A removable soft pad and method for controlling deformation during grinding of thin sheet metal.

Abstract

This invention discloses a detachable soft pad and method for controlling deformation during grinding of thin sheet metal. The soft pad comprises a friction adsorption reinforcement layer, a microporous damping layer, and an elastic support layer, which are sequentially detachable and connected from top to bottom. The elastic support layer provides flexible buffering, the microporous damping layer absorbs processing vibrations through its closed-cell microporous structure, and the friction adsorption reinforcement layer enhances adsorption force and stability through non-uniform wave patterns and conical grooves. Its bottom-sealed design effectively prevents grinding fluid penetration. The layers work together to improve processing accuracy. The multi-layered design of the soft pad effectively reduces processing deformation by providing a positioning reference, significantly improving the problems of initial deformation, end-face runout, and flatness deviations in thin sheet metal caused by traditional rigid fixing or adsorption methods.

Description

Technical Field

[0001] This invention belongs to the technical field of machining auxiliary devices, and particularly relates to a detachable soft pad and method for controlling deformation during grinding of thin plates. Background Technology

[0002] The statements in this section are merely background information relating to this disclosure and do not necessarily constitute prior art.

[0003] Surface grinding of thin sheets is widely used in the production of metal sheets, crystals, glass, and semiconductor substrates. Its machining accuracy and surface quality directly affect the product's performance, reliability, and lifespan. Because thin sheets typically have low thickness and low rigidity, precise control of positioning and machining conditions is required during precision grinding to ensure dimensional accuracy and surface flatness. However, existing thin sheet grinding technologies face numerous challenges. Thin sheets often exhibit initial deformation before machining. During machining, external forces, strong clamping, and elastic recovery can easily lead to end-face runout, flatness deviations, and residual stress accumulation, resulting in unstable surface quality. These problems not only reduce machining accuracy but also increase the complexity of subsequent inspection and finishing, significantly impacting production efficiency and product quality.

[0004] In existing technologies, thin sheet metal grinding often employs rigid clamping or adsorption fixing methods (such as electromagnetic chucks or vacuum chucks) for positioning. Some technologies use rigid fixtures combined with adhesives to fix the workpiece and rotate it during grinding to achieve multi-faceted processing. However, this method relies on rigid contact, and the clamping force can easily induce contact stress, leading to deformation of the thin sheet metal or localized stress concentration. Furthermore, the adhesive curing process is complex and cumbersome, and it is difficult to flexibly adjust according to the workpiece material and size, limiting process adaptability. For non-magnetic thin sheet metal, the above processes are also unsuitable. Existing technologies have attempted to optimize fixture design, but most do not effectively control the initial deformation of the thin sheet metal, failing to meet the comprehensive requirements of high-precision grinding for deformation control and processing stability. After processing, additional finishing or manual correction is required, further increasing process complexity and production costs, limiting processing efficiency and process flexibility.

[0005] Therefore, there is an urgent need for a new type of thin sheet grinding technology that can effectively solve the problems of initial deformation of thin sheets, end face runout and flatness deviation caused by strong adsorption and elastic recovery during processing, overcome the limitations of existing technologies, and improve processing accuracy, efficiency and adaptability to diverse industrial applications. Summary of the Invention

[0006] Thin sheet metal workpieces are deformed before grinding. During the grinding process, strong suction clamping and elastic recovery can easily cause end face runout and flatness deviation. In order to overcome the shortcomings of the prior art, this invention provides a detachable soft pad and method for controlling the deformation of thin sheet metal during grinding. By optimizing the machining datum through the design of the positioning datum (i.e., the grinding datum surface), the phenomenon of deformation error replication is reduced.

[0007] To achieve the above objectives, one or more embodiments of the present invention provide the following technical solutions: In a first aspect, the present invention provides a detachable soft pad for controlling deformation during grinding of thin plates, the structure of which includes a friction adsorption enhancement layer, a microporous damping layer and an elastic support layer that are detached and connected sequentially from top to bottom. The upper surface of the triboad enhancement layer has a non-uniform wave pattern to increase the contact area and friction. The microporous damping layer has a closed-cell microporous structure for absorbing and dispersing vibrations; The elastic support layer is used to provide flexible support.

[0008] In a further technical solution, the elastic support layer is made of a low-hardness elastic material.

