Disc motor controller and drive device

Abstract

The application relates to the field of controllers, in particular to a disc motor controller and a driving device. The disc motor controller comprises a heat dissipation mechanism and a power control mechanism; the heat dissipation mechanism comprises a heat dissipation plate, the profile of the heat dissipation plate is matched with the profile of a motor; one side of the heat dissipation plate is provided with a welding table assembly to connect the power control mechanism; the other side of the heat dissipation plate is provided with a heat dissipation protrusion. The disc motor controller provided by the application is matched with the profile of the motor by matching the profile of the heat dissipation plate with the profile of the motor, so that the heat dissipation mechanism can also be arranged in a form with a large diameter and a small axial size, the size in the axial direction of the motor can be reduced, and the compactness of the assembly of the heat dissipation mechanism and the motor is realized.

Description

Technical Field

[0001] This application relates to the field of controllers, and in particular to a disc motor controller and drive device. Background Technology

[0002] Axial flux drive motor systems play a crucial role in improving the driving performance and competitiveness of electric vehicles. Due to their advantages such as high power density, high torque density, high efficiency, and good NVH (Noise, Vibration, and Harshness) performance, they have become a research hotspot in the electric vehicle drive motor system industry.

[0003] Due to the structural characteristics of axial flux drive motors—large diameter and small axial dimension—existing motor controllers cannot be well matched axially, reducing their compactness in vehicle layout. Therefore, designing a motor controller that is well-matched to axial flux drive motors has become an urgent problem to be solved. Summary of the Invention

[0004] The purpose of this application is to provide a disc motor controller and drive device that can be well matched with an axial flux drive motor, thereby improving its compactness in the overall vehicle layout.

[0005] This application provides a disc motor controller, including a heat dissipation mechanism and a power control mechanism; The heat dissipation mechanism includes a heat sink, the outline of which is adapted to the outline of the motor. A soldering station assembly is provided on one side of the heat sink to connect to the power control mechanism; a heat dissipation protrusion is provided on the other side of the heat sink.

[0006] In the above technical solution, the soldering station assembly further includes a plurality of first soldering stations and a plurality of second soldering stations; the plurality of first soldering stations are arranged at intervals on a first circumference, and the plurality of second soldering stations are arranged at intervals on a second circumference, the first circumference and the second circumference are concentric circles, and the first soldering station and the second soldering station correspond one-to-one; The power control mechanism includes multiple power modules; the upper bridge of the power module is connected to the first soldering station, and the lower bridge of the power module is connected to the corresponding second soldering station.

[0007] In the above technical solution, the power control mechanism further includes a detection component; The detection component includes an integrated temperature sensor and an insulation sensor, and the detection component is modeled after the power module. In the opposing first and second soldering stations, the sensing part of the temperature sensor is connected to one of them, and the insulating sensor is connected to the other.

[0008] In the above technical solution, the multiple power modules further form a first phase module group, a second phase module group, and a third phase module group. The first phase module group includes at least one of the power modules, the second phase module group includes at least one of the power modules, and the third phase module group includes at least one of the power modules. The number of detection components is three, namely a first phase detection component, a second phase detection component, and a third phase detection component; the first phase detection component is located between the first phase module group and the second phase module group; the second phase detection component is located between the second phase module group and the third phase module group; and the third phase detection component is located between the third phase module group and the first phase module group.

[0009] The above technical solution further includes conductive components; The conductive component includes a first conductive busbar, a second conductive busbar, and a third conductive busbar, all of which are connected to the motor. The first busbar is connected to the neutral point of the power module in the first phase module group; the second busbar is connected to the neutral point of the power module in the second phase module group; and the third busbar is connected to the neutral point of the power module in the third phase module group.

[0010] The above technical solution further includes a circuit board; The circuit board is adapted to the contour of the motor; the circuit board and the heat sink are spaced apart. Both the power module and the detection component are provided with pins, and the circuit board is provided with corresponding connection holes, and the pins are connected to the connection holes.

