An etching device for semiconductor chip production

Abstract

The application relates to the field of semiconductor chip production, and discloses a semiconductor chip production etching device, which comprises a shell mechanism and a recovery mechanism arranged below the shell mechanism, a placing mechanism is arranged in the shell mechanism, the shell mechanism comprises a fixed shell, an arc-shaped connecting shell is fixedly connected to the lower side of the outer side of the fixed shell, an etching liquid injection pipe is fixedly connected to the lower side of the outer side of the fixed shell, and a deionized water inlet pipe is fixedly connected to the upper side of the outer side of the fixed shell. The transverse partition plate and the protruding block structure arranged in the placing barrel keep the chip in a micro-distance suspension state from the bottom of the container, ensure that the etching liquid can contact the chip surface in 360 degrees without dead angle, when the etching liquid is injected from the etching liquid injection pipe, the liquid level slowly rises in the container cavity and completely wraps the chip, the supporting effect of the protruding block avoids the "shielding effect" caused by the direct contact of the chip with the barrel bottom, and thus the quality hidden danger of incomplete etching of the bottom surface is eliminated.

Description

Technical Field

[0001] This invention relates to the field of semiconductor chip manufacturing technology, specifically to an etching apparatus for semiconductor chip manufacturing. Background Technology

[0002] The patent application with publication number CN216528790U includes a housing, an etching chamber, a lifting mechanism, a placement mechanism, a top cover, a valve, a window, and a discharge valve. This invention features a reasonable and simple structure, low production cost, convenient installation, and complete functions. The second motor drives the placement seat to move to the right, exposing the placement slot, allowing the semiconductor chip to be directly placed into the slot, thus improving the convenience of chip removal during etching. The first motor in this application drives the front and rear sliders to synchronously move the placement mechanism downwards, moving the semiconductor chip into the etching liquid for etching, avoiding the inconvenience and trouble of manual movement. The valve in this invention only opens when the semiconductor chip is removed or placed, limiting the release of toxic gases and protecting the health of workers.

[0003] In the aforementioned patents, in most semiconductor chip etching equipment, uneven etching occurs during the semiconductor chip etching process due to the bottom surface contacting the container. Uneven etching of semiconductor chips can lead to a decrease in pattern accuracy, affecting device performance and yield. Residual etching solution can corrode the chip or contaminate subsequent processes. Furthermore, direct discharge of etching waste liquid increases environmental risks and treatment costs, while wasting a large amount of deionized water, reducing production efficiency and sustainability. Summary of the Invention

[0004] The purpose of this invention is to provide an etching apparatus for semiconductor chip manufacturing, so as to solve the problems mentioned in the background art.

[0005] To solve the above-mentioned technical problems, the technical solution of the present invention is: an etching device for semiconductor chip production, comprising a housing mechanism and a recycling mechanism disposed below the housing mechanism, wherein a placement mechanism is disposed inside the housing mechanism, the housing mechanism includes a fixed shell, an arc-shaped connecting shell is fixedly connected to the lower outer side of the fixed shell, an etching solution injection pipe is fixedly connected to the lower outer side of the fixed shell, and a deionized water inlet pipe is fixedly connected to the upper outer side of the fixed shell.

[0006] The placement mechanism includes a placement assembly disposed within a fixed housing. A baffle assembly is disposed on one side of the placement assembly. The placement assembly includes a placement bucket. A connecting element is fixedly disposed on the upper end of the placement bucket. A fixed frame is fixedly connected to the outer side of the placement bucket. A through hole is opened on the side of the placement bucket facing the fixed frame. A baffle is fixedly connected to the fixed frame. A liquid inlet is opened above the baffle. A slot is opened above the placement bucket. The slot and the fixed frame are arranged opposite to each other in the axial direction of the placement bucket. Multiple cavities are opened on the outer side of the placement bucket. Multiple transverse partitions corresponding to the cavities are fixedly connected inside the placement bucket. Multiple protrusions are fixedly disposed above the transverse partitions.

[0007] Preferably, the baffle assembly includes an arc-shaped plate slidably connected in the slot, a handle is fixedly connected above the arc-shaped plate, and multiple vertical water channels are formed on the arc-shaped plate.

