A method for fabricating a semiconductor packaging structure

Abstract

This invention provides a method for fabricating a semiconductor packaging structure, relating to the field of semiconductor packaging technology, comprising the following steps: S1: covering a crystal substrate with fluorescent adhesive and cutting multiple fluorescent adhesive films on the fluorescent adhesive; S2: dispensing the multiple fluorescent adhesive films using a defoaming dispensing device; S3: contacting the top of an LED chip with the dispensing adhesive, pressing the LED chip, and allowing it to stand for 3-5 minutes before drying; S4: applying blue adhesive tape to the bottom of the LED chip to detach the LED chip, dispensing adhesive, and fluorescent adhesive films from the crystal substrate, and then performing a molding process; S5: die-bonding the LED chip onto a substrate, then filling the space between the dispensing adhesive and the substrate with white adhesive, and then injection molding to form a lens; S6: dividing the multiple LED chips. This invention, by using a defoaming dispensing device, can strictly control the amount of adhesive dispensed, preventing excessive adhesive overflow into the cutting path, thus avoiding waste and optical pollution; furthermore, it can also treat air bubbles in the adhesive, avoiding uneven light refraction caused by air bubbles.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, specifically to a method for preparing a semiconductor packaging structure. Background Technology

[0002] LED semiconductor chips are the core components of light-emitting diodes (LEDs). Their core structure is a PN junction, composed of P-type and N-type semiconductors, with external P-type (anode) and N-type (cathode) electrodes. They are fabricated by growing an epitaxial layer on substrates such as sapphire or silicon, which determines the emission wavelength and efficiency. The principle of light emission is that when current passes through the PN junction, electrons and holes recombine, releasing energy and emitting photons. The color of the emitted light is determined by the band gap of the semiconductor material. Their high efficiency, energy saving, long lifespan, and fast response characteristics have led to their widespread application in lighting, displays, and backlighting.

[0003] For example, patent application CN 115425124 A discloses a method for preparing a flip-chip white LED packaging structure, including the following steps: Step S1: applying phosphor film onto a die-laying plate; Step S2: pre-cutting the phosphor film, the pre-cutting forming a cutting channel on the phosphor film separating multiple phosphor films; Step S3: applying transparent silicone adhesive to the upper side of the phosphor films... Step S10: cutting the substrate in units of one LED chip, separating each LED chip, and forming multiple flip-chip white LED packaging structures.

[0004] However, the above-mentioned patents are prone to the following problems when applying adhesive: 1) Applying too much adhesive will cause excessive adhesive to overflow into the cutting channel, which will not only waste materials, but may also seep into the LED light-emitting area and affect optical performance; 2) Applying too little adhesive will cause the LED chip to be in contact with the transparent silicone. If the surrounding area is not completely covered, the heat generated by the chip will be directly conducted to the fluorescent film, accelerating the light decay phenomenon; 3) If there are too many air bubbles, the transparent silicone will cause uneven refraction when reflecting light, resulting in inconsistent brightness distribution of the light source and affecting the uniformity of light output. Summary of the Invention

[0005] The present invention provides a method for fabricating a semiconductor packaging structure to solve at least one of the problems mentioned in the background art.

[0006] To solve the above-mentioned technical problems, the present invention discloses a method for preparing a semiconductor packaging structure, comprising the following steps: S1: covering a crystal plate with fluorescent adhesive and cutting out multiple fluorescent adhesive films on the fluorescent adhesive; S2: using a defoaming adhesive dispensing device to dispense the multiple fluorescent adhesive films.

[0007] S3: Make contact between the top of the LED chip and the dispensing adhesive, press the LED chip, let it stand for 3-5 minutes and then dry it; S4: Apply blue film tape to the bottom of the LED chip to separate the LED chip, dispensing adhesive and fluorescent film from the crystal board, and then perform molding; S5: Deposit the LED chip onto the substrate, fill the gap between the dispensing adhesive and the substrate with white glue, and then injection mold to form a lens; S6: Divide multiple LED chips.

