Electronic device, heat dissipation method, and computer-readable storage medium

Abstract

This invention discloses an electronic device, a heat dissipation method, and a computer-readable storage medium, applicable to the field of electronic device heat dissipation. The electronic device includes a chassis and at least one heat dissipation system disposed within the chassis. The heat dissipation system includes: a cold plate, comprising a first cold plate and a second cold plate, the first cold plate being perpendicular to the motherboard and the second cold plate being parallel to the motherboard; a liquid storage component, a flow pump, and liquid cooling piping; and a return manifold assembly, wherein the liquid outlet of the first cold plate and the liquid inlet of the return manifold assembly are flush with each other in the extension direction of the motherboard; the liquid inlets of the liquid storage component and the second cold plate are arranged along a first direction and are respectively located on both sides of the motherboard. The electronic device disclosed in this invention can fully utilize the internal space of the chassis, meeting the miniaturization requirements of edge servers while satisfying heat dissipation requirements.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation in electronic devices, and in particular to an electronic device, a heat dissipation method, and a computer-readable storage medium. Background Technology

[0002] As edge computing gradually becomes an important way of information processing and data storage, edge servers, as the core facilities of edge computing, are usually deployed on the user side, such as workstations, when used indoors. They need to process a large amount of data and respond to user needs in real time.

[0003] In related technologies, due to the high heat dissipation requirements of edge servers, cold plate heat dissipation structures are generally used. These structures utilize the high heat capacity and high thermal conductivity of the cooling medium to remove the heat generated by the heat-generating components, thus meeting the heat dissipation needs of high-power, high-density servers. However, for scenarios where edge servers are deployed on the user side, it is difficult to equip the secondary cooling side of the liquid cooling cycle with large CDU (Cooling Distribution Unit) devices. This greatly limits the application of cold plate heat dissipation systems in edge server heat dissipation systems.

[0004] Therefore, how to improve heat dissipation and reduce noise is a technical problem that needs to be solved by those skilled in the art. Summary of the Invention

[0005] The purpose of this invention is to provide an electronic device, a heat dissipation method, and a computer-readable storage medium to meet the heat dissipation requirements of edge servers, reduce noise, and facilitate the large-scale deployment and use of edge servers on the indoor user side.

[0006] To achieve the above objectives, the present invention provides the following technical solution.

[0007] An electronic device includes a chassis and at least one heat dissipation system disposed within the chassis; the heat dissipation system includes:

[0008] The cold plate includes a first cold plate and a second cold plate. The first cold plate is set perpendicular to the motherboard, and the second cold plate is set parallel to the motherboard.

[0009] The liquid storage component, flow pump, and liquid cooling pipeline are used to store the cooling medium. Both the liquid storage component and the flow pump are connected to the liquid cooling pipeline, and the flow pump is used to drive the cooling medium to circulate along the liquid cooling pipeline.

[0010] The return manifold assembly is connected to the liquid cooling pipeline. The liquid outlet of the first cold plate and the liquid inlet of the return manifold assembly are flush with each other in the extension direction of the main board. The liquid outlet of the return manifold assembly is connected to the liquid inlet of the second cold plate. Furthermore, the liquid storage component and the liquid inlet of the second cold plate are arranged along the first direction and are respectively located on both sides of the main board.

[0011] On the other hand, it also includes:

[0012] The liquid inlet manifold assembly is connected to the liquid cooling pipeline. The liquid outlet of the liquid inlet manifold assembly is connected to the liquid inlet of the first cold plate, and the height of the liquid outlet of the liquid inlet manifold assembly is higher than the height of the liquid inlet of the first cold plate.

[0013] On the other hand, it also includes:

[0014] The heat exchange component is used to cool the cooling medium and is connected to the return manifold assembly.

[0015] The fan module, the inlet manifold assembly, the return manifold assembly, and the flow pump are all located on the side of the heat exchange component near the cold plate; the fan module and the inlet manifold assembly are arranged longitudinally, and the fan module and the return manifold assembly are arranged laterally; the fan module is located between the heat exchange component and the return manifold assembly, and the airflow direction of the fan module is towards the heat exchange component.

[0016] On the other hand, the chassis is provided with several heat dissipation areas, each corresponding to a heat dissipation system. The heat dissipation areas include cooling areas, confluence areas, and liquid storage areas. The cooling areas and liquid storage areas are arranged along a first direction and are adjacent to each other. The cooling areas and liquid storage areas are located on the same side of the confluence area along a second direction, with the first direction perpendicular to the second direction. Furthermore, the inlet manifold assembly, return manifold assembly, heat exchange components, and fan modules are all located in the confluence area, the liquid storage components and flow pump are located in the liquid storage area, and the first cold plate and the second cold plate are located in the cooling area.

[0017] On the other hand, the heat dissipation area is a square area, and the heat dissipation area also includes a power supply area. The heat dissipation system also includes a power supply compartment, which is located in the power supply area. The power supply area and the liquid storage area are arranged along the second direction. The liquid storage area is located close to the confluence area. The sum of the lengths of the power supply area and the liquid storage area along the second direction is the same as the length of the cooling area along the second direction. The sum of the widths of the liquid storage area and the cooling area along the first direction is the same as the width of the confluence area along the first direction.

[0018] On the other hand, the first cold plate is used to absorb the heat emitted by the first heating element, and the second cold plate is used to absorb the heat emitted by the second heating element; the liquid outlet of the liquid storage component, the flow pump, and the liquid inlet of the liquid inlet manifold assembly are connected in sequence; the liquid outlet of the liquid inlet manifold assembly is connected to the liquid inlet of the first cold plate; the liquid outlet of the first cold plate is connected to the liquid inlet of the return manifold assembly; the liquid outlet of the return manifold assembly is connected to the liquid inlet of the second cold plate; the liquid outlet of the second cold plate is connected to the liquid inlet of the heat exchange component; and the liquid outlet of the heat exchange component is connected to the liquid inlet of the liquid storage component; wherein, the power of the second heating element is less than the power of the first heating element.

[0019] On the other hand, the liquid inlet and liquid outlet of the first cold plate are arranged along a third direction, the liquid inlet of the liquid inlet manifold assembly and the liquid outlet of the liquid return manifold assembly are arranged along a third direction, and the liquid inlet and liquid outlet of the first cold plate, the liquid inlet of the liquid inlet manifold assembly and the liquid outlet of the liquid return manifold assembly are located in the same plane; the first direction, the second direction and the third direction are perpendicular to each other.

[0020] On the other hand, the liquid cooling pipeline includes a liquid cooling main pipe and several liquid cooling branch pipes. The liquid inlet manifold assembly is located between the liquid inlet of each liquid cooling branch pipe and the liquid cooling main pipe. The liquid cooling branch pipes are connected to the first cold plate one by one, and the liquid storage component and the flow pump are both connected to the liquid cooling main pipe.

[0021] The inlet manifold assembly includes a housing and a flow guiding component disposed within the housing. The periphery of the housing has an inlet and several outlets, and the interior of the housing has several flow channels. The liquid cooling main pipe is connected to the inlet, and the flow channels, outlets, and liquid cooling branch pipes are connected one-to-one. The flow guiding component is used to divert the cooling medium so that the cooling medium is diverted to each flow channel.

[0022] On the other hand, a velocity distribution zone is provided inside the shell between the inlet and the flow channel, and the flow guiding component is arranged in the velocity distribution zone;

[0023] The flow guiding components include inclined blocking components and flow diversion blocking components. The inclined blocking components are located near the inlet, and the flow diversion blocking components are located near the flow channel. There are at least two inclined blocking components, located on both sides of the inlet, and the inclined blocking components are inclined from the side near the inlet to the side near the flow channel toward the left and right sides of the flow velocity distribution area. There are multiple flow diversion blocking components, which are spaced apart, and the extension direction of the flow diversion blocking components is parallel to the arrangement direction of each flow channel.

[0024] On the other hand, the inlet manifold assembly also includes several guide plates, which are located between adjacent flow channels to separate each flow channel. The guide plates extend from the side near the inlet to the side away from the inlet. A bend is provided on the side of the guide plate away from the inlet. Furthermore, from the side near the inlet to the side away from the inlet, the bending angle of the bend of each guide plate decreases sequentially.

[0025] On the other hand, it also includes a fixed bracket, on which the flow pump, inlet manifold assembly, return manifold assembly, heat exchange components and fan module are all mounted. The heat exchange components are spaced apart from the fixed bracket to form a receiving space for the fan module, flow pump and inlet manifold assembly to be placed.

[0026] On the other hand, the liquid storage component is located on the side of the fixed bracket away from the heat exchange component, the flow pump is located on the side of the fixed bracket closer to the liquid storage component, and the liquid inlet and outlet of the heat exchange component are both located on the side of the heat exchange component closer to the flow pump.

[0027] On the other hand, it also includes:

[0028] Temperature sensing component, used to detect the temperature of heating element;

[0029] The control system is used to adjust the flow rate of the flow pump and the speed of the fan module based on the difference between the temperature of the heating element and the target temperature.

[0030] On the other hand, it also includes a leakage detection component, which is installed on the liquid cooling pipeline and is used to detect whether the liquid cooling pipeline is leaking; the control system is connected to the leakage detection component and is also used to issue a leakage signal when the liquid cooling pipeline is leaking; and / or, it also includes a liquid level detection component, which is used to obtain the liquid level value in the liquid storage component; the control system is connected to the liquid level detection component and is also used to issue a liquid replenishment signal when the liquid level value in the liquid storage component is less than the liquid level alarm threshold.