[0011] In the above technical solution, the heat dissipation mechanism further includes a flow channel housing; The flow channel housing is disc-shaped, the heat dissipation plate covers the opening of the flow channel housing, and the heat dissipation plate and the flow channel housing surround to form a cooling cavity, and the heat dissipation protrusion is located in the cooling cavity; The cooling chamber is filled with coolant, the heat dissipation protrusions are immersed in the coolant, and the heat dissipation protrusions are arranged to form a flow guiding structure.

[0012] The above technical solution further includes a busbar thin-film capacitor; The busbar thin film capacitor is located on the side of the flow channel housing away from the heat sink, and the busbar thin film capacitor is in close contact with the flow channel housing. The heat dissipation mechanism is provided with a through hole, through which the busbar thin film capacitor passes to be electrically connected to the power control mechanism.

[0013] The above technical solution further includes a connecting strip; The connection bar is located on the side of the heat sink where the soldering station assembly is located. The connection bar is connected to the upper bridge of the multiple power modules and to the positive terminal of the busbar thin film capacitor.

[0014] This application also provides a drive device, including the disc motor controller described in the above solution.

[0015] Compared with the prior art, the beneficial effects of this application are as follows: The disc motor controller provided in this application adapts the heat sink profile to the motor profile, allowing the heat sink mechanism to be configured with a large diameter and a small axial dimension. This reduces the axial dimension of the motor and achieves a compact assembly between the heat sink mechanism and the motor.

[0016] This application also provides a drive device, including the disc motor controller described in the above solution. Based on the above analysis, it is clear that the drive device also possesses the aforementioned beneficial effects, which will not be elaborated upon further here. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0018] Figure 1 A schematic diagram of the structure of the disc motor controller provided in this application; Figure 2 An exploded structural diagram of the disc motor controller provided in this application; Figure 3 A schematic diagram of the arrangement structure of the power control mechanism provided in this application on the heat sink. Figure 4 A schematic diagram of one side of the heat sink provided in this application; Figure 5 A schematic diagram of the structure of the other side of the heat sink provided in this application; Figure 6 This is a schematic diagram of the temperature sensor provided in this application; Figure 7 This is a schematic diagram of the structure of the insulation sensor provided in this application; Figure 8A schematic diagram of the copper busbar provided in this application.

[0019] In the diagram: 101-Heat sink; 102-Heat dissipation protrusion; 103-First soldering station; 104-Second soldering station; 105-Power module; 106-Temperature sensor; 107-Insulation sensor; 108-PIN pin; 109-U-phase module group; 110-V-phase module group; 111-W-phase module group; 112-First busbar; 113-Second busbar; 114-Third busbar; 115-Circuit board; 116-Flow channel housing; 117-Busline film capacitor; 118-Plastic coated positive copper busbar; 119-Window; 120-Conductive component; 121-Positive output copper busbar; 122-Negative output copper busbar. Detailed Implementation

[0020] The technical solutions of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0021] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0022] In the description of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0023] Example 1 See Figures 1 to 8 As shown, the disc motor controller provided in this application includes a heat dissipation mechanism and a power control mechanism.

[0024] The heat dissipation mechanism includes a heat sink 101, the outline of which is adapted to the outline of the motor. This allows the heat dissipation mechanism to be configured with a large diameter and a small axial dimension, reducing the axial dimension of the motor and achieving a compact assembly between the heat dissipation mechanism and the motor. Specifically, the heat sink 101 is circular, matching the circular outline of the axial flux drive motor. The thickness of the heat sink 101 can be set between 5mm and 30mm, and the diameter can be set between 250-500mm. The material of the heat sink 101 can be aluminum alloy or pure copper with surface treatments such as nickel plating.

[0025] A soldering station assembly is provided on one side of the heat sink 101 to connect to the power control mechanism; a heat dissipation protrusion 102 is provided on the other side of the heat sink 101. The power control mechanism is directly soldered to the heat sink 101 via the soldering station assembly, forming a short and efficient heat conduction path that can quickly conduct heat to the heat sink 101. The heat dissipation protrusion 102 on the heat sink 101 increases the heat dissipation area, thereby improving convective and radiative heat transfer capabilities and accelerating heat dissipation.