[0008] Preferably, the thickness of the crystal plate is 500-800μm, and the surface adhesion is 50-150gf / 25mm width.

[0009] Preferably, in step S2, the defoaming and dispensing device includes a base plate, a glue storage box is fixedly installed on the base plate, a drive box is fixedly installed on the glue storage box, a dispensing channel is connected to one side of the glue storage box, and a dispensing pipe is connected to the other end of the dispensing channel, with the dispensing pipe penetrating through the base plate.

[0010] Preferably, a motor is fixedly installed inside the drive box, and a rotating rod is fixedly connected to the lower output end of the motor. A gear one is fixedly installed on the rotating rod, and a gear two is meshed on the gear one. A rotating shaft is fixedly installed through the gear two, and the rotating shaft rotates and extends into the glue storage box. A threaded rod is fixedly connected to the lower end of the rotating shaft, and a filter plate is threadedly connected to the threaded rod. The filter plate is slidably connected to the inner wall of the glue storage box.

[0011] Preferably, a protrusion is symmetrically fixed on the rotating shaft, an mounting block is slidably mounted on the protrusion, a through pipe is symmetrically rotatably connected to the mounting block, and an adsorption cylinder is fixedly connected to the other end of the through pipe, with a groove opened on the adsorption cylinder.

[0012] Preferably, a concave cavity is provided inside the rotating shaft, and an end cap is detachably provided at the upper end of the concave cavity. The concave cavity is filled with defoamer. A through groove is symmetrically opened on the rotating shaft, and a first channel is symmetrically opened on the mounting block. The first channel cooperates with the through groove and is connected to the through pipe.

[0013] Preferably, the mounting block has an annular groove with an opening at the lower end, which communicates with the first channel. Elastic elements are symmetrically fixed in the annular groove, and a stop block is fixedly connected to the lower end of the elastic element. The stop block is slidably connected to the annular groove. A second channel is provided through the stop block, which cooperates with the first channel. A sleeve is fixedly provided on the filter plate, which is sleeved on the threaded rod and cooperates with the annular groove.

[0014] Preferably, an opening is provided on one side wall of the drive box, and gear one extends out of the drive box from the opening. A fixing plate is fixedly provided on one side wall of the glue storage box, and a rotating rod is fixedly provided on the fixing plate. Gear three is fixedly provided at the upper end of the rotating rod, and gear three meshes with gear one.

[0015] Preferably, a rotating shaft is rotatably installed through the glue dispensing channel, and a limiting block is fixedly installed on the rotating shaft. The limiting block is located inside the glue dispensing channel and is used to control the opening and closing of the glue dispensing channel. A glue dispensing machine is also installed inside the glue dispensing channel. A mating wheel is fixedly installed at the upper end of the rotating shaft, and a cam is fixedly installed on the rotating rod. The cam and the mating wheel are mated. A torsion spring is installed at the connection position between the rotating shaft and the glue dispensing channel.

[0016] Preferably, the rotating shaft rotates through the base plate, and a gear four is fixedly installed at the lower end of the rotating shaft. A funnel-shaped cavity is provided inside the glue dispensing tube, and the funnel-shaped cavity is connected to the glue dispensing channel. A baffle is slidably inserted on the glue dispensing tube. The baffle is used to control the opening and closing of the funnel-shaped cavity. A toothed plate is fixedly installed on one end of the baffle, and the toothed plate is meshed with the gear four.

