Air-cooling device and semiconductor apparatus

Abstract

The application provides a kind of air cooling device and semiconductor equipment, and the top cover of protective cover is provided with multiple communication ports, and the air cooling device includes: air inlet structure is arranged above the protective cover, and the air inlet structure includes: air inlet is arranged on the top surface of air inlet structure, and multiple independent air ducts are located in the inside of air inlet structure;Air inlet includes multiple sub-air inlets, and the inflow end of each air duct corresponds to at least one sub-air inlet, and the outflow end corresponds to at least one communication port;The ratio of the total flow area of the communication port corresponding to each air duct and the total flow area of the sub-air inlet corresponding thereto is the same.The air cooling device of the application is up in the cooling air, so not only can the difference of the cooling air flow to each part of the annular reflector be reduced, but also the consistency of the cooling air temperature flowing to each part of the annular reflector can be improved, and further, the cooling uniformity of each part of the annular reflector can be improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more specifically, to an air-cooling device and semiconductor equipment. Background Technology

[0002] The working principle of silicon epitaxial equipment is to use chemical vapor deposition (CVD) technology to deliver reaction gases to the process chamber, and then heat them to react and deposit a single crystal layer on the substrate.

[0003] The process chamber is heated using a heating module, which includes a heating lamp and a reflector. Infrared light emitted from the heating lamp is reflected by the reflector and shines onto the tray used to support the substrate, bringing the tray to the process temperature. Since the process temperature range is typically as high as 1000℃ to 1200℃, the heating module temperature becomes excessively high as the process time increases, severely impacting its lifespan. To mitigate the negative effects of excessive heating, an air-cooling device is used to cool the heating module.

[0004] Currently, the air-cooling device uses a side-inlet and side-outlet airflow method. Specifically, cooling air flows in through the side wall of the protective cover that covers the heating module, passes through the reflectors and individual heating lamps inside the cover, then flows downwards and exits through the side wall of the cover to carry away the heat from the reflectors and heating lamps. However, this method results in poor cooling uniformity. Summary of the Invention

[0005] The present invention aims to at least solve the technical problem of poor cooling uniformity in the prior art, and proposes an air-cooling device and a semiconductor device.

[0006] In a first aspect, the present invention provides an air-cooling device applied to a semiconductor device, the semiconductor device including a heating module and a protective cover, the protective cover including an annular shell and a top cover covering the top of the shell, the inner circumferential surface of the shell and the bottom surface of the top cover together forming a mounting cavity for accommodating the heating module; the top cover is provided with a plurality of communication ports communicating with the mounting cavity, the plurality of communication ports being spaced apart and evenly distributed around the central axis of the protective cover, and the shell is provided with an air outlet; the air-cooling device includes: an air inlet structure disposed above the protective cover;

[0007] The air intake structure includes: an air inlet on the top surface of the air intake structure and multiple independent ventilation ducts located inside the air intake structure; the air inlet includes multiple sub-air inlets, and the inflow end of each ventilation duct is connected to at least one sub-air inlet and the outflow end is connected to at least one connecting port.

[0008] The ratio of the total flow area of ​​the connecting openings corresponding to each ventilation duct to the total flow area of ​​its corresponding sub-air inlet is the same.

[0009] In one implementation of the first aspect of the present invention, an annular space is defined within the air intake structure, and the annular space is divided into a plurality of ventilation ducts; each ventilation duct includes at least a first connecting area, the first connecting areas of each ventilation duct are distributed around the central axis of the protective cover, and the orthographic projection of the connecting opening corresponding to each ventilation duct along the vertical direction falls into the first connecting area of ​​the ventilation duct;

[0010] The ventilation duct having a first connecting area that is not directly opposite the corresponding sub-air inlet also includes a second connecting area connected to the first connecting area of ​​the ventilation duct, the second connecting area extending circumferentially along the annular space to the corresponding sub-air inlet.

[0011] In one implementation of the first aspect of the present invention, the air intake structure includes a first annular partition plate and a second annular partition plate disposed coaxially in an internal hollow cavity. The second annular partition plate is disposed around the outside of the first annular partition plate. The first annular partition plate, the second annular partition plate, the top surface and the bottom surface of the air intake structure together form the annular space.

