Probe cleaning mechanism and probe cleaning method

Abstract

The application discloses a kind of probe cleaning mechanism and probe cleaning method, applied to square resistance measurement technical field, relative rotation occurs when along circumferential direction in working time pad installation disc and clean needle mud installation disc;Pad installation disc is provided with pad towards the surface of clean needle mud installation disc one side of pad installation disc, and the installation plate of clean needle mud installation disc is provided with through hole, and the installation plate is provided with first clean needle mud towards the surface of pad installation disc one side of pad installation disc, and the installation plate is provided with second clean needle mud towards the surface of pad installation disc one side of pad installation disc;First clean needle mud and through hole are sequentially arranged along circumferential direction.The first clean needle mud can be washed with the rotation to the microparticle remaining in pad, and simultaneously with the rotation through hole can expose the pad cleaned, so that the probe can be contacted to pad to wash the probe through through hole.After second clean needle mud can be used to further wash the probe, to keep the probe clean at all times.

Description

Technical Field

[0001] This invention relates to the field of sheet resistance measurement technology, and in particular to a probe cleaning mechanism and a probe cleaning method. Background Technology

[0002] Currently, sheet resistance is typically measured using a four-probe sheet resistance measuring machine with four probes. The principle of the four-probe sheet resistance measuring machine is as follows: a constant current is applied to the two outer probes, creating an electric field inside; the two inner probes calculate the resistance value by measuring the voltage between the two probe points on the material.

[0003] However, during the measurement process, the probe can adsorb particles, which will alter the contact resistance at the probe's microscopic level and affect the measurement results. Therefore, the probe needs to be cleaned before measuring sheet resistance.

[0004] In existing technologies, a rough-surfaced grinding pad is used to clean the probe, cleaning it by controlling the probe's contact with the rough surface of the pad. However, this approach has drawbacks because particles from the probe surface, particles formed by the shedding of probe material, and particles formed by the shedding of grinding pad material remain on the pad, resulting in poor cleaning effectiveness and unstable measurement results. In existing technologies, after determining that the measurement results are unstable, a cleaning agent is used to absorb particles from the probe and grinding pad, achieving a cleaning effect. However, this method cannot guarantee the probe surface condition in real time due to different operating techniques and its time-sensitive nature. Therefore, how to provide a probe cleaning mechanism that can keep the probe clean at all times is a problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0005] The purpose of this invention is to provide a probe cleaning mechanism and a probe cleaning method that can keep the probe clean at all times.

[0006] To solve the above technical problems, the present invention provides a probe cleaning mechanism, including a grinding needle pad mounting plate and a cleaning needle mud mounting plate arranged opposite to each other; during operation, the grinding needle pad mounting plate and the cleaning needle mud mounting plate rotate relative to each other in the circumferential direction.

[0007] The grinding needle pad mounting plate has a grinding needle pad on the surface facing the cleaning needle mud mounting plate. The mounting plate of the cleaning needle mud mounting plate has a through hole. The surface of the mounting plate facing the grinding needle pad mounting plate has a first cleaning needle mud, and the surface of the mounting plate facing away from the grinding needle pad mounting plate has a second cleaning needle mud. The first cleaning needle mud and the through hole are arranged sequentially along the circumferential direction.

[0008] When the grinding needle pad mounting plate and the cleaning paste mounting plate rotate relative to each other in the circumferential direction, the first cleaning paste is used to clean the grinding needle pad, and the through hole is used to expose the cleaned grinding needle pad.

[0009] Optionally, the second cleaning agent and the through hole are arranged sequentially along the circumferential direction.

[0010] Optionally, it may also include a probe driving mechanism, which is connected to the probe;

[0011] The probe driving mechanism is used for:

[0012] When the through hole rotates to below the probe, the probe is driven to pass through the through hole to contact the grinding needle pad for cleaning, and after the probe is cleaned by the grinding needle pad, the probe is driven to disengage from the through hole.

[0013] When the second cleaning sludge rotates to a position below the probe, it drives the probe to contact the second cleaning sludge for cleaning.

[0014] Optionally, the grinding needle pad mounting plate is further provided with an assembly groove on the side facing the cleaning needle mud mounting plate, and the outline dimension of the assembly groove is not less than the outline dimension of the first cleaning needle mud.

