A cooling structure and nanocrystal relay

Abstract

The application discloses a cooling structure and nanocrystalline relay and relates to the technical field of relays.The application comprises a shell, two contacts arranged in the shell, an air inlet pipe, a connecting pipe, a second three-way pipe, a fixing cylinder and a temporary storage cylinder which are arranged on the shell, a heat-conducting glue coated on the surface of the contacts, a heat-conducting plate arranged on the surface of the heat-conducting glue, a cavity arranged in the fixing cylinder, and an elastic diaphragm and a piezoelectric driving chip arranged on the fixing cylinder.In use, the piezoelectric effect is used to drive the flow of gas, and when the key high temperature caused by the breaking of the arc of the contacts is generated, the compressed air stored in advance is automatically released, and the internal airflow channel of the heat-conducting plate which is closely connected with the contacts is forced to flow, so that the heat of the contacts is quickly and efficiently taken away.Compared with the passive heat exchange mode of the conventional heat-conducting material, the active forced convection heat exchange mode has a significantly reduced thermal resistance and a doubled heat transfer efficiency.

Description

Technical Field

[0001] This invention relates to the field of relay technology, specifically to a cooling structure and a nanocrystal relay. Background Technology

[0002] A relay, also known as an electric relay, is an electrical control device that has both a control system and a controlled system. It is commonly used in automatic control circuits. In essence, it is an automatic switch that uses a smaller current to control a larger current. It plays a role in automatic adjustment, safety protection, and circuit switching in the circuit. Nanocrystalline relays use high-permeability nanocrystalline materials as magnetic materials to achieve the transmission of greater magnetic flux with a smaller cross-section. This is the most effective way to achieve high performance, high reliability, and lightweight design. It can give relays high power density, high surge current resistance, high mechanical strength, and fast response capability.

[0003] When the relay disconnects the load current, the contacts heat up due to the generation of an electric arc. The electric arc is a high-temperature plasma, which can easily melt, vaporize, or severely ablate the surface metal of the contacts, leading to contact deformation, material transfer, increased surface roughness, and the formation of oxide layers or carbide deposits. To ensure the performance of the relay, guarantee its reliable operation, extend its lifespan, and prevent failures, a cooling structure is usually used to cool the contacts. Most existing cooling structures rely solely on thermally conductive materials, making it difficult to establish an effective thermal contact path between the contacts and the cooling surface. To achieve good contact, a thickened thermally conductive pad or a large amount of thermally conductive adhesive is required, which results in low cooling efficiency. Therefore, a cooling structure and a nanocrystalline relay are proposed. Summary of the Invention

[0004] The purpose of this invention is to address the technical problem that most existing cooling structures rely solely on thermally conductive materials, making it difficult to establish an effective thermal contact path between the contacts and the cooling surface. To achieve good contact, thickened thermally conductive pads or large amounts of thermally conductive adhesive are required, which leads to low cooling efficiency. This invention provides a cooling structure and a nanocrystalline relay.

[0005] To achieve the above objectives, the present invention specifically adopts the following technical solution:

[0006] A cooling structure includes a housing with two contacts inside, an inlet pipe, a connecting pipe, a second three-way pipe, and a fixed cylinder and a temporary storage cylinder, both mounted on the housing. The contact surfaces are coated with thermally conductive adhesive, and a heat-conducting plate is mounted on the surface of the thermally conductive adhesive. The fixed cylinder has a cavity, and an elastic film and a piezoelectric drive chip are mounted on the fixed cylinder. The elastic film covers the cavity and has piezoelectric ceramic facing the piezoelectric drive chip on its outer side. The inlet pipe and connecting pipe each have a first one-way valve with opposite conduction directions. One end of the inlet pipe communicates with the cavity, and both ends of the connecting pipe communicate with the cavity and the temporary storage cylinder, respectively. A piston rod is slidably mounted on the temporary storage cylinder, and a return spring is positioned between the piston rod and the piston rod. The temporary storage cylinder is connected to the first three-way pipe, and a solenoid valve is mounted on the first three-way pipe. The heat-conducting plate has an airflow channel, and an inlet pipe and an outlet pipe, both communicating with the airflow channel, are mounted on the heat-conducting plate. The first three-way pipe communicates with the two inlet pipes, and the two outlet pipes communicate with the second three-way pipe.