[0008] Preferably, a deionized water drain pipe and an etching solution drain pipe are fixedly connected to the outside of the arc-shaped connecting shell, and valves are provided on both the deionized water drain pipe and the etching solution drain pipe.

[0009] Preferably, a connecting bottom shell is fixedly connected to the lower end of the fixed shell, a drive motor is fixedly installed inside the lower part of the connecting bottom shell, a water baffle is fixedly connected inside the upper part of the connecting bottom shell, a stirring blade is fixedly connected to the output end of the drive motor through the water baffle, and multiple drainage holes are opened on the upper part of the outer side of the connecting bottom shell.

[0010] Preferably, a connecting ring is fixedly connected to the lower part of the interior of the fixed shell, and the shape of the through groove inside the connecting ring corresponds to the placement mechanism.

[0011] Preferably, the connecting ring has holes corresponding to the immersion liquid injection pipe.

[0012] Preferably, a baffle plate is fixedly connected to one side of the upper part of the fixed shell where the deionized water inlet pipe is located, and baffle plates are fixedly installed on both sides of the baffle plate.

[0013] Preferably, the recycling mechanism includes a collection component disposed at the bottom of the fixed shell, and a storage component for collecting cleaning fluid is disposed on the outside of the collection component.

[0014] Preferably, the collection assembly includes a connecting shell fixedly connected to the lower end of the fixed shell, the connecting shell being disposed outside the connecting bottom shell, a conical shell fixedly connected to the lower end of the connecting shell, a drain pipe fixedly connected to the lower end of the conical shell, and a drain valve provided on the drain pipe.

[0015] Preferably, the liquid storage assembly includes a liquid storage shell fixedly connected to the lower end of the fixed shell, the liquid storage shell being disposed on the outside of the connecting shell, a fixed support rod fixedly connected to the upper inner wall of the liquid storage shell, the fixed support rod being fixedly connected to the connecting shell, multiple legs fixedly connected to the outside of the liquid storage shell, an injection pipe fixedly connected to the lower outside of the liquid storage shell, a water pump fixedly installed inside the lower part of the liquid storage shell, a connecting pipe fixedly connected to the water pump, and the other end of the connecting pipe being fixedly connected to the injection pipe.

[0016] Compared with the prior art, the technical solution of the present invention has the following advantages:

[0017] (1) A recycling mechanism is set below the housing mechanism, and a placement mechanism is set inside the housing mechanism. This etching device effectively solves the problem of uneven etching caused by the contact of the bottom surface of the semiconductor chip with the container in the traditional etching process through the unique placement mechanism design. Specifically, the horizontal partition and bump structure set in the placement barrel keep the chip suspended at a micro distance from the bottom of the container, ensuring that the etching liquid can contact the chip surface without dead angles in 360°. When the etching liquid is injected from the etching liquid injection pipe, the liquid level rises slowly through the cavity and completely covers the chip. The support of the bump avoids the "shading effect" caused by the chip directly contacting the bottom of the barrel, thereby eliminating the quality hazard of incomplete bottom etching. In addition, the coordinated design of the fixed frame and the baffle not only prevents chip displacement, but also controls the liquid flow direction through the liquid inlet hole, making the fluid dynamics of the etching process more stable. Compared with the traditional immersion process, this device can improve the etching uniformity of the chip surface and significantly improve the pattern integrity of the semiconductor chip.

[0018] (2) This device innovatively integrates the leaching solution recovery and cleaning water circulation system to form a green production closed loop with efficient resource utilization. Its core is to collect cleaning water containing low-concentration leaching solution through the liquid storage component and use it for pre-cleaning in the next operation. In the specific process, the water pump re-injects the mixed liquid temporarily stored in the liquid storage tank into the leaching pipeline, which not only completes the initial neutralization of the residual solution inside the equipment, but also reduces the consumption of fresh deionized water. The forced stirring of the stirring blades in the cleaning stage makes the diluted leaching solution fully contact the dead corner of the equipment. With the phased drainage design, the high-concentration mixed solution is first discharged to the dedicated pipeline, and the low-concentration solution is discharged to the liquid storage tank, which can improve the leaching solution recovery rate. This closed loop system saves water compared with the traditional direct discharge process, and avoids the direct discharge of heavy metal waste liquid. The drain hole connecting the bottom shell and the funnel design of the conical shell further ensures that the waste liquid does not stagnate and transfer, eliminates cross-contamination, and reduces the cost of hazardous waste treatment. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0020] Figure 2 This is a schematic diagram of the fixed shell structure of the present invention;