[0015] Optionally, the depth of the assembly groove is not less than the height of the first cleaning agent protruding from the cleaning agent mounting plate.

[0016] Optionally, the grinding needle pad mounting plate is further provided with an empty groove on the side facing the cleaning needle mud mounting plate.

[0017] Optionally, the outline dimensions of the empty slot correspond to the outline dimensions of the grinding needle pad.

[0018] Optionally, it may also include a mounting plate drive mechanism, which is used to drive the cleaning needle installation plate to rotate along the circumferential direction.

[0019] The present invention also provides a probe cleaning method, applied to the aforementioned probe cleaning mechanism, comprising:

[0020] The grinding needle pad mounting plate and the cleaning needle mud mounting plate rotate relative to each other in the circumferential direction;

[0021] The control probe passes through the through hole to contact the grinding needle pad for cleaning;

[0022] After cleaning the probe with the grinding needle pad, the probe is controlled to contact the second cleaning sludge for cleaning.

[0023] Optionally, the second cleaning agent and the through hole are arranged along the circumferential direction;

[0024] The control probe passes through the through hole to contact the grinding needle pad for cleaning, including:

[0025] Drive the through hole to rotate to below the probe, then drive the probe through the through hole to contact the grinding needle pad for cleaning, and after cleaning the probe through the grinding needle pad, drive the probe to disengage from the through hole;

[0026] The step of controlling the probe to contact the second cleaning sludge for cleaning includes:

[0027] The second cleaning sludge is driven to rotate to the area below the probe, and then the probe is driven to contact the second cleaning sludge for cleaning.

[0028] The present invention provides a probe cleaning mechanism, comprising a grinding needle pad mounting plate and a cleaning needle mud mounting plate arranged opposite to each other; during operation, the grinding needle pad mounting plate and the cleaning needle mud mounting plate rotate relative to each other in the circumferential direction; a grinding needle pad is provided on the surface of the grinding needle pad mounting plate facing the cleaning needle mud mounting plate, and a through hole is provided on the mounting plate of the cleaning needle mud mounting plate; a first cleaning needle mud is provided on the surface of the mounting plate facing the grinding needle pad mounting plate, and a second cleaning needle mud is provided on the surface of the mounting plate facing away from the grinding needle pad mounting plate; the first cleaning needle mud and the through hole are arranged sequentially in the circumferential direction; when the grinding needle pad mounting plate and the cleaning needle mud mounting plate rotate relative to each other in the circumferential direction, the first cleaning needle mud is used to clean the grinding needle pad, and the through hole is used to expose the cleaned grinding needle pad.

[0029] When the grinding needle pad mounting plate and the cleaning putty mounting plate rotate circumferentially, the first cleaning putty can clean the particles remaining on the grinding needle pad as it rotates. Simultaneously, the rotation exposes the cleaned grinding needle pad through the through hole, allowing the probe to pass through and contact the grinding needle pad for cleaning. Since the second cleaning putty is located on the surface of the cleaning putty mounting plate opposite to the grinding needle pad mounting plate, after cleaning the probe with the grinding needle pad, the second cleaning putty can be used for further cleaning to ensure effective cleaning and keep the probe clean at all times.

[0030] The present invention also provides a probe cleaning method, which has the same beneficial effects as described above, and will not be described in detail here. Attached Figure Description

[0031] To more clearly illustrate the technical solutions of the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a schematic diagram of a probe cleaning mechanism provided in an embodiment of the present invention;

[0033] Figure 2 This is a top view schematic diagram of a specific probe cleaning mechanism provided in an embodiment of the present invention;

[0034] Figure 3 A flowchart of a probe cleaning method provided in an embodiment of the present invention;

[0035] Figure 4 This is a state diagram of a specific probe cleaning process provided in an embodiment of the present invention.