[0007] Furthermore, the airflow channel includes multiple air passages that are sequentially connected and form a labyrinthine structure.

[0008] Furthermore, the inner wall of the airflow channel is constructed with a plurality of alternating hemispherical protrusions and hemispherical depressions.

[0009] Furthermore, the first tee pipe and the inlet pipe are connected by a flexible silicone tube.

[0010] Furthermore, the free end of the air intake pipe is connected to an air intake cylinder, and a filter screen is provided at the inlet of the air intake cylinder.

[0011] Furthermore, the air intake cylinder is provided with a backflush cylinder facing the inside of the filter screen, and the free end of the second three-way pipe is connected to the backflush cylinder.

[0012] Furthermore, a heat dissipation cylinder is provided on the housing, a heat dissipation plate is provided inside the housing, the heat dissipation cylinder and the cavity are connected by a fixed pipe, a second one-way valve is provided on the fixed pipe, the inner diameter of the fixed pipe is smaller than the diameter of the connecting pipe, and a plurality of heat dissipation columns are provided on the heat dissipation plate, all of which penetrate the housing and extend into the heat dissipation cylinder.

[0013] Furthermore, the surface of the heat sink is provided with multiple heat dissipation fins, and both the heat sink and the heat dissipation column are constructed with filling cavities, which are filled with thermally conductive silicone grease.

[0014] Furthermore, the heat dissipation column is constructed in a polygonal prism shape, with adjacent columns of heat dissipation columns staggered.

[0015] Nanocrystalline relay, including the cooling structure described above.

[0016] The beneficial effects of this invention are as follows:

[0017] In use, this invention drives gas flow through the piezoelectric effect and automatically releases pre-stored compressed air at the critical high temperature generated by the contact arc breaking. The compressed air is forced to flow through the internal airflow channel of the heat-conducting plate that is tightly thermally connected to the contact. Compared with the traditional passive heat exchange method that relies solely on heat-conducting materials, this active forced convection heat exchange method significantly reduces thermal resistance and multiplies heat transfer efficiency. It can quickly and efficiently remove heat from the contact, effectively suppressing the contact temperature rise and fundamentally solving the problem of contact overheating, thus making it more practical. Attached Figure Description

[0018] Figure 1 This is a three-dimensional view of the structure of the present invention;

[0019] Figure 2 This is a three-dimensional sectional view of the present invention;

[0020] Figure 3 This is the present invention. Figure 2 Enlarged view of point A in the middle;

[0021] Figure 4 This is the present invention. Figure 2 Enlarged view of point B in the middle;

[0022] Figure 5 This is the present invention. Figure 2 Enlarged view of point C in the middle;

[0023] Figure 6 This is a three-dimensional view of part of the structure of the present invention;

[0024] Figure 7 This is the present invention. Figure 6 A three-dimensional sectional view;

[0025] Figure 8 This is the present invention. Figure 6 Another perspective of a three-dimensional sectional view;

[0026] Figure 9 This is the present invention. Figure 8 Enlarged view of point D in the middle;

[0027] Figure 10 This is the present invention. Figure 6 Another perspective of a three-dimensional sectional view;

[0028] Figure 11 This is the present invention. Figure 10 Enlarged view of point E in the middle.

