A method of breaking pieces

Abstract

This application relates to the field of semiconductor material processing, and in particular to a chip-breaking method, comprising: the chip-breaking method including: setting a target final value F of the chip-breaking force. 终 The drive mechanism outputs power to make the splitter plate deflect at a uniform speed; the output speed v and output force P of the drive mechanism are controlled to increase the splitting force F output by the splitter plate at a preset incremental rate to the target final value F. 终 By controlling the force applied to the substrate during the breaking process, the yield rate of the broken substrate can be improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor material processing, and in particular to a method for breaking wafers. Background Technology

[0002] In the current production of silicon nitride ceramic substrates, it is necessary to make the sintered silicon nitride ceramic substrate into a standard size. This step usually involves using a laser to scribble a certain depth on the four sides of the silicon nitride ceramic substrate, and then breaking off the four sides.

[0003] In existing technologies, silicon nitride ceramic substrates have low tensile strength and high brittleness, making them prone to sudden breakage under stress. During the breaking process, if the applied force is too large or changes suddenly, it may cause edge chipping or internal microcracks. Therefore, force control is very important. However, most current breaking methods involve manually breaking off the four edges one by one with handheld equipment. This manual breaking method is inefficient, the force cannot be precisely controlled, and the yield is low, which cannot meet the needs of modern automated production.

[0004] Therefore, the technical problem with the existing technology is that the yield of silicon nitride ceramic substrates is low. Summary of the Invention

[0005] This application provides a method for breaking substrates, which improves the yield of substrate breaking by controlling the breaking force applied to the substrate.

[0006] A method for breaking pieces, applicable to a piece-breaking device, the piece-breaking device comprising:

[0007] Base;

[0008] A support plate for supporting a substrate, the support plate having a receiving station for accommodating the substrate;

[0009] A chip-breaking assembly, rotatably connected to the base, such that the chip-breaking assembly can deflect toward the receiving station to chip the substrate; and

[0010] Driver components, including:

[0011] A driving element connected to the base, the driving element being used to act on the break assembly in a direction perpendicular to the receiving station;

[0012] A connecting rod, the first end of which is rotatably connected to the output end of the drive member, and the second end of which is rotatably connected to the pry bar assembly, so that the drive member acts on the pry bar assembly through the connecting rod to deflect the pry bar assembly;

[0013] The method of breaking the pieces includes:

[0014] Set the target final value F of the breaking force.终 ;

[0015] The driving component outputs to make the deflector plate rotate at a uniform speed.

[0016] Controlling the output speed v and output force P of the drive component, the breaking force F output by the breaking plate increases to the target final value F at a preset incremental rate. 终 .

[0017] Preferably, the "control driver output rate v" includes:

[0018] The relationship between the displacement S at the output end of the drive component and the angle α between the cleaver plate and the direction perpendicular to the receiving station is obtained as follows:

[0019]

[0020] Wherein, α is the angle between the breaking plate and the direction perpendicular to the receiving station;

[0021] L is the length of the connecting rod;

[0022] R is the distance from the rotation center of the splitting plate to the point of contact between the splitting plate and the substrate.

[0023] Preferably, the "control driver output rate v" further includes:

[0024] Differentiating the displacement S with respect to time, the output speed v of the driving component is:

[0025]

[0026] Wherein, ω is the angular velocity of the split plate.

[0027] Preferably, the breaking force F is:

[0028]

[0029] Wherein, R0 is the breaking lever arm of the breaking plate;

[0030] R is the distance from the rotation center of the splitting plate to the contact point between the splitting plate and the substrate;

[0031] L is the length of the connecting rod;

[0032] α is the angle between the breaking plate and the direction perpendicular to the receiving station.

[0033] Preferably, the method further includes: defining the desired force F exerted by the prying plate on the substrate when the prying plate is deflected to an angle of α. s :

[0034]

[0035] Where α0 is the maximum angle between the breaking plate and the direction perpendicular to the receiving station.

[0036] Preferably, the included angle α is initially set to 90°, and the desired force F of the substrate is set to... s The initial value is:

[0037]

[0038] Preferably, the preset growth rate is between 30N / s and 50N / s.