[0021] Figure 3 This is a schematic diagram of the housing mechanism of the present invention;

[0022] Figure 4 This is a schematic diagram of the recycling mechanism of the present invention;

[0023] Figure 5 This is a schematic diagram of the liquid storage component structure of the present invention;

[0024] Figure 6 This is a schematic diagram of the component structure for the present invention;

[0025] Figure 7 This is a schematic diagram of the placement mechanism of the present invention;

[0026] Figure 8 This is a schematic diagram of the component placement structure of the present invention;

[0027] Figure 9 This is a schematic diagram of the internal structure of the component placement device of the present invention;

[0028] Figure 10 This is a schematic diagram of the baffle assembly structure of the present invention.

[0029] In the diagram: 1. Shell structure; 11. Fixed shell; 12. Arc-shaped connecting shell; 121. Deionized water drain pipe; 122. Etching solution drain pipe; 13. Etching solution injection pipe; 14. Deionized water inlet pipe; 15. Connecting ring; 16. Connecting bottom shell; 161. Drive motor; 162. Water baffle plate; 163. Stirring blade; 164. Drain hole; 17. Baffle plate; 171. Baffle vertical plate; 2. Recovery mechanism; 21. Liquid storage assembly; 211. Liquid storage shell; 212. Fixed support rod; 213. Support leg; 214. 215. Injection pipe; 216. Water pump; 217. Connecting pipe; 22. Collection assembly; 221. Connecting shell; 222. Conical shell; 223. Drainage pipe; 224. Drainage valve; 3. Placement mechanism; 31. Placement assembly; 311. Placement bucket; 312. Connecting element; 313. Fixing frame; 314. Baffle; 315. Inlet hole; 316. Slot; 317. Cavity; 318. Horizontal partition; 319. Protrusion; 32. Baffle assembly; 321. Arc plate; 322. Water vertical channel; 323. Handle. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0031] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms "comprising" or "including," and similar terms used in this disclosure, mean that an element or object preceding the term encompasses the elements or objects listed following the term and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but may also include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0032] like Figures 1 to 10 As shown, the present invention provides an etching apparatus for semiconductor chip production, including a housing mechanism 1 and a recycling mechanism 2 disposed below the housing mechanism 1. The housing mechanism 1 is provided with a placement mechanism 3. The housing mechanism 1 includes a fixed shell 11. An arc-shaped connecting shell 12 is fixedly connected to the lower outer side of the fixed shell 11. An etching solution injection pipe 13 is fixedly connected to the lower outer side of the fixed shell 11. A deionized water inlet pipe 14 is fixedly connected to the upper outer side of the fixed shell 11. One end of the deionized water inlet pipe 14 is connected to a deionized water injection device. The etching solution injection pipe 13 is connected to the etching solution injection device and a hose through a three-way pipe.

[0033] The placement mechanism 3 includes a placement component 31 disposed within the fixed housing 11. A baffle component 32 is disposed on one side inside the placement component 31. The placement component 31 includes a placement bucket 311. A connecting element 312 is fixedly disposed on the upper end of the placement bucket 311. The placement bucket 311 is connected to a driving device through the connecting element 312. The driving device is used to control the height of the placement mechanism 3 within the fixed housing 11. A fixed frame 313 is fixedly connected to the outside of the placement bucket 311. A through hole is opened on the side of the placement bucket 311 facing the fixed frame 313. A baffle 314 is fixedly connected to the fixed frame 313. An inlet hole 315 is opened above the baffle 314. A slot 316 is opened above the placement bucket 311. The slot 316 and the fixed frame 313 are arranged opposite to each other in the axial direction of the placement bucket 311. Multiple cavities 317 are opened on the outside of the placement bucket 311. Multiple transverse partitions 318 corresponding to the cavities 317 are fixedly connected inside the placement bucket 311. Multiple protrusions 319 are fixedly disposed above the transverse partitions 318.

