Crack monitoring method, device, system, apparatus, and storage medium

Abstract

The application provides a crack monitoring method, device, system, equipment and storage medium, and relates to the technical field of physical detection. The crack monitoring method comprises the following steps: acquiring acoustic wave signals generated by cracks collected by two acoustic emission sensors on a monitoring component; determining a crack initiation position of the cracks based on material information of the monitoring component, a distance between the two acoustic emission sensors and a time difference of receiving the acoustic wave signals; the material information comprises density and Young's modulus of the monitoring component; acquiring acoustic wave characteristic information of the cracks at the crack initiation position based on the material information, the crack initiation position and the acoustic wave signals; and acquiring a development condition of the cracks based on the acoustic wave characteristic information. According to the crack monitoring method, the real-time monitoring of a dynamic process of cracks of important pressure-bearing components of a nuclear power plant can be completed by arranging two acoustic emission sensors on the monitoring component.

Description

Technical Field

[0001] This disclosure relates to the field of physical testing technology, and in particular to a crack monitoring method, apparatus, system, equipment, and storage medium. Background Technology

[0002] Key pressure-bearing components of nuclear power plants (such as reactor pressure vessels, steam generators, main pump casings, and main piping) are the most critical equipment in the nuclear island system. Their operating environment typically involves high temperatures, high pressures, and radioactive media. These components endure complex stresses over long periods, making them prone to cracking and damage during service. When the pressure boundary integrity of these components fails, it can lead to the leakage of high-temperature, high-pressure radioactive materials, posing a serious threat to the safe and stable operation of the nuclear power plant and potentially causing environmental pollution and health risks to personnel.

[0003] In pressurized water reactor nuclear power plants, crack initiation and propagation are among the main failure modes of critical pressure-bearing components. Traditional crack detection methods mainly include ultrasonic testing (UT) and radiographic testing (RT). However, these methods require offline inspection during refueling overhauls, making it impossible to track the dynamic process of crack initiation and propagation in real time. Furthermore, due to their long inspection cycles, they are difficult to detect potential risks in a timely manner. These two detection methods have certain limitations in terms of applicability, monitoring accuracy, and adaptability to components with complex geometries, making it difficult to meet the requirements for the long-term safe operation of pressure-bearing components in nuclear power plants.

[0004] Therefore, there is a need to provide a crack monitoring method, device, system, equipment, and storage medium to promptly detect and assess the crack initiation and propagation behavior of pressure-bearing components, thereby improving the aforementioned problems. Summary of the Invention

[0005] The purpose of this disclosure is to provide a crack monitoring method, apparatus, system, equipment, and storage medium to improve the technical defects of current methods for monitoring the initiation and propagation of cracks in pressure-bearing components of nuclear power plants, which suffer from poor timeliness and insufficient accuracy.

[0006] To achieve the above and other related objectives, in a first aspect, this disclosure provides a crack monitoring method, which includes the following steps: Acquire acoustic wave signals collected by two acoustic emission sensors on a monitoring component, the acoustic wave signals being generated by cracks on the monitoring component, the two acoustic emission sensors being respectively disposed at both ends of the extension direction of the monitoring component; Based on the material information of the monitoring component, the distance between the two acoustic emission sensors, and the time difference in receiving the acoustic signal, the crack initiation location is determined; the material information includes the density and Young's modulus of the monitoring component; Based on the material information, the crack initiation location, and the acoustic signal, the acoustic characteristic information of the crack at the crack initiation location is obtained; Based on the acoustic wave characteristic information, the development status of the crack is obtained.

[0007] Secondly, this disclosure provides a crack monitoring device, which includes a controller and two acoustic emission sensors.

[0008] Two acoustic emission sensors are respectively disposed at both ends of the monitoring component along its extension direction. The controller is communicatively connected to the two acoustic emission sensors and is configured to: acquire acoustic wave signals collected by the two acoustic emission sensors on the monitoring component; determine the crack initiation location based on the material information of the monitoring component, the distance between the two acoustic emission sensors, and the time difference of receiving the acoustic wave signals; the material information includes the density and Young's modulus of the monitoring component; acquire acoustic wave characteristic information of the crack at the crack initiation location based on the material information, the crack initiation location, and the acoustic wave signals; and acquire the crack development status based on the acoustic wave characteristic information.