[0009] A further technical solution is that the microporous damping layer has uniformly distributed independent and closed micropores inside, and there are no interconnected channels between the pores.

[0010] In a further technical solution, the microporous damping layer is made of closed-cell foam elastic material.

[0011] In a further technical solution, the crest of the wave pattern is a rectangular protrusion, and the protrusion is provided with multiple conical grooves.

[0012] In a further technical solution, the elastic support layer, the microporous damping layer, and the friction adsorption enhancement layer are connected and fixed by a magnetic attraction structure.

[0013] In a further technical solution, the magnetic attraction structure is a ring-shaped flexible magnetic strip distributed along the edge of the pad.

[0014] In a further technical solution, the annular flexible magnetic strip is tightly fixed to the elastic support layer, the microporous damping layer, and the friction adsorption enhancement layer.

[0015] In a further technical solution, the gasket is also uniformly provided with multiple through holes, which vertically penetrate the elastic support layer, microporous damping layer and friction adsorption enhancement layer of the gasket.

[0016] Secondly, the present invention provides a method for controlling grinding deformation of thin sheet metal using a removable soft pad, comprising: A soft pad is obtained by connecting and fixing the friction adsorption enhancement layer, the microporous damping layer and the elastic support layer through a magnetic structure. The soft pad is placed on the surface of the adsorption device to cover the contact area of ​​the thin plate. The thin sheet is placed on a soft pad and fixed in place by an adsorption device; The first surface of the thin sheet is initially ground using a soft shim to form a grinding reference surface. After the processing is completed, the soft shim is removed. The thin sheet is flipped so that the first side of the thin sheet is in direct contact with the adsorption device, while the second side of the thin sheet is fixed upwards. Based on the accuracy of the grinding reference surface, the grinding parameters are dynamically adjusted using an online monitoring system to perform precision grinding on the second side of the thin sheet. The thin sheet is flipped over again so that its second side comes into direct contact with the adsorption device, while the first side of the thin sheet is fixed upwards. The grinding parameters are dynamically adjusted using an online monitoring system, and the sheet is ground alternately until both sides of the thin sheet have the same thickness.

[0017] The above one or more technical solutions have the following beneficial effects: The soft gasket in this invention features a multi-layered structure, which significantly improves the problems of initial deformation, end face runout, and flatness deviations in thin plates caused by traditional rigid fixing or adsorption methods. The elastic support layer in the soft gasket provides flexible cushioning, the microporous vibration damping layer absorbs processing vibrations through its closed-cell microporous structure, and the friction adsorption enhancement layer enhances adsorption force and stability through non-uniform wave patterns and conical grooves. Its bottom-sealed design effectively prevents grinding fluid penetration, and the synergistic effect improves processing accuracy.

[0018] The soft pad of this invention enables rapid assembly and disassembly through four-sided magnetic connection, adapts to various adsorption methods, requires no major equipment modifications, and has the advantages of low cost, strong adaptability, and high efficiency, providing an economical and efficient solution for precision grinding of thin plates in aerospace, electronics, automotive and other fields.

[0019] The soft gasket of this invention effectively reduces processing deformation by providing a positioning reference. It can be replaced and assembled in a timely and convenient manner according to the thickness requirements of the incoming workpiece, thereby improving processing accuracy and efficiency. Compared with the prior art, it significantly improves the problems of initial deformation, end face runout and flatness deviation caused by rigid adsorption. Attached Figure Description

[0020] The accompanying drawings, which form part of this invention, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an improper limitation of the invention.

[0021] Figure 1 This is a schematic diagram of the removable soft pad according to an embodiment of the present invention; Figure 2 This is a schematic diagram of circular saw blade grinding based on a soft pad according to an embodiment of the present invention; Figure 3 This is a schematic diagram of vacuum adsorption of a soft gasket in a thin plate grinding process according to an embodiment of the present invention; Figure 4 This is a schematic diagram of the open-pore structure of the soft gasket friction adsorption enhancement layer according to an embodiment of the present invention; Figure 5 This is a flowchart of a method for controlling the grinding deformation of thin plates using a removable soft pad, according to an embodiment of the present invention. Detailed Implementation

[0022] It should be noted that the following detailed descriptions are exemplary and intended to provide further illustration of the invention. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains.