[0029] Reference numerals: 1. Housing; 2. Contact; 3. Inlet pipe; 4. Connecting pipe; 5. Second tee pipe; 6. Fixing cylinder; 7. Temporary storage cylinder; 8. Thermally conductive adhesive; 9. Thermally conductive plate; 10. Cavity; 11. Elastic film; 12. Piezoelectric drive chip; 13. Piezoelectric ceramic; 14. First one-way valve; 15. Piston rod; 16. Return spring; 17. First tee pipe; 18. Solenoid valve; 19. Airflow channel; 20. Inlet pipe; 21. Outlet pipe; 22. Hemispherical protrusion; 23. Hemispherical depression; 24. Flexible silicone tube; 25. Inlet cylinder; 26. Filter plate; 27. Backflush cylinder; 28. Heat sink cylinder; 29. ​​Heat sink plate; 30. Fixing pipe; 31. Second one-way valve; 32. Heat sink column; 33. Heat sink fins; 34. Filling cavity; 35. Thermally conductive silicone grease. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0031] like Figures 1-11 As shown, a cooling structure proposed in one embodiment of the present invention includes a housing 1, which is the outer shell of a relay. Two contacts 2 are provided inside the housing 1, one of which is stationary and the other is moving.

[0032] The distinguishing technical features of this invention also include: an intake pipe 3, a connecting pipe 4, a second three-way pipe 5, and a fixed cylinder 6 and a temporary storage cylinder 7, both mounted on the housing 1. The fixed cylinder 6 and the temporary storage cylinder 7 are both fixed to the housing 1. The surface of the contact point 2 is coated with thermally conductive adhesive 8, which serves to conduct heat and provide insulation. A thermally conductive plate 9 is mounted on the surface of the thermally conductive adhesive 8 and is fixed to the surface of the thermally conductive adhesive 8. The fixed cylinder 6 has a cavity 10 inside, and an elastic film 11 and a piezoelectric drive chip 12 are mounted on the fixed cylinder 6. All 12 are fixed on the fixed cylinder 6. The elastic film 11 covers the cavity 10 and the piezoelectric ceramic 13 facing the piezoelectric drive chip 12 is arranged on the outside. The piezoelectric ceramic 13 is fixed on the outside of the elastic film 11. The air inlet pipe 3 and the connecting pipe 4 are both provided with a first one-way valve 14 and their conduction directions are opposite. One end of the air inlet pipe 3 is connected to the cavity 10. The two ends of the connecting pipe 4 are connected to the cavity 10 and the temporary storage cylinder 7, respectively. External air can only enter the cavity 10 through the air inlet pipe 3. The air in the cavity 10 enters the connecting pipe 4. The temporary storage cylinder 7 is slidably equipped with A piston rod 15 is provided, and a return spring 16 is provided between the two. The piston rod 15 slides along the length of the temporary storage cylinder 7. The two ends of the return spring 16 are fixedly connected to the piston rod 15 and the temporary storage cylinder 7, respectively. A first three-way pipe 17 is connected to the temporary storage cylinder 7. A solenoid valve 18 is provided on the first three-way pipe 17. The solenoid valve 18 is fixed on the first three-way pipe 17. In this embodiment, the solenoid valve 18 is normally open. When the solenoid valve 18 is energized, it is in a closed state. Conversely, when the power is off, it is in an open state. The piezoelectric drive chip 12 and the solenoid valve 1... All 8 are electrically connected to the control circuit of the relay. When the relay is energized, the piezoelectric drive chip 12 and the solenoid valve 18 are energized together. Conversely, when the relay disconnects the load current, the piezoelectric drive chip 12 and the solenoid valve 18 are de-energized together. The heat-conducting plate 9 has an airflow channel 19. The heat-conducting plate 9 is provided with an inlet pipe 20 and an outlet pipe 21 that are connected to the airflow channel 19. The first three-way pipe 17 is connected to the two inlet pipes 20. The two outlet pipes 21 are connected to the second three-way pipe 5. The free end of the second three-way pipe 5 extends to the outside.