[0009] Thirdly, this disclosure provides a crack monitoring system, which includes: The signal acquisition module acquires the acoustic wave signals collected by two acoustic emission sensors on the monitoring component. The acoustic wave signals are generated by cracks on the monitoring component. The two acoustic emission sensors are respectively located at both ends of the extension direction of the monitoring component. The location determination module determines the crack initiation location based on the material information of the monitoring component, the distance between the two acoustic emission sensors, and the time difference in receiving the acoustic signal; the material information includes the density and Young's modulus of the monitoring component; The feature acquisition module acquires the acoustic feature information of the crack at the crack initiation location based on the material information, the crack initiation location, and the acoustic signal. The situation assessment module obtains the development status of the crack based on the acoustic wave characteristic information.

[0010] Fourthly, this disclosure provides a computer device including a processor, a memory, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the steps of the method described in any of the above examples.

[0011] Fifthly, this disclosure provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the steps of the method described in any of the above examples.

[0012] The crack monitoring method disclosed herein uses two acoustic emission sensors on a monitoring component to collect acoustic signals released during crack initiation and propagation. The crack initiation location is determined based on the distance between the two acoustic emission sensors and the time difference in receiving the acoustic signals. The acoustic characteristic information of the crack at the initiation location is reconstructed using the collected acoustic signals. Finally, the crack development status can be obtained based on the acoustic characteristic information.

[0013] This crack monitoring method can monitor the dynamic process of cracks in important pressure-bearing components of nuclear power plants in real time by simply setting two acoustic emission sensors on the monitoring component. No human intervention is required during the monitoring process. In particular, after installing monitoring instruments in some high-radiation areas, in-service inspections in these areas can be eliminated, improving the work safety of maintenance personnel. Moreover, the monitoring accuracy and sensitivity are high, and the crack size can be monitored down to the sub-millimeter level. Attached Figure Description

[0014] The features and advantages of this disclosure will be more clearly understood by referring to the accompanying drawings, which are schematic and should not be construed as limiting the scope of this disclosure in any way. Figure 1 The diagram shown is a flowchart of a crack monitoring method according to an embodiment of this disclosure. Figure 2 The diagram shown is a flowchart of step S1 in one embodiment of this disclosure. Figure 3 The diagram shown is a flowchart of step S2 in one embodiment of this disclosure; Figure 4 The diagram shown is a flowchart of step S3 in one embodiment of this disclosure. Figure 5 The diagram shown is a flowchart of step S4 in one embodiment of this disclosure. Figure 6 The diagram shown is a structural schematic of a crack monitoring device according to an embodiment of this disclosure. Figure 7 The diagram shown is a structural block diagram of a crack monitoring system according to an embodiment of this disclosure. Figure 8 The diagram shown is a structural block diagram of a computer device according to an embodiment of this disclosure.

[0015] Component designation explanation: 100. Monitoring components; 200. Acoustic emission sensor; 10. Crack monitoring system; 11. Signal acquisition module; 12. Location determination module; 13. Feature acquisition module; 14. Situation assessment module. Detailed Implementation

[0016] The technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0017] Please see Figures 1 to 8 It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this disclosure. Therefore, the drawings only show components related to this disclosure and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0018] Please see Figures 1 to 5 In a first aspect, this disclosure provides a crack detection method, which includes the following steps: Step S1: Acquire the acoustic wave signals collected by the two acoustic emission sensors on the monitoring component.

[0019] like Figure 6 As shown, this disclosure uses acoustic emission (AE) technology to collect data on crack initiation and propagation on the monitoring component 100. Specifically, two acoustic emission sensors 200 are installed on the monitoring component 100, respectively located at both ends of the extension direction of the monitoring component 100. When crack initiation or propagation occurs on the monitoring component 100, energy is released and high-frequency elastic acoustic waves (typically in the 20 kHz to 2 MHz frequency band) are generated. The two acoustic emission sensors 200 capture the high-frequency elastic acoustic waves propagating along the material surface of the monitoring component 100 at their respective detection positions to monitor the crack development status on the monitoring component 100 in real time.