[0039] As a preferred option, it also includes:

[0040] Make the actual force F exerted by the cleaver on the substrate equal to the desired force F. s The output force P of the driving component is:

[0041]

[0042] Wherein, α0 is the maximum angle between the breaking plate and the direction perpendicular to the receiving station.

[0043] Preferably, the target final value F 终 for:

[0044]

[0045] Where, d min This represents the minimum cutting depth of the substrate.

[0046] F min For in d min The required breaking force at the cutting depth;

[0047] d max This represents the maximum cutting depth of the substrate.

[0048] F max For in d max The breaking force required at the cutting depth.

[0049] As a preferred option, it also includes:

[0050] Obtain the cutting depth d of the substrate min =1 / 3d0, define F 终 =F max ;

[0051] Obtain the cutting depth d of the substrate max =1 / 2d0, define F 终 =F min ;

[0052] Where d0 is the substrate thickness.

[0053] In summary, this application includes at least one of the following beneficial technical effects:

[0054] By coordinating the movement of the drive component and the linkage mechanism, and by controlling the breaking force applied to the substrate, the breaking force is linearly increased, thereby improving the yield of the broken substrate. Attached Figure Description

[0055] Figure 1 This is a schematic diagram of the first direction view of the splitting device described in this application;

[0056] Figure 2 This is a schematic diagram of the second-direction view of the chip-breaking device described in this application;

[0057] Figure 3 This is a schematic diagram of the process for the chip-breaking method described in this application;

[0058] Figure 4 This is a schematic diagram of the first mechanical model of the shard assembly described in this application;

[0059] Figure 5 This is a schematic diagram of the second mechanical model of the shard assembly described in this application.

[0060] Explanation of reference numerals in the attached figures:

[0061] 100, Base; 110, Waist-shaped hole; 200, Bearing plate; 210, Accommodation station; 300, Plier assembly; 310, Plier plate; 320, Sliding plate; 400, Drive assembly; 410, Drive component; 411, Output end; 420, Connecting rod; 500, Reset assembly; 510, Reset component. Detailed Implementation

[0062] The serial numbers assigned to components in this document, such as "first" and "second," are used solely to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages). It should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are used solely for the convenience of describing this application and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0063] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0064] This application provides a wafer-breaking device and method, which improves the wafer-breaking yield by controlling the breaking force acting on the substrate.

[0065] To better understand the above technical solutions, a detailed description of the technical solutions will be provided below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit the scope of this application.

[0066] In the field of semiconductor material processing, there are significant differences in the breaking process between ceramic substrates (such as silicon nitride substrates) and ordinary solar cells (silicon materials). Ceramic substrates are characterized by high hardness and brittleness, with low tensile strength, making them more prone to sudden fracture under stress. If the force applied during the breaking process is too large or changes suddenly, it can easily lead to edge chipping or internal microcracks, severely affecting product yield. Currently, manual breaking methods are not only inefficient but also lack precise force control, making it difficult to meet the demands of modern automated production. Therefore, precise control of the breaking force is crucial for the breaking process of ceramic substrates. This invention sets a target final value for the breaking force and controls the output rate and force of the drive component, allowing the breaking force to linearly increase to the target final value at a preset incremental rate. In this way, the instantaneous impact force that damages the ceramic substrate in traditional processes is avoided, effectively reducing the edge chipping rate, improving processing quality and stability, reducing the risk of extrusion damage, and providing a reliable solution for high-precision processing of ceramic substrates.

[0067] This application provides a splitting device, such as... Figure 1 As shown, a chipping device for breaking silicon carbide ceramic substrates includes a base 100, a support plate 200, a chipping assembly 300, a drive assembly 400, and a reset assembly 500. The base 100 serves as the mounting base for each component to ensure device stability; the support plate 200 supports the substrate to be broken; the chipping assembly 300 acts on the substrate to complete the chipping action; the drive assembly 400 drives the chipping assembly 300 to deflect; and the reset assembly 500 resets the chipping assembly 300 after deflection.