[0031] A heat dissipation method, applied to the aforementioned electronic device, includes the following steps:

[0032] The temperature of the heating element is obtained, and when the temperature of the heating element is less than or equal to the corresponding target temperature, the flow rate of the flow pump is kept at the target flow rate, and the speed of the fan module is adjusted according to the difference between the temperature of the heating element and the target temperature.

[0033] After the temperature of the heating element is higher than the target temperature and maintained for a preset time, the flow rate of the flow pump and the speed of the fan module are adjusted according to the difference between the temperature of the heating element and the target temperature.

[0034] On the other hand, it also includes the following steps:

[0035] An alarm signal is issued when the temperature of any heating element is between the corresponding first temperature alarm threshold and the second temperature alarm threshold.

[0036] When the temperature of any heating element is greater than or equal to the corresponding second temperature alarm threshold, control all heating elements to stop operating;

[0037] Among them, the target temperature corresponding to the same heating element is less than the first temperature alarm threshold and less than the second temperature alarm threshold.

[0038] On the other hand, it also includes the following steps:

[0039] The liquid level in the storage component is detected, and a liquid replenishment signal is issued when the liquid level is less than or equal to the liquid level alarm threshold.

[0040] It detects leaks in the liquid cooling lines and sends a leak signal when a leak occurs.

[0041] When the liquid level is greater than the liquid level alarm threshold and there is no leakage in the liquid cooling pipeline, control the activation of each heating element.

[0042] On the other hand, adjusting the flow rate of the flow pump and the speed of the fan module based on the difference between the temperature of the heating element and the target temperature includes:

[0043] Obtain the temperature of the heating element at time t, t-1, and t-2;

[0044] Based on the temperatures of the heating element at time t, t-1, and t-2, the target temperature, and the flow signal value of the flow pump at time t-1, calculate the flow signal value of the flow pump at time t.

[0045] The fan module's rotation speed signal value at time t is calculated based on the temperatures of the heating element at times t-1 and t-2, the target temperature, and the fan module's rotation speed signal value at time t-1.

[0046] On the other hand, calculating the flow signal value of the flow pump at time t includes:

[0047] The flow signal value of the flow pump (220) at time t is calculated according to formula (1);

[0048]

[0049] And / or, the calculation of the fan module (700) speed signal value at time t includes:

[0050] The rotational speed signal value of the fan module (700) at time t is calculated according to formula (2);

[0051]

[0052] in:

[0053] : The fan module (700) speed signal value at time t;

[0054] The fan module (700) speed signal value at time t-1;

[0055] : The flow signal value of the flow pump (220) at time t;

[0056] : The flow signal value of the flow pump (220) at time t-1;

[0057] Target temperature;

[0058] : The temperature of the heating element (10) at time t;

[0059] : The temperature of the heating element (10) at time t-1;

[0060] : The temperature of the heating element (10) at time t-2;

[0061] , , It is a constant.

[0062] A computer-readable storage medium storing a computer program, wherein the computer program, when executed by a processor, implements the steps of the heat dissipation method described above.

[0063] The heat dissipation system provided by this invention has the following advantages: The arrangement of the first and second cold plates with two different configurations allows for heat transfer to heat-generating components installed in different ways; the built-in liquid storage component and flow pump within the chassis facilitate integrated design of electronic devices and result in a more compact structure, meeting the miniaturization requirements of edge servers while satisfying their heat dissipation needs, achieving self-circulation, and reducing reliance on external equipment; furthermore, the liquid outlet of the first cold plate and the liquid inlet of the return manifold assembly are flush with each other along the extension direction of the motherboard, enabling horizontal plug-in installation; the liquid cooling pipeline layout is simple and assembly is convenient; the liquid storage component and the liquid inlet of the second cold plate are located on opposite sides of the motherboard, fully utilizing the space on both sides of the motherboard, resulting in a more compact structure and further meeting the miniaturization design requirements of the chassis.

[0064] In one embodiment, the flow guiding component includes an inclined blocking member and a flow-diverting blocking member. The inclined blocking member is disposed near the inlet, and the flow-diverting blocking member is disposed near the flow channel. There are at least two inclined blocking members, located on both sides of the inlet, and the inclined blocking members are inclined from the side near the inlet to the side near the flow channel toward the left and right sides of the flow velocity distribution area. There are multiple flow-diverting blocking members, which are spaced apart, and the extension direction of the flow-diverting blocking members is parallel to the arrangement direction of each flow channel. The above arrangement utilizes the flow guiding function of the inclined blocking member to allow the cooling medium entering the shell to flow smoothly to both sides of the shell, and utilizes the blocking function of the flow-diverting blocking member to prevent the cooling medium from directly entering the flow channel closest to the inlet, but instead disperses it to the flow channels located on both sides of the shell. By setting up the inclined blocking member and the flow-diverting blocking member, the flow direction of the cooling medium can be restricted, so that the cooling medium entering the shell can flow evenly to each outlet, ensuring that the flow rate of the cooling medium in each liquid cooling branch pipe is uniform.

[0065] The heat dissipation method provided by this invention obtains the temperature of the heating element and maintains the flow rate of the flow pump at the target flow rate when the temperature of the heating element is less than or equal to the corresponding target temperature. The fan module speed is adjusted based on the difference between the heating element temperature and the target temperature. This configuration eliminates the need to adjust the flow pump flow rate when the heating element temperature is less than or equal to the target temperature, avoiding the problem of insufficient cooling medium filling in the liquid cooling pipeline due to the need to reduce the flow pump flow rate when the heating element temperature is low. This heat dissipation method ensures that the liquid cooling pipeline is filled with cooling medium and achieves a dual cooling effect by adjusting the flow pump flow rate when the fan module's maximum speed is insufficient. Because the flow pump flow rate is adjustable, the maximum speed of the fan module does not need to be too high, thus reducing the noise of the heat dissipation system and effectively lowering noise pollution.

[0066] The electronic device provided in this application can implement the above-mentioned heat dissipation method. Since the heat dissipation method has the above-mentioned technical effects, the electronic device should also have the corresponding technical effects.

[0067] The computer-readable storage medium provided in this application can implement the above-mentioned heat dissipation method. Since the heat dissipation method has the above-mentioned technical effects, the computer-readable storage medium should also have the corresponding technical effects.

[0068] The computer program product provided in this application can implement the above-mentioned heat dissipation method. Since the heat dissipation method has the above-mentioned technical effects, the computer program product should also have the corresponding technical effects. Attached Figure Description

[0069] To more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0070] Figure 1 This is a schematic diagram of a specific embodiment of the heat dissipation system in the electronic device provided by the present invention.

[0071] Figure 2 for Figure 1 The diagram shows a top view of the cooling system applied to the chassis.

[0072] Figure 3-1 for Figure 1 The diagram shows a partial structural schematic of the heat dissipation system when it is applied to the chassis.

[0073] Figure 3-2 for Figure 1 The diagram shows a partial structural schematic of the heat dissipation system when it is applied to the chassis.

[0074] Figure 4-1 for Figure 1 A schematic diagram of the heat dissipation system from another perspective.

[0075] Figure 4-2 for Figure 1 The diagram shows the location of each area in the heat dissipation system.

[0076] Figure 5 for Figure 1 The diagram shows the internal structure of the inlet manifold assembly in the heat dissipation system.

[0077] Figure 6 This is a schematic diagram illustrating the working principle of the heat dissipation system provided by the present invention.

[0078] Figure 7 This is a schematic diagram of the connection structure of the control system in the heat dissipation system provided by the present invention.

[0079] Figure 8 This is a flowchart illustrating a specific embodiment of the heat dissipation method provided by the present invention.

[0080] Figure 9 A flowchart illustrating another specific embodiment of the heat dissipation method provided by the present invention.

[0081] Figure label:

[0082] Heating element 10; First heating element 11; Second heating element 12; Chassis 20; Motherboard 30;

[0083] Cold plate 100; First cold plate 110; Second cold plate 120; Liquid outlet 121 of the second cold plate; Liquid inlet 122 of the second cold plate; Liquid storage component 210; Flow pump 220; Liquid cooling pipeline 300; Liquid cooling main pipe 310; Liquid cooling branch pipe 320; Quick-release connector 321; First liquid cooling branch pipe 322; Second liquid cooling branch pipe 323; Inlet manifold assembly 400; Housing 410; Inlet 411; Outlet 412; Flow channel 413; Velocity distribution zone A; Velocity development zone B; Velocity diffusion zone C; Flow guide Component 420; Inclined blocking component 421; Diverting blocking component 422; Guide plate 423; Bending part 423-1; Return manifold assembly 500; Heat exchange component 600; Inlet of heat exchange component 601; Outlet of heat exchange component 602; Fan module 700; Fixed bracket 800; Control system 910; Temperature detection component 920; Leakage detection component 930; Liquid level detection component 940; Power supply compartment 950; Cooling area P1; Merging area P2; Liquid storage area P3; Power supply area P4. Detailed Implementation

[0084] The core of this invention is to provide an electronic device, a heat dissipation method, and a computer-readable storage medium, which can significantly improve the applicability and meet the heat dissipation requirements of edge servers.

[0085] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0086] Please refer to Figure 1 and Figure 2 In this embodiment, the electronic device includes a chassis 20 and at least one heat dissipation system disposed within the chassis; multiple heat dissipation systems may be disposed within the chassis, and different heat dissipation systems may be disposed separately or may share some structures, such as a liquid storage component 210.

[0087] The heat dissipation system includes:

[0088] Cold plate 100 includes a first cold plate 110 and a second cold plate 120. The first cold plate 110 is set perpendicular to the motherboard 30, and the second cold plate 120 is set parallel to the motherboard 30.