[0017] Compared with the prior art, the present invention provides a method for preparing a semiconductor packaging structure. By setting a defoaming dispensing device, the amount of dispensing can be strictly controlled, preventing excessive dispensing from overflowing into the cutting channel and causing waste and optical pollution; it also prevents the heat dissipation hazards caused by insufficient dispensing, which would accelerate light decay; in addition, it can also treat the air bubbles in the dispensing to avoid uneven light refraction caused by air bubbles, effectively improving the dispensing effect and thus further enhancing the lighting effect. Attached Figure Description

[0018] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0019] Figure 1 This is a schematic diagram of the defoaming and dispensing device of the present invention;

[0020] Figure 2 For the present invention Figure 1 Enlarged view of point A;

[0021] Figure 3 This is a schematic diagram of the internal structure of the glue storage box of the present invention;

[0022] Figure 4 This is a schematic diagram illustrating the fit between the annular groove and the first channel of the present invention;

[0023] Figure 5 This is a bottom view of the mating wheel of the present invention;

[0024] Figure 6 This is a schematic diagram of the installation of the dispensing tube and dispensing channel of the present invention;

[0025] Figure 7 This is a schematic diagram of the installation of the toothed plate and the baffle of the present invention;

[0026] Figure 8This is a schematic diagram of the engagement of the cam and the mating wheel of the present invention.

[0027] In the diagram: 1. Glue storage box; 2. Base plate; 3. Drive box; 4. Gear 2; 5. Rotating shaft; 6. Motor; 7. Gear 1; 8. Rotating rod; 9. Rotating shaft; 10. Glue dispensing channel; 11. Glue dispensing tube; 12. Gear 3; 13. Cam; 14. Rotating rod; 15. Fixing plate; 16. Matching wheel; 17. Protrusion; 18. Through pipe; 19. Adsorption cylinder; 20. Threaded rod; 21. Sleeve; 22. Filter plate; 23. Mounting block; 24. First channel; 25. Stop block; 26. Annular groove; 27. Second channel; 28. Elastic element; 29. ​​Concave cavity; 30. Glue dispensing machine; 31. Groove; 32. Restricting block; 33. Gear 4; 34. Tooth plate; 35. Baffle; 36. Funnel-shaped cavity. Detailed Implementation

[0028] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] In the description of this invention, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0030] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0031] Example 1

[0032] The present invention provides a method for fabricating a semiconductor packaging structure, comprising the following steps: S1: covering a crystal substrate with fluorescent adhesive and cutting multiple fluorescent adhesive films on the fluorescent adhesive; S2: dispensing the multiple fluorescent adhesive films using a defoaming dispensing device; S3: contacting the top of an LED chip with the dispensing adhesive, pressing the LED chip, and drying it after standing for 3-5 minutes; S4: applying blue film tape to the bottom of the LED chip to separate the LED chip, the dispensing adhesive, and the fluorescent adhesive films from the crystal substrate, and then performing a molding process; S5: die bonding the LED chip onto a substrate, filling the space between the dispensing adhesive and the substrate with white adhesive, and then injection molding to form a lens; S6: dividing the multiple LED chips.

[0033] Preferably, the thickness of the crystal plate is 500-800μm, and the surface adhesion is 50-150gf / 25mm width.

[0034] The working principle and beneficial effects of the above technical solution are as follows: S1: Cover the crystal plate with fluorescent adhesive and cut multiple fluorescent adhesive films on the fluorescent adhesive; S2: Use a defoaming adhesive dispensing device to dispense the multiple fluorescent adhesive films; S3: Make the top of the LED chip contact with the dispensing adhesive, press the LED chip, let it stand for 3-5 minutes and then dry it; S4: Apply blue film tape to the bottom of the LED chip to separate the LED chip, dispensing adhesive and fluorescent adhesive films from the crystal plate, and then perform molding; S5: Deposit the LED chip onto the substrate, fill the gap between the dispensing adhesive and the substrate with white glue, and then injection mold to form a lens; S6: Divide the multiple LED chips;

[0035] This application, by setting up a defoaming dispensing device, can strictly control the amount of glue dispensed, preventing excessive glue from overflowing into the cutting path and causing waste and optical pollution; it also prevents the heat dissipation hazards caused by insufficient glue, which accelerates light decay; in addition, it can also treat the air bubbles in the glue to avoid uneven light refraction caused by air bubbles, effectively improving the dispensing effect and thus further enhancing the lighting effect.