[0036] In the diagram: 1. Grinding needle pad mounting plate, 11. Grinding needle pad, 12. Assembly slot, 13. Empty slot;

[0037] 2. Cleaning putty installation plate, 21. Through hole, 22. First cleaning putty, 23. Second cleaning putty. Detailed Implementation

[0038] The core of this invention is to provide a probe cleaning mechanism. In existing technologies, a rough-surfaced grinding pad is used to clean the probe, cleaning it by controlling the probe's contact with the rough surface of the pad. However, this approach has a drawback: particles from the probe surface, particles formed by the shedding of probe material, and particles formed by the shedding of grinding pad material remain on the pad, resulting in poor cleaning effectiveness and unstable measurement results. In existing technologies, after determining that the measurement results are unstable, a cleaning agent is used to absorb the particles from the probe and grinding pad, achieving a cleaning effect. However, this method cannot guarantee the probe surface condition in real time due to different operating techniques and its time-sensitive nature.

[0039] The probe cleaning mechanism provided by this invention includes a grinding needle pad mounting plate and a cleaning needle mud mounting plate arranged opposite to each other. During operation, the grinding needle pad mounting plate and the cleaning needle mud mounting plate rotate relative to each other in the circumferential direction. A grinding needle pad is provided on the surface of the grinding needle pad mounting plate facing the cleaning needle mud mounting plate. A through hole is provided on the mounting plate of the cleaning needle mud mounting plate. A first cleaning needle mud is provided on the surface of the mounting plate facing the grinding needle pad mounting plate, and a second cleaning needle mud is provided on the surface of the mounting plate facing away from the grinding needle pad mounting plate. The first cleaning needle mud and the through hole are arranged sequentially in the circumferential direction. When the grinding needle pad mounting plate and the cleaning needle mud mounting plate rotate relative to each other in the circumferential direction, the first cleaning needle mud is used to clean the grinding needle pad, and the through hole is used to expose the cleaned grinding needle pad.

[0040] When the grinding needle pad mounting plate and the cleaning putty mounting plate rotate circumferentially, the first cleaning putty can clean the particles remaining on the grinding needle pad as it rotates. Simultaneously, the rotation exposes the cleaned grinding needle pad through the through hole, allowing the probe to pass through and contact the grinding needle pad for cleaning. Since the second cleaning putty is located on the surface of the cleaning putty mounting plate opposite to the grinding needle pad mounting plate, after cleaning the probe with the grinding needle pad, the second cleaning putty can be used for further cleaning to ensure effective cleaning and keep the probe clean at all times.

[0041] To enable those skilled in the art to better understand the present invention, the invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are merely some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0042] Example 1

[0043] Please refer to Figure 1 , Figure 1 This is a schematic diagram of a probe cleaning mechanism provided in an embodiment of the present invention.

[0044] See Figure 1 In this embodiment, the probe cleaning mechanism includes a grinding needle pad mounting plate 1 and a cleaning needle mud mounting plate 2 arranged opposite to each other. During operation, the grinding needle pad mounting plate 1 and the cleaning needle mud mounting plate 2 rotate relative to each other in the circumferential direction. A grinding needle pad 11 is provided on the surface of the grinding needle pad mounting plate 1 facing the cleaning needle mud mounting plate 2. A through hole 21 is provided on the mounting plate of the cleaning needle mud mounting plate 2. A first cleaning needle mud 22 is provided on the surface of the mounting plate facing the grinding needle pad mounting plate 1, and a second cleaning needle mud 23 is provided on the surface of the mounting plate facing away from the grinding needle pad mounting plate 1. The first cleaning needle mud 22 and the through hole 21 are arranged sequentially in the circumferential direction. When the grinding needle pad mounting plate 1 and the cleaning needle mud mounting plate 2 rotate relative to each other in the circumferential direction, the first cleaning needle mud 22 is used to clean the grinding needle pad 11, and the through hole 21 is used to expose the cleaned grinding needle pad 11.

[0045] The aforementioned grinding needle pad mounting plate 1 is mainly used to mount the grinding needle pad 11, the surface of which can be a rough surface, cleaning the probe surface by contacting the probe. The cleaning needle putty mounting plate 2 is mainly used to mount the cleaning needle putty, which can remove particles from the probe surface and the surface of the grinding needle pad 11 by adsorption. In this embodiment, the grinding needle pad mounting plate 1 and the cleaning needle putty mounting plate 2 need to be arranged relative to each other. At this time, the grinding needle pad mounting plate 1 has a surface facing the cleaning needle putty mounting plate 2, and the base plate of the cleaning needle putty mounting plate 2 is a mounting plate in this embodiment, which has a surface facing the grinding needle pad mounting plate 1 and a surface facing away from the grinding needle pad mounting plate 1. It should be noted that the projections of the aforementioned grinding needle pad mounting plate 1 and the cleaning needle putty mounting plate 2 in the relative direction can be circular or any other arbitrary shape, and are not specifically limited here. During operation, the grinding needle pad mounting plate 1 and the cleaning needle putty mounting plate 2 need to be able to rotate relative to each other in the circumferential direction.