[0089] The liquid storage component 210, the flow pump 220, and the liquid cooling pipeline 300 are provided. The liquid storage component 210 is used to store the cooling medium. The liquid storage component 210 and the flow pump 220 are both connected to the liquid cooling pipeline 300. The flow pump 220 is used to drive the cooling medium to circulate along the liquid cooling pipeline 300.

[0090] The return manifold assembly 500 is connected to the liquid cooling pipeline 300. The liquid outlet of the first cold plate 110 and the liquid inlet of the return manifold assembly 500 are flush with each other in the extension direction of the main board 30. The liquid outlet of the return manifold assembly 500 is connected to the liquid inlet 122 of the second cold plate. Furthermore, the liquid storage component 210 and the liquid inlet 122 of the second cold plate are arranged along the first direction and are respectively located on both sides of the main board 30.

[0091] Specifically, the chassis 20 of the electronic device can be a server chassis 20. The heat-generating element 10 is installed on the motherboard 30 inside the chassis 20. The chassis 20 also houses a power supply compartment 950, which supplies power to the various components inside the chassis 20. The chassis 20 primarily provides physical protection for the internal components of the electronic device and provides fixed space for each hardware component, ensuring the stable installation of components such as the motherboard 30, hard drive, power supply, and fan module 700. Designing a heat dissipation system inside the chassis 20 helps to reduce the operating temperature of the electronic device and prevent internal heat from entering the chassis 20. Overheating can cause hardware damage or performance degradation, thus improving hardware operating efficiency is crucial. The cold plate 100 primarily employs fluid cooling technology, introducing a cooling medium into its interior through liquid cooling pipes 300. The cooling medium absorbs heat and dissipates it, a method more efficient than air cooling, particularly suitable for high-performance edge electronic devices. The cold plate 100 can be made of metal materials such as copper or aluminum and features a complex internal flow channel 413 to enhance the heat transfer coefficient. It is fixed to the CPU (Central Processing Unit) inside the electronic device via spring screws and a structural backplate. The heat-generating elements 10, including the CPU (Central Processing Unit), GPU (Graphics Processing Unit), BMC (Baseboard Management Controller), and switching elements, are coated with a high thermal conductivity silicone grease between the cold plate 100 and the encapsulation surface of the heat-generating elements 10 to reduce the thermal resistance between the heat-generating elements 10 and the cold plate 100. The liquid cooling pipeline 300 mainly provides a flow path for the cooling medium, connecting the cold plate 100, the inlet manifold assembly 400, and the return manifold assembly 500. The flow pump 220 is the flow path between the micro flow pump 220, the liquid storage component 210, and the heat exchange component 600, transferring the heat absorbed from the heat-generating elements 10 to the heat exchange component 600 through the liquid cooling pipeline 300, forming a closed-loop cooling medium circulation system. The return manifold assembly 500 is used to collect the cooling medium that has absorbed heat from each of the cold plates 100 and guide it to the outlet to form a circulation. The liquid cooling pipes 300 are generally made of high-molecular materials such as polyurethane, silicone, fluoroplastics and polytetrafluoroethylene. The cooling medium can be ethylene glycol, which has low corrosivity. Polyurethane can be used as the material for the liquid cooling pipes 300 because it has good flexibility and bending resistance, making it easy to install and fix in the complex chassis 20.

[0092] This heat dissipation system, utilizing two different arrangements of the first and second cold plates, can meet the heat transfer requirements of heat-generating elements with different installation methods. Both the liquid storage component 210 and the flow pump 220 are housed within the electronic device's chassis 20. By arranging both the liquid storage component 210 and the flow pump 220 within the electronic device's chassis 20, an external CDU (Cooling Distribution Unit) is not required. The cooling distribution unit (CU) facilitates the deployment of edge servers on the user side, promotes integrated design of electronic devices, and results in a more compact structure. While meeting the miniaturization requirements of edge servers, it also meets their heat dissipation needs and achieves self-circulation, reducing reliance on external equipment. Furthermore, the liquid outlet of the first cold plate 110 and the liquid inlet of the return manifold assembly 500 are flush with each other in the extension direction of the motherboard 30, enabling horizontal plug-in installation. The liquid cooling pipeline layout is simple and easy to assemble. The liquid storage component 210 and the liquid inlet 122 of the second cold plate are located on both sides of the motherboard 30, making full use of the space on both sides of the motherboard, resulting in a more compact structure and further meeting the miniaturization design requirements of the chassis.

[0093] In some implementations, it also includes:

[0094] The liquid inlet manifold assembly 400 is connected to the liquid cooling pipeline 300. The liquid outlet of the liquid inlet manifold assembly 400 is connected to the liquid inlet of the first cold plate 110, and the height of the liquid outlet of the liquid inlet manifold assembly 400 is higher than the height of the liquid inlet of the first cold plate 110. The liquid cooling pipeline 300, which connects the liquid outlet of the liquid inlet manifold assembly 400 and the liquid inlet of the first cold plate 110, can be provided with an arc transition structure for easy connection.

[0095] Specifically, the inlet manifold assembly 400 is used to distribute the cooling medium from the liquid cooling line 300 to each of the first cold plates 110, ensuring that each first cold plate 110 receives a sufficient and uniform flow of cooling medium, and avoiding overheating or insufficient cooling in certain areas; the flow pump 220 can be flush with the upper part of the inlet manifold assembly 400 to reduce the extra space occupied by the flow pump 220; both the liquid storage component 210 and the flow pump 220 should be set close to the inlet manifold assembly 400 to reduce the length of the liquid cooling line 300.

[0096] In some implementations, it also includes:

[0097] The heat exchange component 600 is used to cool the cooling medium and is connected to the return manifold assembly 500.

[0098] The fan module 700, the inlet manifold assembly 400, the return manifold assembly 500, and the flow pump 220 are all located on the side of the heat exchange component 600 near the cold plate 100. The fan module 700 and the inlet manifold assembly 400 are arranged longitudinally, and the fan module 700 and the return manifold assembly 500 are arranged transversely. The fan module 700 is located between the heat exchange component 600 and the return manifold assembly 500, and the airflow direction of the fan module 700 is towards the heat exchange component 600.

[0099] Specifically, the heat from the heating element 10 is transferred using the cold plate 100, and then transferred to the heat exchange component 600 via the liquid cooling pipe 300. The fan module 700 then cools the heat exchange component 600, achieving a dual heat dissipation effect from both the heat exchange component 600 and the fan module 700, thus meeting the heat dissipation requirements of the self-circulating cooling system. Simultaneously, the fan module 700 and the liquid inlet manifold assembly 400 are arranged longitudinally, and the fan module 700 and the liquid return manifold assembly 500 are also arranged longitudinally. Along the horizontal arrangement, the flow pump 220 can be located above the return manifold assembly 500 and flush with the inlet manifold assembly 400, so that the fan module 700, the inlet manifold assembly 400, the return manifold assembly 500 and the flow pump 220 are all positioned close to the heat exchange component 600. This allows the cooling system to make full use of the internal space of the chassis 20, meet the miniaturization requirements of the edge server, meet its heat dissipation requirements, and achieve self-circulation, reducing dependence on external equipment.

[0100] Furthermore, the heat exchange component 600 can be a radiator, which includes several fins and heat dissipation pipes. The heat dissipation pipes are connected to the liquid cooling pipeline 300. The cooling medium transfers heat to each fin through the heat dissipation pipes. There are gaps between adjacent fins. The fan module 700 accelerates the cooling of the fins by providing airflow to the gaps between adjacent fins, thereby cooling the cooling medium in the heat dissipation pipes and liquid cooling pipeline 300. This heat dissipation system combines the heat dissipation methods of the cold plate 100, the fan module 700, and the air-liquid radiator heat exchange component 600 to construct a miniaturized internal circulation air-liquid hybrid heat dissipation system. This system can ensure efficient heat dissipation of each heat-generating component 10 of the edge server while minimizing the noise of the fan module 700, which is beneficial for the large-scale deployment and use of edge electronic devices on the indoor user side. The fan module 700 can include multiple individual fans, which can be controlled simultaneously or individually. The overall heat dissipation efficiency of the fan module 700 can be changed by adjusting the speed of each individual fan.

[0101] In some implementation methods, please refer to Figure 4-2The chassis 20 has several heat dissipation areas, each corresponding to a heat dissipation system. The heat dissipation areas include a cooling area P1, a confluence area P2, and a liquid storage area P3. The cooling area P1 and the liquid storage area P3 are arranged along a first direction and are adjacent to each other. The cooling area P1 and the liquid storage area P3 are located on the same side of the confluence area P2 along a second direction. The first direction is perpendicular to the second direction. By placing the confluence area P2 on one side of the heat dissipation area, it is convenient to cool the confluence area P2. The layout is more reasonable and the structure is more compact.

[0102] In some embodiments, the inlet manifold assembly 400, the return manifold assembly 500, the heat exchange component 600, and the fan module 700 are all located in the confluence area P2, the liquid storage component 210 and the flow pump 220 are located in the storage area P3, and the first cold plate 110 and the second cold plate 120 are located in the cooling area P1. By partitioning, specific functions can be performed in each area, saving space.

[0103] In some embodiments, the heat dissipation area is a square area, and the projection of the heat dissipation area in a third direction is also a square area. The heat dissipation area also includes a power supply area P4, and the heat dissipation system also includes a power supply compartment 950, which is located in the power supply area P4. The power supply area P4 and the liquid storage area P3 are arranged along a second direction, and the liquid storage area P3 is located close to the confluence area P2. The sum of the lengths of the power supply area P4 and the liquid storage area P3 along the second direction is the same as the length of the cooling area P1 along the second direction, and the sum of the widths of the liquid storage area P3 and the cooling area P1 along the first direction is the same as the width of the confluence area P2 along the first direction. By setting the heat dissipation area in a directional structure, the space occupied by the entire heat dissipation system is more reasonable, and the arrangement within the chassis 20 is more convenient.