[0036] Example 2

[0037] Based on the above embodiment 1, in step S2, as follows: Figures 1-8 As shown, the defoaming and dispensing device includes a base plate 2, a glue storage box 1 is fixedly installed on the base plate 2, a drive box 3 is fixedly installed on the glue storage box 1, a dispensing channel 10 is connected to one side of the glue storage box 1, and a dispensing pipe 11 is connected to the other end of the dispensing channel 10. The dispensing pipe 11 passes through the base plate 2.

[0038] Preferably, a motor 6 is fixedly installed inside the drive box 3. A rotating rod 8 is fixedly connected to the lower output end of the motor 6. A gear 7 is fixedly installed on the rotating rod 8. A gear 4 is meshed on the gear 7. A rotating shaft 5 is fixedly installed through the gear 4. The rotating shaft 5 rotates and extends into the glue storage box 1. A threaded rod 20 is fixedly connected to the lower end of the rotating shaft 5. A filter plate 22 is threadedly connected to the threaded rod 20. The filter plate 22 is slidably connected to the inner wall of the glue storage box 1.

[0039] The working principle and beneficial effects of the above technical solution are as follows: the motor 6 drives the rotating rod 8 to rotate, the rotating rod 8 drives the gear 1 7 to rotate, the gear 1 7 drives the gear 2 4 to rotate, the gear 2 4 drives the rotating shaft 5 to rotate, and the rotating shaft 5 drives the threaded rod 20 to rotate together. The threaded rod 20 causes the filter plate 22 to move up and down in the glue storage box 1 (in the initial position, the filter plate 22 is at the bottom). During the upward movement of the filter plate 22, impurities in the glue will be left on the upper surface of the filter plate 22; while during the up and down movement of the filter plate 22, air bubbles in the glue are removed through physical compression and filtration, which significantly reduces the air bubble content of the glue.

[0040] This design integrates impurity filtration and bubble elimination functions into a single moving part. Through the stable output of mechanical transmission, it achieves a higher impurity retention rate in the adhesive and a significant reduction in bubble content. This effectively avoids dispensing defects caused by impurity blockage and bubble residue, and significantly improves the stability of the encapsulation process.

[0041] Example 3

[0042] Based on the above embodiment 2, as Figure 3 , Figure 5 As shown, a protrusion 17 is symmetrically fixed on the rotating shaft 5, and an installation block 23 is slidably installed on the protrusion 17. A through pipe 18 is symmetrically rotatably connected to the installation block 23, and an adsorption cylinder 19 is fixedly connected to the other end of the through pipe 18. A groove 31 is opened on the adsorption cylinder 19.

[0043] The working principle and beneficial effects of the above technical solution are as follows: When the filter plate 22 rises, it will come into contact with the adsorption cylinder 19 (the adsorption cylinder 19 is similar to an activated carbon rod). The rotation of the rotating shaft 5 will drive the mounting block 23 to rotate through the protrusion 17. The mounting block 23 will drive the through pipe 18 to rotate. The through pipe 18 will drive the adsorption cylinder 19 to rotate (revolution and rotation) and roll on the filter plate 22. During the rolling process, the residual adhesive particles and bubbles on the surface of the filter plate 22 will be captured by physical adsorption. In addition, even if the filter plate 22 continues to rise, the mounting block 23 will rise together under the action of the protrusion 17, which will not affect the contact adsorption between the filter plate 22 and the adsorption cylinder 19, ensuring that the cleaning effect is not affected by the change of stroke. The scraping action of the adsorption cylinder 19 on the surface of the filter plate 22 will cause the trapped bubbles to be released and float to the surface, further reducing the adhesive bubble rate. This design combines mechanical motion with physical adsorption, which significantly improves the cleaning efficiency of the filter plate 22, significantly increases the adhesive bubble removal rate, and significantly reduces the risk of encapsulation defects caused by bubble residue.

