Bidirectional heat-conducting graphene film of metal via hole, and preparation method and application of bidirectional heat-conducting graphene film

CN120648985APending Publication Date: 2025-09-16CHONGQING INST OF EAST CHINA NORMAL UNIV +1
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Patent Information

Application Number
CN202511007082.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-07-22
Publication Date
2025-09-16

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Abstract

The invention provides a bidirectional heat conduction graphene film of a metal via hole and a preparation method and application thereof, and belongs to the technical field of heat dissipation. The preparation method comprises the following steps: coating a substrate with a graphene oxide dispersion liquid, heating, drying, stripping from the substrate to obtain a graphene oxide film, graphitizing and annealing the obtained graphene oxide film to obtain a graphene film, printing a through hole array on the graphene film by adopting a dispensing machine microneedle, sputtering a metal titanium layer on the surface of the hole wall of a through hole, and sealing the hole by using a metal solder. And obtaining the bidirectional heat-conducting graphene film with the metal through hole. The thermal conductivity of the graphene film in the vertical direction is improved through the metal via hole process, and the main function of the metal solder is to improve the vertical thermal conductivity of the graphene film; the metal titanium layer and the metal solder act together to improve the vertical heat conduction capability of the graphene film and still keep excellent heat conductivity in the horizontal direction, the bidirectional high heat conductivity performance of the metal via hole graphene film rapidly conducts heat of a heat source, and the heat dissipation efficiency of electronic components is greatly improved.
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