[0068] like Figure 1 As shown, the base 100 serves as the mounting base for various components to ensure the stability of the device. The base 100 has a rectangular frame structure. The drive assembly 400 is connected to the top surface of the base 100; the prying assembly 300 is rotatably connected to the side of the base 100; and the support plate 200 is connected to the bottom of the base 100. When the substrate is fixed on the support plate 200, the part to be pryed extends beyond the support plate 200 (or the base 100). When the drive member 410 acts on the prying assembly 300, the prying assembly 300 deflects and acts on the substrate, thereby realizing the prying of the substrate.

[0069] like Figure 1 As shown, the support plate 200 is used to support the substrate to be broken. The support plate 200 can fix the substrate to be broken. The support plate 200 is disposed below the base 100 to form a receiving station 210 for accommodating the substrate. Generally, the receiving station 210 is horizontal, and the size of the receiving station 210 matches the substrate to ensure positioning accuracy. In one embodiment, the support plate 200 can fix the substrate by negative pressure adsorption. In other embodiments, the substrate can also be fixed by other methods, such as adhesive. It should be noted that the support plate 200 is fixedly connected to the base 100, or the support plate 200 can be part of the base 100, or an external frame structure can be used to form the support plate 200 for fixing the substrate.

[0070] like Figure 1 , 2 As shown, the drive assembly 400 is used to drive the chipper assembly 300 to deflect. The drive assembly 400 acts on the chipper assembly 300 to cause the chipper assembly 300 to deflect or reset; specifically, the drive assembly 400 includes a drive member 410 and a connecting rod 420. The drive member 410 is connected to the base 100 and acts on the chipper assembly 300 in a direction perpendicular to the receiving station 210; the first end of the connecting rod 420 is rotatably connected to the output end 411 of the drive member 410, and the second end of the connecting rod 420 is rotatably connected to the chipper assembly 300, so that the drive member 410 acts on the chipper assembly 300 through the connecting rod 420 to cause the chipper assembly 300 to deflect.

[0071] Specifically, such as Figure 1 , 2As shown, the driving component 410 is fixedly connected to the base 100 and acts on the prying plate assembly 300 through the connecting rod 420. The output end 411 of the driving component 410 moves in a direction perpendicular to the receiving station 210. In one embodiment, the receiving station 210 is in a horizontal state, that is, the output end 411 of the driving component 410 outputs in a vertical direction. The connecting rod 420 connects the driving component 410 and the prying plate assembly 300. More specifically, the first end of the connecting rod 420 is rotatably connected to the output end 411 of the driving component 410, and the second end of the connecting rod 420 is rotatably connected to the prying plate assembly 300 (prying plate 310), so that the linear motion of the driving component 410 is converted into the deflection motion of the prying plate assembly 300. In one embodiment, the driving component 410 can be a linear drive structure such as a cylinder or an electric cylinder.

[0072] like Figure 1 , 2 As shown, the chipping assembly 300 acts on the substrate to perform the chipping action. The chipping assembly 300 is rotatably connected to the base 100, allowing it to deflect toward the receiving station 210 to chip the substrate. The chipping assembly 300 includes a chipping plate 310 and a sliding plate 320. The chipping plate 310 is rotatably connected to the base 100, and a connecting rod 420 is rotatably connected to the chipping plate 310, allowing it to deflect toward the receiving station 210 under the action of the driving member 410 to chip the substrate. The sliding plate 320 is rotatably connected to the substrate and slides along a rotation axis perpendicular to the chipping plate 310.

[0073] like Figure 1 , 2 As shown, the prying plate 310 serves as an actuator. Driven and deflected, the prying plate 310 acts on the substrate to pry it. Specifically, the prying plate 310 is rotatably connected to the base 100; more specifically, both sides of the prying plate 310 are rotatably connected to the base 100. The rotatable connection between the prying plate 310 and the base 100 allows the prying plate 310 to have a rotation axis. In one embodiment, the prying plate 310 can be rotatably connected to the base 100 via a pin. It should be noted that the distance R between the rotation axis of the prying plate 310 and the contact point formed when the prying plate 310 acts on the substrate is used to directly act on the edge of the substrate to achieve prying. The sliding plate 320 is also rotatably connected to the base 100. Specifically, both sides of the sliding plate 320 are rotatably connected to the base 100. In one embodiment, the sliding plate 320 can be rotatably connected to the base 100 via a pin. The sliding plate 320 is disposed on the break plate 310 and is slidably connected to the break plate 310 via a slide rail and a slider. The sliding direction is perpendicular to the rotation axis of the break plate 310.

