封装芯片超声波扫描夹具
By designing an ultrasonic scanning fixture for packaged chips, and utilizing a combination of a transparent substrate and an elastic outer side plate, convenient positioning of packaged chips and simultaneous detection of multiple chips are achieved. This solves the problem of low efficiency in existing technologies, improves detection efficiency, and reduces costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- NO 24 RES INST OF CETC
- Filing Date
- 2025-07-09
- Publication Date
- 2026-07-17
AI Technical Summary
Existing packaged chips are inefficient during ultrasonic inspection and face challenges such as high labor costs, complex operation, and irregular placement.
An ultrasonic scanning fixture for packaged chips has been designed, including a substrate with a transparent scanning area and a mounting area. The scanning area has multiple positioning areas, and the positioning areas have protrusions and recesses for mounting the packaged chips. Combined with an outer plate made of elastic polymer material, the fixture enables convenient positioning and testing of the packaged chips.
It improves the testing efficiency of packaged chips, reduces labor costs, simplifies the operation process, avoids damage to packaged chips, and enables simultaneous testing of multiple chips.
Smart Images
Figure CN120651973B_ABST