[0012] In one implementation of the first aspect of the present invention, five ventilation ducts are provided, namely, an inner air duct, a first middle air duct, a second middle air duct, a first outer air duct, and a second outer air duct arranged concentrically; except for the inner air duct, the first middle air duct, the second middle air duct, the first outer air duct, and the second outer air duct all include a second connecting area; a portion of the inner air duct, the second connecting area of ​​the first middle air duct, and the second connecting area of ​​the first outer air duct are arranged sequentially from inside the mounting cavity to outside the mounting cavity, and the remaining portion of the inner air duct, the second connecting area of ​​the second middle air duct, and the second connecting area of ​​the second outer air duct are arranged sequentially from inside the mounting cavity to outside the mounting cavity.

[0013] In one implementation of the first aspect of the present invention, the orthographic projection of one of the connecting ports along the vertical direction falls simultaneously into the first connecting area of ​​the first external air duct and the first connecting area of ​​the second external air duct.

[0014] In one implementation of the first aspect of the present invention, the air inlet is provided with a first diverter plate, and a second diverter plate and a third diverter plate that are parallel to each other; one end of the first diverter plate is connected to the inner wall of the air inlet and the other end is connected to the second diverter plate, and the first diverter plate and the third diverter plate are cross-connected, the air inlet is divided into five sub-air inlets, and the five sub-air inlets are connected to the five ventilation ducts one by one.

[0015] In one implementation of the first aspect of the present invention, the total flow area of ​​the connecting openings corresponding to each of the ventilation ducts is the same; or, the total flow area of ​​the connecting openings corresponding to at least two of the ventilation ducts is different.

[0016] In one implementation of the first aspect of the present invention, the flow area of ​​each of the connecting ports is the same.

[0017] In one implementation of the first aspect of the present invention, each of the sub-inlets is provided with a guide slope, which extends downward at an inclination from the top surface to the bottom surface of the air inlet structure.

[0018] In a second aspect, the present invention also provides a semiconductor device, comprising: a process chamber, a protective cover, a heating module, and any of the above-mentioned air-cooling devices provided in the first aspect of the present invention, wherein the heating module is disposed in the mounting cavity of the protective cover, and the air inlet structure of the air-cooling device is disposed above the protective cover.

[0019] In one implementation of the second aspect of the present invention, the heating module includes a plurality of heating lamps spaced apart and evenly distributed around the central axis of the protective cover; the orthographic projection of each of the communication ports on the top surface of the air inlet structure is located between the orthographic projections of two adjacent heating lamps on the top surface of the air inlet structure; and the flow area of ​​each of the communication ports is the same.

[0020] The present invention has the following beneficial effects:

[0021] The air-cooling device and semiconductor equipment provided by this invention form an upward-inlet, side-outlet flow channel for cooling air on the protective cover. The ratio of the total flow area of ​​the connecting openings corresponding to each ventilation channel to the total flow area of ​​its corresponding sub-inlet is the same. This helps to reduce the difference in cooling air volume flowing to different parts of the annular reflector. Furthermore, after entering the mounting cavity through each connecting opening, the cooling air flows from top to bottom. A portion of the cooling air entering through the connecting openings flows directly to the corresponding part of the annular reflector, thus the cooling air in contact with the annular reflector does not carry heat from other components, and the temperature of the cooling air in contact with each part of the annular reflector is the same.

[0022] In summary, by reducing the difference in cooling airflow volume across different parts of the annular reflector and improving the uniformity of cooling air temperature in contact with different parts of the annular reflector, the difference in cooling effect across different parts of the annular reflector can be effectively reduced, thus improving the cooling uniformity of the annular reflector. Attached Figure Description

[0023] Figure 1 A schematic cross-sectional view of a semiconductor device in a top-view direction, provided for related technologies;

[0024] Figure 2 for Figure 1 A schematic cross-sectional view of the semiconductor device shown along the AA direction;

[0025] Figure 3 for Figure 1 The diagram shown is a three-dimensional schematic of a semiconductor device omitting part of the process chamber structure.

[0026] Figure 4 A schematic cross-sectional view of a semiconductor device provided in an embodiment of this application;

[0027] Figure 5 for Figure 4 A schematic cross-sectional view of the semiconductor device shown along the BB direction;

[0028] Figure 6 A three-dimensional schematic diagram of a semiconductor device omitting a portion of the process chamber, provided as an embodiment of this application;

[0029] Figure 7 A three-dimensional structural diagram illustrating the connection between the protective cover and the air inlet structure according to an embodiment of this application;

[0030] Figure 8 A schematic cross-sectional view of an air intake structure provided in an embodiment of this application from a top perspective;

[0031] Figure 9 This is a schematic diagram of the air inlet structure of an air-cooled device provided in an embodiment of this application;

[0032] Figure 10 A top view schematic diagram of the air inlet structure of an air-cooled device provided in an embodiment of this application;

[0033] Figure 11 A schematic diagram of the air inlet of the air-cooling device provided in an embodiment of this application.