[0020] It should be noted that the monitoring components equipped with acoustic emission sensors can be critical pressure-bearing components of a nuclear power plant, such as reactor pressure vessels, steam generators, main pump casings, and main pipelines. Installing acoustic emission sensors on these pressure-bearing components allows for real-time monitoring of crack conditions during normal operation of the nuclear power plant.

[0021] like Figure 2 As shown, in some embodiments, step S1 includes the following steps: S11. Acquire the electrical signals collected by the two acoustic emission sensors. These electrical signals are voltage signals that vary with time, and are represented as follows: V(t) .

[0022] S12. Convert the electrical signal into a sound wave signal. The sound wave signal is a time-varying sound wave amplitude signal, represented as: v(t).

[0023] Since the acoustic emission sensor converts elastic waves into electrical signals through the piezoelectric effect, in step S12, the quantitative relationship between the electrical signal and the acoustic wave signal can be determined based on the material information of the monitored component and the sensor information of the acoustic emission sensor; and the electrical signal is converted into an acoustic wave signal according to the quantitative relationship between the electrical signal and the acoustic wave signal. The material information includes the density of the material of the monitored component. ρ (kg / m³) and Young's modulus E (N / m 2 Sensor information includes the piezoelectric constant of the piezoelectric material in the acoustic emission sensor. d (C / N), effective area of ​​action A (m 3 and the circuit equivalent capacitance C (F).

[0024] The quantitative relationship between the electrical signal and the acoustic signal can be expressed as follows: V(t) = K ( d,ρ,E,A,C )· v(t) Parameter coefficients K ( d,ρ,E,A,C This can be adapted to the type of acoustic emission sensor. For example, in one example, the quantitative relationship between the electrical signal and the acoustic signal can be expressed as: Equation (1) In the formula, the coefficients k With sound wave frequency f Proportional to the frequency of sound waves f It can be obtained by performing spectral analysis on the electrical signal.

[0025] Next, step S2 is performed to determine the crack initiation location based on the material information of the monitoring component, the distance between the two acoustic emission sensors, and the time difference of receiving the acoustic signal.

[0026] like Figure 3 As shown, in some embodiments, step S2 includes the following steps: S21. Based on material information, determine the propagation speed of sound waves in the monitoring component.

[0027] In step S21, the density is determined based on the material information of the monitored component. ρ (kg / m³) and Young's modulus E (N / m 2 To determine the speed of sound propagation in the monitoring component. c(m / s), the propagation speed is expressed as .

[0028] S22. Based on the propagation speed, the distance between the two acoustic emission sensors, and the time difference between the two acoustic emission sensors receiving the acoustic wave signals, the crack initiation location is determined.

[0029] like Figure 6 As shown, in step S22, firstly, based on the propagation speed of sound waves in the monitoring component 100, the distance between the two acoustic emission sensors 200, and the time difference between the two acoustic emission sensors 200 receiving the sound wave signals, the distance between the crack and the nearest acoustic emission sensor 200 is determined; for example, in one example, the distance between the crack and the nearest acoustic emission sensor 200 can be determined according to the relationship of equation (2), which is shown below: Equation (2) Among them, △ l The distance between the crack and the nearest acoustic emission sensor 200. l △ is the distance between the two acoustic emission sensors 200. t The time difference between the reception of acoustic signals by the two acoustic emission sensors 200 c The speed at which sound waves propagate in the monitoring component 100.

[0030] Then, based on the location of the nearest acoustic emission sensor 200 and the distance between the crack and the nearest acoustic emission sensor 200, the initiation location of the crack on the monitoring component 100 is determined.

[0031] Next, step S3 is executed: based on material information, crack initiation location, and acoustic signal, acoustic characteristic information of the crack at the crack initiation location is obtained.

[0032] In step S3, the acoustic signal is subjected to spectrum analysis, and the source acoustic signal intensity at the crack initiation location is restored to obtain acoustic characteristic information that can represent the crack development status.

[0033] like Figure 4 As shown, in some embodiments, step S3 includes the following steps: S31. Obtain the frequency of the sound wave signal.

[0034] In step S31, the acoustic signal is subjected to spectral analysis to obtain its frequency. For example, background noise is first filtered from the acoustic signal, and then Fourier transform is performed on the filtered acoustic signal to obtain its frequency and amplitude spectral characteristics.

