting the accuracy of subsequent clamping; the rough grinding head is used to perform preliminary rough grinding on the material, while the fine grinding head performs fine grinding on the basis of rough grinding to ensure the processing accuracy of the material; the second nozzle can blow air onto the surface of the ground material to remove residual debris. 3. After the quartz parts are cleaned by the second nozzle, they will fall from the feeding chute after the clamping device is released, thus achieving automatic feeding. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of this application; Figure 2 This is a schematic diagram of the overall structure of this application; Figure 3 This is a partial sectional view of the overall structure of this application; Figure 4 This application is Figure 1 Enlarged view of part A; Figure 5 This application is Figure 2 Enlarged view of part B; The reference numerals in the figure are as follows: 100, base; 200, support rod; 300, drive assembly; 310, drive motor; 320, first rotating shaft; 330, rotating cylinder; 340, first gear; 350, second gear; 500, bearing; 600, grinding assembly; 610, rotating disk; 620, loading disk; 621, unloading chute; 630, clamping device; 631, clamping disk; 632, drive groove; 633, electric telescopic rod; 634, clamping claw; 635, clamping groove; 636, rubber... Rubber pad; 640, Lifting device; 650, Support frame; 660, Grinding device; 661, Telescopic groove; 662, Telescopic frame; 663, First frame; 664, Second frame; 665, Third frame; 666, Fourth frame; 667, Hydraulic rod; 670, Mounting plate; 681, First nozzle; 682, Rough grinding head; 683, Fine grinding head; 684, Second nozzle; 800, Feeding assembly; 810, Feeding hopper; 820, Damper; 830, Buffer pad; 840, Spring. Detailed Implementation

[0021] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0022] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0023] The embodiments of this application are described in detail below with reference to the accompanying drawings, through specific examples and application scenarios.

[0024] Example 1: like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 As shown, this application embodiment provides a processing equipment for a quartz holder in chip manufacturing processes, including a base 100, and further comprising: Support rod 200, which is mounted on base 100; A drive assembly 300 includes a drive motor 310, a first rotating shaft 320, a rotating cylinder 330, a first gear 340, and a second gear 350. The drive motor 310 is mounted on a base 100. The first rotating shaft 320 is connected to the output shaft of the drive motor 310 via a coupling. The rotating cylinder 330 is sleeved on a support rod 200 and is coaxially mounted on the base 100 with the support rod 200. The first gear 340 is mounted on the first rotating shaft 320, and the second gear 350 is mounted on the rotating cylinder 330. The first gear 340 and the second gear 350 mesh with each other. Bearing 500, the outer ring of bearing 500 is connected to rotating cylinder 330, and the inner ring of bearing 500 is connected to support rod 200; A grinding assembly 600 includes a rotating disk 610, a loading disk 620, a clamping device 630, a lifting device 640, a support frame 650, and a grinding device 660. The rotating disk 610 is mounted on a rotating cylinder 330. Four loading disks 620 are evenly distributed on the rotating disk 610, and each of the four loading disks 620 is equipped with a clamping device 630 for clamping and fixing the material to be processed. The lifting device 640 is mounted on a support rod 200, and the support frame 650 is mounted on the lifting device 640. An mounting plate 670 is provided on the support frame 650 at a position corresponding to the loading disk 620. The grinding device 660 is mounted on the support frame 650 and is used to grind the material to be processed.

[0025] The base 100 serves as the foundation support for the entire device, providing an installation platform for other components. The rotating cylinder 330 is rotatably connected and mounted on the base 100. The support rod 200 is vertically mounted on the base 100, providing the main support. In the drive assembly 300, the drive motor 310 is fixed to the base 100, and its output shaft is connected to the first rotating shaft 320 via a coupling. When the drive motor 310 operates, it drives the first rotating shaft 320 to rotate synchronously. The first gear 340 is mounted on the first rotating shaft 320 and rotates synchronously with the first rotating shaft 320. The first gear 340 rotates in tandem with the second gear 350, which is mounted on the rotating cylinder 330. The first gear 340 meshes with the second gear 350, and the rotation of the first gear 340 drives the second gear 350 and the rotating cylinder 330 to rotate together. The rotating cylinder 330 is sleeved on the support rod 200 and coaxially mounted on the base 100 with the support rod 200. At the same time, the outer ring of the bearing 500 is connected to the rotating cylinder 330, and the inner ring is connected to the support rod 200. This arrangement ensures that the rotating cylinder 330 can rotate smoothly around the support rod 200 and also stabilizes the rotating cylinder 330. In the support and grinding assembly 600, a rotating disk 610 is mounted on a rotating cylinder 330 and rotates synchronously with the rotating cylinder 330. Four loading disks 620 are evenly distributed on the rotating disk 610. Each loading disk 620 has a clamping device 630 that can clamp and fix the workpiece. A lifting device 640 is mounted on the support rod 200, and a support frame 650 is mounted on the lifting device 640. The lifting device 640 can use existing structures such as lead screws. The rotation of the lead screw drives the support frame 650 to move up and down. The support frame 650 is connected to the loading disks 620. Mounting plates 670 are provided at corresponding positions, and grinding devices 660 are mounted on support frames 650. When lifting devices 640 move support frames 650 downward, grinding devices 660 can grind the clamped and fixed materials. The equipment drives the rotating disk 610 to rotate through the drive component 300, realizing the rapid transfer of materials between the loading, grinding and unloading stations. With the lifting device 640 driving the grinding device 660 to move up and down for grinding, the equipment can efficiently and stably complete the processing of quartz brackets, improving the degree of automation and processing efficiency.