[0034] The baffle assembly 32 includes an arc-shaped plate 321 that is slidably connected in the slot 316, a handle 323 that is fixedly connected above the arc-shaped plate 321, and multiple water-passing vertical grooves 322 that are opened on the arc-shaped plate 321.

[0035] The outer side of the arc-shaped connecting shell 12 is fixedly connected to a deionized water drain pipe 121 and an etching solution drain pipe 122. Both the deionized water drain pipe 121 and the etching solution drain pipe 122 are equipped with valves.

[0036] A connecting bottom shell 16 is fixedly connected to the lower end of the fixed shell 11. A drive motor 161 is fixedly installed inside the lower part of the connecting bottom shell 16. A water baffle 162 is fixedly connected inside the upper part of the connecting bottom shell 16. A stirring blade 163 is fixedly connected to the output end of the drive motor 161 through the water baffle 162. Multiple drainage holes 164 are opened on the upper part of the outer side of the connecting bottom shell 16.

[0037] A connecting ring 15 is fixedly connected to the lower part of the interior of the fixed shell 11, and the shape of the through groove inside the connecting ring 15 corresponds to that of the placement mechanism 3.

[0038] The connecting ring 15 has a hole corresponding to the immersion liquid injection pipe 13.

[0039] A baffle plate 17 is fixedly connected to one side of the deionized water inlet pipe 14 located inside the fixed shell 11. A baffle plate 171 is fixedly installed on both sides of the baffle plate 17.

[0040] The recycling mechanism 2 includes a collection component 22 disposed at the bottom of the fixed housing 11, and a liquid storage component 21 for collecting cleaning fluid is disposed on the outside of the collection component 22.

[0041] The collecting component 22 includes a connecting shell 221 fixedly connected to the lower end of the fixed shell 11. The connecting shell 221 is located outside the connecting bottom shell 16. A conical shell 222 is fixedly connected to the lower end of the connecting shell 221. A drain pipe 223 is fixedly connected to the lower end of the conical shell 222. A drain valve 224 is provided on the drain pipe 223. The drain valve 224 is fixedly connected to a handwheel through the liquid storage shell 211 via a connecting rod.

[0042] The liquid storage assembly 21 includes a liquid storage shell 211 fixedly connected to the lower end of the fixed shell 11. The liquid storage shell 211 is located outside the connecting shell 221. A fixed support rod 212 is fixedly connected to the upper inner wall of the liquid storage shell 211. The fixed support rod 212 is fixedly connected to the connecting shell 221. Multiple support legs 213 are fixedly connected to the outer side of the liquid storage shell 211. An injection pipe 214 is fixedly connected to the lower outer side of the liquid storage shell 211. The other end of the injection pipe 214 is connected to a liquid hose. The hose is connected to a tee pipe at one end of the immersion liquid injection pipe 13. A water pump 215 is fixedly installed inside the lower part of the liquid storage shell 211. A connecting pipe 216 is fixedly connected to the water pump 215. The other end of the connecting pipe 216 is fixedly connected to the injection pipe 214.

[0043] The working principle of this invention is as follows: In use, a semiconductor chip is placed above the transverse partition 318 through the cavity 317, with the protrusion 319 pressing against the bottom of the semiconductor chip. The arc-shaped plate 321 is inserted into the slot 316 to block the semiconductor chip and prevent it from moving out of the placement container 311. The driving device drives the placement container 311 into the bottom of the fixed shell 11 through the connecting element 312. At this time, the placement container 311 blocks the top of the connecting bottom shell 16, preventing liquid from entering the connecting bottom shell 16. At this time, the etching solution... The etchant is injected into the lower part of the fixed shell 11 through the connecting ring 15, and the liquid level is not higher than the height of the connecting ring 15. After the etchant enters the fixed shell 11, as the liquid flows in, the liquid surface enters the placement tank 311 from the cavity 317. As the liquid surface rises, the liquid surface completely submerges the semiconductor chip. Because of the setting of the bump 319, the liquid surface simultaneously etches the bottom surface of the semiconductor chip, preventing the bottom surface of the semiconductor chip from directly contacting the bottom of the container. The etchant cannot completely etch the bottom surface of the semiconductor chip, which affects the quality of the etch.