[0034] Explanation of reference numerals in the attached figures:

[0035] 100 - Semiconductor equipment;

[0036] 10-Air-cooled device; 11-Air inlet structure; 111-First diverter plate; 112-Second diverter plate;

[0037] 1122 - Air inlet; 1124 - Guide slope; 1125 - Inner air duct; 1126 - First middle air duct; 1127 - Second middle air duct; 1128 - First outer air duct; 1129 - Second outer air duct; 113 - Third diverter plate; 14 - Air inlet duct; 15 - Air outlet duct; 160 - First annular partition plate; 161 - Second annular partition plate; 162 - First arc-shaped partition plate; 163 - Second arc-shaped partition plate; 164 - First barrier plate; 165 - Second barrier plate; 166 - Third barrier plate; 167 - Fourth barrier plate; 168 - Fifth barrier plate; 169 - Sixth barrier plate;

[0038] 20 - Process chamber; 21 - Upper dome; 22 - Tray;

[0039] 30 - Protective cover; 31 - Housing; 310 - Air outlet; 32 - Top cover; 321 - Connecting port; 33 - Annular support plate;

[0040] 40 - Heating module; 41 - Heating lamp; 42 - Ring reflector;

[0041] 200-substrate. Detailed Implementation

[0042] Figure 1 A schematic cross-sectional view of a semiconductor device in a top-view direction, provided for related technologies. Figure 2 for Figure 1 The diagram shows a cross-sectional view of the semiconductor device along the AA direction. Figure 3 for Figure 1 The diagram shown is a three-dimensional schematic of a semiconductor device, omitting a portion of the process chamber structure. According to... Figures 1 to 3 The semiconductor device 100' shown in the related technology has a process chamber 20' with an upper dome 21'. The process chamber 20' contains a tray 22', which supports a substrate 200. Infrared light emitted by a heating lamp 41' is reflected by a reflector 42' and passes through the transparent upper dome 21' to irradiate the tray 22', heating it to 1000°C–1200°C, causing a single-crystal layer to grow on the surface of the substrate 200 supported by the tray 22'. To achieve cooling, the outlet end of the air inlet duct 14' is connected to an air inlet 1122' on the side wall of the protective cover 30', and the inlet end of the air outlet duct 15' is connected to an air outlet 310' on the side wall of the protective cover 30'. In practical applications, the heat dissipation path is roughly as follows: Cooling air flows into the air inlet duct 14' from the inlet end, then enters the protective cover 30' through the air inlet 1122'. The cooling air diffuses within the protective cover 30', flows past the reflector 42' and the heating lamp 41', and then enters the air outlet duct 15' through the air outlet 310' to exit outside the protective cover 30'. The flow path of the cooling air within the protective cover 30' is as follows: Figure 1 and Figure 2 As indicated by the dashed arrow.

[0043] When using this semiconductor equipment for epitaxial processes, the process quality is poor. The inventors of this application discovered that one of the reasons for this problem is that the cooling effect varies greatly at different parts of the reflector, that is, the cooling uniformity of the reflector is poor. This results in large temperature differences and different reflectivities on the surface of the reflector. Consequently, the infrared light reflected from different parts to the tray varies, leading to temperature differences on the tray and affecting the uniformity of the epitaxial process.

[0044] Another reason for this problem is that during the epitaxial process, reactants, i.e., coatings, are deposited on the inner wall of the process chamber. The cooling airflow passing over the upper surface of the upper dome also has a cooling effect on the upper dome. However, the cooling effect varies greatly in different parts of the upper dome, i.e., the cooling uniformity of the upper dome is poor. This results in temperature differences in various parts of the upper dome, and the distribution of the film grown on the lower surface of the upper dome also varies. This, in turn, affects the distribution of infrared light passing through the upper dome, thus affecting the uniformity of the epitaxial process.