[0026] Example 2: like Figure 1 , Figure 4 As shown, this application embodiment provides a processing equipment for quartz substrates in chip manufacturing processes. In addition to the above-mentioned technical features, the grinding device 660 includes: Expansion groove 661 is provided on each of the four mounting plates 670; The telescopic frame 662 is provided in four parts, which are slidably installed in each telescopic slot 661. The four telescopic frames 662 are respectively the first frame 663, the second frame 664, the third frame 665, and the fourth frame 666, and are respectively equipped with the first nozzle 681, the rough grinding head 682, the fine grinding head 683, and the second nozzle 684. A hydraulic rod 667 is provided, the output end of which is connected to the telescopic frame 662, and the bottom of the hydraulic rod 667 is fixedly connected to the mounting plate 670.

[0027] In the grinding device 660, four mounting plates 670 are each provided with a telescopic groove 661. Four telescopic frames 662 are slidably installed in each telescopic groove 661, and the four telescopic frames 662 are respectively a first frame 663, a second frame 664, a third frame 665, and a fourth frame 666. A first nozzle 681, a rough grinding head 682, a fine grinding head 683, and a second nozzle 684 are respectively installed on the four telescopic frames 662. The first nozzle 681 and the second nozzle 684 are both connected to an external air source. The output end of the hydraulic rod 667 is connected to the telescopic frame 662, and the bottom is fixed to the mounting plate 670. When the hydraulic rod 667 is working, it can drive the telescopic frame 662 to slide in the telescopic groove 661, thereby adjusting the first nozzle 681. The positions of the rough grinding head 682, the fine grinding head 683, and the second nozzle 684 are as follows: During operation, the first nozzle 681 blows air onto the clamping plate 631 containing pre-loaded materials to remove debris and impurities, preventing these impurities from affecting the subsequent clamping accuracy; the rough grinding head 682 is used for preliminary rough grinding of the materials, while the fine grinding head 683 performs fine grinding based on the rough grinding to ensure the processing accuracy of the materials; the second nozzle 684 blows air onto the surface of the ground materials to remove residual debris. The position of each component is adjusted by driving the telescopic frame 662 through the hydraulic rod 667, which can adapt to the processing needs of materials of different sizes, improving the versatility of the equipment. Moreover, the setting of multiple grinding and cleaning processes can effectively ensure the processing quality of the quartz holder.

[0028] Example 3: like Figure 1 , Figure 2 , Figure 3 , Figure 5 As shown in the figure, this application embodiment provides a processing equipment for quartz holders in chip manufacturing processes. In addition to the above-mentioned technical features, the loading tray 620 is provided with a feeding groove 621 for feeding.

[0029] The loading tray 620 is equipped with a discharge chute 621. When the discharge process is in progress, the quartz parts that have been cleaned by the second nozzle 684 will fall from the discharge chute 621 after the clamping device 630 releases its clamps, thus achieving automatic discharge. The discharge chute 621 enables the finished quartz parts to be accurately and quickly removed from the processing station, solving the problem of low unloading efficiency caused by manual discharge, further improving the automation level and production efficiency of the equipment, and ensuring that the equipment can discharge materials in an orderly manner during the workflow.

[0030] Example 4: like Figure 5 As shown, this application embodiment provides a processing equipment for quartz holders in chip manufacturing processes. In addition to the above-mentioned technical features, the clamping device 630 includes: A clamping plate 631 is mounted on a loading plate 620; The four drive slots 632 are arranged in a ring array on the clamping plate 631. An electric telescopic rod 633 is provided in each of the drive slots 632; A clamping claw 634 is installed at the output end of the electric telescopic rod 633, and the clamping claw 634 is arc-shaped.