[0044] After etching is complete, the valve on the etching solution drain pipe 122 is opened to drain the etching solution from the fixed housing 11. Then, the etching solution drain pipe 122 is closed, and the drive device, through the connecting element 312, drives the placement tank 311 to rise to the upper part of the fixed housing 11. At this time, the liquid inlet 315 is located above the baffle plate 17, and deionized water is poured into the fixed housing 11 through the deionized water inlet pipe 14. At this time, the bottom of the placement tank 311, the fixed frame 313, and the connecting ring 15 are not separated to prevent deionized water from entering the bottom of the fixed housing 11. The placement tank 311, the fixed frame 313, the baffle plate 17, and the baffle vertical plate 171 form a separate cavity. Deionized water is first injected into the placement tank 311, the fixed frame 313, and the baffle plate 17. The liquid forms a cavity with the baffle plate 171, and then enters the placement tank 311 through the inlet hole 315. After the deionized water completely submerges the placement tank 311, the drive device drives the placement tank 311 to rise slightly upward through the connecting element 312, so that the placement tank 311 is no longer in contact with the connecting ring 15. At this time, the distance between the placement tank 311 and the connecting ring 15 is small, and the deionized water in the upper part of the fixed shell 11 slowly seeps into the lower part of the fixed shell 11. The deionized water continues to pour into the fixed shell 11. There is no longer the obstruction of the placement tank 311 above the connecting bottom shell 16, and the liquid comes into contact with the stirring blade 163. The drive motor 161 drives the stirring blade 163 to rotate and stir the deionized water in the lower part of the fixed shell 11, so that the solid... The deionized water at the bottom of the fixed shell 11 cleans the residual etching solution inside the fixed shell 11. As the deionized water at the top of the fixed shell 11 slowly flows downwards, the liquid is in a flowing state, cleaning the semiconductor chip in the placement tank 311 and completely stopping the etching solution from etching the semiconductor chip. When the liquid level at the bottom of the fixed shell 11 is almost full, the valve on the deionized water drain pipe 121 is opened to drain the deionized water containing more etching solution from the fixed shell 11. When the deionized water contains less etching solution, the deionized water drain pipe 121 is closed and the drain valve 224 is opened, allowing the deionized water containing less etching solution in the fixed shell 11 to enter the connecting shell 2 through the drain hole 164. 21. The solution enters the storage tank 211 through the drain pipe 223. After the semiconductor chip cleaning is completed, the injection of deionized water is stopped. In the next cleaning, the deionized water containing a small amount of etching solution in the storage tank 211 is first pumped out by the water pump 215 and injected into the hose connected to the injection pipe 214. The deionized water in the storage tank 211 is then injected into the lower part of the fixed shell 11 to clean the lower part of the fixed shell 11 first. After etching the semiconductor chip, the semiconductor chip is cleaned directly, and the cleaning deionized water is used to clean the etching equipment to prevent the etching solution from remaining and deteriorating, which would affect the etching of the semiconductor chip in the next time and affect the etching quality of the semiconductor chip.

[0045] The above embodiments are merely exemplary embodiments of the present invention and are not intended to limit the present invention. The scope of protection of the present invention is defined by the claims. Those skilled in the art can make various modifications or equivalent substitutions to the present invention within its spirit and scope of protection, and such modifications or equivalent substitutions should also be considered to fall within the scope of protection of the present invention.

Claims

1. An etching apparatus for semiconductor chip manufacturing, comprising a housing mechanism (1) and a recovery mechanism (2) disposed below the housing mechanism (1), wherein a placement mechanism (3) is disposed inside the housing mechanism (1), characterized in that: The housing mechanism (1) includes a fixed housing (11), an arc-shaped connecting housing (12) is fixedly connected to the lower outer side of the fixed housing (11), an immersion liquid injection pipe (13) is fixedly connected to the lower outer side of the fixed housing (11), and a deionized water inlet pipe (14) is fixedly connected to the upper outer side of the fixed housing (11). The placement mechanism (3) includes a placement component (31) disposed within a fixed housing (11). A baffle assembly (32) is provided on one side inside the placement component (31). The placement component (31) includes a placement bucket (311). A connecting element (312) is fixedly disposed on the upper end of the placement bucket (311). A fixed frame (313) is fixedly connected to the outside of the placement bucket (311). A through hole is provided on the side of the placement bucket (311) facing the fixed frame (313). A baffle is fixedly connected to the fixed frame (313). The plate (314) has an inlet hole (315) above it, and a slot (316) is provided above the placement bucket (311). The slot (316) and the fixing frame (313) are arranged opposite to each other in the axial direction of the placement bucket (311). Multiple cavities (317) are provided on the outside of the placement bucket (311). Multiple transverse partitions (318) corresponding to the cavities (317) are fixedly connected inside the placement bucket (311). Multiple protrusions (319) are fixedly provided above the transverse partitions (318).