[0035] S32. Based on the frequency of the acoustic signal, the material information of the monitoring component, the acoustic signal collected by the acoustic emission sensor, and the relative distance between the acoustic emission sensor and the crack initiation location, determine the source acoustic wave intensity at the crack initiation location.

[0036] In step S32, the sound wave signal is first converted from the sound wave amplitude signal. v(t) Converted into sound wave intensity signal I(t) Specifically, the acoustic wave amplitude signal can be determined according to the relationship in equation (3). v(t) Converted into sound wave intensity signal I(t) Equation (3) is shown below: Equation (3) The acoustic intensity signal represents the acoustic intensity detected by the acoustic emission sensor at the measuring point. This acoustic intensity signal, as shown in equation (3), can be derived from the acoustic amplitude signal. v(t) It can be derived from electrical signals. V(t) It is derived from conversion.

[0037] Then, based on the characteristic that the intensity of the sound wave signal decreases exponentially with the propagation distance when it propagates in the medium, the sound wave signal (i.e., the sound wave intensity signal) collected at the sound emission sensor is inverted to the crack initiation position by using the frequency of the sound wave signal, the sound wave propagation speed corresponding to the material information of the monitoring component, and the relative distance between the sound emission sensor and the crack initiation position, so as to obtain the source sound wave intensity of the sound wave signal at the crack initiation position.

[0038] Specifically, the acoustic wave intensity signal collected at the acoustic emission sensor can be inverted and converted into the source acoustic wave intensity at the crack initiation location according to the relationship of equation (4), as shown in equation (4) below: Equation (4) in, Indicates the sound wave signal (i.e., the transmission time) t and transmission distance x (changing sound wave intensity signal) Let be the intensity of the source acoustic wave at the crack initiation point. f The frequency of the sound wave, c The speed of sound wave propagation. This is the loss factor of sound waves propagating in the monitoring component.

[0039] S33. The frequency of the sound wave and the intensity of the source sound wave at the crack initiation location are used as the characteristic information of the sound wave. Among them, the frequency of the sound wave can be used to classify and represent the type of crack initiation or propagation; the intensity of the source sound wave represents the amount of energy released by crack initiation or propagation, and can be used to assess the impact of crack initiation or propagation behavior on the structural stability of the monitored component, that is, to assess crack stability.

[0040] Next, step S4 is performed to obtain the development status of the crack based on the acoustic wave feature information.

[0041] In step S4, based on acoustic wave characteristic information, the crack development status is matched and confirmed in the established acoustic signature database. The development status includes the failure mode and initiation degree of the crack on the monitored component. Specifically, as follows... Figure 5 As shown, in some embodiments, step S4 includes the following steps: S41. Determine the crack failure mode corresponding to the frequency in the acoustic signature database. The crack failure modes include fatigue crack, tearing crack, and stress corrosion crack.

[0042] In step S41, the frequency in the acoustic feature information is compared with the frequency range of each crack failure mode in the acoustic pattern database to obtain the crack failure mode that matches the frequency.

[0043] S42. Determine the safe acoustic intensity limit corresponding to this failure mode from the acoustic signature database. The safe acoustic intensity limit represents the acoustic wave intensity generated by the maximum destructive force that the monitored component can withstand under this failure mode.

[0044] S43. Determine the degree of crack initiation based on the source sound wave intensity and the safe sound intensity limit. The degree of crack initiation is the ratio of the safe sound intensity limit to the sound wave intensity.

[0045] For example, as shown in Table 1, Table 1 represents the established acoustic signature database information. In step S4, if the frequency of the acoustic wave characteristic information is between 60-100 kHz, the crack failure mode of the monitored component is confirmed to be fatigue crack based on the acoustic signature database; then, the safe acoustic intensity limit corresponding to the fatigue crack failure mode is determined to be 0.02 W / mm² from the acoustic signature database. 2 Finally, the intensity of the source acoustic wave in the acoustic wave characteristic information is compared with the safe acoustic intensity limit to determine the degree of crack initiation.