[0104] In some embodiments, the heating element 10 includes a first heating element 11 and a second heating element 12. There are multiple first cold plates 110 and multiple first heating elements 11, with the positions of the first cold plates 110 corresponding one-to-one with the positions of the first heating elements 11, ensuring that each first heating element 11 has a corresponding first cold plate 110 for heat dissipation. The first cold plate 110 is used to absorb the heat emitted by the first heating element 11, and the second cold plate 120 is used to absorb the heat emitted by the second heating element 12. The liquid storage component 210 has a liquid outlet, and the flow pump 22... The inlet of the liquid inlet manifold assembly 400 and the liquid outlet of the liquid inlet manifold assembly 400 are connected in sequence. The liquid outlet of the liquid inlet manifold assembly 400 is connected to the liquid inlet of the first cold plate 110. The liquid outlet of the first cold plate 110 is connected to the liquid inlet of the return manifold assembly 500. The liquid outlet of the return manifold assembly 500 is connected to the liquid inlet 122 of the second cold plate. The liquid outlet 121 of the second cold plate is connected to the liquid inlet 601 of the heat exchange component. The liquid outlet 602 of the heat exchange component is connected to the liquid inlet of the liquid storage component 210. The power of the second heating element 12 is less than that of the first heating element 11.

[0105] Specifically, the second cold plate 120 is located on the liquid cooling main pipe 310 and between the liquid cooling branch pipe 320 and the heat exchange component 600; wherein, the power of the second heating element 12 is less than the power of the first heating element 11; specifically, the cooling medium flows from the liquid storage component 210 through the flow pump 220 in the liquid cooling pipeline 300, first enters each of the first cold plates 110 through the liquid inlet manifold assembly 400 for the first heating, then flows to the liquid return manifold assembly 500, enters the second cold plate 120 for the second heating, and then passes through the heat exchange component 600. After being cooled by the heat exchange component 600 and the fan module 700, it returns to the liquid storage component 210.

[0106] In some embodiments, the liquid inlet and outlet of the first cold plate 110 are arranged along a third direction, and the liquid inlet of the liquid inlet manifold assembly 400 and the liquid outlet of the liquid return manifold assembly 500 are arranged along a third direction. The liquid inlet and outlet of the first cold plate 110, the liquid inlet of the liquid inlet manifold assembly 400, and the liquid outlet of the liquid return manifold assembly 500 are located in the same plane. This arrangement is to ensure that the liquid inlet of the liquid inlet manifold assembly 400 and the liquid outlet of the liquid return manifold assembly 500 can be simultaneously inserted with the liquid inlet and outlet of the first cold plate 110, which is beneficial for the arrangement of the liquid cooling branch pipe 320 and saves the length of the liquid cooling branch pipe 320. The first direction, the second direction, and the third direction are perpendicular to each other. The liquid inlet of the first cold plate 110 is located on the side of the liquid outlet of the first cold plate 110 away from the main board 30.

[0107] In some implementations, such as Figure 1 and Figure 6As shown, the liquid cooling pipeline 300 includes a liquid cooling main pipe 310 and several liquid cooling branch pipes 320. Each liquid cooling branch pipe 320 is connected to the liquid cooling main pipe 310. The liquid inlet manifold assembly 400 is disposed between the liquid inlet of each liquid cooling branch pipe 320 and the liquid cooling main pipe 310. The liquid cooling branch pipes 320 are connected to the first cold plate 110 in a one-to-one correspondence. The liquid storage component 210, the flow pump 220 and the heat exchange component 600 are all connected to the liquid cooling main pipe 310. The liquid cooling branch pipes 320 are used to allow the cooling medium in the liquid cooling main pipe 310 to flow through the corresponding first cold plate 110 to effectively dissipate heat from the first heating element 11. The liquid cooling branch pipe 320 includes a first liquid cooling branch pipe 322 and a second liquid cooling branch pipe 323. The first liquid cooling branch pipe 322 connects the liquid outlet of the inlet manifold assembly 400 to the liquid inlet of the first cold plate 110. The second liquid cooling branch pipe 323 connects the liquid outlet of the first cold plate 110 to the liquid inlet of the return manifold assembly 500. The second liquid cooling branch pipe 323 is arranged horizontally, and the first liquid cooling branch pipe 322 is located at the upper part of the second liquid cooling branch pipe 323 along a first direction. The side of the first liquid cooling branch pipe 322 near the first cold plate 110 is arranged parallel to the side of the second liquid cooling branch pipe 323 near the first cold plate 110. The first liquid cooling branch pipe 322 is close to the liquid inlet. One side of the manifold assembly 400 is bent away from the second liquid cooling branch pipe 323, thereby satisfying the setting that the height of the liquid outlet of the liquid inlet manifold assembly 400 is higher than the height of the liquid inlet of the first cold plate 110; quick-release connectors 321 are provided at both ends of the first liquid cooling branch pipe 322 and the second liquid cooling branch pipe 323 to improve the efficiency of disassembly and assembly; a wire harness can be provided between the first liquid cooling branch pipe 322 and the second liquid cooling branch pipe 323. Since the distance between the first liquid cooling branch pipe 322 and the second liquid cooling branch pipe 323 is relatively close and the structure is compact, the wire harness can avoid mutual interference between the liquid cooling pipes 300, further meeting the requirements of miniaturization design.

[0108] In some embodiments, the inlet manifold assembly 400 is disposed between the inlet 411 of each liquid-cooled branch pipe 320 and the liquid-cooled main pipe 310. The inlet manifold assembly 400 is used to distribute the flow rate of the cooling medium entering each liquid-cooled branch pipe 320 from the liquid-cooled main pipe 310; further, such as Figure 5As shown, the inlet manifold assembly 400 includes a housing 410 and a flow guiding component 420 disposed within the housing 410. The periphery of the housing 410 is provided with an inlet 411 and several outlets 412. The interior of the housing 410 is provided with several flow channels 413. The liquid cooling main pipe 310 is connected to the inlet 411, and the flow channels 413, outlets 412, and liquid cooling branch pipes 320 are connected one-to-one. The flow guiding component 420 is used to divert the cooling medium so that the cooling medium is diverted to each flow channel 413. Specifically, the flow guiding component 420 can be a block structure or a plate structure. It can be fixed inside the housing 410 by welding to ensure the connection strength; the number of flow channels 413 is the same as the number of outlets 412 and they correspond one by one to ensure that the cooling medium entering a single flow channel 413 can flow out smoothly through the outlet 412; furthermore, through the setting of the flow guiding component 420, after the cooling medium enters the housing 410, it will encounter the structural feature barrier of the flow guiding component 420 in the flow velocity distribution area A, and the flow direction of the cooling medium will flow to both sides, and the forward flow velocity will decrease. Based on this structure, the flow rate of the cooling medium is distributed to both sides.

[0109] In some embodiments, a flow velocity distribution zone A is provided within the housing 410 between the inlet 411 and the flow channel 413, and a flow guiding component 420 is disposed within the flow velocity distribution zone A. The flow guiding component 420 includes an inclined blocking component 421 and a flow diversion blocking component 422. The inclined blocking component 421 is disposed near the inlet 411, and the flow diversion blocking component 422 is disposed near the flow channel 413. There are at least two inclined blocking components 421, which are respectively located on both sides of the inlet 411, and the inclined blocking components 421 are inclined from the side near the inlet 411 towards the side near the flow channel 413 toward the left and right sides of the flow velocity distribution zone A. There are multiple flow diversion blocking components 422, which are spaced apart, and the extending direction of the flow diversion blocking components 422 is parallel to the arrangement direction of each flow channel 413. Specifically, the left and right sides of the flow velocity distribution zone A refer to the direction perpendicular to the direction of the inlet 411, and the arrangement direction of each flow channel 413 is perpendicular to the direction of the inlet 411. The above configuration utilizes the flow guide of the inclined blocking member 421 to allow the cooling medium entering the housing 410 to flow smoothly to both sides of the housing 410. The flow divider blocking member 422 prevents the cooling medium from directly entering the flow channel 413 closest to the inlet 411, and instead disperses it to the flow channels 413 located on both sides of the housing 410. By setting up the inclined blocking member 421 and the flow divider blocking member 422, the flow direction of the cooling medium can be restricted, so that the cooling medium entering the housing 410 can flow evenly to each outlet 412, ensuring that the flow rate of the cooling medium in each liquid cooling branch pipe 320 is uniform.

[0110] In some embodiments, the inlet manifold assembly 400 further includes a plurality of guide plates 423, which are located between adjacent flow channels 413 to separate each flow channel 413. The guide plates 423 extend from the side near the inlet 411 to the side away from the inlet 411. A bend 423-1 is provided on the side of the guide plate 423 away from the inlet 411. Furthermore, from the side near the inlet 411 to the side away from the inlet 411, the bending angle of the bend 423-1 of each guide plate 423 decreases sequentially. That is, the bending angle of the bend 423-1 of different guide plates 423 is different, such as... Figure 5 The bending angle α varies depending on the location of the outlet 412. The closer the outlet 412 is to the inlet 411, the larger the bending angle α of the corresponding bend portion 423-1 of the guide plate 423.