[0033] In the initial state, the relay, piezoelectric drive chip 12, and solenoid valve 18 are all de-energized, the piston rod 15 is in the initial position, and the return spring 16 is in its natural state. When the relay is energized, the piezoelectric drive chip 12 and solenoid valve 18 are energized together, the solenoid valve 18 closes, and an alternating electric field is applied to the piezoelectric ceramic 13 through the piezoelectric drive chip 12. The piezoelectric ceramic 13 undergoes periodic expansion and contraction deformation, converting electrical energy into mechanical vibration. This deformation changes the volume of the cavity 10, creating an intake and exhaust pressure difference. When the volume of the cavity 10 increases, the internal pressure decreases, and external air enters the cavity 10 through the intake pipe 3. When the volume of the cavity 10 decreases, the internal pressure increases, and air enters the storage cylinder 7 through the connecting pipe 4. This process repeats, achieving unidirectional airflow and driving... When the piston rod 15 slides to its limit position, the return spring 16 is stretched, and air is temporarily stored in the storage cylinder 7. Conversely, when the relay disconnects the load current, the two contacts 2 will heat up due to the generation of an electric arc. The piezoelectric drive chip 12 and the solenoid valve 18 are de-energized together, the solenoid valve 18 opens, the return spring 16 returns to its natural state, the piston rod 15 slides to the initial position, and the air stored in the storage cylinder 7 first enters the first three-way pipe 17 and is split into two streams. The two streams of air enter the two airflow channels 19 through the two inlet pipes 20 respectively. The heat of the contacts 2 is conducted to the heat-conducting plate 9 through the thermal conductive adhesive 8. The air passing through the airflow channel 19 will carry away the heat and be discharged through the outlet pipe 21. Then, the air is discharged to the outside through the second three-way pipe 5, thereby cooling the contacts 2 and reducing the temperature of the contacts 2.

[0034] In summary, when in use, this invention drives gas flow through the piezoelectric effect, and automatically releases pre-stored compressed air at the critical high temperature moment when the electric arc is broken at contact 2. The compressed air is forced to flow through the internal airflow channel 19 of the heat-conducting plate 9, which is tightly thermally connected to contact 2. Compared with the traditional passive heat exchange method that relies solely on heat-conducting materials, this active forced convection heat exchange method significantly reduces thermal resistance and multiplies heat transfer efficiency. It can quickly and efficiently remove the heat from contact 2, effectively suppress the temperature rise of contact 2, and fundamentally solve the problem of overheating of contact 2. Therefore, it is more practical.

[0035] like Figure 11 As shown, a further technical solution of the present invention is disclosed, wherein the airflow channel 19 includes a plurality of airways that are connected in sequence and form a labyrinth-shaped structure;

[0036] Referring to the above, when air passes through airflow channel 19, the labyrinthine structure design can increase the heat exchange area, extend the heat exchange time, and further improve the cooling efficiency.

[0037] like Figure 11 As shown, a further technical solution of the present invention is disclosed, wherein the inner wall of the airflow channel 19 is constructed with a plurality of alternating hemispherical protrusions 22 and hemispherical recesses 23.

[0038] Referring to the above, when air passes through the airflow channel 19, it forms a periodically undulating surface by passing through multiple alternating hemispherical protrusions 22 and hemispherical depressions 23. The edges of the hemispherical protrusions 22 generate high-speed peak flow velocities, and the hemispherical depressions 23 induce vortices. The alternating arrangement causes the air velocity distribution to fluctuate but improves the overall uniformity.

[0039] like Figure 9 As shown, a further technical solution of the present invention is disclosed, wherein the first tee pipe 17 and the inlet pipe 20 are connected by a flexible silicone pipe 24:

[0040] Referring to the above, during use, connecting the first tee pipe 17 and the inlet pipe 20 through the flexible silicone tube 24 can eliminate the transmission of mechanical vibration and improve the stability of use.

[0041] like Figures 1-7 As shown, a further technical solution of the present invention is disclosed. The free end of the air intake pipe 3 is connected to an air intake cylinder 25. The air intake cylinder 25 is fixed on the housing 1. A filter screen plate 26 is provided at the inlet of the air intake cylinder 25. The filter screen plate 26 is fixed at the inlet of the air intake cylinder 25.