[0046] Table 1: Schematic diagram of voiceprint database information

[0047] In some embodiments, the process of establishing the acoustic signature database used in step S4 includes the following steps: acquiring crack acoustic emission data of the test sample under each failure mode, the crack acoustic emission data including the acoustic wave signal corresponding to the crack initiation or propagation on the test sample, the test sample and the monitoring component having the same material and shape; then, based on the crack acoustic emission data, using finite element analysis to analyze the stability effect of each failure mode crack on the test sample and the corresponding acoustic wave signal, and determining the frequency range and safe acoustic intensity limit of the acoustic wave vibration of the monitoring component under the action of cracks in each failure mode; finally, establishing the acoustic signature database based on the frequency range and safe acoustic intensity limit corresponding to each failure mode.

[0048] Furthermore, in some embodiments, step S4 further includes determining the stability of the monitoring component based on the degree of crack initiation. For example, if the degree of crack initiation is greater than or equal to 2, the monitoring component is determined to be structurally stable and no maintenance is required; if the degree of crack initiation is greater than 1 and less than 2, the structural stability of the monitoring component is determined to be at risk, and the monitoring component can be maintained during the next nuclear power plant overhaul; if the degree of crack initiation is less than or equal to 1, the monitoring component is determined to be structurally unstable and maintenance intervention is required.

[0049] Please see Figure 6 In a second aspect, this disclosure provides a crack monitoring device, which includes a controller and two acoustic emission sensors 200. The two acoustic emission sensors 200 are disposed on a monitoring component 100, with one of the two acoustic emission sensors disposed at one end of the monitoring component 100 and the other at the other end. The two acoustic emission sensors 200 capture high-frequency elastic sound waves generated in the monitoring component 100 due to crack initiation and propagation at their respective detection positions.

[0050] The controller is communicatively connected to two acoustic emission sensors 200. The controller acquires the acoustic wave signals collected by the two acoustic emission sensors 200 on the monitoring component 100. Based on the material information of the monitoring component 100, the distance between the two acoustic emission sensors 200, and the time difference between the two acoustic emission sensors 200 receiving the acoustic wave signals, the controller determines the crack initiation location. The material information includes the density and Young's modulus of the material of the monitoring component 100. Based on the material information, the crack initiation location, and the acoustic wave signals, the controller acquires the acoustic wave characteristic information of the crack at the crack initiation location. Based on the acoustic wave characteristic information, the controller acquires the crack development status.

[0051] It should be noted that the monitoring component 100 of the acoustic emission sensor 200 can be an important pressure-bearing component of a nuclear power plant, such as the reactor pressure vessel, steam generator, main pump casing, and main pipeline.

[0052] In a third aspect, the present invention provides a crack monitoring system 10, which corresponds one-to-one with the crack monitoring methods in the above embodiments.

[0053] like Figure 7 As shown, the crack monitoring system 10 includes a signal acquisition module 11, a location determination module 12, a feature acquisition module 13, and a condition assessment module 14. Detailed descriptions of each functional module are as follows: The signal acquisition module 11 acquires the acoustic wave signals collected by two acoustic emission sensors on the monitoring component. The acoustic wave signals are generated by cracks on the monitoring component. The two acoustic emission sensors are respectively disposed at both ends of the extension direction of the monitoring component. The location determination module 12 determines the crack initiation location based on the material information of the monitoring component, the distance between the two acoustic emission sensors, and the time difference of receiving the acoustic signal; the material information includes the density and Young's modulus of the monitoring component; The feature acquisition module 13 acquires the acoustic feature information of the crack at the crack initiation position based on the material information, the crack initiation location, and the acoustic signal. The situation assessment module 14 obtains the development status of the crack based on the acoustic wave feature information.

[0054] In one embodiment, the signal acquisition module 11 is specifically used for: Acquire electrical signals collected by the two acoustic emission sensors; convert the electrical signals into acoustic signals.

[0055] In one embodiment, the signal acquisition module 11 is specifically used for: Based on the material information of the monitoring component and the sensor information of the acoustic emission sensor, a quantitative relationship between the electrical signal and the acoustic wave signal is determined; wherein, the sensor information includes the piezoelectric constant, effective area, and equivalent capacitance of the acoustic emission sensor. Based on the quantitative relationship between the electrical signal and the acoustic signal, the electrical signal is converted into an acoustic signal.