[0023] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of exemplary embodiments according to the invention. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0024] Where there is no conflict, the embodiments and features in the embodiments of the present invention can be combined with each other.

[0025] Example 1 like Figure 1 As shown in the figure, this embodiment discloses a detachable soft pad for controlling the deformation during grinding of thin plates. Its structure includes a friction adsorption enhancement layer, a microporous damping layer, and an elastic support layer that are sequentially detachable from top to bottom. The upper surface of the friction adsorption enhancement layer has a non-uniform wave pattern to increase the contact area and friction. The microporous damping layer has a closed-cell microporous structure to absorb and disperse vibrations. The elastic support layer provides flexible support.

[0026] Each layer of the removable flexible gasket is a module, and the thickness or pore density of different modules can be adjusted according to different needs. Different modules can also be disassembled and merged for convenient combination and application. Modular design optimizes the processing benchmark, controls grinding deformation of thin plates, and improves processing accuracy and efficiency.

[0027] In this embodiment, the elastic support layer is located at the bottom layer and is made of a low-hardness elastic material (such as silicone or polyurethane) to provide flexible support and reduce the effect of contact stress on the deformation of the thin sheet.

[0028] In this embodiment, the microporous vibration damping layer is located in the middle layer and is made of closed-cell foam elastic material. It has a closed-cell microporous structure, that is, uniformly distributed independent and closed micropores inside, with no interconnected channels between the pores, forming a honeycomb-like discrete structure. The micropores are embedded in the rubber matrix in a three-dimensional random distribution to form an "elastic skeleton", which has both overall rigidity and local compressibility. The closed-cell microporous structure effectively absorbs and disperses vibration and dynamic stress fluctuations during the grinding process, suppresses end face runout and flatness deviation, and protects the thin sheet from the negative effects of processing deformation.

[0029] Preferably, the microporous damping layer can be made of butyl rubber closed-cell microporous material. This type of material has an independent and closed microporous structure, which can effectively absorb and disperse vibration and stress during the grinding process, while providing low air permeability and high flexibility to enhance the deformation control effect of thin sheet metal.

[0030] The closed-pore structure can effectively isolate grinding fluid penetration, enhance the adaptability of the processing environment, and ensure the stability of vibration reduction performance. Its thickness, pore size and density can be flexibly adjusted according to the workpiece material and processing requirements to adapt to different vibration intensities and workpiece rigidity requirements.

[0031] Through the above technical solution, the microporous walls undergo reversible elastic deformation under pressure, converting mechanical energy into heat energy. Furthermore, butyl rubber itself is resistant to acids, alkalis, and oils. Combined with the closed-cell structure, this ensures that its performance does not degrade when exposed to grinding fluid for extended periods. The wide temperature range of butyl rubber also ensures that the structure does not collapse during high-temperature grinding. The microporous vibration damping layer achieves a balance between rigidity and flexibility in deformation control through its closed-cell microporous structure, taking into account both vibration damping performance and environmental robustness.

[0032] In this embodiment, the friction adsorption enhancement layer is located on the top layer and is made of an elastic material (such as polyurethane). Its upper surface is designed with a non-uniform wave pattern, and the upper surface presents a periodic wave undulation to increase the contact area and friction with the thin plate. Multiple conical grooves are processed on the crests of the wave pattern. The conical grooves construct adsorption cavities and form a dense adsorption cavity array, which further enhances the adsorption force between the gasket and the workpiece and improves the adsorption stability.

[0033] Furthermore, the peaks on the upper surface of the friction adsorption enhancement layer are rectangular protrusions, and multiple conical grooves are evenly arranged on each rectangular protrusion. The top of the conical grooves is open to hold the workpiece and prevent the workpiece from slipping during processing. The conical grooves are formed by processing and adopt a bottom-sealed design to prevent grinding fluid from penetrating.

[0034] In some embodiments, the conical groove can also be set at the trough of the upper surface of the friction adsorption enhancement layer, and the conical groove can be randomly set at the peak and trough.

[0035] In some embodiments, when adsorbing a workpiece by vacuum adsorption, through holes are provided in the conical groove to enhance negative pressure adsorption, guide the negative pressure to concentrate on the thin plate, enhance the adsorption force, and prevent the workpiece from sliding. The conical groove, in synergy with the through holes, constructs a highly efficient negative pressure adsorption channel, further enhancing adsorption stability and preventing the workpiece from sliding or its end face from jumping during high-speed grinding.