[0044] Example 4

[0045] Based on the above embodiment 3, such as Figures 3-5 As shown, a concave cavity 29 is provided inside the rotating shaft 5. An end cap is detachably provided at the upper end of the concave cavity 29. The concave cavity 29 is filled with defoamer. A through groove is symmetrically opened on the rotating shaft 5. A first channel 24 is symmetrically opened on the mounting block 23. The first channel 24 cooperates with the through groove and is connected to the through pipe 18.

[0046] Preferably, the mounting block 23 has an annular groove 26 with an opening at the lower end, which communicates with the first channel 24. Elastic members 28 are symmetrically fixed in the annular groove 26, and a stop block 25 is fixedly connected to the lower end of the elastic member 28. The stop block 25 is slidably connected to the annular groove 26. A second channel 27 is provided through the stop block 25, which cooperates with the first channel 24. A sleeve 21 is fixedly provided on the filter plate 22, which is sleeved on the threaded rod 20 and cooperates with the annular groove 26.

[0047] Among these, it is necessary to select a defoamer compatible with the adhesive (such as silicone or mineral oil), and the addition amount is usually 0.1% to 1%. The optimal ratio needs to be determined through pre-testing.

[0048] The concave cavity 29 inside the rotating shaft 5 serves as a defoamer storage chamber, which can be quickly replenished through a detachable end cap.

[0049] The working principle and beneficial effects of the above technical solution are as follows: When the filter plate 22 gradually rises, the sleeve 21 will enter the annular groove 26. The sleeve 21 pushes the stop 25 to squeeze the elastic element 28. The elastic element 28 contracts, and the stop 25 moves upward so that the second channel 27 is aligned with the first channel 24 to form a conductive path. When the rotating shaft 5 rotates, under the action of centrifugal force and weight, the defoamer enters the adsorption cylinder 19 through the through groove, the first channel 24, the second channel 27 and the through pipe 18, and flows out from the groove 31. Then the defoamer will remain on the filter plate 22. When the filter plate 22 descends, the filter plate 22 will fully contact the glue in the glue storage box 1, thereby effectively reducing the number of glue bubbles in the glue storage box 1.

[0050] Example 5

[0051] Based on the above embodiments 1-2, such as Figure 2 , Figures 6-8 As shown, an opening is provided on one side wall of the drive box 3, and gear 7 extends out of the drive box 3 from the opening. A fixing plate 15 is fixedly provided on one side wall of the glue storage box 1, and a rotating rod 14 is fixedly provided on the fixing plate 15. Gear 3 12 is fixedly provided at the upper end of the rotating rod 14, and gear 3 12 meshes with gear 7.

[0052] Preferably, a rotating shaft 9 is rotatably installed through the glue dispensing channel 10, and a limiting block 32 is fixedly installed on the rotating shaft 9. The limiting block 32 is located inside the glue dispensing channel 10 and is used to control the opening and closing of the glue dispensing channel 10. A glue dispensing machine 30 is also installed inside the glue dispensing channel 10. A mating wheel 16 is fixedly installed at the upper end of the rotating shaft 9, and a cam 13 is fixedly installed on the rotating rod 14. The cam 13 and the mating wheel 16 are mated. A torsion spring is installed at the connection position between the rotating shaft 9 and the glue dispensing channel 10.

[0053] The working principle and beneficial effects of the above technical solution are as follows: When the motor 6 drives the gear 7 to rotate, the gear 7 drives the gear 12 to rotate, the gear 12 drives the rotating rod 14 to rotate, the rotating rod 14 drives the cam 13 to rotate, and the cam 13 periodically pushes the mating wheel 16 to rotate, causing the rotating shaft 9 to oscillate back and forth; the oscillation of the rotating shaft 9 drives the limiting block 32 (similar to a valve plate structure) to rotate in the glue dispensing channel 10, realizing the opening and closing adjustment of the glue dispensing channel 10; and the setting of the torsion spring will cause the limiting block 32 to return to the initial position when the cam 13 is not mating with the mating wheel 16, forming a periodic on and off cycle;