[0026] Optionally, the multiple heat dissipation protrusions 102 provided on the heat sink 101 form a fin structure to improve the heat dissipation effect. On a plane parallel to the heat sink 101, the cross-sectional shape of the heat dissipation protrusions 102 can be set to a circular, elliptical, trapezoidal, triangular, or teardrop shape, etc.

[0027] In an optional embodiment, the soldering station assembly includes multiple first soldering stations 103 and multiple second soldering stations 104; the multiple first soldering stations 103 are arranged at intervals on a first circumference, and the multiple second soldering stations 104 are arranged at intervals on a second circumference, the first circumference and the second circumference are concentric circles, and the first soldering stations 103 and the second soldering stations 104 correspond one-to-one; the power control mechanism includes multiple power modules 105; the upper bridge of the power module 105 is connected to the first soldering station 103, and the lower bridge of the power module 105 is connected to the corresponding second soldering station 104.

[0028] In this embodiment, such as Figure 4 As shown, the heat sink 101 has two rings of soldering stations, an inner ring and an outer ring. Each ring has 12 evenly distributed soldering stations. The inner and outer ring soldering stations correspond one-to-one and are used to connect the upper and lower bridges of the power module 105. The centers of the two rings of soldering stations are concentric with the center of the heat sink 101 to fit the circular structure of the heat sink 101, thereby achieving a reasonable arrangement of the heat dissipation module.

[0029] Specifically, the connection between the inner ring soldering station and the upper or lower bridge of the power module 105 can be configured according to actual conditions. For ease of description, the first soldering station 103 located on the outer ring is connected to the upper bridge of the power module 105, and the second soldering station 104 located on the inner ring is connected to the lower bridge of the power module 105. When the heat sink 101 is made of aluminum alloy, the surfaces of the first soldering station 103 and the second soldering station 104 are copper-plated or silver-plated to facilitate connection with the power module 105. Specifically, the power module 105 is a TPAK single-tube device, which has advantages such as high power density, low on-resistance, excellent thermal performance, and high reliability.

[0030] When connecting TPAK single-tube devices to a soldering station, the substrate on the back of the TPAK single-tube device is connected to the upper surface of the soldering station. The main purpose is to transfer heat. This connection is crucial; it's essential to minimize thermal resistance and ensure sufficient connection strength. The connection process between the TPAK single-tube device and the soldering station can be achieved through vacuum formic acid reflow soldering, using tin foil as solder to form an alloy layer; or through sintering processes, such as copper sintering or silver sintering.

[0031] In an optional embodiment, the power control mechanism further includes a detection component; the detection component includes an integrated packaged temperature sensor 106 and an insulation sensor 107, and the detection component is modeled after the power module 105; in the first soldering station 103 and the second soldering station 104 which are arranged opposite to each other, the sensing part of the temperature sensor 106 is connected to one of them, and the insulation sensor 107 is connected to the other.

[0032] In this embodiment, for the convenience of platform design and manufacturing process, the temperature sensor 106 of the detection component and the insulation sensor 107 for detecting high voltage insulation resistance are also integrated into a TPAK package, but are different in color from the power module 105, so as to facilitate assembly on the production line.

[0033] like Figure 6 As shown, when the detection component is connected to the soldering station component, the bottom copper substrate of the temperature sensor 106 is connected to the second soldering station 104 in the inner ring to detect the temperature of the surface of the second soldering station 104. The principle is to transmit the change in the surface temperature of the second soldering station 104 to the internal detection circuit. The internal detection circuit can be a thermistor voltage divider circuit. The voltage signal is connected to the circuit board 115 through two pins 108. The circuit board 115 is equipped with a filter circuit to transmit the temperature signal to the main control chip.