[0031] The clamping device 630's clamping plate 631 is mounted on the loading plate 620. Four drive slots 632 are arranged in a circular array on the clamping plate 631. Each drive slot 632 is equipped with an electric telescopic rod 633. Clamping claws 634 are installed at the output end of the electric telescopic rod 633 and are arc-shaped. When material needs to be clamped, the output end of the electric telescopic rod 633 extends, driving the clamping claws 634 to move towards the center of the clamping plate 631. Through the combined action of the four arc-shaped clamping claws 634, the material is clamped and fixed. When the material needs to be removed, the output end of the electric telescopic rod 633 retracts, driving the clamping claws 634 away from the center and releasing the clamping of the material. This clamping method is powered by the electric telescopic rod 633, and the clamping force is stable and controllable, ensuring that the material will not shift during processing and guaranteeing processing accuracy. At the same time, the arc-shaped clamping claws 634 can better fit the surface of the round material, improving the stability of clamping.

[0032] Example 5: like Figure 5 As shown in the figure, this application embodiment provides a processing equipment for quartz holders in chip manufacturing process. In addition to the above-mentioned technical features, each of the clamping claws 634 is provided with a clamping groove 635, which is used to clamp square materials.

[0033] Each of the clamping claws 634 is equipped with a clamping groove 635, which is specifically designed for clamping square materials. When processing a square quartz bracket, the square material is placed on the clamping plate 631, so that the four corners of the square material are respectively clamped in the clamping grooves 635 of the four clamping claws 634. Then, the electric telescopic rod 633 is driven to move the clamping claws 634. Through the cooperation between the clamping grooves 635 and the square material, the square material can be firmly clamped. The setting of the clamping grooves 635 allows the clamping device 630 to not only adapt to the clamping of round materials, but also reliably clamp square materials, thus expanding the applicability of the equipment and improving its flexibility and practicality.

[0034] Example 6: like Figure 5 As shown, this application embodiment provides a processing equipment for a quartz holder for chip manufacturing process. In addition to the above-mentioned technical features, each of the clamping claws 634 is equipped with a rubber pad 636.

[0035] Rubber pads 636 are installed on each of the clamping claws 634. When the clamping claws 634 clamp the quartz material, the rubber pads 636 directly contact the surface of the material. The rubber pads 636 are soft and have a certain degree of elasticity, which can avoid hard contact between the clamping claws 634 and the material, thereby preventing scratches and damage to the surface of the material during the clamping process, protecting the surface quality of the material, and ensuring that the processed quartz holder meets the surface precision requirements of the chip manufacturing process.

[0036] Example 7: like Figure 2 , Figure 3 As shown, this application embodiment provides a processing equipment for quartz substrates in chip manufacturing processes. In addition to the above-mentioned technical features, it also includes a blanking assembly 800, which includes: The hopper 810 is placed on the base 100, and the opening of the hopper 810 corresponds to the position of the trough 621. Damper 820, which is fixedly connected inside the hopper 810; A buffer pad 830 is fixedly connected and installed on top of the damper 820; Spring 840, which is sleeved on damper 820.

[0037] The hopper 810 of the feeding assembly 800 is placed on the base 100, with its opening corresponding to the position of the feeding groove 621. Quartz pieces falling from the feeding groove 621 can accurately fall into the hopper 810. The damper 820 is fixedly connected inside the hopper 810, and the buffer pad 830 is installed on top of the damper 820. The spring 840 is sleeved on the damper 820. When the quartz piece falls from the feeding groove 621, it will first contact the buffer pad 830, which can play a preliminary buffering role. The hopper 810 has a side opening, and the operator can take out the processed quartz piece through the side opening. At the same time, the damper 820 and the spring 840 will further cooperate to play a good buffering and shock absorption role for the falling quartz piece. This setting can effectively prevent the quartz piece from being damaged by the impact of falling, and ensure the integrity and quality of the quartz piece after processing.