[0046] Specifically, in this embodiment, a grinding needle pad 11 is provided on the surface of the grinding needle pad mounting plate 1 facing the cleaning needle sludge mounting plate 2. During operation, the probe to be cleaned will contact the grinding needle pad 11, thereby cleaning the probe based on the grinding needle pad 11. The mounting plate of the cleaning needle sludge mounting plate 2 first needs to have a through hole 21. During the relative rotation of the cleaning needle sludge mounting plate 2, the through hole 21 should be able to expose the aforementioned grinding needle pad 11 at least when it rotates to a certain angle, so that the probe can contact the grinding needle pad 11 through the through hole 21.

[0047] A first cleaning paste 22 is provided on the surface of the mounting plate facing the grinding needle pad mounting disc 1, and a second cleaning paste 23 is provided on the surface of the mounting plate facing away from the grinding needle pad mounting disc 1. The structures of the first cleaning paste 22 and the second cleaning paste 23 are generally the same, the main difference being their positions on the mounting plate. The first cleaning paste 22 is positioned on the surface of the mounting plate facing the grinding needle pad mounting disc 1, allowing it to contact the surface of the grinding needle pad 11 during operation. Furthermore, the first cleaning paste 22 can clean the surface of the grinding needle pad 11 during rotation. The first cleaning paste 22 needs to be positioned circumferentially with the through hole 21, meaning that when the cleaning paste mounting disc 2 rotates, the through hole 21 exposes the portion of the grinding needle pad 11 cleaned by the first cleaning paste 22. Of course, taking the center of the cleaning needle pad 2 as the center of rotation, the center of the through hole 21 and the center of the first cleaning needle pad 22 do not necessarily have to be on the same radius, as long as the through hole 21 can expose the part of the grinding needle pad 11 that has been cleaned by the first cleaning needle pad 22 when rotating.

[0048] The aforementioned second cleaning putty 23 is specifically disposed on the surface of the mounting plate facing away from the grinding needle pad mounting plate 1, and is mainly used for cleaning the probe. Preferably, in this embodiment, the second cleaning putty 23 and the through hole 21 are arranged along the circumferential direction, so that after the probe is cleaned by the grinding needle pad 11, it is not necessary to control the probe to move horizontally. Instead, the second cleaning putty 23 is rotated under the probe when the cleaning putty mounting plate 2 rotates, and then the probe is controlled to move vertically downwards to clean it with the cleaning putty. This avoids complex probe driving and facilitates the cleaning operation. Of course, with the center of the cleaning putty mounting plate 2 as the center of rotation, the center of the through hole 21 and the center of the second cleaning putty 23 do not necessarily have to be on the same radius, as long as the above effect is achieved.

[0049] Of course, in this embodiment, the second cleaning needle mud 23 may not be set in the circumferential direction with the through hole 21. In this case, when using the second cleaning needle mud 23 to clean the probe, it is necessary to control the probe to move in the horizontal direction so that the probe can contact the second cleaning needle mud 23 for cleaning.

[0050] Correspondingly, in this embodiment, the probe cleaning mechanism may also include a probe driving mechanism, which is connected to the probe. The probe driving mechanism is used to: drive the probe through the through hole 21 to contact the grinding needle pad 11 for cleaning when the through hole 21 rotates to below the probe; and drive the probe to disengage from the through hole 21 after cleaning the probe through the grinding needle pad 11; and drive the probe to contact the second cleaning needle sludge 23 for cleaning when the second cleaning needle sludge 23 rotates to below the probe.