[0045] In general, the uniformity of the epitaxial process is closely related to the uniformity of the cooling effect. Through further careful research, the inventors discovered that the uniformity of the cooling effect is related to the flow path of the cooling air. Firstly, in related technologies, the cooling air flow path is side-in, side-out. This results in a large volume of cooling air near the air inlet within the protective cover, and a smaller volume near the air outlet, leading to uneven airflow. This, in turn, causes the reflector to dissipate heat faster near the air inlet and slower further away. Secondly, the cooling air entering the protective cover from the side wall has downward kinetic energy, resulting in less cooling air flowing between the heating lamp near the air inlet and the upper dome. This leads to a significant difference in the heat dissipation effect of the upper dome surface corresponding to that heating lamp compared to the other heating lamps. Third, the cooling air enters the protective cover from the side wall of the protective cover. As the cooling air diffuses from the area near the air inlet to the area away from the air inlet, it carries some of the heat from the heating lamps and reflectors it passes through, which in turn causes the temperature of the cooling air that comes into contact with different parts of the reflector and each heating lamp to be different.

[0046] Based on this, the following embodiments of this application provide an air-cooling device and a semiconductor device. To enable those skilled in the art to better understand the technical solution of this invention, the air-cooling device and semiconductor device provided by this invention will be described in detail below with reference to the accompanying drawings.

[0047] Figure 4 This is a top-view cross-sectional schematic diagram of a semiconductor device provided in an embodiment of this application. Figure 5 for Figure 4The diagram shows a cross-sectional view of the semiconductor device along the BB direction. Figure 6 This is a perspective view of a semiconductor device with a partially omitted process chamber, provided as an embodiment of this application. Please refer to... Figures 4 to 6 The semiconductor device 100 includes a process chamber 20, a heating module 40, an air-cooling device 10, and a protective cover 30 disposed above the process chamber 20. The process chamber 20 has an upper dome 21, and a tray 22 is placed inside the process chamber 20 to support a substrate 200. The semiconductor device 100 is used to perform silicon epitaxial processes to grow an epitaxial layer on the substrate 200.

[0048] The protective cover 30 includes an annular housing 31 and a top cover 32 that covers the top of the housing 31. The bottom surface of the top cover 32 and the inner circumferential surface of the housing 31 together form an installation cavity for accommodating the heating module 40.

[0049] For example, the protective cover 30 can be a separate component. For instance, the housing 31 and the top cover 32 can be connected by snap-fit, welding, bonding, or screwing. Alternatively, the protective cover 30 can be a single piece formed by a molding process. Compared to making the protective cover 30 a separate component, this not only eliminates the assembly process of the housing 31 and the top cover 32, but also improves the structural strength of the protective cover 30 without increasing costs.

[0050] An annular support plate 33 is also fixedly installed inside the mounting cavity. The annular support plate 33 is connected to the inner circumferential surface of the housing 31. The annular support plate 33 divides the mounting cavity into a first space and a second space. The first space is located above the second space. The first space and the second space are connected through a through hole in the middle of the annular support plate 33.

[0051] like Figure 4 and Figure 6 As shown, along the extension direction of the central axis of the protective cover 30, the cross-sectional shape of the shell 31 and the top cover 32 can be a regular hexagon. Of course, the cross-sectional shape of the shell 31 and the top cover 32 is not limited to this, and can also be circular, rectangular, regular pentagonal, octagonal, etc.

[0052] The heating module 40 mentioned above is used to heat the tray 22, bringing it to the process temperature. Please refer to... Figures 4 to 6The heating module 40 includes an annular reflector 42 and multiple heating lamps 41. The heating lamps 41 are specifically disposed within the first space and fixed to the annular support plate 33. The annular support plate 33 provides support for the heating lamps 41, ensuring their stable installation within the mounting cavity. The annular reflector 42 is also specifically disposed within the first space and positioned above the heating lamps 41, reflecting the infrared light emitted by the heating lamps 41 back to the tray 22. The annular reflector 42 can be gold-plated, which offers advantages such as heat insulation and high reflectivity.

[0053] Specifically based on Figure 4 In the example shown, there may be twelve heating lamps 41, and the twelve heating lamps 41 are evenly distributed around the central axis of the protective cover 30 so that the infrared light projected onto the annular reflector 42 is evenly distributed.

[0054] The top cover 32 has multiple connecting openings 321 extending through its thickness, and the central axis of the connecting openings 321 coincides with the central axis of the annular reflector 42. The number of connecting openings 321 can be the same as the number of heating lamps 41, depending on the specific requirements. Figure 4 In the example shown, when there are twelve heating lamps 41, there are also twelve connecting ports 321, which are evenly distributed around the central axis of the protective cover 30. It is understood that the number of heating lamps 41 and the number of connecting ports 321 are not limited to the above numbers, as long as there are multiple heating lamps 41 and multiple connecting ports 321.