[0038] Example 8: like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 As shown in the figure, this application provides a processing method for a quartz substrate processing equipment used in chip manufacturing processes: Step 1: The first nozzle 681 is driven to work, and the first nozzle 681 blows the clamping plate 631 corresponding to the position of the first frame 663 to remove the debris and impurities on the pre-loaded material clamping plate 631 at this station. Then, the quartz material (round or square) to be processed is placed on the clamping plate 631 corresponding to the position of the first frame 663. The output ends of the four electric telescopic rods 633 are driven to extend simultaneously, driving the four clamping claws 634 to move towards the center of the clamping plate 631 simultaneously until the quartz material is clamped and fixed. When clamping and fixing the square quartz material, ensure that it is stuck in the four clamping slots 635 of the clamping claw 634. Step Two: After the quartz material is fixed in position on the loading tray 620 corresponding to the first frame 663, the drive motor 310 drives the first rotating shaft 320 to rotate. The rotation of the first rotating shaft 320 drives the first gear 340 to rotate. The first gear 340 drives the second gear 350 meshing with it to rotate. The rotation of the second gear 350 drives the rotating cylinder 330 to rotate clockwise around the axis of the rotating cylinder 330 until the clamping tray 631 carrying the quartz material is aligned with the position of the rough grinding head 682 and then stops. Subsequently, the drive lifting device 640 drives the support frame 650 to move down. The support frame 650 drives the rough grinding head 682 to move down for rough grinding. Step 3: After the rough grinding is completed, the lifting device 640 drives the support frame 650 to reset and move upward. Then, the drive motor 310 is driven to work again to drive the rotating cylinder 330 to rotate clockwise around its axis until the clamping plate 631, which is loaded with the rough-ground quartz material, is aligned with the position of the fine grinding head 683 and then stops. Then, the lifting device 640 drives the support frame 650 to move downward. The downward movement of the support frame 650 drives the fine grinding head 683 to move downward for fine grinding. Step Four: After the precision grinding head 683 completes the precision grinding of the quartz material, the lifting device 640 drives the support frame 650 to reset and move upward. Then, the drive motor 310 is driven to work again, driving the rotating cylinder 330 to rotate around its axis until the clamping plate 631, which is loaded with the precision-ground quartz material, is aligned with the position of the second nozzle 684 and then stops. At this time, the second nozzle 684 blows and cleans the debris on the surface of the quartz part after grinding. After cleaning, the four electric telescopic rods 633 retract at the same time, driving the clamping claw 634 to reset and release the clamping of the quartz part. The quartz part falls from the feeding groove 621 into the feeding hopper 810. The quartz part makes flexible contact with the buffer pad 830. At the same time, the damper 820 and the spring 840 work together to provide a buffering and shock absorption effect for the falling quartz part. Step 5: After the processed quartz parts fall into the hopper 810, the drive motor 310 drives the rotating cylinder 330 to rotate again. The rotation of the rotating cylinder 330 drives the rotating disk 610 and the gripping disk to rotate clockwise to the position corresponding to the first frame 663. The first nozzle 681 is driven again to blow on the gripping disk. After the blowing is completed, the unprocessed quartz parts can be loaded again.

[0039] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0040] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A processing apparatus for quartz holders in chip manufacturing processes, comprising a base (100), characterized in that... It also includes: A support rod (200) is mounted on a base (100); A drive assembly (300) includes a drive motor (310), a first rotating shaft (320), a rotating cylinder (330), a first gear (340), and a second gear (350). The drive motor (310) is mounted on a base (100). The first rotating shaft (320) is connected to the output shaft of the drive motor (310) via a coupling. The rotating cylinder (330) is sleeved on a support rod (200), and the rotating cylinder (330) and the support rod (200) are coaxially mounted on the base (100). The first gear (340) is mounted on the first rotating shaft (320), and the second gear (350) is mounted on the rotating cylinder (330). The first gear (340) and the second gear (350) mesh with each other. The bearing (500) has an outer ring connected to a rotating cylinder (330) and an inner ring connected to a support rod (200). A grinding assembly (600) includes a rotating disk (610), a loading disk (620), a clamping device (630), a lifting device (640), a support frame (650), and a grinding device (660). The rotating disk (610) is mounted on a rotating cylinder (330). Four loading disks (620) are evenly distributed on the rotating disk (610), and each of the four loading disks (620) is equipped with a clamping device (640). 30), the clamping device (630) is used to clamp and fix the processing material, the lifting device (640) is set on the support rod (200), the support frame (650) is installed on the lifting device (640), the support frame (650) is provided with an mounting plate (670) at a position corresponding to the loading tray (620), the grinding device (660) is installed on the mounting plate (670), and the grinding device (660) is used to grind the processing material; The grinding apparatus (660) includes: The four mounting plates (670) are provided with expansion grooves (661); Telescopic frame (662), four telescopic frames (662) are provided and are slidably installed in each telescopic groove (661). The four telescopic frames (662) are respectively the first frame (663), the second frame (664), the third frame (665), and the fourth frame (666), and are respectively equipped with the first nozzle (681), the rough grinding head (682), the fine grinding head (683), and the second nozzle (684). A hydraulic rod (667) is provided, the output end of which is connected to a telescopic frame (662), and the bottom of the hydraulic rod (667) is fixedly connected to a mounting plate (670). The loading tray (620) is provided with a feeding trough (621) for feeding materials; It also includes a feeding assembly (800), the feeding assembly (800) comprising: A feeding hopper (810) is placed on a base (100), and the opening of the feeding hopper (810) corresponds to the position of the feeding trough (621). A damper (820) is fixedly connected inside the hopper (810); A buffer pad (830) is fixedly connected and installed on top of the damper (820); A spring (840) is fitted onto a damper (820).