[0051] The aforementioned probe driving mechanism needs to be connected to the probe and drive it to move vertically up and down at appropriate times, without needing to move the probe horizontally. Specifically, when the through hole 21 rotates to below the probe, the probe driving mechanism drives it to move vertically downward to pass through the through hole 21 and contact the abrasive pad 11 for cleaning. After the abrasive pad 11 has cleaned the probe, the mechanism drives it to move vertically upward to disengage from the through hole 21. Similarly, when the second cleaning sludge 23 rotates to below the probe, the probe drives it to move vertically downward to contact the second cleaning sludge 23 for cleaning, and then it can move vertically upward to detach from the second cleaning sludge 23. This driving method is very simple, and the probe driving mechanism only needs to move in one direction, namely the vertical direction, thus simplifying the structure of the probe driving mechanism.

[0052] It should be noted that, in this embodiment, since the first cleaning agent 22 and the second cleaning agent 23 are disposed on different surfaces of the mounting plate, their projections along the relative directions may or may not overlap, depending on the specific circumstances, and no specific limitation is made here.

[0053] In this embodiment, a mounting plate drive mechanism may also be included, which drives the cleaning needle pad mounting plate 2 to rotate along the circumferential direction. In this embodiment, the grinding needle pad mounting plate 1 is typically fixed, and the cleaning needle pad mounting plate 2 is driven to rotate circumferentially by the mounting plate drive mechanism. This avoids the need for rotating probes and probe drive mechanisms, reducing the structural complexity of the probe cleaning mechanism. The mounting plate drive mechanism mainly needs to drive the cleaning needle pad mounting plate 2 to rotate around its center; its specific structure is not specifically limited here.

[0054] The probe cleaning mechanism provided in this embodiment allows the first cleaning paste 22 to clean residual particles on the grinding needle pad 11 when the grinding needle pad mounting plate 1 and the cleaning paste mounting plate 2 rotate circumferentially. Simultaneously, with the relative rotation, the through hole 21 in the cleaning paste mounting plate 2 exposes the cleaned grinding needle pad 11, allowing the probe to pass through the through hole 21 and contact the grinding needle pad 11 for cleaning. Since the second cleaning paste 23 is located on the surface of the cleaning paste mounting plate 2 facing away from the grinding needle pad mounting plate 1, after cleaning the probe with the grinding needle pad 11, the second cleaning paste 23 can be used for further cleaning to ensure effective cleaning and maintain probe cleanliness at all times.

[0055] The specific structure of the probe cleaning mechanism provided in this application will be described in detail in the following embodiments.

[0056] Example 2

[0057] Please refer to Figure 2 , Figure 2 This is a top view schematic diagram of a specific probe cleaning mechanism provided in an embodiment of the present invention.

[0058] Unlike the embodiments described above, this embodiment further defines the structure of the probe cleaning mechanism based on the above embodiments. The remaining details have been described in detail in the above embodiments and will not be repeated here.

[0059] See Figure 2 In this embodiment, the grinding needle pad mounting plate 1 is also provided with an assembly groove 12 on the side facing the cleaning needle mud mounting plate 2, and the outline dimension of the assembly groove 12 is not less than the outline dimension of the first cleaning needle mud 22.

[0060] The assembly groove 12 is mainly used to at least partially accommodate the first cleaning putty 22, thereby facilitating the assembly of the grinding needle pad mounting plate 1 and the cleaning putty mounting plate 2 during non-working hours. Since the first cleaning putty 22 is used to clean the grinding needle pad 11 in this embodiment, it typically protrudes from the cleaning putty mounting plate 2 and comes into contact with the grinding needle pad 11 during operation. To ensure that the grinding needle pad mounting plate 1 and the cleaning putty mounting plate 2 can be interlocked during non-working hours, an assembly groove 12 is provided on the side of the grinding needle pad mounting plate 1 facing the cleaning putty mounting plate 2 to accommodate, at least partially, the first cleaning putty 22, thereby reducing the gap width when the grinding needle pad mounting plate 1 and the cleaning putty mounting plate 2 are interlocked during non-working hours. Based on this, the outline dimension of the assembly groove 12 needs to be no less than the outline dimension of the first cleaning putty 22, that is, the size of the projection of the assembly groove 12 in the relative direction needs to be no less than the size of the projection of the first cleaning putty 22, so as to ensure that the assembly groove 12 can at least partially accommodate the first cleaning putty 22, so as to at least reduce the distance between the grinding needle pad mounting plate 1 and the cleaning putty mounting plate 2 when not in operation.