[0074] Furthermore, such as Figure 2As shown, the base 100 has an oblong hole 110, and the angle between the oblong hole 110 and the receiving station 210 is acute. The breaking plate 310 is rotatably connected to the oblong hole 110, so that the breaking plate 310 can slide along the oblong hole 110, so that when the breaking plate 310 is deflected to break the substrate, it moves away from the receiving station 210. In other words, the base 100 has an obliquely set oblong hole 110, and the angle between the oblong hole 110 and the receiving station 210 is acute. The breaking plate 310 is installed in the oblong hole 110 by a pin, so that when the breaking plate 310 is deflected to break the substrate, it can slide along the oblong hole 110, thereby moving away from the receiving station 210 while applying the breaking force, and avoiding squeezing damage to the substrate.

[0075] Thus, the breaking plate 310 needs to simultaneously perform both pressing and rotating actions to break the substrate, thereby removing the edge of the substrate. This application limits the movement trajectory of the breaking plate 310 by sliding between the sliding plate 320 and the breaking plate 310. On one hand, the breaking plate 310 is mounted in the oblong hole 110 via a pin, allowing it to slide along the oblong hole 110 when deflecting the breaking plate, thus restricting its movement. On the other hand, the sliding plate 320 is rotatably connected to the base 100, and the sliding plate 320 and the breaking plate 310 slide against each other, allowing for a sliding fit. The sliding action between the sliding plate 320 and the splitting plate 310, along with the rotating shaft of the sliding plate 320, ensures that when the driving member 410 presses down, the splitting plate 310 can only rotate around the shaft while moving away from the rotating shaft. Through the combined limiting of these two aspects, the splitting plate 310 can move along a preset trajectory to deflect the edge of the substrate. At the same time, the splitting plate 310 also tends to move away from the center of the substrate, which can effectively prevent the splitting plate 310 from squeezing and damaging the substrate when splitting.

[0076] It should be noted that the splitting plate 310 slips along the waist-shaped hole 110 during the splitting process, causing the position of the splitting plate 310's rotation axis to change. The distance R between the rotation axis of the splitting plate 310 and the contact point formed by the splitting plate 310 acting on the substrate changes. Since the waist-shaped hole 110 is small in size, the calculation error of the subsequent splitting force is small and can be ignored.

[0077] like Figure 2 As shown, the reset assembly 500 is used to reset the chipper assembly 300 after deflection. The reset assembly 500 includes a reset member 510, which is connected between the chipper plate 310 and the base 100 to reset the chipper plate 310 after chipping. In one embodiment, the reset member 510 is a spring; after chipping, the drive member 410 rises, and the reset member 510 assists the chipper plate 310 in resetting to its initial position.

[0078] This application also proposes a method for breaking the pieces, such as... Figure 3 As shown, the above-mentioned chip-breaking device includes:

[0079] S1: Set the target final value F of the breaking force. 终 ;

[0080] S2: Cause the drive unit 410 to output so that the pry bar 310 deflects at a constant speed;

[0081] S3: Control the output speed v and output force P of the drive component 410, so that the breaking force F output by the breaking plate 310 increases to the target final value F at a preset incremental rate. 终 .

[0082] First, set the target final value F of the breaking force. 终 This refers to the increasing of the breaking force of the breaking plate 310 on the substrate during the breaking process from small to large. 终 Then stop, F 终 The required force for substrate splitting; target final value F 终 for:

[0083]

[0084] Where, d min This represents the minimum cutting depth of the substrate.

[0085] F min For in d min The required breaking force at the cutting depth;

[0086] d max This represents the maximum cutting depth of the substrate.

[0087] F max For in d max The required breaking force at the cutting depth;

[0088] Furthermore, it also includes:

[0089] Obtain the cutting depth d of the substrate min =1 / 3d0, define F 终 =F max ;

[0090] Obtain the cutting depth d of the substrate max =1 / 2d0, define F 终 =F min ;

[0091] Where d0 is the substrate thickness.

