An anti-interference superconductive composite film and a preparation method thereof

CN120656784BActive Publication Date: 2026-06-05JIANGSU TELILAN COATING TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
JIANGSU TELILAN COATING TECH CO LTD
Filing Date
2025-07-11
Publication Date
2026-06-05

AI Technical Summary

Technical Problem

In wireless communication systems, especially in modern communication scenarios involving multiple frequency bands and high power, PIM interference causes signal distortion, decreased receiver sensitivity, and increased bit error rate, affecting data transmission efficiency.

Method used

An anti-interference superconducting composite film structure consisting of a substrate layer, a transition layer, a conductive layer, an anti-PIM interface layer, and an encapsulation layer is adopted. The structure includes a polyimide foam film, a chromium-aluminum metal layer, a copper-graphite composite conductive layer, an amorphous carbon layer, and a silicon nitride layer. An anti-interference superconducting composite film is formed through a specific preparation method.

Benefits of technology

It significantly reduces PIM interference, improves signal transmission quality, enhances conductivity and anti-interference ability, reduces dielectric constant, reduces nonlinear contact, and provides good heat resistance and mechanical properties.

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Abstract

The application relates to the technical field of conductive composite films, and particularly discloses an anti-interference superconductive composite film and a preparation method thereof. First, diamine and dianhydride are used to synthesize polyimide film containing para-arylester and bulky side groups, and the polyimide film is foamed as a base film; then, a chromium-aluminum metal transition layer is deposited on the base film, the adhesion is enhanced, and the diffusion of copper in the conductive layer is prevented; then, a conductive layer composed of copper nanowires and reduced graphene is prepared on the transition layer; finally, an anti-PIM interface layer and an encapsulation layer are prepared on the conductive layer, so that the anti-interference superconductive composite film is formed. The composite film is a non-magnetic material as a whole, has no grain boundary and lattice defects, avoids a nonlinear current path, reduces nonlinear contact, significantly reduces PIM, and avoids PIM interference caused by magnetic impurities.
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