[0111] Specifically, through the aforementioned configuration of the inlet manifold assembly 400, a gradually changing flow channel 413 structure is designed inside the distribution manifold assembly. Firstly, a flow velocity distribution zone A is designed at the inlet 411 of the housing 410. In this zone, the high-velocity cooling medium flow slows down and changes direction upon encountering an obstacle, flowing towards the two side flow channels 413. This design effectively reduces the impact force of the cooling medium at the inlet 411, preventing excessive velocity differences in the cooling medium within the flow channels 413, thus avoiding uneven distribution. Secondly, the inlet manifold assembly 400 employs a multi-layer flow channel 413 design. The evenly distributed cooling medium enters the velocity development zone B through each flow channel 413. This design increases the cooling medium's velocity distribution. The design reduces the number of channels and layers for the cooling medium flow, slowing down the flow rate and preventing excessively high or low flow rates in certain areas. Simultaneously, a velocity diffusion zone C is designed downstream of the flow channel 413. In this zone, the bending angle of the guide plate 423 corresponding to each flow channel 413 varies, with the bending angle decreasing further away from the inlet 411. This is because the velocity development zone B, further from the inlet 411, is longer, allowing for more complete fluid development and requiring a smaller bending radius to reduce turbulence. This design alters the flow direction and velocity of the cooling medium within each flow channel 413, resulting in a more uniform flow rate and reduced turbulence. This ensures a balanced flow rate for each first cold plate 110. Through this design, a gradually depressurizing flow channel 413 structure is formed at both the inlet 411 and outlet 412 of the housing 410 of the inlet manifold assembly 400. This effectively reduces the impact force and turbulence of the cooling medium, allowing it to flow smoothly and ensuring uniform flow rate.

[0112] In some embodiments, the number of flow-diverting obstructions 422 is the same as the number of flow guides 423, and they are arranged in a one-to-one correspondence. The flow-diverting obstructions 422 are located on the side of the flow guide 423 near the inlet 411. The side of each flow guide 423 near the inlet 411 is flush with the side of each flow-diverting obstruction 422, and the flow-diverting obstructions 422 and the flow guide 423 are spaced apart. That is to say, the side of each flow guide 423 near the inlet 411 is flush with the side of each flow-diverting obstruction 422. This arrangement is to ensure a stable flow rate of the cooling medium. The spaced arrangement of the flow-diverting obstructions 422 and the flow guide 423 provides sufficient space for the flow of the cooling medium, ensuring that the cooling medium can smoothly enter the flow channel 413.

[0113] In some embodiments, the first cold plate 110 and the first heating element 11 are both disposed perpendicular to the motherboard 30, and the second cold plate 120 and the second heating element 12 are both disposed parallel to the motherboard 30. Specifically, the first heating element 11 can be a plug-in component, such as a CPU. Figure 3-1 As shown, or GPU, such as Figure 3-2 As shown, the second heating element 12 can be a switching element, such as a switch element; the first heating element 11 is vertically inserted into the motherboard 30 inside the chassis 20 of the electronic device, and the second heating element 12 is horizontally laid on the motherboard 30. By installing the first cold plate 110 perpendicular to the motherboard 30, space can be saved and the heat conduction area with the first heating element 11 can be increased, thereby improving the heat conduction efficiency.

[0114] In some implementations, such as Figure 1 As shown, the system also includes a fixed bracket 800, a flow pump 220, an inlet manifold assembly 400, a return manifold assembly 500, a heat exchange component 600, and a fan module 700, all mounted on the fixed bracket 800. The heat exchange component 600 is spaced apart from the fixed bracket 800 to form a space for the fan module 700, the flow pump 220, and the inlet manifold assembly 400. Specifically, the inlet manifold assembly 400 and the return manifold assembly 500 are mounted inside the electronic equipment chassis 20 using screws and the fixed bracket 800. Quick-release connectors 321 are welded to each inlet 411 and outlet 412 of the inlet manifold assembly 400 and the return manifold assembly 500. The quick-release connectors 321 include a male quick-connect and a female quick-connect. The male quick-connect is oriented directly towards the female quick-connect of the liquid cooling pipe 300. The male and female quick-connects can be quickly inserted and removed without leakage, improving assembly efficiency.

[0115] In some implementation methods, please refer to Figure 4-1The liquid storage component 210 is located on the side of the fixed bracket 800 away from the heat exchange component 600, and the flow pump 220 is located on the side of the fixed bracket 800 close to the liquid storage component 210. The inlet 601 and outlet of the heat exchange component are both located on the side of the heat exchange component 600 close to the flow pump 220. The liquid cooling main pipe 310 includes a main pipe connection section for communicating with the outlet 121 of the second cold plate. The main pipe connection section and the liquid storage component 210 are respectively located on the left and right sides of the liquid cooling branch pipe 320 along the first direction, and the liquid storage component 210 is arranged close to the first cold plate 110. This arrangement can store the liquid... The liquid component 210 and the main pipe connection section are located on both sides of the liquid cooling branch pipe 320, that is, on both sides of the main board 30, which can make fuller use of the space inside the chassis 20 and make the structure more compact. The main pipe connection section can be a section of liquid cooling main pipe 310 connected to the inlet of the second cold plate 120, or it can be a section of liquid cooling main pipe 310 connected to the liquid outlet 121 of the second cold plate. Furthermore, the bottom of the fixed bracket 800 is provided with an assembly plate for detachable connection with the chassis 20. The assembly plate and the chassis 20 can be bolted together to ensure the stability of the fixed bracket 800.

[0116] In some implementations, the flow pump 220 drives the circulation of the cooling medium within the liquid cooling pipeline 300, ensuring continuous heat absorption and transfer. The flow rate of the cooling medium can be adjusted to meet the varying heat dissipation requirements of the electronic device. Compared to electronic devices in related technologies that rely on external CDU devices, the flow pump 220 can be integrated within the electronic device to power the cooling circulation, facilitating integrated design and a more compact structure. The flow pump 220 is mounted inside the electronic device chassis 20 using screws and mounting brackets 800, positioned close to the liquid cooling manifold 310 of the liquid cooling system to minimize resistance to the cooling medium flow and improve circulation efficiency. The outlet of the flow pump 220 is connected to the inlet of the inlet manifold assembly 400 via a pipeline, and the inlet of the flow pump 220 is connected to the outlet of the liquid storage component 210 via a pipeline.

[0117] In some embodiments, the liquid storage component 210 is used to store the cooling medium required to replenish the cold plate 100, serving as a backup cooling medium source for the liquid cooling pipeline 300. This prevents insufficient cooling medium in the pipeline due to leakage or evaporation of the cooling medium. The liquid storage component 210 can be a liquid storage tank, with its inlet designed above the tank in the direction of gravity and connected to the outlet 602 of the heat exchange component via a pipeline. The outlet is designed below the tank in the direction of gravity and connected to the inlet of the flow pump 220 via a pipeline. Under the influence of gravity, the flow pump 220 can ensure that there is always sufficient cooling medium pumped out. At the same time, a liquid level sensor is designed inside the liquid storage component 210. The liquid level sensor communicates with the control system 910 on the main board 30 of the electronic device to monitor the cooling medium level in the liquid storage component 210 in real time, ensuring that the cooling medium in the liquid storage component 210 is replenished in a timely manner, and avoiding a decrease in the system's heat dissipation performance due to insufficient cooling medium.

[0118] In some implementations, the fan module 700 primarily cools the high-temperature cooling medium entering the heat exchange component 600 through forced convection. The cooled low-temperature cooling medium is then pumped back to each cold plate 100 for heat dissipation circulation by the flow pump 220. It is mounted inside the chassis 20 using screws and mounting brackets 800, with the air outlet directly facing the copper tube finned heat exchanger of the heat exchange component 600. Simultaneously, the fan module 700 can also provide heat dissipation for some small heat-generating components 10 inside electronic devices that cannot be mounted on cold plates 100 due to their small size. Aluminum heat sinks are installed on these smaller heat-generating components 10, utilizing the excellent thermal conductivity of aluminum to conduct the heat generated by the heat-generating components 10, such as the CPU, LED heat-generating components 10, and power semiconductors, to the heat exchange component 600. The heat exchange component 600 then increases the contact area with the air, for example through fin design, and dissipates the heat into the environment through natural convection or forced fan airflow to enhance air cooling. In order to achieve intelligent control of the fan module 700, the fan module 700 communicates with the control system 910 on the electronic device motherboard 30 through a cable connector to realize automatic adjustment of the fan module 700 speed and achieve intelligent heat dissipation management.

[0119] In some embodiments, the heat exchanger 600 is a key heat dissipation component in the liquid cooling system. It is made of multiple sets of horizontally and vertically distributed copper tubes and fins. After a high-temperature cooling medium flows into the copper tubes, it transfers heat to the fins welded to them. Under the action of the fan module 700, the heat in the heat dissipation system is dissipated to the external environment through forced convection. The heat exchanger 600 is installed at the air outlet of the electronic equipment chassis 20 to ensure sufficient airflow space. Its liquid inlet is connected to the liquid outlet of the return manifold assembly 500 through a pipe, and its liquid outlet is connected to the liquid inlet of the liquid storage component 210 through a pipe.

[0120] In some implementations, such as Figure 7 As shown, it also includes a temperature detection component 920 and a control system 910. The temperature detection component 920 is used to detect the temperature of the heating element 10. When there are multiple heating elements 10, there should also be multiple temperature detection components 920, with each temperature detection component 920 corresponding to a heating element 10. The control system 910 is used to adjust the flow rate of the flow pump 220 and the speed of the fan module 700 based on the difference between the temperature of the heating element 10 and the target temperature. Specifically, the control system 910 is used to monitor the temperature of each heating element 10 inside the electronic device in real time, and automatically adjust the operating parameters of the fan module 700 and the flow pump 220 through data analysis to ensure the stable operation and safety of the electronic device under various loads and environmental conditions. The control system 910 may include CPLD (Complex Programmable Logic Device) components and BMC (Baseboard Management) components. The controller (baseboard management controller) component, after receiving the sensor signal, performs logical judgment and sends adjustment commands to the cooling fan module 700 and the flow pump 220, thereby realizing intelligent control of the entire cooling system. At the same time, it triggers an alarm shutdown when an abnormality is detected in the system. The temperature sensor is mainly used to monitor the temperature of each heat-generating component 10 of the electronic device in real time and transmit the signal to the latter. Both the heat-generating component 10 and the temperature sensor are distributed on the motherboard 30 of the electronic device.