[0034] like Figure 7As shown, the insulation sensor 107 is packaged similarly to a TPAK plastic package. The bottom copper substrate of the insulation sensor 107 is connected to the first soldering station 103 to detect the insulation resistance between the first soldering station 103 and the high voltage. Because the first soldering station 103 is made of metal and connected to the controller housing, it actually tests the insulation resistance between the high voltage and the controller housing. The insulation sensor 107 has four pins 108, two of which are used to power the internal detection circuit, and the other two are used for high voltage power extraction and signal transmission, respectively. The insulation sensor 107 is implemented by connecting one pin 108 to the high voltage module of the circuit board 115, and the bottom copper substrate to the first soldering station 103. The internal detection circuit calculates the resistance between the high voltage on the circuit board 115 and the first soldering station 103, then transmits the resistance signal to the filter circuit of the circuit board 115 via the pin 108, and finally to the main control chip.

[0035] In an optional embodiment, multiple power modules 105 form a first phase module group, a second phase module group, and a third phase module group. The first phase module group includes at least one power module 105, the second phase module group includes at least one power module 105, and the third phase module group includes at least one power module 105. The number of detection components is three, namely a first phase detection component, a second phase detection component, and a third phase detection component. The first phase detection component is located between the first phase module group and the second phase module group; the second phase detection component is located between the second phase module group and the third phase module group; and the third phase detection component is located between the third phase module group and the first phase module group.

[0036] In this embodiment, such as Figure 3 As shown, multiple power modules 105 form a UVW three-phase module group. The U-phase module group 109 includes three power modules 105, occupying three first soldering stations 103 and three second soldering stations 104. The V-phase module group 110 includes three power modules 105, occupying three first soldering stations 103 and three second soldering stations 104. The W-phase module group 111 includes three power modules 105, occupying three first soldering stations 103 and three second soldering stations 104. The three-phase power modules 105 are implemented using a TPAK single-transistor parallel device scheme. The internal switching device type of the power module 105 can be IGBT, SiC MOS, GANMOS, etc. The TPAK single-transistor device can achieve platform design by changing the switching device type and the number of switching device chips connected in parallel. Selecting switching devices with different withstand voltage levels can cover electrical control products from 300V to 1000V bus voltage range. Different numbers of switching device chips connected in parallel can also cover electrical control products of different power ranges to match motors of different power levels.

[0037] The remaining empty first soldering station 103 and second soldering station 104 can be used to place temperature sensors 106 and insulation sensors 107. Specifically, a temperature sensor 106 is placed on each second soldering station 104 for each phase to detect temperature. An insulation sensor 107 is placed on each first soldering station 103 for the UW phase to detect the insulation resistance between the positive and negative high-voltage DC bus and ground. An insulation sensor 107 is placed on the first soldering station 103 for the V phase to detect the insulation resistance between the three-phase motor windings and the stator core.

[0038] In an optional embodiment, the disc motor controller further includes a conductive component 120; the conductive component 120 includes a first conductive bus 112, a second conductive bus 113, and a third conductive bus 114, all of which are connected to the motor; the first conductive bus 112 is connected to the neutral point of the power module 105 in the first phase module group; the second conductive bus 113 is connected to the neutral point of the power module 105 in the second phase module group; and the third conductive bus 114 is connected to the neutral point of the power module 105 in the third phase module group.

[0039] In this embodiment, specifically as follows: Figure 8 As shown, the first busbar 112, the second busbar 113, and the third busbar 114 are three-phase copper busbars. Each of the three busbars includes an arc-shaped portion and a straight portion. The arc-shaped portion is adapted to the first and second circumferences so that the arc-shaped portion of each busbar spans multiple power modules 105 of the same phase, thereby connecting to the neutral point of the power modules 105. The straight portion extends radially along the first and second circumferences, with one end of the straight portion connected to the middle of the arc-shaped portion, and the other end of the straight portion leading out a three-phase wire for connection to the motor.

[0040] In an optional embodiment, the disc motor controller further includes a circuit board 115; the circuit board 115 is adapted to the contour of the motor; the circuit board 115 is spaced apart from the heat sink 101; both the power module 105 and the detection component are provided with pins, and the circuit board 115 is provided with corresponding connection holes, with the pins connected to the connection holes.