[0061] Furthermore, the depth of the assembly groove 12 is not less than the height of the first cleaning putty 22 protruding from the cleaning putty mounting plate 2. In this case, the assembly groove 12 can completely accommodate the first cleaning putty 22 protruding from the cleaning putty mounting plate 2. During non-working periods, when the grinding needle pad mounting plate 1 and the cleaning putty mounting plate 2 are engaged, the first cleaning putty 22 can be completely accommodated within the assembly groove 12, thus ensuring that there are no gaps when the grinding needle pad mounting plate 1 and the cleaning putty mounting plate 2 are engaged. In practice, the shape of the assembly groove 12 needs to correspond to the shape of the first cleaning putty 22 to ensure a complete engagement without gaps between the grinding needle pad mounting plate 1 and the cleaning putty mounting plate 2.

[0062] In this embodiment, the grinding needle pad mounting plate 1 also has an empty slot 13 on the side facing the cleaning needle mud mounting plate 2. This empty slot 13 can be used as spare space; for example, it can hold other functional components, such as another grinding needle pad 11 with a different surface roughness than the aforementioned grinding needle pad 11, to meet the cleaning needs of different types or materials of probes. The specific function of the empty slot 13 can be set according to actual conditions and is not specifically limited here.

[0063] Specifically, the outline dimensions of the aforementioned empty slot 13 can correspond to the outline dimensions of the aforementioned grinding needle pad 11. In this case, the empty slot 13 can be used as a space to temporarily place the grinding needle pad 11 when replacing it. Of course, in this embodiment, the specific function of the aforementioned empty slot 13 is not specifically limited, and depends on the specific situation. Under normal circumstances, the aforementioned empty slot 13, assembly slot 12, and grinding needle pad 11 are arranged sequentially along the circumference of the grinding needle pad mounting plate 1, and each component or groove occupies about one-third of the space of the grinding needle pad mounting plate 1.

[0064] Correspondingly, on the needle cleaning putty mounting tray 2, the aforementioned first needle cleaning putty 22, second needle cleaning putty 23, and through hole 21 can also be arranged sequentially along the circumference of the needle cleaning putty mounting tray 2, and each component or through hole 21 will occupy about one-third of the space of the needle cleaning putty mounting tray 2. The projections of the first needle cleaning putty 22 and the second needle cleaning putty 23 in the opposite direction will not overlap, which facilitates the automated cleaning of the probe. The specific process of cleaning the probe will be described in detail in the following embodiments, and will not be repeated here.

[0065] The probe cleaning mechanism provided in this embodiment allows the grinding needle pad mounting plate 1 and the cleaning needle mud mounting plate 2 to be interlocked without gaps during non-working hours by setting the assembly groove 12. The empty groove 13 facilitates the replacement of the grinding needle pad 11.

[0066] Example 3

[0067] The following describes a probe cleaning method provided in this embodiment. The probe cleaning method described below can be referred to in correspondence with the probe cleaning mechanism described above.

[0068] Please refer to Figure 3 , Figure 3 This is a flowchart of a probe cleaning method provided in an embodiment of the present invention.

[0069] See Figure 3 In this embodiment, the probe cleaning method is applied to the probe cleaning mechanism described in the above embodiments, and the probe cleaning method includes:

[0070] S101: Causes the grinding needle pad mounting plate and the cleaning needle mud mounting plate to rotate relative to each other in the circumferential direction.

[0071] The specific details of the probe cleaning mechanism have been described in detail in the above embodiments and will not be repeated here.

[0072] In this step, the cleaning putty mounting disc 2 can be driven to rotate circumferentially by the mounting disc drive mechanism. This rotation can be either stepwise or linear at a constant speed; no specific limitation is made here. It should be noted that during rotation, the first cleaning putty 22 can sweep across the surface of the grinding needle pad 11 to clean it.

[0073] S102: Control the probe to pass through the through hole and contact the grinding needle pad for cleaning.