2. The etching apparatus for semiconductor chip manufacturing according to claim 1, characterized in that: The baffle assembly (32) includes an arc-shaped plate (321) slidably connected in a slot (316), a handle (323) fixedly connected above the arc-shaped plate (321), and multiple water-passing vertical grooves (322) opened on the arc-shaped plate (321).

3. The etching apparatus for semiconductor chip manufacturing according to claim 1, characterized in that: The outer side of the arc-shaped connecting shell (12) is fixedly connected to a deionized water drain pipe (121) and an etchant drain pipe (122), and valves are provided on both the deionized water drain pipe (121) and the etchant drain pipe (122).

4. The etching apparatus for semiconductor chip manufacturing according to claim 1, characterized in that: The lower end of the fixed shell (11) is fixedly connected to the connecting bottom shell (16). A drive motor (161) is fixedly installed inside the lower part of the connecting bottom shell (16). A water baffle (162) is fixedly connected inside the upper part of the connecting bottom shell (16). The output end of the drive motor (161) passes through the water baffle (162) and is fixedly connected to the stirring blade (163). Multiple drainage holes (164) are opened on the upper part of the outer side of the connecting bottom shell (16).

5. The etching apparatus for semiconductor chip manufacturing according to claim 1, characterized in that: A connecting ring (15) is fixedly connected to the lower part of the inside of the fixed shell (11), and the shape of the through groove inside the connecting ring (15) corresponds to the placement mechanism (3).

6. The etching apparatus for semiconductor chip manufacturing according to claim 5, characterized in that: The connecting ring (15) has a hole corresponding to the immersion liquid injection pipe (13).

7. The etching apparatus for semiconductor chip manufacturing according to claim 1, characterized in that: Inside the fixed shell (11), a deionized water inlet pipe (14) is provided on one side and a baffle plate (17) is fixedly connected. Both sides of the baffle plate (17) are fixedly provided with baffle vertical plates (171).

8. The etching apparatus for semiconductor chip manufacturing according to claim 1, characterized in that: The recycling mechanism (2) includes a collection component (22) disposed at the bottom of the fixed shell (11), and a storage component (21) for collecting cleaning fluid is disposed on the outside of the collection component (22).

9. The etching apparatus for semiconductor chip manufacturing according to claim 8, characterized in that: The collection component (22) includes a connecting shell (221) fixedly connected to the lower end of the fixed shell (11). The connecting shell (221) is located on the outside of the connecting bottom shell (16). A conical shell (222) is fixedly connected to the lower end of the connecting shell (221). A drain pipe (223) is fixedly connected to the lower end of the conical shell (222). A drain valve (224) is provided on the drain pipe (223).

10. The etching apparatus for semiconductor chip manufacturing according to claim 8, characterized in that: The liquid storage assembly (21) includes a liquid storage shell (211) fixedly connected to the lower end of the fixed shell (11). The liquid storage shell (211) is located on the outside of the connecting shell (221). A fixed support rod (212) is fixedly connected to the upper part of the inner wall of the liquid storage shell (211). The fixed support rod (212) is fixedly connected to the connecting shell (221). Multiple legs (213) are fixedly connected to the outside of the liquid storage shell (211). An injection pipe (214) is fixedly connected to the lower outside of the liquid storage shell (211). A water pump (215) is fixedly installed inside the lower part of the liquid storage shell (211). A connecting pipe (216) is fixedly connected to the water pump (215). The other end of the connecting pipe (216) is fixedly connected to the injection pipe (214).

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