[0041] In this embodiment, such as Figure 1 and Figure 2 As shown, the circuit board 115 is specifically a circular printed circuit board 115, which integrates driving circuitry and control circuitry. The printed circuit board 115 has small connection holes through which the pins 108 of the TPAK single-tube device can pass, and the PCBA is electrically connected to the TPAK single-tube device via wave soldering. Similarly, the pins 106 of the temperature sensor and 108 of the insulation sensor 107 can pass through the corresponding connection holes, and the PCBA is electrically connected to the temperature sensor 106 and the insulation sensor 107 via wave soldering.

[0042] In an optional embodiment, the heat dissipation mechanism further includes a flow channel housing 116; the flow channel housing 116 is disc-shaped, the heat dissipation plate 101 covers the opening of the flow channel housing 116, and the heat dissipation plate 101 and the flow channel housing 116 surround to form a cooling cavity, and the heat dissipation protrusion 102 is located in the cooling cavity; coolant flows in the cooling cavity, the heat dissipation protrusion 102 is immersed in the coolant, and the heat dissipation protrusion 102 is arranged to form a flow guiding structure.

[0043] In this embodiment, the heat dissipation protrusion 102 is directly immersed in the coolant, allowing heat to be rapidly transferred from the protrusion 102 to the coolant, thus improving heat dissipation efficiency. Preferably, as shown below... Figure 4 As shown, the cross-sectional shape of the heat dissipation protrusion 102 is teardrop-shaped, and the teardrop-shaped heat dissipation protrusion 102 is arranged along the flow direction of the coolant so that the heat dissipation protrusion 102 can play the roles of heat dissipation and reducing flow resistance, thereby accelerating heat dissipation and improving heat dissipation efficiency.

[0044] Example 2 The disc motor controller in this second embodiment is an improvement on the above embodiments. The technical content disclosed in the above embodiments will not be described again, and the content disclosed in the above embodiments also belongs to the content disclosed in this second embodiment.

[0045] See Figure 1 and Figure 2 As shown, in an optional embodiment, the disc motor controller further includes a busbar thin film capacitor 117; the busbar thin film capacitor 117 is located on the side of the flow channel housing 116 away from the heat sink 101, and the busbar thin film capacitor 117 is attached to the flow channel housing 116; the heat dissipation mechanism is provided with a through hole, through which the busbar thin film capacitor 117 passes to be electrically connected to the power control mechanism.

[0046] In this embodiment, the positive output copper busbar 121 and negative output copper busbar 122 of the busbar film capacitor 117 are designed as two cylindrical shapes, one inner and one outer, passing through a through hole, facilitating their connection to the positive and negative terminals of the inner and outer rings of the three-phase power module 105, respectively. Furthermore, the upper surface of the busbar film capacitor 117 is disc-shaped and fits against the back of the flow channel housing 116, enabling direct cooling of the busbar film capacitor 117. The core of the busbar film capacitor 117 is placed in the lower circular solid portion.

[0047] In an optional embodiment, the disc motor controller further includes a connection busbar. The connection busbar is located on the side of the heat sink 101 where the soldering station assembly is located. The connection busbar is connected to the upper bridge of multiple power modules 105 and to the positive terminal of the busbar film capacitor 117. Specifically, the connection busbar is a circular, plastic-coated copper busbar 118 used to connect the collector (C) terminal of the three-phase power module to the positive terminal of the busbar film capacitor 117. The connection busbar has multiple windows 119 through which the pins 108 of the power modules 105, the temperature sensor 106, and the insulation sensor 107 can pass to connect to the circuit board 115.

[0048] All connections between copper busbars, including the connection between the C and E terminals of the upper and lower bridge arms, the connection between the C terminal of the upper bridge arm TPAK single-tube device and the plastic-coated positive copper busbar 118, the connection between the E terminal of the lower bridge arm and the negative copper busbar of the busbar film capacitor 117, the connection between the plastic-coated positive copper busbar 118 and the positive copper busbar of the busbar film capacitor 117, and the connection between the three-phase copper busbars and the neutral points of the upper and lower bridge arms, are made using laser welding.