[0092] It should be noted that the force required to break the substrate (i.e., the target final value F) 终 The cutting depth on the substrate is related to the depth of the cut on the substrate. At that time, the cutting depth and the force required to break the substrate (i.e., the target final value F) 终 The relationship is linearly related; specifically, the minimum cutting depth d is defined. min When = 1 / 3d0, the target final value F 终 For F max Maximum cutting depth d max When = 1 / 2d0, the target final value F 终 For F min Where d0 is the substrate thickness; therefore, at a certain cutting depth d (1 / 3d0≤d≤1 / 2d0), the required final target value F 终 for:

[0093]

[0094] Next, the drive unit 410 outputs to make the breaking plate 310 deflect at a constant speed. Specifically, during the deflection process of the breaking plate 310, it is necessary to maintain the breaking plate 310 rotating around the rotation axis at a constant angular velocity ω. In this way, the breaking action performed by the breaking plate 310 on the substrate is stable, so as to ensure the breaking quality.

[0095] Based on the motion analysis of the 310-piece splitter plate, a simplified model diagram is constructed, as follows: Figure 4 As shown, B0 is the initial position point of the output end 411 of the drive component 410, and point B is the position point of the output end 411 of the drive component 410 when it is pressed down at a certain moment. The relationship between the displacement S of the drive component 410 at a certain moment and the angle α between the pry plate 310 and the direction perpendicular to the receiving station 210 is as follows:

[0096]

[0097] Summarized as follows:

[0098]

[0099] Differentiating the above relationship with respect to time, we obtain the output rate v of the drive unit 410 as:

[0100]

[0101] Where ω is the angular velocity of the 310-degree bend plate;

[0102] R is the distance from the rotation axis of the prying plate 310 to the contact point between the prying plate 310 and the substrate;

[0103] L represents the length of the connecting rod 420;

[0104] α is the angle between the breaking plate 310 and the direction perpendicular to the receiving station 210. Specifically, as shown in the figure... Figure 4 , 5As shown, α is the angle formed by the splitting plate 310 and the direction perpendicular to the receiving station 210 from top to bottom.

[0105] based on It can be determined that when the pry bar 310 rotates to a certain angle α, the required output speed v of the drive unit 410 can be determined.

[0106] Then, the output speed v and output force P of the drive unit 410 are controlled to increase the breaking force F output by the breaking plate 310 to the target final value F at a preset incremental growth rate. 终 Mechanical calculations were performed on the break assembly 300, and a simplified mechanical model diagram was constructed, as follows. Figure 5 As shown, based on the mechanical model, we get:

[0107]

[0108] available:

[0109]

[0110] Where P is the output force of the driving component 410; M1 is the output torque of the breaking plate 310. For this model, the lever arm between the breaking plate 310 and the substrate cutting position is constant at R0; the breaking force F applied by the breaking plate 310 to the substrate is:

[0111]

[0112] Wherein, R0 is the prying lever arm of the prying plate 310;

[0113] R is the distance from the rotation axis of the prying plate 310 to the contact point between the prying plate 310 and the substrate;

[0114] L represents the length of the connecting rod 420;

[0115] α is the angle between the breaking plate 310 and the direction perpendicular to the receiving station 210.

[0116] Furthermore, to improve the breaking effect, the pressure of the breaking plate 310 on the substrate increases linearly. In one embodiment, the preset rate of increase of the breaking force of the breaking plate 310 on the substrate is between 30 N / s and 50 N / s, preferably 30 N / s, 40 N / s, or 50 N / s. Since the breaking plate 310 rotates at a constant speed, the maximum angle α0 between the breaking plate 310 and the direction perpendicular to the receiving station 210 is defined. When the breaking plate 310 deflects to a certain angle, the desired force F of the breaking plate 310 on the substrate is... s for:

[0117]

[0118] Furthermore, the initial value of the included angle α is set to 90°, and the desired force F of the substrate is increased.s The initial value is: Initial value of the breaking force Based on this, the increment is increased at a preset growth rate of 30N / s to 50N / s.

[0119] The actual force F exerted by the scissor plate 310 on the substrate is equal to the desired force F. s The output force P of the driving component 410 is:

[0120]

[0121] Wherein, α0 is the maximum angle between the break assembly 300 and the direction perpendicular to the receiving station 210.