[0056] In one embodiment, the position determination module 12 is specifically used for: Based on the material information, the propagation speed of sound waves in the monitoring component is determined; The crack initiation location is determined based on the propagation speed, the distance between the two acoustic emission sensors, and the time difference in receiving the acoustic signal.

[0057] In one embodiment, the position determination module 12 is specifically used for: Based on the propagation speed, the distance between the two acoustic emission sensors, and the time difference of receiving the acoustic signal, the distance between the crack and the nearest acoustic emission sensor is determined. The initiation location of the crack is determined based on the location of the nearest acoustic emission sensor and the distance between the crack and the nearest acoustic emission sensor.

[0058] In one embodiment, the location determination module 12 is specifically used to: determine the distance between the crack and the nearest acoustic emission sensor according to formula (I), where formula (I) is: Equation (I) Among them, △ l The distance between the crack and the nearest acoustic emission sensor. l Δ is the distance between the two acoustic emission sensors. t The time difference between the two acoustic emission sensors receiving the acoustic wave signal. c The propagation speed is denoted as .

[0059] In one embodiment, the feature acquisition module 13 is specifically used for: Obtain the frequency of the sound wave signal; Based on the frequency, the material information, the acoustic wave signal collected by the acoustic emission sensor, and the relative distance between the acoustic emission sensor and the crack initiation location, the source acoustic wave intensity of the acoustic wave signal at the crack initiation location is determined. The frequency and the intensity of the source sound wave are used as sound wave characteristic information.

[0060] In one embodiment, the feature acquisition module 13 is specifically used for: Based on the frequency, the propagation speed corresponding to the material information, and the relative distance between the acoustic emission sensor and the crack initiation location, the acoustic wave signal collected at the acoustic emission sensor is inverted to the crack initiation location to obtain the source acoustic wave intensity of the acoustic wave signal at the crack initiation location.

[0061] In one embodiment, the feature acquisition module 13 is specifically used to: determine the intensity of the source acoustic wave according to formula (II), wherein formula (II) is: Formula (II) in, This represents the sound wave signal. The intensity of the source acoustic wave, f For the frequency, c The propagation speed, The loss factor is the material of the monitoring component.

[0062] In one embodiment, the condition assessment module 14 is specifically used to: based on the acoustic wave feature information, match and confirm the development status of the crack in the acoustic fingerprint database, wherein the development status includes the failure mode and the degree of crack initiation of the crack.

[0063] In one embodiment, the situation assessment module 14 is specifically used for: Determine the crack failure mode corresponding to the frequency from the acoustic signature database; Determine the safe sound intensity limit corresponding to the failure mode from the soundprint database; The degree of crack initiation is determined based on the source acoustic wave intensity and the safe acoustic intensity limit, wherein the degree of crack initiation is the ratio of the safe acoustic intensity limit to the source acoustic wave intensity.

[0064] In one embodiment, the situation assessment module 14 is specifically used for: Acquire crack acoustic emission data of the test sample under various failure modes, the crack acoustic emission data including acoustic signals corresponding to crack initiation or propagation; the test sample has the same shape and material as the monitoring component. Based on the crack acoustic emission data, determine the frequency range and safe acoustic intensity limit of the monitoring component under the action of cracks in each failure mode; A voiceprint database is established based on the frequency range and safe sound intensity limit corresponding to each failure mode.

[0065] Specific limitations regarding the crack monitoring system 10 can be found in the limitations of the crack monitoring method described above, and will not be repeated here. Each module in the crack monitoring system 10 can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in or independent of the processor in a computer device, or stored in the memory of a computer device as software, so that the processor can call and execute the operations corresponding to each module.

[0066] In one embodiment, a computer device is provided, the internal structure of which can be shown in the following diagram. Figure 8 As shown, the computer device includes a processor, memory, network interface, display screen, and input devices connected via a system bus. The processor provides computational and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system and computer programs. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage media. The network interface is used to communicate with an external server via a network connection. When the computer program is executed by the processor, it implements the functions or steps of a crack monitoring method.