[0036] The wavelength of the wavy pattern and the density of the conical grooves on the crest can be flexibly adjusted according to the workpiece material and processing requirements to adapt to different adsorption needs.

[0037] Preferably, the upper surface of the friction adsorption enhancement layer adopts a non-uniform wave pattern design with a wavelength range of 0.8 mm to 2.5 mm, a peak height of 0.1 mm to 0.3 mm, and multiple conical grooves uniformly machined on the peaks. The groove depth is 0.2 mm to 0.4 mm, the groove spacing is 0.5 mm to 1.8 mm, and the cone angle ranges from 30° to 60°. The flexible adjustment of the wave pattern wavelength and conical groove density can adapt to different workpiece materials, thicknesses, rigidities, and surface characteristics, ensuring optimal matching of adsorption force and processing stability. The parameter optimization of the wave pattern wavelength and conical groove density is based on the comprehensive requirements of the workpiece material's surface roughness, hardness, thickness, and processing environment (such as vacuum adsorption or electromagnetic adsorption). Specific parameter ranges can be determined through experiments or simulations to improve the process adaptability and processing accuracy of the soft pad.

[0038] For ultra-thin, low-rigidity, or smooth-surfaced workpieces (such as semiconductor silicon wafers and glass substrates), it is recommended to use short wavelengths (0.8 mm to 1.2 mm) and high-density conical grooves (groove spacing 0.5 mm to 1.0 mm) to form a dense array of adsorption cavities, enhance the negative pressure adsorption effect, uniformly distribute the adsorption force, and prevent workpiece deformation or slippage. For thicker, higher-rigidity, or rough-surfaced workpieces (such as 65Mn steel circular saw blade substrates and stainless steel plates), it is recommended to use long wavelengths (1.5 mm to 2.5 mm) and medium-density conical grooves (groove spacing 1.2 mm to 1.8 mm) to increase the contact area and friction, adapt to larger grinding forces and contact stresses, and ensure processing stability.

[0039] The thickness and material of the elastic support layer, microporous damping layer, and friction adsorption reinforcement layer can be adjusted and replaced at any time according to the different materials and processing requirements of the workpiece, making operation simple. The elastic support layer provides flexible support and buffering effect by adjusting the thickness and replacing materials with different hardness; the microporous damping layer optimizes the damping performance by adjusting the pore size, density, and thickness of butyl rubber to adapt to different vibration intensities and workpiece rigidity; the friction adsorption reinforcement layer enhances friction and adsorption stability through non-uniform wave texture and through-hole design, and its bottom sealed structure effectively isolates the influence of grinding fluid and processing environment, adapting to different processing needs.

[0040] In this embodiment, the layers of the detachable soft pad are connected and fixed by a magnetic attraction structure, which consists of annular flexible magnetic strips distributed along the periphery of the pad. The magnetic attraction structure can also be used to fix the pad to an adsorption device (such as a grinding machine electromagnetic chuck), achieving magnetic connection and fixation. Specifically, the top of the elastic support layer, the bottom and top of the microporous damping layer, and the bottom of the friction adsorption enhancement layer are each tightly attached to annular flexible magnetic strips, and are fixedly connected one by one through the magnetic strips.

[0041] In some implementations, the magnetic strips can be fixed to the edges of each layer by adhesive.

[0042] The ring-shaped flexible magnetic strip is matched to the gasket in shape, size, and thickness, providing magnetism to the gasket itself. This not only connects and fixes the layers but also magnetically attaches the gasket to the adsorption device. The magnetic strip is made of silicone coated with magnetic powder, approximately 1 mm wide, and the interlayer polarity matching enables automatic adsorption and manual disassembly. In other words, two adsorbed layers can be manually separated, and when the two layers are close together, they can automatically adsorb due to the magnetic strip.

[0043] The following application focuses on the circular saw blade substrate (65Mn steel). By using the aforementioned removable soft pad, the positioning accuracy and processing stability of the circular saw blade substrate during the grinding process are optimized, solving the problems of initial deformation, end face runout, and flatness deviation caused by traditional rigid contact, and ensuring the consistency of thickness on both sides.