[0122] It should be noted that the force exerted by the breaking plate 310 on the substrate can also be detected by setting a pressure sensor below the breaking plate 310 to detect the actual force exerted by the breaking plate 310 on the substrate.

[0123] Based on the above, the output speed v and output force P of the control drive 410 are realized, so that the breaking force F output by the breaking assembly 300 increases to the target final value F at a preset incremental growth rate. 终 This achieves precise linear increase in breaking force, improving the breaking effect.

[0124] Although preferred embodiments of this application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this application.

[0125] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A method for breaking pieces, characterized in that, Suitable for chip breaking devices, which include: Base (100); A support plate (200) is used to support a substrate, and the support plate (200) has a receiving station (210) for receiving the substrate; A chip-breaking assembly (300) rotatably connected to the base (100) such that the chip-breaking assembly (300) can be deflected toward the receiving station (210) to chip the substrate; and Driver component (400), driver component (400) includes: A drive member (410) is connected to the base (100) and is used to act on the break assembly (300) in a direction perpendicular to the receiving station (210). A connecting rod (420) has its first end rotatably connected to the output end (411) of the drive member (410) and its second end rotatably connected to the pry bar assembly (300), so that the drive member (410) acts on the pry bar assembly (300) through the connecting rod (420) to deflect the pry bar assembly (300); The method of breaking the pieces includes: Set the target final value F of the breaking force. 终 ; The drive unit (410) outputs to make the swashplate (310) deflect at a constant speed; The output speed v and output force P of the control drive (410) are increased so that the breaking force F output by the breaking plate (310) increases to the target final value F at a preset incremental rate. 终 .

2. The method for breaking pieces according to claim 1, characterized in that, The "output rate v of the control drive (410)" includes: The relationship between the displacement S of the output end (411) of the drive component (410), the angle α between the break plate (310) and the direction perpendicular to the receiving station (210) is as follows: Wherein, α is the angle between the breaking plate (310) and the direction perpendicular to the receiving station (210); L is the length of the connecting rod (420); R is the distance from the rotation center of the splitting plate (310) to the point of contact between the splitting plate (310) and the substrate.

3. The method for breaking pieces according to claim 1, characterized in that, The "output rate v of the control drive (410)" also includes: Differentiating the displacement S with respect to time, the output speed v of the driving element (410) is: Wherein, ω is the angular velocity of the pry bar (310).

4. The method for breaking pieces according to claim 2, characterized in that, The breaking force F is: Wherein, R0 is the breaking lever arm of the breaking plate (310); R is the distance from the rotation center of the splitting plate (310) to the contact point between the splitting plate (310) and the substrate; L is the length of the connecting rod (420); α is the angle between the breaking plate (310) and the direction perpendicular to the receiving station (210).

5. The method for breaking pieces according to claim 4, characterized in that, Also includes: When the prying plate (310) is deflected to an angle of α, the desired force exerted by the prying plate (310) on the substrate is defined as F. s : Wherein, α0 is the maximum angle between the breaking plate (310) and the direction perpendicular to the receiving station (210).

6. The method for breaking pieces according to claim 5, characterized in that, Let the included angle α be initially 90°, and let the desired force F of the substrate be... s The initial value is:

7. A method for breaking pieces according to any one of claims 1, 4, or 5, characterized in that, The preset growth rate is between 30N / s and 50N / s.

8. A method for breaking pieces according to claim 5, characterized in that, Also includes: Make the actual force F exerted by the splitting plate (310) on the substrate equal to the desired force F. s The output force P of the driving component (410) is: Wherein, α0 is the maximum angle between the breaking plate (310) and the direction perpendicular to the receiving station (210).

9. A method for breaking pieces according to claim 1, characterized in that, The target final value F 终 for: Where, d min This represents the minimum cutting depth of the substrate. F min For in d min The required breaking force at the cutting depth; d max This represents the maximum cutting depth of the substrate. F max For in d max The breaking force required at the cutting depth.

10. A method for breaking pieces according to claim 9, characterized in that, Also includes: Obtain the cutting depth d of the substrate min =1 / 3d0, define F 终 =F max ; Obtain the cutting depth d of the substrate max =1 / 2d0, define F 终 =F min ; Where d0 is the substrate thickness.

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