[0074] In this embodiment, as the grinding needle pad mounting plate 1 and the cleaning putty mounting plate 2 rotate relative to each other, the through hole 21 can expose the grinding needle pad 11 that has been cleaned by the first cleaning putty 22. Accordingly, in this step, it is necessary to control the probe to pass through the through hole 21 and contact the cleaned grinding needle pad 11 in order to clean the probe.

[0075] Specifically, in this embodiment, the second cleaning paste 23 and the through hole 21 can be arranged circumferentially. Therefore, when the cleaning paste mounting plate 2 rotates, the through hole 21 and the second cleaning paste 23 can be rotated sequentially to below the probe, thereby facilitating the driving of the probe. This step can specifically include: driving the through hole 21 to rotate to below the probe, then driving the probe through the through hole 21 to contact the grinding pad 11 for cleaning, and after cleaning the probe through the grinding pad 11, driving the probe to detach from the through hole 21. This driving method only requires driving the probe to move vertically up and down, simplifying the probe driving structure. The way to drive the through hole 21 to rotate to below the probe can be by setting the rotation angle of the cleaning paste mounting plate 2, or by driving its rotation based on the image recognition result, or any other method can be used; no specific limitation is made here.

[0076] S103: After cleaning the probe with the grinding needle pad, control the probe to contact the second cleaning needle mud for cleaning.

[0077] In this embodiment, the probe is usually cleaned first with the grinding needle pad 11, and then the probe is cleaned with the second cleaning needle mud 23 to ensure that the particles on the probe surface can be adsorbed and removed.

[0078] Specifically, when the second cleaning needle slurry 23 and the through hole 21 are arranged in the circumferential direction, this step may specifically include: driving the second cleaning needle slurry 23 to rotate below the probe, then driving the probe to contact the second cleaning needle slurry 23 for cleaning, and then driving the probe to separate from the second cleaning needle slurry 23 after cleaning the probe with the second cleaning needle slurry 23. This driving method only requires driving the probe to move vertically up and down, which can simplify the structure of the probe driving structure. The way to drive the second cleaning needle slurry 23 to rotate below the probe can be by setting the rotation angle of the cleaning needle slurry mounting plate 2, or by driving its rotation based on the image recognition result, or any other method can be used, without specific limitation here.

[0079] The probe cleaning method provided in this embodiment allows the first cleaning paste 22 to clean residual particles on the grinding needle pad 11 as the grinding needle pad mounting plate 1 and the cleaning paste mounting plate 2 rotate circumferentially. Simultaneously, with rotation, the cleaning paste mounting plate 2 exposes the cleaned grinding needle pad 11, allowing the probe to pass through the through hole 21 and contact the cleaned grinding needle pad 11 for further cleaning. Since the second cleaning paste 23 is located on the surface of the cleaning paste mounting plate 2 facing away from the grinding needle pad mounting plate 1, after cleaning the probe with the grinding needle pad 11, the second cleaning paste 23 can be used for further cleaning to ensure effective cleaning and maintain probe cleanliness at all times.

[0080] Example 4

[0081] Please refer to Figure 4 , Figure 4 This is a state diagram of a specific probe cleaning process provided in an embodiment of the present invention.

[0082] This embodiment takes the following as an example: the grinding needle pad 11, the assembly groove 12, and the empty groove 13 are arranged in three equal parts on the grinding needle pad mounting plate 1; the first cleaning needle mud 22, the second cleaning needle mud 23, and the through hole 21 are arranged in three equal parts on the cleaning needle mud mounting plate 2. The specific content of the cooperation between the probe cleaning mechanism and the probe cleaning method is described in detail.

[0083] See Figure 4 In this embodiment, when not in use and under static conditions, the first cleaning putty 22 is positioned relative to the assembly groove 12, and the first cleaning putty 22 will be engaged within the assembly groove 12. The projection of the second cleaning putty 23 along the opposite direction can coincide with the grinding needle pad 11.

[0084] The first step is to rotate the first cleaning needle mud 22 towards the position of the grinding needle pad 11 during operation, and control the contact point between the first cleaning needle mud 22 and the grinding needle pad 11 during rotation, thereby cleaning the grinding needle pad 11.

[0085] The second step is to control the probe to pass through the through hole 21 and contact the grinding needle pad 11 to clean the probe when the through hole 21 is rotated to the position of the grinding needle pad 11.