[0044] Based on the material characteristics of the circular saw blade substrate (65Mn steel, initial thickness 3.02 mm, target thickness 2.84 mm), a removable soft shim is selected. The shim consists of an elastic support layer, a microporous damping layer, and a friction adsorption reinforcement layer. Each layer is fixed by a four-sided magnetic connection, supporting thickness adjustment and quick replacement. The magnetic structure is a ring-shaped flexible magnetic strip.

[0045] This embodiment uses an electromagnetic chuck for fixing the grinding machine, eliminating the need for through holes in the shims. The shims consist of three layers with the following thicknesses: an elastic support layer (bottom layer, PTFE) of 0.40 mm, providing flexible support and reducing the impact of contact stress on workpiece deformation; a microporous vibration damping layer (middle layer, butyl rubber closed-cell microporous material) of 0.42 mm, with micropore diameters of 0.3 mm and a 90% closed-cell rate, effectively absorbing processing vibrations through its closed-cell microporous structure, suppressing end-face runout and flatness deviations. The closed-cell structure also isolates grinding fluid penetration, ensuring stable vibration damping performance. The pore diameter and closed-cell rate can be adjusted according to workpiece rigidity and processing vibration intensity; and a friction adsorption enhancement layer (top layer, polyurethane) of 0.40 mm, with its upper surface designed as a non-uniform wave pattern. The wave peak height is 0.2 mm, and the wavelength is 1.5 mm, increasing the contact area and friction with the workpiece. The wave pattern surface is uniformly distributed with machined conical grooves (the conical grooves can be placed on the wave peaks or troughs), with a groove spacing of 1.5 mm and a groove depth of 0.3 mm. The cone angle is 35°, and an adsorption chamber is constructed to improve adsorption stability. The cone angle can be adjusted from 30° to 60° according to the workpiece material and adsorption requirements. In this embodiment, no through holes are provided because an electromagnetic chuck is used for fixation. The total thickness of the gasket is 1.22 mm to ensure machining allowance. The thickness and material of the three layers can be adjusted and changed at any time according to the workpiece material and machining requirements, making operation simple.

[0046] like Figure 2 As shown, the assembled soft pad is placed on the surface of the electromagnetic chuck, forming a contact interface with the circular saw blade substrate. The circular saw blade substrate is placed flat on the pad and fixed by the electromagnetic chuck. A grinding wheel is used to grind the first surface, with each pass being 0.01 mm, for a total grinding depth of 0.02 mm, creating a high-precision grinding reference surface. The elastic support layer provides flexible support, reducing contact stress. The microporous vibration damping layer absorbs processing vibration through its closed-cell microporous structure, suppressing end-face runout and flatness deviation. The friction adsorption enhancement layer enhances friction and adsorption stability through non-uniform wave patterns and conical grooves. The top and bottom sealing design of the conical grooves prevents grinding fluid penetration, ensuring processing stability. After processing, the pad is removed and will not be used in subsequent steps.

[0047] The specific data mentioned above, such as the cutting depth, number of grinding passes, and grinding amount during circular saw blade substrate grinding, are only examples and can be flexibly set according to actual application conditions, without specific limitations.

[0048] Example 2 This embodiment discloses a detachable soft pad for controlling deformation during grinding of thin plates. Its structure includes a friction adsorption enhancement layer, a microporous damping layer, and an elastic support layer that are sequentially detachable from top to bottom. The upper surface of the friction adsorption enhancement layer has a non-uniform wave pattern to increase the contact area and friction. The microporous damping layer has a closed-cell microporous structure to absorb and disperse vibrations. The elastic support layer provides flexible support.

[0049] In this embodiment, the gasket is uniformly provided with multiple through holes, which can form a negative pressure through vacuum adsorption to adsorb the thin sheet material and prevent the workpiece from sliding during processing. The through holes vertically penetrate the elastic support layer, microporous damping layer and friction adsorption enhancement layer of the gasket, forming a three-layer aligned continuous channel, which can ensure the smooth flow of fluid or negative pressure.

[0050] like Figure 4 As shown, the inner area surrounded by the magnetic strip of the pad is provided with multiple through holes that penetrate the three layers and are evenly distributed in a grid pattern. The number and size of the through holes are designed according to the area of ​​the thin plate and the adsorption requirements to ensure that the adsorption force is evenly distributed.