[0055] The housing 31 also has an air outlet 310 extending through its thickness. Thus, the connecting port 321, the mounting cavity, and the air outlet 310 are sequentially connected to form a flow channel, along which cooling air flows. The air outlet 310 is located below the heating lamp 41, allowing as much cooling air as possible to pass through the heating lamp 41 and then be discharged outside the protective cover 30. (Reference) Figure 5 As shown, the air outlet 310 can be specifically located below the annular support plate 33 and communicates with the second space of the mounting cavity.

[0056] Figure 7 This is a three-dimensional structural diagram illustrating the connection between the protective cover and the air inlet structure according to an embodiment of this application. Please refer to... Figure 7 The air-cooling device 10 provided in this application embodiment also includes an air inlet structure 11 disposed above the protective cover 30, and the top surface of the air inlet structure 11 is provided with an air inlet 1122.

[0057] Figure 8 This is a schematic cross-sectional view of an air intake structure provided in an embodiment of this application, viewed from above. Please refer to... Figure 8 The air intake structure 11 also has multiple independent ventilation ducts inside.

[0058] Figure 9This is a schematic diagram of the air inlet structure of an air-cooled device provided in an embodiment of this application. Figure 10 This is a top view schematic diagram of the air inlet structure of an air-cooled device provided in an embodiment of this application. The air inlet 1122 includes multiple sub-air inlets, and the inflow end of each ventilation duct is connected to at least one sub-air inlet, and the outflow end is connected to at least one connecting port 321. The orthographic projection of each sub-air inlet onto the bottom surface of the top cover 32 falls into the corresponding ventilation duct to achieve connection.

[0059] Furthermore, the ratio of the total flow area of ​​the connecting opening 321 corresponding to each ventilation duct to the total flow area of ​​its corresponding sub-inlet is the same. In other words, for any ventilation duct, if the ratio of the total flow area of ​​the sub-inlet corresponding to that ventilation duct to the total flow area of ​​its corresponding connecting opening 321 is K, then K is the same for each ventilation duct in this application. For example, the total flow area of ​​the sub-inlet corresponding to one of the ventilation ducts is 1 mm². 2 The total flow area of ​​the connecting port 321 corresponding to the ventilation duct is 1 mm². 2 The K value for this ventilation duct is 1. The total flow area of ​​the sub-inlet corresponding to the other ventilation duct is 2 mm². 2 The total flow area of ​​the connecting port 321 corresponding to the ventilation duct is 2mm. 2 The K value corresponding to this ventilation duct is also 1. It can be seen that the total flow area of ​​the connecting port 321 corresponding to the ventilation duct is directly proportional to the total flow area of ​​its corresponding sub-air inlet.

[0060] In this way, the cooling air delivered to the air inlet 1122 is distributed according to the proportion of the total flow area of ​​each sub-air inlet. Since the ratio of the total flow area of ​​the sub-air inlet corresponding to each ventilation duct to the total flow area of ​​its corresponding connecting port 321 is the same, the ratio of the cooling air volume in each ventilation duct to the total flow area of ​​its corresponding connecting port 321 is also equal, thus making the ratio of the air volume of each connecting port 321 to its flow area equal. Therefore, the air volume per unit area of ​​each connecting port 321 is the same.

[0061] According to this embodiment, the heat dissipation path during the epitaxial process of the semiconductor device 100 is as follows: Cooling air flows to the air inlet 1122 on the top surface of the air inlet structure 11, and is distributed into multiple streams according to the flow area of ​​each sub-air inlet. The multiple streams of cooling air flow into the ventilation ducts corresponding to the sub-air inlets, and then enter the mounting cavity through the connecting port 321 corresponding to the ventilation ducts. Then, it flows from top to bottom towards the bottom of the housing 31. Part of the cooling air flows through the annular reflector 42, carrying away some of the heat from the annular reflector 42 before continuing to flow downward. Part of the cooling air flows between two adjacent heating lamps 41, carrying away some of the heat from the heating lamps 41 before continuing to flow downward. Then, the cooling air flows through the central through-hole of the annular support plate 33 into the second space and diffuses in the second space. The cooling air contacts the upper surface of the upper dome 21, carrying away some of the heat from the upper dome 21 before being discharged from the air outlet 310 to the outside of the protective cover 30. The flow path of the cooling air in the protective cover 30 is as follows: Figure 4 and Figure 5 As indicated by the dashed arrow.