[0121] In some embodiments, a leakage detection component 930, such as a leakage sensor, is also included. The leakage detection component 930 is disposed on the liquid cooling pipeline 300 and is used to detect whether the liquid cooling pipeline 300 is leaking. The control system 910 is connected to the leakage detection component 930 and is also used to issue a leakage signal when the liquid cooling pipeline 300 is leaking. The setting of the leakage detection component 930 can ensure the safe operation of the electronic equipment. The leakage detection component 930 can monitor the leakage of the liquid cooling pipeline 300 in real time and stop the operation of the electronic equipment at any time when leakage is detected, so as to avoid damage to the internal components of the electronic equipment.

[0122] In some embodiments, a liquid level detection component 940, such as a liquid level sensor, is also included. The liquid level detection component 940 is installed inside the liquid storage component 210 and is used to acquire the liquid level value inside the liquid storage component 210. The control system 910 is connected to the liquid level detection component 940 and is also used to issue a liquid replenishment signal when the liquid level value inside the liquid storage component 210 is less than the liquid level alarm threshold. Specifically, the control system 910 is used to monitor the leakage of the liquid cooling pipeline 300 and the liquid level inside the liquid storage component 210 in real time. When system leakage or low liquid level is detected, an alarm log is triggered to ensure the stable operation of electronic equipment and equipment safety under various load and environmental conditions. The leakage detection component 930 and the liquid level sensor communicate with the motherboard 30 via cables.

[0123] In some embodiments, the control system 910 includes an acquisition unit, a calculation unit, a judgment unit, and an execution unit; the acquisition unit is connected to the temperature detection component 920 and is used to acquire the temperature of the heating element 10; the calculation unit is used to calculate the difference between the temperature of the heating element 10 and the target temperature; the judgment unit is used to determine whether the temperature of any heating element 10 is between a corresponding first temperature alarm threshold and a second temperature alarm threshold, and is also used to determine whether the temperature of any heating element 10 is greater than or equal to the corresponding second temperature alarm threshold; the execution unit is used to adjust the flow rate of the flow pump 220 and the rotation speed of the fan module 700 according to the difference between the temperature of the heating element 10 and the target temperature, and is also used to adjust the flow rate of any heating element 10. When the temperature of heating element 10 is between the corresponding first temperature alarm threshold and the second temperature alarm threshold, an alarm signal is issued. It is also used to control each heating element 10 to stop operating when the temperature of any heating element 10 is greater than or equal to the corresponding second temperature alarm threshold. Furthermore, the acquisition unit is also used to acquire the detection results of the leakage detection component 930 and the detection results of the liquid level detection component 940. The execution unit is also used to control each heating element 10 to stop operating when the liquid cooling pipeline 300 leaks or when the liquid level in the liquid storage component 210 is less than the liquid level alarm threshold. Specifically, the heating element 10 can be stopped by powering off the electronic equipment to avoid damage to the heating element 10 and the control system 910.

[0124] In some embodiments, the motherboard 30 is provided with multiple slots for connecting the first heating element 11. The number of first cold plates 110, the number of slots, and the number of liquid cooling branch pipes 320 are all the same and are configured one-to-one. Furthermore, it also includes several electrically controlled valves, each corresponding to a liquid cooling branch pipe 320. The control system 910 is also used to acquire the target slot connected to the first heating element 11, determine the target liquid cooling branch pipe 320 based on the position of the target slot, and open the corresponding electrically controlled valve based on the position of the target liquid cooling branch pipe 320. Specifically, not every slot is connected to the first heating element 11. Therefore, by acquiring the target slot connected to the first heating element 11 through the control system 910, it determines which first cold plate 110 needs to participate in heat dissipation, and then opens the corresponding electrically controlled valve. For first cold plates 110 that do not need cooling, the corresponding electrically controlled valve does not need to be opened, ensuring that the cooling medium can be fully utilized, avoiding waste, and improving the applicability.

[0125] In one specific embodiment, during normal operation of the electronic device, the heat dissipation system coordinates with the intelligent control system to drive the cooling fan module 700 and the flow pump 220 for efficient heat dissipation. Specifically, the low-temperature cooling medium is drawn from the liquid storage component 210 by the flow pump 220 and delivered to the liquid inlet manifold assembly 400 through the liquid cooling pipeline 300. The liquid inlet manifold assembly 400 adopts a precision flow channel 413 design to ensure uniform distribution of the cooling medium, which then enters the first cold plate 110 corresponding to the CPU heat-generating element 10 and the GPU heat-generating element 10, respectively. In the first cold plate 110, the cooling medium undergoes efficient heat exchange with the first heat-generating element 11, absorbing the heat generated by the first heat-generating element 11, and the temperature gradually rises to form a high-temperature cooling medium. These high-temperature cooling media then converge. The liquid returns to the return manifold assembly 500. The return manifold assembly 500 and the inlet manifold assembly 400 can have the same structure, or they can be set according to needs. After reasonable collection, the liquid enters the second cold plate 120 corresponding to the second heating element 12 for secondary heat exchange, further absorbing the heat generated by the second heating element 12, and finally forming a secondary high-temperature cooling medium. The secondary high-temperature cooling medium is then sent to the heat exchange component 600 by the flow pump 220. During this process, the heat is transferred to the copper tube and fins through the efficient heat exchange structure of the heat exchange component 600. The fan module 700 effectively dissipates the heat generated by the heat exchange component 600 to the external environment through the air duct design, thereby turning the secondary high-temperature cooling medium into a low-temperature cooling medium, completing the entire cooling cycle, and returning to the liquid storage component 210 to start the next cycle. Through this liquid cooling cycle, the thermal resistance of the heat-generating element 10 is effectively reduced. Compared with traditional radiator-type air cooling, the heat exchange efficiency between the heat exchange component 600 and the fan module 700 is higher, thus significantly reducing the actual speed of the fan module 700. The entire cooling system is not only low-noise but also highly efficient, meeting the user's operational needs. This cooling system adopts a fully enclosed circulation design, ensuring high reliability and effectively preventing cooling medium leakage. This efficient thermal management solution not only improves the heat dissipation performance of electronic devices but also provides reliable heat dissipation assurance for high-density electronic device computing platforms, ensuring stable and efficient operation of edge electronic devices in indoor user environments.

[0126] In addition to the above-mentioned heat dissipation system, the present invention also provides a heat dissipation method that can be applied to the above-mentioned heat dissipation system.

[0127] Please refer to Figure 8 The heat dissipation method includes the following steps:

[0128] Step S1: Obtain the temperature of the heating element 10, and when the temperature of the heating element 10 is less than or equal to the corresponding target temperature, maintain the flow rate of the flow pump 220 at the target flow rate, and adjust the speed of the fan module 700 according to the difference between the temperature of the heating element 10 and the target temperature; specifically, the control accuracy can be improved by obtaining the temperature of the heating element 10 in real time; of course, the target flow rate should be set such that the flow rate of the flow pump 220 can fill the liquid cooling pipe 300 with cooling medium; the above settings do not require adjustment when the temperature of the heating element 10 is less than or equal to the corresponding target temperature. The flow rate of the flow pump 220 is adjusted to avoid the problem that the liquid cooling pipe 300 cannot be filled with cooling medium when the temperature of the heating element 10 is low. This method can ensure that the liquid cooling pipe 300 is filled with cooling medium, and can also achieve a dual cooling effect by adjusting the flow rate of the flow pump 220 when the fan module 700 cannot meet the requirements even at its maximum speed. Since the flow rate of the flow pump 220 is adjustable, the maximum speed of the fan module 700 does not need to be too high, which makes the noise of the heat dissipation system not too high and effectively reduces noise pollution.

[0129] Step S2: After the temperature of the heating element 10 is higher than the target temperature and maintained for a preset time, the flow rate of the flow pump 220 and the speed of the fan module 700 are adjusted according to the difference between the temperature of the heating element 10 and the target temperature. Specifically, when the temperature of each heating element 10 is lower than its corresponding target temperature, the fan module 700 is adjusted according to PID (Proportional-Integral-Derivative) mode, and the flow pump 220 maintains the initial flow rate. Run, for example, given When the control system 910 detects that the temperature of any one of the heating elements 10 exceeds the corresponding target temperature, and this continues for a preset time (the preset time can be set as needed, for example, 5 minutes), it means that the maximum fan module airflow of 700 and the initial flow rate are maintained. When the heat dissipation system reaches its limit, the flow pump 220 will activate the PID control mode to increase the flow rate, thereby further reducing the temperature of the heat-generating element 10 and maintaining it near the corresponding target temperature.

[0130] In some implementation methods, please refer to Figure 9 It also includes the following steps:

[0131] Step S3: When the temperature of any heating element 10 is between the corresponding first temperature alarm threshold and the second temperature alarm threshold, an alarm signal is issued to remind manual inspection.

[0132] Step S4: When the temperature of any heating element 10 is greater than or equal to the corresponding second temperature alarm threshold, control each heating element 10 to stop operating, record the alarm log, and remind manual inspection. At this time, the electronic equipment enters a high temperature abnormal state; wherein, the target temperature corresponding to the same heating element 10 is less than the first temperature alarm threshold and less than the second temperature alarm threshold.