2. The processing equipment for quartz substrates used in chip manufacturing processes according to claim 1, characterized in that, The clamping device (630) includes: A clamping plate (631) is mounted on a loading plate (620); A drive slot (632), four of which are arranged in a ring array on the clamping plate (631); An electric telescopic rod (633) is provided in each of the drive slots (632); A clamping claw (634) is installed at the output end of the electric telescopic rod (633), and the clamping claw (634) is arc-shaped.

3. The processing equipment for quartz substrates in chip manufacturing processes according to claim 2, characterized in that, Each of the clamping claws (634) is provided with a clamping groove (635), which is used to clamp square materials.

4. The processing equipment for quartz holders in chip manufacturing processes according to claim 3, characterized in that, Each of the clamping jaws (634) is equipped with a rubber pad (636).

5. A processing method for a quartz substrate processing equipment for chip manufacturing processes, applicable to the quartz substrate processing equipment for the chip manufacturing process described in claim 4, the processing method comprising the following steps: Step 1: Drive the first nozzle (681) to work. The first nozzle (681) blows the clamping plate (631) corresponding to the position of the first frame (663) to remove the debris and impurities on the pre-loaded material clamping plate (631) at the work station. Then, place the quartz material to be processed on the clamping plate (631) corresponding to the position of the first frame (663). Drive the output ends of the four electric telescopic rods (633) to extend at the same time, and drive the four clamping claws (634) to move towards the center of the clamping plate (631) at the same time until the quartz material is clamped and fixed. When clamping and fixing the square quartz material, ensure that it is stuck in the four clamping slots (635) of the clamping claw (634). Step Two: After the quartz material is fixed in position on the loading tray (620) corresponding to the first frame (663), the drive motor (310) drives the first rotating shaft (320) to rotate. The rotation of the first rotating shaft (320) drives the first gear (340) to rotate. The first gear (340) drives the second gear (350) meshing with it to rotate. The rotation of the second gear (350) drives the rotating cylinder (330) to rotate clockwise around the axis of the rotating cylinder (330) until the clamping tray (631) carrying the quartz material is aligned with the position of the rough grinding head (682) and then stops. Subsequently, the drive lifting device (640) drives the support frame (650) to move down. The support frame (650) drives the rough grinding head (682) to move down to perform rough grinding. Step 3: After the rough grinding is completed, the lifting device (640) drives the support frame (650) to reset and move upward. Then, the drive motor (310) is driven to work again to drive the rotating cylinder (330) to rotate clockwise around its axis until the clamping plate (631) loaded with the rough-ground quartz material is aligned with the position of the fine grinding head (683) and then stops. Then, the lifting device (640) is driven to move the support frame (650) downward. The downward movement of the support frame (650) drives the fine grinding head (683) downward to perform fine grinding. Step Four: After the precision grinding head (683) completes the precision grinding of the quartz material, the lifting device (640) drives the support frame (650) to reset and move upward. Then, the drive motor (310) is driven to work again, driving the rotating cylinder (330) to rotate around its axis until the clamping plate (631) loaded with the precision-ground quartz material is aligned with the position of the second nozzle (684) and stops. At this time, the second nozzle (684) blows and cleans the debris on the surface of the quartz part after grinding. After cleaning, the four electric telescopic rods (633) retract at the same time, driving the clamping claw (634) to reset and release the clamping of the quartz part. The quartz part falls from the feeding groove (621) into the feeding hopper (810). The quartz part is in flexible contact with the buffer pad (830). At the same time, the damper (820) and the spring (840) work together to provide buffering and shock absorption for the falling quartz part. Step 5: After the processed quartz parts fall into the hopper (810), the drive motor (310) drives the rotating cylinder (330) to rotate again. The rotation of the rotating cylinder (330) drives the rotating disk (610) and the gripping disk to rotate clockwise to the position corresponding to the first frame (663). The first nozzle (681) is driven again to blow on the gripping disk. After the blowing is completed, the unprocessed quartz parts can be loaded again.

Images