[0054] When the limiting block 32 opens the channel, the dispensing machine 30 (such as a peristaltic pump) delivers the adhesive to the dispensing pipe 11; when it closes, the flow of adhesive is interrupted. Through the cooperation of the cam 13 and the mating wheel 16, the opening and closing time ratio of the limiting block 32 is precisely controlled to achieve pulsed output of adhesive, which can effectively control the accuracy of dispensing amount, making it more precise and practical.

[0055] Example 6

[0056] Based on the above embodiment 5, such as Figure 2 , Figures 6-8 As shown, the rotating shaft 9 rotates through the base plate 2. A gear 33 is also fixedly installed at the lower end of the rotating shaft 9. A funnel-shaped cavity 36 is provided inside the glue dispensing tube 11. The funnel-shaped cavity 36 is connected to the glue dispensing channel 10. A baffle 35 is slidably inserted on the glue dispensing tube 11. The baffle 35 is used to control the opening and closing of the funnel-shaped cavity 36. A toothed plate 34 is fixedly installed on one end of the baffle 35. The toothed plate 34 is meshed with the gear 33.

[0057] The working principle and beneficial effects of the above technical solution are as follows: When the rotating shaft 9 swings under the action of the cam 13 and the mating wheel 16, it drives the lower gear 33 to rotate synchronously; the gear 33 drives the baffle 35 to move, which will open the opening of the funnel-shaped cavity 36; when the limiting block 32 opens the glue outlet channel 10, the glue flows into the funnel-shaped cavity 36 and then flows out from the funnel-shaped cavity 36. When the limiting block 32 closes the glue outlet channel 10, the baffle 35 will completely seal the funnel-shaped cavity 36, effectively reducing the glue dripping from the funnel-shaped cavity 36 after the glue outlet channel 10 is closed. Under the dual action of the limiting block 32 and the baffle 35, the glue dispensing amount can be accurately and effectively controlled, reducing the probability of glue residue or dripping; in addition, by adjusting the profile of the cam 13 and the stroke of the baffle 35, it can be adapted to glues with different viscosities and different dosage requirements, making it more practical and effective.

[0058] Through a "dual-stage linkage control + adaptive adjustment" mechanism, precise glue output and efficient leak prevention are achieved: When the rotating shaft 9 is driven to swing by the cam 13 and the mating wheel 16, it drives the gear 4 33 to rotate, which in turn pushes the baffle 35 to slide open the funnel-shaped cavity 36; at this time, if the limiting block 32 simultaneously opens the glue outlet channel 10, the glue flows out stably through the two-stage channels under pressure. When the dispensing ends, the limiting block 32 first closes the main channel to cut off the glue flow, and then the baffle 35 completely seals the funnel-shaped cavity 36, preventing residual glue from dripping. This dual-cutoff design of "rapid main channel cut-off + precise branch channel sealing" reduces the glue residue rate to below 0.1%, far exceeding the level of traditional single-stage valve control.

[0059] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention.