[0051] like Figure 3 As shown, when surface grinding non-magnetic / weakly magnetic materials that cannot be attracted by an electromagnetic chuck, the shim design is still applicable. Simply create a through-hole connecting three layers within the inner area of ​​the shim's magnetic stripe ring to achieve stable adsorption in conjunction with the vacuum chuck, ensuring grinding accuracy. When the external vacuum chuck is activated, negative pressure is transmitted through the through-hole to the contact surface between the shim and the workpiece (non-magnetic / weakly magnetic material), generating a uniformly distributed adsorption force that holds the workpiece in place.

[0052] The above technical solution solves the problems of unstable clamping and easy deformation in the grinding of non-magnetic / weakly magnetic thin plates, and achieves high-precision machining results.

[0053] Example 3 This embodiment discloses a method for controlling grinding deformation of thin sheet metal using a removable soft pad, including: S1: A soft pad is obtained by connecting and fixing the friction adsorption enhancement layer, the microporous damping layer and the elastic support layer through a magnetic attraction structure. The soft pad is placed on the surface of the adsorption device to cover the contact area of ​​the thin plate. In this embodiment, the assembled multi-layered soft pads are placed on the surface of the adsorption device, covering the contact area of ​​the thin sheet. The size of the soft pads is adapted to the thin sheet; the adsorption device is an electromagnetic chuck or a vacuum chuck, suitable for thin sheets of different materials.

[0054] S2: Place the thin sheet on a soft pad and fix it in place using an adsorption device; S3: Use a soft pad to perform initial grinding on the first surface of the thin sheet to form a grinding reference surface. After the processing is completed, remove the soft pad. In this embodiment, the flexible buffer, vibration reduction and friction optimization functions of the soft pad are used to perform the initial grinding of the first surface to form a high-precision grinding reference surface, reduce the processing stress, and the pad is removed after the processing is completed.

[0055] S4: Flip the thin sheet so that the first side of the thin sheet is in direct contact with the adsorption device, and fix the second side of the thin sheet facing upward. Based on the accuracy of the grinding reference surface, the grinding parameters are dynamically adjusted using an online monitoring system to perform precision grinding on the second side of the thin sheet. In this embodiment, relying on the accuracy of the first grinding reference surface, and combined with the online monitoring system (including a laser thickness gauge and a vibration sensor) to detect the thickness and processing vibration of the thin plate in real time, the grinding parameters are dynamically adjusted to perform precision grinding on the second surface.

[0056] S5: Flip the thin sheet again so that the second side of the thin sheet is in direct contact with the adsorption device, and fix the first side of the thin sheet facing upward. Use the online monitoring system to dynamically adjust the grinding parameters, and grind alternately until the thickness of both sides of the thin sheet is consistent, to ensure processing accuracy and stress balance.

[0057] Taking the adsorption device using an electromagnetic chuck as an example, the application method of the soft pad will be explained in detail below.

[0058] like Figure 5 As shown, following the comprehensive operation procedure, the circular saw blade base is flipped so that its first side faces down and directly contacts the electromagnetic chuck, while the second side faces up and is fixed in place. Based on the grinding accuracy of the first side's reference surface, and combined with an online monitoring system (laser thickness gauge and vibration sensor) to detect thickness and processing vibration in real time, the grinding parameters are dynamically adjusted. In this step, the second side is ground 9 times, with each cut being 0.01 mm, resulting in a total grinding depth of 0.09 mm on the second side. The total grinding depth is 0.18 mm (initial thickness 3.02 mm minus target thickness 2.84 mm). After deducting the 0.02 mm already ground on the first side, the remaining 0.16 mm is distributed between the front and back sides.

[0059] like Figure 5As shown, continuing with the comprehensive operation procedure, the circular saw blade base is flipped again so that its second side faces down and contacts the electromagnetic chuck, while the first side faces up and is fixed in place. The grinding parameters are adjusted using online monitoring data, and the remaining grinding is performed on the first side. The remaining grinding amount is 0.07 mm (total remaining 0.16 mm minus the 0.09 mm already ground on the second side). This step involves grinding the first side 7 times, with each pass having a depth of 0.01 mm and a grinding amount of 0.07 mm. The total grinding amount on the first side is 0.02 mm (base machining) + 0.07 mm (remaining machining) = 0.09 mm, consistent with the grinding amount on the second side (0.09 mm). The total number of grinding passes on both sides is 18 (9 passes on the first side and 9 passes on the second side), ensuring a balanced number of passes and achieving a final thickness of 2.84 mm, reducing stress unevenness caused by thickness asymmetry.