[0133] It should be noted that the target temperature, first temperature alarm threshold, and second temperature alarm threshold differ for different heat-generating elements 10. When adjusting the flow rate of the flow pump 220 and the speed of the fan module 700, the maximum value of the flow rate of the flow pump 220 and the speed of the fan module 700 calculated for each heat-generating element 10 should be used as the adjustment value. This ensures that the temperature of any heat-generating element 10 does not exceed the corresponding second temperature alarm threshold and can be controlled below the first temperature alarm threshold. Furthermore, temperature warnings can be provided to predict the temperature of the heat-generating elements 10, thereby allowing for advance setting of the adjustment range for the flow pump 220 and the fan module 700. Specifically, through adaptive adjustment, the cooling system not only responds when the temperature reaches the alarm threshold but also performs trend analysis based on historical temperature data to predict potential high-temperature problems and make adaptive adjustments. When the temperature of the heating element 10 exceeds the first alarm threshold, the fan module 700 and the flow pump 220 increase their load and activate the alarm mechanism; when the temperature of the heating element 10 is greater than or equal to the first alarm threshold, a high-temperature shutdown is required, and the heat dissipation system will immediately execute the shutdown command to prevent damage to the electronic equipment.

[0134] In one specific embodiment, the target temperature can be the temperature specification value of the heating element 10 minus 10°C, the first alarm threshold can be the temperature specification value of the heating element 10 minus 4°C, and the second alarm threshold can be the temperature specification value of the heating element 10 minus 2°C. The temperature specification value of the heating element 10 refers to the theoretical operating temperature value of the heating element 10. The heating element 10 should not exceed the temperature specification value during application. Of course, the settings of the target temperature, the first alarm threshold, and the second alarm threshold can also be selected as needed, so that the target temperature, the first alarm threshold, and the second alarm threshold increase sequentially.

[0135] In some embodiments, before step S1, the steps include: detecting the liquid level in the liquid storage component 210 and issuing a liquid replenishment signal when the liquid level is less than or equal to the liquid level alarm threshold; detecting leakage in the liquid cooling pipeline 300 and issuing a leakage signal when leakage occurs in the liquid cooling pipeline 300; controlling each heating element 10 to start when the liquid level is greater than the liquid level alarm threshold and there is no leakage in the liquid cooling pipeline 300; the flow of the cooling medium depends not only on the temperature signal, but should also be adjusted based on factors such as liquid level and heat dissipation performance; by detecting the liquid level in the liquid storage component 210, when the liquid level is less than or equal to the liquid level alarm threshold, the system automatically stops working and reminds manual replenishment of the cooling medium.

[0136] In some embodiments, adjusting the flow rate of the flow pump 220 and the rotational speed of the fan module 700 based on the difference between the temperature of the heating element 10 and the target temperature includes:

[0137] Step S21: Obtain the temperature of the heating element 10 at time t, time t-1, and time t-2;

[0138] Step S22: Based on the temperatures of the heating element 10 at times t, t-1, and t-2, the target temperature, and the flow signal value of the flow pump 220 at time t-1, calculate the flow signal value of the flow pump 220 at time t. Specifically, after calculating the flow signal value of the flow pump 220 at time t, the flow rate of the flow pump 220 at time t can be obtained according to the pre-stored data information and the flow signal value of the flow pump 220 at time t. The flow pump 220 is then adjusted and controlled according to the flow rate of the flow pump 220 at time t. Of course, the flow signal value of the flow pump 220 at time t-1 is determined by obtaining the flow rate of the flow pump 220 at time t-1 and based on the pre-stored data information.

[0139] Step S23: Calculate the rotational speed signal value of the fan module 700 at time t based on the temperatures of the heating element 10 at times t-1 and t-2, the target temperature, and the rotational speed signal value of the fan module 700 at time t-1. Specifically, after obtaining the rotational speed signal value of the fan module 700 at time t, the corresponding rotational speed of the fan module 700 at time t can be obtained based on the pre-stored data information, and the actual adjustment and control of the fan module 700 can be performed based on the rotational speed of the fan module 700 at time t. Of course, the rotational speed signal value of the fan module 700 at time t-1 is determined by obtaining the rotational speed of the fan module 700 at time t-1 and based on the pre-stored data information.

[0140] In some implementations, calculating the flow signal value of the flow pump 220 at time t includes:

[0141] The flow signal value of the flow pump (220) at time t is calculated according to formula (1);

[0142]

[0143] And / or, the calculation of the fan module (700) speed signal value at time t includes:

[0144] The rotational speed signal value of the fan module (700) at time t is calculated according to formula (2);

[0145]

[0146] in:

[0147] : The speed signal value of the fan module (700) at time t, dimensionless;

[0148] : The speed signal value of the fan module (700) at time t-1, dimensionless;

[0149] : The flow signal value of the flow pump (220) at time t, dimensionless;

[0150] : The flow signal value of the flow pump (220) at time t-1, dimensionless;

[0151] Target temperature, dimensionless;

[0152] : The temperature of the heating element (10) at time t, dimensionless;

[0153] : The temperature of the heating element (10) at time t-1, dimensionless;

[0154] : The temperature of the heating element (10) at time t-2, dimensionless;

[0155] , , It is a constant.

[0156] Using the above formulas (1) and (2), the flow rate of the flow pump 220 can be quickly and accurately adjusted, and the speed of the fan module 700 can be adjusted. For example, the initial flow rate of the flow pump 220 can be adjusted. 2.1 L / min; K p= 5, K i = 0.1, K d =0.3, by obtaining the temperature of the heating element 10, we can substitute it into formula (1) and formula (2).

[0157] Specifically, in one embodiment, after the electronic device is powered on, the CPLD element of the control system 910 first starts working, controlling the fan module 700 and the flow pump 220 to operate at approximately 50% power or load. At this time, the electronic device has not yet entered the operating system. The control system 910 acquires signals from the leakage detection component 930 and the liquid level detection component 940 in real time and analyzes and judges them. If the control system 910 detects a leakage signal, the electronic device needs to be manually powered off and the leakage location needs to be located for repair. After the repair is completed, the electronic device is restarted and the intelligent control system is tested again. If no leakage is found, a power-on command is issued to start the operating system. If the intelligent control system 910 detects a signal that the liquid level in the liquid storage component 210 is insufficient, the electronic device needs to be manually powered off and the liquid storage component 210 needs to be replenished. After the replenishment is completed, the electronic device is restarted and the intelligent control system is tested. After confirming that there is no leakage and the liquid level meets the requirements, the control system 910 will send a power-on command to start the operating system. At this time, the BMC element of the control system 910 will acquire the temperature signal of each heating element 10, the liquid level signal in the liquid storage component 210, the flow signal of the flow pump 220, and the speed signal of the fan module 700 in real time, and perform adaptive PID control based on the above feedback signals. Under the premise of meeting the cooling requirements, the speed of the fan module 700 can be reduced as much as possible, and the flow of the flow pump 220 can be appropriately increased, thereby maximizing the reduction of noise, saving energy, and ensuring the normal operation of electronic equipment.

[0158] For a description of the features in the embodiment corresponding to the heat dissipation method, please refer to the relevant description of the embodiment corresponding to the heat dissipation system, which will not be repeated here.

[0159] Embodiments of this application also provide an electronic device, including a memory and a processor, wherein the memory stores a computer program and the processor is configured to run the computer program to perform the steps in any of the above-described heat dissipation method embodiments.

[0160] Embodiments of this application also provide a computer-readable storage medium storing a computer program, wherein the computer program is configured to execute the steps in any of the above-described heat dissipation method embodiments when it is run.

[0161] In one exemplary embodiment, the aforementioned computer-readable storage medium may include, but is not limited to, various media capable of storing computer programs, such as a USB flash drive, read-only memory (ROM), random access memory (RAM), portable hard disk, magnetic disk, or optical disk.

[0162] Embodiments of this application also provide a computer program product, which includes a computer program that, when executed by a processor, implements the steps in any of the above-described heat dissipation method embodiments.

[0163] Embodiments of this application also provide another computer program product, including a non-volatile computer-readable storage medium storing a computer program, which, when executed by a processor, implements the steps in any of the above-described heat dissipation method embodiments.

[0164] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0165] The electronic device, heat dissipation method, and computer-readable storage medium provided by the present invention have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of the present invention. It should be noted that those skilled in the art can make various improvements and modifications to the present invention without departing from its principles, and these improvements and modifications also fall within the protection scope of the present invention.