[0086] Third, when the second cleaning needle mud 23 rotates back to the position of the grinding needle pad 11, the probe is controlled to contact the second cleaning needle mud 23 for a second cleaning of the probe. At this time, the relative position of the grinding needle pad mounting plate 1 and the cleaning needle mud mounting plate 2 is the same as the relative position when not in operation and stationary, thus facilitating a new round of probe cleaning operations.

[0087] The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0088] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.

[0089] The steps of the methods or algorithms described in conjunction with the embodiments disclosed herein can be implemented directly by hardware, a software module executed by a processor, or a combination of both. The software module can be located in random access memory (RAM), main memory, read-only memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, removable disk, CD-ROM, or any other form of storage medium known in the art.

[0090] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0091] The probe cleaning mechanism and method provided by this invention have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this invention. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this invention. It should be noted that those skilled in the art can make various improvements and modifications to this invention without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this invention.

Claims

1. A probe cleaning mechanism, characterized in that, It includes a grinding needle pad mounting plate and a cleaning needle mud mounting plate that are arranged opposite to each other; during operation, the grinding needle pad mounting plate and the cleaning needle mud mounting plate rotate relative to each other in the circumferential direction; The grinding needle pad mounting plate has a grinding needle pad on the surface facing the cleaning needle mud mounting plate. The mounting plate of the cleaning needle mud mounting plate has a through hole. The surface of the mounting plate facing the grinding needle pad mounting plate has a first cleaning needle mud, and the surface of the mounting plate facing away from the grinding needle pad mounting plate has a second cleaning needle mud. The first cleaning needle mud and the through hole are arranged sequentially along the circumferential direction. When the grinding needle pad mounting plate and the cleaning needle mud mounting plate rotate relative to each other in the circumferential direction, the first cleaning needle mud is used to clean the grinding needle pad, and the through hole is used to expose the cleaned grinding needle pad. The second cleaning agent and the through hole are arranged sequentially along the circumferential direction; It also includes a probe driving mechanism, which is connected to the probe; The probe driving mechanism is used for: When the through hole rotates to below the probe, the probe is driven to pass through the through hole to contact the grinding needle pad for cleaning, and after the probe is cleaned by the grinding needle pad, the probe is driven to disengage from the through hole. When the second cleaning sludge rotates to a position below the probe, it drives the probe to contact the second cleaning sludge for cleaning.

2. The probe cleaning mechanism according to claim 1, characterized in that, The grinding needle pad mounting plate is further provided with an assembly groove on the side facing the cleaning needle mud mounting plate, and the outline dimension of the assembly groove is not less than the outline dimension of the first cleaning needle mud.

3. The probe cleaning mechanism according to claim 2, characterized in that, The depth of the assembly groove is not less than the height of the first cleaning putty protruding from the cleaning putty mounting plate.

4. The probe cleaning mechanism according to claim 1, characterized in that, The grinding needle pad mounting plate also has an empty slot on the side facing the cleaning needle mud mounting plate.

5. The probe cleaning mechanism according to claim 4, characterized in that, The outline dimensions of the empty slot correspond to the outline dimensions of the grinding needle pad.

6. The probe cleaning mechanism according to claim 1, characterized in that, It also includes an installation disc drive mechanism, which is used to drive the cleaning needle installation disc to rotate along the circumferential direction.

7. A probe cleaning method, characterized in that, The probe cleaning mechanism according to claim 1 includes: The grinding needle pad mounting plate and the cleaning needle mud mounting plate rotate relative to each other in the circumferential direction; The control probe passes through the through hole to contact the grinding needle pad for cleaning; After cleaning the probe with the grinding needle pad, the probe is controlled to contact the second cleaning sludge for cleaning; The second cleaning agent and the through hole are arranged along the circumferential direction; The control probe passes through the through hole to contact the grinding needle pad for cleaning, including: Drive the through hole to rotate to below the probe, then drive the probe through the through hole to contact the grinding needle pad for cleaning, and after cleaning the probe through the grinding needle pad, drive the probe to disengage from the through hole; The step of controlling the probe to contact the second cleaning sludge for cleaning includes: The second cleaning sludge is driven to rotate to the area below the probe, and then the probe is driven to contact the second cleaning sludge for cleaning.

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