[0049] Example 3 Embodiment 3 of this application provides a drive device, which includes the disc motor controller of any of the above embodiments. Therefore, it has all the beneficial technical effects of the disc motor controller of any of the above embodiments, which will not be repeated here.

[0050] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application. In addition, those skilled in the art can understand that although some embodiments herein include certain features included in other embodiments but not other features, combinations of features from different embodiments are meant to be within the scope of this application and form different embodiments.

Claims

1. A disc motor controller, characterized in that, Includes heat dissipation mechanisms and power control mechanisms; The heat dissipation mechanism includes a heat sink, the outline of which is adapted to the outline of the motor. A soldering station assembly is provided on one side of the heat sink to connect to the power control mechanism; a heat dissipation protrusion is provided on the other side of the heat sink. The soldering station assembly includes a plurality of first soldering stations and a plurality of second soldering stations; the plurality of first soldering stations are arranged at intervals on a first circumference, and the plurality of second soldering stations are arranged at intervals on a second circumference, the first circumference and the second circumference are concentric circles, and the first soldering station and the second soldering station correspond one-to-one; The power control mechanism includes multiple power modules; the upper bridge of the power module is connected to the first soldering station, and the lower bridge of the power module is connected to the corresponding second soldering station. The power control mechanism also includes a detection component; The detection component includes an integrated temperature sensor and an insulation sensor, and the detection component is modeled after the power module. In the opposing first and second soldering stations, the sensing part of the temperature sensor is connected to one of them, and the insulating sensor is connected to the other. The power modules are configured to form a first phase module group, a second phase module group and a third phase module group, wherein the first phase module group includes at least one of the power modules, the second phase module group includes at least one of the power modules and the third phase module group includes at least one of the power modules; The disc motor controller also includes conductive components; The conductive component includes a first conductive busbar, a second conductive busbar, and a third conductive busbar, all of which are connected to the motor. The first busbar is connected to the neutral point of the power module in the first phase module group; the second busbar is connected to the neutral point of the power module in the second phase module group; and the third busbar is connected to the neutral point of the power module in the third phase module group.

2. The disc motor controller according to claim 1, characterized in that, The number of detection components is three, namely a first phase detection component, a second phase detection component, and a third phase detection component; the first phase detection component is located between the first phase module group and the second phase module group; the second phase detection component is located between the second phase module group and the third phase module group; and the third phase detection component is located between the third phase module group and the first phase module group.

3. The disc motor controller according to claim 1, characterized in that, It also includes circuit boards; The circuit board is adapted to the contour of the motor; the circuit board and the heat sink are spaced apart. Both the power module and the detection component are provided with pins, and the circuit board is provided with corresponding connection holes, and the pins are connected to the connection holes.

4. The disc motor controller according to claim 1, characterized in that, The heat dissipation mechanism also includes a flow channel housing; The flow channel housing is disc-shaped, the heat dissipation plate covers the opening of the flow channel housing, and the heat dissipation plate and the flow channel housing surround to form a cooling cavity, and the heat dissipation protrusion is located in the cooling cavity; The cooling chamber is filled with coolant, the heat dissipation protrusions are immersed in the coolant, and the heat dissipation protrusions are arranged to form a flow guiding structure.

5. The disc motor controller according to claim 4, characterized in that, This also includes busbar film capacitors; The busbar thin film capacitor is located on the side of the flow channel housing away from the heat sink, and the busbar thin film capacitor is in close contact with the flow channel housing. The heat dissipation mechanism is provided with a through hole, through which the busbar thin film capacitor passes to be electrically connected to the power control mechanism.

6. The disc motor controller according to claim 5, characterized in that, It also includes connecting rows; The connection bar is located on the side of the heat sink where the soldering station assembly is located. The connection bar is connected to the upper bridge of the multiple power modules and to the positive terminal of the busbar thin film capacitor.

7. A driving device, characterized in that, Includes a disc motor and a disc motor controller as described in any one of claims 1 to 6.

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