Claims

1. An electronic device, comprising: Includes a chassis (20) and at least one heat dissipation system disposed within the chassis; the heat dissipation system includes: The cold plate (100) includes a first cold plate (110) and a second cold plate (120), wherein the first cold plate (110) is arranged perpendicular to the main board (30) and the second cold plate (120) is arranged parallel to the main board (30); The liquid storage component (210), the flow pump (220), and the liquid cooling pipeline (300) are provided. The liquid storage component (210) is used to store the cooling medium. The liquid storage component (210) and the flow pump (220) are both connected to the liquid cooling pipeline (300). The flow pump (220) is used to drive the cooling medium to circulate along the liquid cooling pipeline (300). A return manifold assembly (500) is connected to the liquid cooling pipeline (300). The liquid outlet of the first cold plate (110) and the liquid inlet of the return manifold assembly (500) are flush with each other in the extension direction of the main board (30). The liquid outlet of the return manifold assembly (500) is connected to the liquid inlet (122) of the second cold plate. Furthermore, the liquid storage component (210) and the liquid inlet (122) of the second cold plate are arranged along the first direction and are respectively located on both sides of the main board (30). A liquid inlet manifold assembly (400) is connected to the liquid cooling pipeline (300), and the liquid outlet of the liquid inlet manifold assembly (400) is connected to the liquid inlet of the first cold plate (110). The liquid inlet manifold assembly (400) includes a housing (410) and a flow guiding component (420) disposed in the housing (410). The periphery of the housing (410) is provided with an inlet (411) and a plurality of outlets (412). The interior of the housing (410) is provided with a plurality of flow channels (413). Furthermore, a flow velocity distribution area (A) is provided inside the housing (410) between the inlet (411) and the flow channel (413), and the flow guiding component (420) is disposed within the flow velocity distribution area (A); The flow guiding component (420) includes an inclined blocking component (421) and a flow diversion blocking component (422). The inclined blocking component (421) is disposed near the inlet (411), and the flow diversion blocking component (422) is disposed near the flow channel (413). There are at least two inclined blocking components (421), which are respectively located on both sides of the inlet (411). The inclined blocking component (421) is inclined from the side near the inlet (411) to the side near the flow channel (413) towards the left and right sides of the flow velocity distribution area (A). There are multiple flow diversion blocking components (422), and each flow diversion blocking component (422) is disposed at intervals. The extension direction of the flow diversion blocking component (422) is parallel to the arrangement direction of each flow channel (413).

2. The electronic device of claim 1, wherein, The height of the liquid outlet of the inlet manifold assembly (400) is higher than the height of the liquid inlet of the first cold plate (110).

3. The electronic device of claim 2, wherein, Also includes: A heat exchange component (600) is used to cool the cooling medium, and the heat exchange component (600) is connected to the return manifold assembly (500); A fan module (700), the inlet manifold assembly (400), the return manifold assembly (500), and the flow pump (220) are all disposed on the side of the heat exchange component (600) near the cold plate (100); the fan module (700) and the inlet manifold assembly (400) are arranged longitudinally, and the fan module (700) and the return manifold assembly (500) are arranged transversely; the fan module (700) is located between the heat exchange component (600) and the return manifold assembly (500), and the airflow direction of the fan module (700) is towards the heat exchange component (600).

4. The electronic device of claim 3, wherein, The chassis (20) is provided with a plurality of heat dissipation areas, each corresponding to a heat dissipation system. Each heat dissipation area includes a cooling area (P1), a confluence area (P2), and a liquid storage area (P3). The cooling area (P1) and the liquid storage area (P3) are arranged along a first direction and are adjacent to each other. The cooling area (P1) and the liquid storage area (P3) are located on the same side of the confluence area (P2) along a second direction, and the first direction is perpendicular to the second direction. Furthermore, the inlet manifold assembly (400), the return manifold assembly (500), the heat exchange component (600), and the fan module (700) are all located in the confluence area (P2), the liquid storage component (210) and the flow pump (220) are located in the liquid storage area (P3), and the first cold plate (110) and the second cold plate (120) are located in the cooling area (P1).

5. The electronic device according to claim 4, characterized in that, The heat dissipation area is a square area, and the heat dissipation area also includes a power supply area (P4). The heat dissipation system also includes a power supply compartment (950), and the power supply compartment (950) is located in the power supply area (P4). The power supply area (P4) and the liquid storage area (P3) are arranged along the second direction. The liquid storage area (P3) is located close to the confluence area (P2). The sum of the lengths of the power supply area (P4) and the liquid storage area (P3) along the second direction is the same as the length of the cooling area (P1) along the second direction. The sum of the widths of the liquid storage area (P3) and the cooling area (P1) along the first direction is the same as the width of the confluence area (P2) along the first direction.

6. The electronic device according to claim 3, characterized in that, The first cold plate (110) is used to absorb the heat emitted by the first heating element (11), and the second cold plate (120) is used to absorb the heat emitted by the second heating element (12); the outlet of the liquid storage component (210), the inlet of the flow pump (220), and the inlet of the liquid inlet manifold assembly (400) are connected in sequence, and the outlet of the liquid inlet manifold assembly (400) is connected to the inlet of the first cold plate (110), and the outlet of the first cold plate (110) is connected to the inlet of the first cold plate (110). The outlet of the return manifold assembly (500) is connected to the inlet of the return manifold assembly (500), the outlet of the return manifold assembly (500) is connected to the inlet (122) of the second cold plate, the outlet (121) of the second cold plate is connected to the inlet (601) of the heat exchange component, and the outlet (602) of the heat exchange component is connected to the inlet of the liquid storage component (210); wherein, the power of the second heating element (12) is less than the power of the first heating element (11).

7. The electronic device according to claim 3, characterized in that, The inlet and outlet of the first cold plate (110) are arranged along a third direction, the inlet of the inlet manifold assembly (400) and the outlet of the return manifold assembly (500) are arranged along the third direction, and the inlet and outlet of the first cold plate (110), the inlet of the inlet manifold assembly (400) and the outlet of the return manifold assembly (500) are located in the same plane; the first direction, the second direction and the third direction are perpendicular to each other.

8. The electronic device according to claim 3, characterized in that, The liquid cooling pipeline (300) includes a liquid cooling main pipe (310) and a plurality of liquid cooling branch pipes (320). The liquid inlet manifold assembly (400) is disposed between the liquid inlet of each of the liquid cooling branch pipes (320) and the liquid cooling main pipe (310). The liquid cooling branch pipes (320) are connected to the first cold plate (110) in a one-to-one correspondence. The liquid storage component (210) and the flow pump (220) are both connected to the liquid cooling main pipe (310). The liquid cooling main pipe (310) is connected to the inlet (411), and the flow channel (413), the outlet (412) and the liquid cooling branch pipe (320) are connected one-to-one; the flow guiding component (420) is used to divert the cooling medium so that the cooling medium is diverted to each of the flow channels (413).

9. The electronic device according to claim 8, characterized in that, The inlet manifold assembly (400) further includes a plurality of guide plates (423), which are located between adjacent flow channels (413) to separate each flow channel (413). The guide plates (423) extend from the side near the inlet (411) to the side away from the inlet (411). A bend (423-1) is provided on the side of the guide plate (423) away from the inlet (411). Furthermore, from the side near the inlet (411) to the side away from the inlet (411), the bending angle of the bend (423-1) of each guide plate (423) decreases sequentially.

10. The electronic device according to claim 3, characterized in that, It also includes a fixed bracket (800), on which the flow pump (220), the inlet manifold assembly (400), the return manifold assembly (500), the heat exchange component (600) and the fan module (700) are all mounted. The heat exchange component (600) is spaced apart from the fixed bracket (800) to form a receiving space for the fan module (700), the flow pump (220) and the inlet manifold assembly (400).

11. The electronic device according to claim 10, characterized in that, The liquid storage component (210) is located on the side of the fixed bracket (800) away from the heat exchange component (600), the flow pump (220) is located on the side of the fixed bracket (800) close to the liquid storage component (210), and the liquid inlet (601) and liquid outlet of the heat exchange component are both located on the side of the heat exchange component (600) close to the flow pump (220).

12. The electronic device according to any one of claims 3 to 11, characterized in that, Also includes: Temperature detection component (920) is used to detect the temperature of heating element (10); The control system (910) is used to adjust the flow rate of the flow pump (220) and the rotation speed of the fan module (700) according to the difference between the temperature of the heating element (10) and the target temperature.

13. The electronic device according to claim 12, characterized in that, It also includes a leakage detection component (930), which is disposed on the liquid cooling pipeline (300) and is used to detect whether the liquid cooling pipeline (300) is leaking; the control system (910) is connected to the leakage detection component (930) and is also used to issue a leakage signal when the liquid cooling pipeline (300) is leaking; And / or, it also includes a liquid level detection component (940) for acquiring the liquid level value in the liquid storage component (210); the control system (910) is connected to the liquid level detection component (940), and the control system (910) is also used to issue a liquid replenishment signal when the liquid level value in the liquid storage component (210) is less than the liquid level alarm threshold.

14. A heat dissipation method, applied to an electronic device as described in any one of claims 3 to 13, characterized in that, Includes the following steps: The temperature of the heating element (10) is obtained, and when the temperature of the heating element (10) is less than or equal to the corresponding target temperature, the flow rate of the flow pump (220) is kept at the target flow rate, and the speed of the fan module (700) is adjusted according to the difference between the temperature of the heating element (10) and the target temperature. After the temperature of the heating element (10) is greater than the target temperature and is maintained for a preset time, the flow rate of the flow pump (220) and the rotation speed of the fan module (700) are adjusted according to the difference between the temperature of the heating element (10) and the target temperature.

15. The heat dissipation method according to claim 14, characterized in that, It also includes the following steps: An alarm signal is issued when the temperature of any of the heating elements (10) is between the corresponding first temperature alarm threshold and the second temperature alarm threshold; When the temperature of any of the heating elements (10) is greater than or equal to the corresponding second temperature alarm threshold, control each of the heating elements (10) to stop operating; Wherein, the target temperature corresponding to the same heating element (10) is less than the first temperature alarm threshold and less than the second temperature alarm threshold.

16. The heat dissipation method according to claim 14, characterized in that, It also includes the following steps: The liquid level in the liquid storage component (210) is detected, and a liquid replenishment signal is issued when the liquid level is less than or equal to the liquid level alarm threshold. Detect the leakage of the liquid cooling pipeline (300) and issue a leakage signal when leakage occurs in the liquid cooling pipeline (300); When the liquid level is greater than the liquid level alarm threshold and there is no leakage in the liquid cooling pipeline (300), the heating elements (10) are activated.

17. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program, wherein the computer program, when executed by a processor, implements the steps of the heat dissipation method as described in any one of claims 14 to 16.

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