Claims

1. A method for fabricating a semiconductor packaging structure, characterized in that, The process includes the following steps: S1: Cover the crystal plate with fluorescent adhesive and cut out multiple fluorescent adhesive films on the fluorescent adhesive; S2: Use a defoaming dispensing device to dispense adhesive onto multiple fluorescent adhesive films. The defoaming dispensing device includes a base plate (2), a glue storage box (1) is fixedly installed on the base plate (2), a drive box (3) is fixedly installed on the glue storage box (1), a dispensing channel (10) is connected to one side of the glue storage box (1), and a dispensing pipe (11) is connected to the other end of the dispensing channel (10). The dispensing pipe (11) passes through the base plate (2). A motor (6) is fixedly installed inside the drive box (3). A rotating rod (8) is fixedly connected to the lower output end of the motor (6). A gear (7) is fixedly installed on the rotating rod (8). A gear (4) is meshed on the gear (7). A rotating shaft (5) is fixedly installed on the gear (4). The rotating shaft (5) rotates and extends into the glue storage box (1). A threaded rod (20) is fixedly connected to the lower end of the rotating shaft (5). A filter plate (22) is threadedly connected to the threaded rod (20). The filter plate (22) is slidably connected to the inner wall of the glue storage box (1). A protrusion (17) is symmetrically fixed on the rotating shaft (5). An installation block (23) is slidably installed on the protrusion (17). A through pipe (18) is symmetrically rotatably connected to the installation block (23). An adsorption cylinder (19) is fixedly connected to the other end of the through pipe (18). A groove (31) is opened on the adsorption cylinder (19). A concave cavity (29) is provided inside the rotating shaft (5). An end cap is detachably provided at the upper end of the concave cavity (29). The concave cavity (29) is filled with defoamer. A through groove is symmetrically opened on the rotating shaft (5). A first channel (24) is symmetrically opened on the mounting block (23). The first channel (24) cooperates with the through groove and is connected to the through pipe (18). The mounting block (23) has an annular groove (26) with an opening at the lower end. The annular groove (26) is connected to the first channel (24). An elastic element (28) is symmetrically fixed in the annular groove (26). The lower end of the elastic element (28) is fixedly connected to a stop block (25). The stop block (25) is slidably connected to the annular groove (26). A second channel (27) is opened through the stop block (25). The second channel (27) cooperates with the first channel (24). A sleeve (21) is fixedly installed on the filter plate (22). The sleeve (21) is sleeved on the threaded rod (20). The sleeve (21) cooperates with the annular groove (26). An opening is provided on one side wall of the drive box (3), and gear 1 (7) extends out of the drive box (3) from the opening. A fixing plate (15) is fixedly provided on one side wall of the glue storage box (1), and a rotating rod (14) is fixedly provided on the fixing plate (15). Gear 3 (12) is fixedly provided at the upper end of the rotating rod (14), and gear 3 (12) meshes with gear 1 (7). A rotating shaft (9) is rotatably installed through the glue dispensing channel (10). A limiting block (32) is fixedly installed on the rotating shaft (9). The limiting block (32) is installed inside the glue dispensing channel (10) and is used to control the opening and closing of the glue dispensing channel (10). A glue dispensing machine (30) is also installed inside the glue dispensing channel (10). A mating wheel (16) is fixedly installed at the upper end of the rotating shaft (9). A cam (13) is fixedly installed on the rotating rod (14). The cam (13) is mated with the mating wheel (16). A torsion spring is installed at the connection position between the rotating shaft (9) and the glue dispensing channel (10). The rotating shaft (9) rotates through the base plate (2). A gear four (33) is fixedly installed at the lower end of the rotating shaft (9). A funnel-shaped cavity (36) is provided in the dispensing tube (11). The funnel-shaped cavity (36) is connected to the dispensing channel (10). A baffle (35) is slidably inserted on the dispensing tube (11). The baffle (35) is used to control the opening and closing of the funnel-shaped cavity (36). A toothed plate (34) is fixedly installed on one end of the baffle (35). The toothed plate (34) meshes with the gear four (33). S3: The top of the LED chip contacts the dispensing glue and presses the LED chip. After standing for 3-5 minutes, it is dried. S4: Blue film tape is applied to the bottom of the LED chip to separate the LED chip, dispensing glue and fluorescent film from the crystal plate and perform molding. S5: The LED chip is die-bonded onto the substrate. White glue is filled between the dispensing glue and the substrate. Then, the lens is formed by injection molding. S6: Multiple LED chips are divided.

2. The method for fabricating a semiconductor packaging structure according to claim 1, characterized in that, The thickness of the crystal plate is 500-800μm, and the surface adhesion is 50-150gf / 25mm width.

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