[0067] In one embodiment, a computer device is provided, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to perform the following steps: Acquire acoustic wave signals collected by two acoustic emission sensors on a monitoring component, the acoustic wave signals being generated by cracks on the monitoring component, the two acoustic emission sensors being respectively disposed at both ends of the extension direction of the monitoring component; Based on the material information of the monitoring component, the distance between the two acoustic emission sensors, and the time difference in receiving the acoustic signal, the crack initiation location is determined; the material information includes the density and Young's modulus of the monitoring component; Based on the material information, the crack initiation location, and the acoustic signal, the acoustic characteristic information of the crack at the crack initiation location is obtained; Based on the acoustic wave characteristic information, the development status of the crack is obtained.

[0068] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon, the computer program performing the following steps when executed by a processor: Acquire acoustic wave signals collected by two acoustic emission sensors on a monitoring component, the acoustic wave signals being generated by cracks on the monitoring component, the two acoustic emission sensors being respectively disposed at both ends of the extension direction of the monitoring component; Based on the material information of the monitoring component, the distance between the two acoustic emission sensors, and the time difference in receiving the acoustic signal, the crack initiation location is determined; the material information includes the density and Young's modulus of the monitoring component; Based on the material information, the crack initiation location, and the acoustic signal, the acoustic characteristic information of the crack at the crack initiation location is obtained; Based on the acoustic wave characteristic information, the development status of the crack is obtained.

[0069] It should be noted that the functions or steps that can be implemented by the computer-readable storage medium or computer device described above can be referred to the relevant descriptions on the server side and client side in the foregoing method embodiments. To avoid repetition, they will not be described one by one here.

[0070] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium. When executed, the computer program can include the processes of the embodiments of the above methods. Any references to memory, storage, databases, or other media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), dual data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), RAM bus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

Claims

1. A crack monitoring method, characterized in that, include: Acquire acoustic wave signals collected by two acoustic emission sensors on a monitoring component, the acoustic wave signals being generated by cracks on the monitoring component, the two acoustic emission sensors being respectively disposed at both ends of the extension direction of the monitoring component; Based on the material information of the monitoring component, the distance between the two acoustic emission sensors, and the time difference in receiving the acoustic signal, the crack initiation location is determined; the material information includes the density and Young's modulus of the monitoring component; Based on the material information, the crack initiation location, and the acoustic signal, the acoustic characteristic information of the crack at the crack initiation location is obtained; Based on the acoustic wave feature information, the development status of the crack is confirmed by matching in the acoustic fingerprint database. The development status includes the failure mode and the degree of crack initiation. The step of obtaining the acoustic characteristic information of the crack at the crack initiation location based on the material information, the crack initiation location, and the acoustic signal includes: Obtain the frequency of the sound wave signal; Based on the frequency, the propagation speed corresponding to the material information, and the relative distance between the acoustic emission sensor and the crack initiation location, the acoustic wave signal collected at the acoustic emission sensor is inverted to the crack initiation location to obtain the source acoustic wave intensity of the acoustic wave signal at the crack initiation location. The frequency and the intensity of the source sound wave are used as sound wave characteristic information; The step of matching and confirming the development status of the crack in the acoustic signature database based on the acoustic wave feature information includes: Determine the crack failure mode corresponding to the frequency from the acoustic signature database; Determine the safe sound intensity limit corresponding to the failure mode from the soundprint database; The degree of crack initiation is determined based on the source acoustic wave intensity and the safe acoustic intensity limit, wherein the degree of crack initiation is the ratio of the safe acoustic intensity limit to the source acoustic wave intensity.

2. The crack monitoring method according to claim 1, characterized in that, The acquisition of acoustic wave signals caused by cracks collected by two acoustic emission sensors on the monitoring component includes: Acquire the electrical signals collected by the two acoustic emission sensors; The electrical signal is converted into an acoustic signal.

3. The crack monitoring method according to claim 2, characterized in that, The process of converting the electrical signal into an acoustic signal includes: Based on the material information of the monitoring component and the sensor information of the acoustic emission sensor, a quantitative relationship between the electrical signal and the acoustic wave signal is determined; wherein, the sensor information includes the piezoelectric constant, effective area, and equivalent capacitance of the acoustic emission sensor. Based on the quantitative relationship between the electrical signal and the acoustic signal, the electrical signal is converted into an acoustic signal.