[0042] Referring to the above, during use, outside air first enters the air intake cylinder 25 and then the air intake pipe 3. During this process, dust and impurities can be filtered through the filter screen 26 to avoid blockage caused by dust and impurities, thereby further improving the stability of use.

[0043] like Figure 7 As shown, a further technical solution of the present invention is disclosed. A backwash cylinder 27 facing the inside of the filter screen plate 26 is provided inside the air intake cylinder 25. The backwash cylinder 27 is fixed inside the air intake cylinder 25, and the outlet of the backwash cylinder 27 faces the inside of the filter screen plate 26. The free end of the second three-way pipe 5 is connected to the backwash cylinder 27.

[0044] Referring to the above, during use, the second three-way pipe 5 discharges air to the backwash cylinder 27, and then the discharged air is used to backwash and clean the filter screen 26 to prevent the filter screen 26 from becoming clogged.

[0045] like Figure 5As shown, a further technical solution of the present invention is disclosed. A heat dissipation cylinder 28 is provided on the housing 1 and the heat dissipation cylinder 28 is fixed on the housing 1. A heat dissipation plate 29 is provided inside the housing 1 and the heat dissipation plate 29 is close to the inner top of the housing 1. The heat dissipation cylinder 28 and the cavity 10 are connected by a fixed pipe 30. A second one-way valve 31 is provided on the fixed pipe 30. The second one-way valve 31 plays a one-way guiding role to prevent external air from entering the cavity 10 through the fixed pipe 30. The inner diameter of the fixed pipe 30 is smaller than the diameter of the connecting pipe 4. A plurality of heat dissipation columns 32 are provided on the heat dissipation plate 29, which all penetrate the housing 1 and extend into the heat dissipation cylinder 28. The two ends of the heat dissipation columns 32 are fixedly connected to the heat dissipation plate 29 and the heat dissipation cylinder 28, respectively.

[0046] Referring to the above, when the relay is powered on, heat is generated inside the housing 1. The heat is conducted to multiple heat dissipation columns 32 through the heat dissipation plate 29, and then to the heat dissipation cylinder 28 through the heat dissipation columns 32. When the volume of the cavity 10 decreases, the internal pressure increases, and a small amount of air enters the heat dissipation cylinder 28 through the fixed pipe 30. The accelerated airflow carries away the heat in the heat dissipation cylinder 28, thereby cooling the inside of the housing 1 and further improving the cooling efficiency.

[0047] like Figure 5 As shown, a further technical solution of the present invention is disclosed. The surface of the heat sink 29 is provided with a plurality of heat sink fins 33. The plurality of heat sink fins 33 are all fixed on the surface of the heat sink 29 and are evenly distributed. Both the heat sink 29 and the heat sink column 32 are constructed with filling cavities 34. The filling cavities 34 are filled with thermally conductive silicone grease 35. The thermally conductive silicone grease 35 is a thermally conductive silicone grease composite made of organosilicone as the main raw material and adding materials with excellent heat resistance and thermal conductivity. It is a high thermal conductivity insulating organosilicone material with excellent thermal conductivity.

[0048] Referring to the above, during use, the design of multiple heat dissipation fins 33 can increase the heat exchange area and improve the heat conduction efficiency. Through the combined effect of the filling cavity 34 and the thermal grease 35, the heat conduction efficiency is further improved, thereby further improving the cooling efficiency.

[0049] like Figure 5 As shown, a further technical solution of the present invention is disclosed, wherein the heat dissipation column 32 is constructed in the shape of a polygonal prism, and adjacent columns of heat dissipation columns 32 are staggered.

[0050] Referring to the above, in use, the design of the polygonal heat dissipation column 32 can increase the heat exchange area between the air and the heat dissipation column 32. The staggered distribution of two adjacent columns of heat dissipation column 32 can avoid the obstruction between the two adjacent columns of heat dissipation column 32, making the air flow smoother and further improving the cooling efficiency.

[0051] Nanocrystalline relay, including the cooling structure described above.

