一种尾部镀金的MEMS探针及其制备方法
By depositing gold plating on the tail and sidewalls of MEMS probes using photolithography and electrolysis, the problems of difficult fixture fixation and plating in existing technologies are solved, enabling low-cost, high-performance probe fabrication.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SOLARIS NANOFAB LTD
- Filing Date
- 2025-06-25
- Publication Date
- 2026-07-17
AI Technical Summary
The existing gold plating process for MEMS probe tails requires fixture fixation, which is difficult to operate, costly, and the gaps in the fixture can easily cause plating to seep into non-gold-plated areas, affecting probe performance.
The uncut and stripped MEMS probe is windowed using photolithography. Based on the principle of electrolysis, gold ions are deposited on the probe tail and sidewalls under direct current to form a gold plating layer. The non-gold plating areas are protected by photoresist.
The gold plating process has been simplified, reducing costs and improving the stability, conductivity, and corrosion resistance of the probe. It is suitable for industrial production, and the gold plating layer is intact and has a long service life.
Smart Images
Figure CN120681719B_ABST