4. The crack monitoring method according to claim 1, characterized in that, The determination of the crack initiation location based on the material information of the monitoring component, the distance between the two acoustic emission sensors, and the time difference in receiving the acoustic signal includes: Based on the material information, the propagation speed of sound waves in the monitoring component is determined; The crack initiation location is determined based on the propagation speed, the distance between the two acoustic emission sensors, and the time difference in receiving the acoustic signal.

5. The crack monitoring method according to claim 4, characterized in that, The determination of the crack initiation location based on the propagation speed, the distance between the two acoustic emission sensors, and the time difference in receiving the acoustic signal includes: Based on the propagation speed, the distance between the two acoustic emission sensors, and the time difference of receiving the acoustic signal, the distance between the crack and the nearest acoustic emission sensor is determined. The initiation location of the crack is determined based on the location of the nearest acoustic emission sensor and the distance between the crack and the nearest acoustic emission sensor.

6. The crack monitoring method according to claim 5, characterized in that, The distance between the crack and the nearest acoustic emission sensor is determined according to equation (I), which is: Equation (Ⅰ) Among them, △ l The distance between the crack and the nearest acoustic emission sensor. l Δ is the distance between the two acoustic emission sensors. t The time difference between the two acoustic emission sensors receiving the acoustic wave signal. c The propagation speed is described above.

7. The crack monitoring method according to claim 1, characterized in that, The intensity of the source acoustic wave is determined according to formula (II), which is: Formula (II) in, This represents the sound wave signal. The intensity of the source acoustic wave, f For the frequency, c The propagation speed, The loss factor is the material of the monitoring component.

8. The crack monitoring method according to claim 1, characterized in that, The process of establishing the voiceprint database includes: Acquire crack acoustic emission data of the test sample under various failure modes, the crack acoustic emission data including acoustic signals corresponding to crack initiation or propagation; the test sample has the same shape and material as the monitoring component. Based on the crack acoustic emission data, determine the frequency range and safe acoustic intensity limit of the monitoring component under the action of cracks in each failure mode; A voiceprint database is established based on the frequency range and safe sound intensity limit corresponding to each failure mode.

9. A crack monitoring device, characterized in that, include: Two acoustic emission sensors are respectively installed at both ends of the extension direction of the monitoring component; A controller, which is communicatively connected to the two acoustic emission sensors, is configured to perform the crack monitoring method according to any one of claims 1 to 8.

10. A crack monitoring system, characterized in that, include: The signal acquisition module acquires the acoustic wave signals collected by two acoustic emission sensors on the monitoring component. The acoustic wave signals are generated by cracks on the monitoring component. The two acoustic emission sensors are respectively located at both ends of the extension direction of the monitoring component. The location determination module determines the crack initiation location based on the material information of the monitoring component, the distance between the two acoustic emission sensors, and the time difference in receiving the acoustic signal; the material information includes the density and Young's modulus of the monitoring component; The feature acquisition module acquires the acoustic feature information of the crack at the crack initiation location based on the material information, the crack initiation location, and the acoustic signal. The situation assessment module, based on the acoustic wave feature information, matches and confirms the development status of the crack in the acoustic fingerprint database. The development status includes the failure mode and the degree of crack initiation. The feature acquisition module is used to acquire the frequency of the acoustic signal; based on the frequency, the propagation speed corresponding to the material information, and the relative distance between the acoustic emission sensor and the crack initiation position, the acoustic signal collected at the acoustic emission sensor is inverted to the crack initiation position to obtain the source acoustic wave intensity of the acoustic signal at the crack initiation position; the frequency and the source acoustic wave intensity are used as acoustic wave feature information. The condition assessment module is used to determine the crack failure mode corresponding to the frequency from the acoustic signature database; determine the safe acoustic intensity limit corresponding to the failure mode from the acoustic signature database; and determine the degree of crack initiation based on the source acoustic wave intensity and the safe acoustic intensity limit, wherein the degree of crack initiation is the ratio of the safe acoustic intensity limit to the source acoustic wave intensity.

11. A computer device, characterized in that, include: Processor and memory; The memory is used to store computer programs; The processor is connected to the memory and is configured to execute a computer program stored in the memory to cause the computer device to perform the steps of the method according to any one of claims 1 to 8.

12. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 8.

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