[0052] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A cooling structure comprising a housing (1) having two contacts (2) disposed within the housing (1), characterized in that, It also includes an air inlet pipe (3), a connecting pipe (4), a second three-way pipe (5), and a fixed cylinder (6) and a temporary storage cylinder (7) both mounted on the housing (1). The surface of the contact point (2) is coated with thermally conductive adhesive (8), and a heat-conducting plate (9) is provided on the surface of the thermally conductive adhesive (8). The fixed cylinder (6) has a cavity (10) inside. An elastic film (11) and a piezoelectric drive chip (12) are provided on the fixed cylinder (6). The elastic film (11) covers the cavity (10) and a piezoelectric ceramic (13) facing the piezoelectric drive chip (12) is provided on the outside. The air inlet pipe (3) and the connecting pipe (4) are both provided with a first one-way valve (14) and their conduction directions are opposite. One end of the air inlet pipe (3) is connected to the cavity (10), and the two ends of the connecting pipe (4) are connected to the cavity (10) and the temporary storage cylinder (7), respectively. The temporary storage cylinder (7) is connected to a piston rod (15) which is slidably arranged on it and a return spring (16) is arranged between them. The temporary storage cylinder (7) is connected to a first three-way pipe (17). The first three-way pipe (17) is equipped with a solenoid valve (18). The heat-conducting plate (9) is constructed with an airflow channel (19). The heat-conducting plate (9) is equipped with an inlet pipe (20) and an outlet pipe (21) that are both connected to the airflow channel (19). The first three-way pipe (17) is connected to the two inlet pipes (20), and the two outlet pipes (21) are both connected to the second three-way pipe (5). The gas flows through the piezoelectric effect and automatically releases the pre-stored compressed air at the critical high temperature moment when the contact (2) breaks the electric arc. The compressed air is forced to flow through the airflow channel (19) inside the heat-conducting plate (9) which is tightly thermally connected to the contact (2).

2. The cooling structure according to claim 1, characterized in that, The airflow channel (19) includes multiple airways that are connected in sequence and form a labyrinth-like structure.

3. The cooling structure according to claim 1, characterized in that, The inner wall of the airflow channel (19) is constructed with multiple alternating hemispherical protrusions (22) and hemispherical depressions (23).

4. The cooling structure according to claim 1, characterized in that, The first tee pipe (17) and the inlet pipe (20) are connected by a flexible silicone pipe (24).

5. The cooling structure according to claim 1, characterized in that, The free end of the air intake pipe (3) is connected to the air intake cylinder (25), and a filter screen plate (26) is provided at the inlet of the air intake cylinder (25).

6. The cooling structure according to claim 5, characterized in that, The air intake cylinder (25) is provided with a backwash cylinder (27) facing the inside of the filter screen plate (26), and the free end of the second three-way pipe (5) is connected to the backwash cylinder (27).

7. The cooling structure according to claim 1, characterized in that, A heat dissipation cylinder (28) is provided on the housing (1), and a heat dissipation plate (29) is provided inside the housing (1). The heat dissipation cylinder (28) and the cavity (10) are connected by a fixed pipe (30). A second one-way valve (31) is provided on the fixed pipe (30). The inner diameter of the fixed pipe (30) is smaller than the diameter of the connecting pipe (4). A plurality of heat dissipation columns (32) are provided on the heat dissipation plate (29), which all penetrate the housing (1) and extend into the heat dissipation cylinder (28).

8. The cooling structure according to claim 7, characterized in that, The surface of the heat sink (29) is provided with a plurality of heat sink fins (33), and both the heat sink (29) and the heat sink column (32) are constructed with filling cavities (34), and the filling cavities (34) are filled with thermally conductive silicone grease (35).

9. The cooling structure according to claim 7, characterized in that, The heat dissipation column (32) is constructed in a polygonal prism shape, with adjacent columns of heat dissipation columns (32) staggered.

10. A nanocrystalline relay, characterized in that, Includes the cooling structure as described in any one of claims 1-9.

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