[0060] After processing, the thickness of the circular saw blade base was precisely measured. Measurements were taken at four different points on the circumference (top, bottom, left, and right), and the average of the four measurements was taken. The measured thickness was 2.84 mm, meeting the target processing thickness tolerance requirements. The average flatness was 0.06 mm, the average stress difference was 0.07 MPa, and the average end runout stress difference was 0.08 MPa, all meeting the quality standards, and the processing was deemed qualified.

[0061] This embodiment uses a 65Mn steel circular saw blade substrate as an example. A removable, multi-layered soft shim is used to establish a grinding reference surface during the initial machining. Subsequently, double-sided machining is completed through online monitoring and alternating grinding, ensuring consistent thickness on both sides. This shim effectively solves the problems of initial deformation, end-face runout, and flatness deviations caused by rigid adsorption of the circular saw blade substrate, improving machining accuracy and efficiency. The flatness and dimensional accuracy meet the standards after machining, requiring no additional finishing, providing an efficient and economical solution for the grinding of circular saw blade substrates.

[0062] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

[0063] While the specific embodiments of the present invention have been described above in conjunction with the accompanying drawings, this is not intended to limit the scope of protection of the present invention. Those skilled in the art should understand that various modifications or variations that can be made by those skilled in the art without creative effort based on the technical solutions of the present invention are still within the scope of protection of the present invention.

Claims

1. A detachable soft shim for sheet grinding deformation control, characterized by, Its structure includes a friction adsorption enhancement layer, a microporous damping layer, and an elastic support layer, which are disassembled and connected sequentially from top to bottom; The upper surface of the friction adsorption enhancement layer is a non-uniform wave pattern, which is used to increase the contact area and friction force; the peaks of the wave pattern are rectangular protrusions, and the protrusions are provided with multiple conical grooves. The microporous damping layer has a closed-cell microporous structure for absorbing and dispersing vibrations; the closed-cell microporous structure consists of independently closed micropores uniformly distributed inside the microporous damping layer, with no interconnected channels between the pores. The elastic support layer is used to provide flexible support; The elastic support layer, the microporous damping layer, and the friction adsorption enhancement layer are connected and fixed by a magnetic attraction structure; the magnetic attraction structure is a ring-shaped flexible magnetic strip distributed along the edge of the pad; the ring-shaped flexible magnetic strip is tightly fixed to the elastic support layer, the microporous damping layer, and the friction adsorption enhancement layer. The gasket is also evenly provided with multiple through holes, which vertically penetrate the elastic support layer, microporous damping layer and friction adsorption enhancement layer of the gasket.

2. A detachable soft shim for sheet grinding distortion control as defined in claim 1, wherein, The elastic support layer is made of a low-hardness elastic material.

3. A removable soft pad for controlling deformation during grinding of thin sheet metal as described in claim 1, characterized in that, The microporous damping layer is made of closed-cell foam elastic material.

4. A method for controlling grinding deformation of thin sheet metal using a removable soft shim as described in any one of claims 1-3, characterized in that, include: A soft pad is obtained by connecting and fixing the friction adsorption enhancement layer, the microporous damping layer and the elastic support layer through a magnetic structure. The soft pad is placed on the surface of the adsorption device to cover the contact area of ​​the thin plate. The thin sheet is placed on the soft pad, and the soft pad is fixed by an adsorption device; The first surface of the thin sheet is initially ground using a soft shim to form a grinding reference surface. After the processing is completed, the soft shim is removed. The thin sheet is flipped so that the first side of the thin sheet is in direct contact with the adsorption device, while the second side of the thin sheet is fixed upwards. Based on the accuracy of the grinding reference surface, the grinding parameters are dynamically adjusted using an online monitoring system to perform precision grinding on the second side of the thin sheet. The thin sheet is flipped over again so that its second side comes into direct contact with the adsorption device, while the first side of the thin sheet is fixed upwards. The grinding parameters are dynamically adjusted using an online monitoring system, and the sheet is ground alternately until both sides of the thin sheet have the same thickness.

Images