[0062] Therefore, in the semiconductor device 100 using the air-cooling device 10 of this embodiment, during the process, the cooling air forms an upward-inlet and side-outlet flow channel, and the ratio of the total flow area of ​​the connecting port 321 corresponding to each ventilation channel to the total flow area of ​​its corresponding sub-inlet is the same. Thus, the cooling air diffuses into the protective cover 30 through multiple connecting ports 321 and flows downward after entering the mounting cavity. The airflow per unit area of ​​each connecting port 321 is the same, which helps to reduce the difference in cooling airflow to different parts of the annular reflector 42.

[0063] Furthermore, since the cooling air flows from top to bottom after entering the mounting cavity through each connecting port 321, some of the cooling air entering through the connecting port 321 flows directly to the corresponding part on the annular reflector 42. Therefore, the cooling air in contact with the annular reflector 42 does not carry the heat of other components, and the temperature of the cooling air in contact with each part of the annular reflector 42 is the same.

[0064] In summary, by reducing the difference in cooling air volume flowing through different parts of the annular reflector 42 and improving the uniformity of cooling air temperature in contact with different parts of the annular reflector 42, the difference in cooling effect among different parts of the annular reflector 42 can be effectively reduced, thus improving the cooling uniformity of the annular reflector 42.

[0065] In addition, with Figure 2 Compared with the related technologies shown, the cooling air entering the protective cover 30 from the communication port 321 of the top cover 32 in this embodiment has downward kinetic energy, which can reduce the adverse effects of the cooling air entering and exiting from the side on the uniformity of heat dissipation effect of each part of the upper dome, and is conducive to improving the consistency of heat dissipation effect of each part of the upper dome.

[0066] In some embodiments, such as Figure 6 As shown, the air-cooling device 10 may also include an air inlet duct 14, which is located outside the protective cover 30. The outlet end of the air inlet duct 14 is connected to the air inlet 1122, and the air inlet duct 14 serves to introduce cooling air. In this way, the cooling air, driven by the fan, flows through the air inlet duct 14 to the air inlet 1122, then flows into the ventilation duct, and then flows along the outlet end of the ventilation duct to the connecting port 321.

[0067] In some embodiments, such as Figure 6 As shown, the air-cooling device 10 may also include an air outlet duct 15, which is located outside the protective cover 30. The inlet end of the air outlet duct 15 is connected to the air outlet 310, and the air outlet duct 15 serves to discharge cooling air. In this way, cooling air carrying heat flows into the air outlet duct 15 through the air outlet 310, and then is discharged outside the protective cover 30 along the air outlet duct 15.

[0068] In some embodiments, please combine Figure 8 and Figure 10 The air intake structure 11 defines an annular space, which is divided into multiple ventilation ducts. In other words, multiple ventilation ducts can collectively form an annular space. It should be noted that the annular space referred to here can be... Figure 8 The circular ring shown can also be square-shaped. The following description uses a circular annular space as an example.

[0069] Furthermore, each ventilation duct includes at least a first connecting area, and the first connecting areas of each ventilation duct are distributed sequentially around the central axis of the protective cover 30. The vertical projection of the connecting opening of each ventilation duct falls into the first connecting area of ​​that ventilation duct. At the same time, ventilation ducts with a first connecting area that is not directly opposite the corresponding sub-air inlet also include a second connecting area. The second connecting area is connected to the first connecting area of ​​the ventilation duct and extends circumferentially along the annular space to its corresponding sub-air inlet.

[0070] This arrangement ensures that each of the interconnecting ports, spaced apart and evenly distributed along the central axis of the protective cover 30, can connect to a corresponding sub-air inlet via its corresponding ventilation duct.

[0071] It should be understood that the specific structure of the air intake structure 11 in the air-cooling device 10 disclosed herein is varied. For example, the bottom of the air intake structure 11 may be open, and the air intake structure 11 can be regarded as a cover to cover the protective cover 30. Alternatively, the bottom of the air intake structure 11 may be closed, and the air intake structure 11 can be regarded as a hollow box. In this example, the bottom plate of the air intake structure 11 has multiple openings corresponding one-to-one with multiple connecting ports 321. The multiple openings are spaced apart and evenly distributed around the central axis of the protective cover 30, and the orthographic projection of each opening on the top surface of the air intake structure 11 and the orthographic projection of its corresponding connecting port 321 on the top surface of the air intake structure 11 completely coincide. Thus, the cooling air flowing into the ventilation duct from the sub-air intake flows through the openings to the corresponding connecting port 321.

[0072] Taking the air inlet structure 11 as an example of a hollow box, the air inlet structure 11 includes a first annular partition plate 160 and a second annular partition plate 161 disposed in the hollow cavity. The first annular partition plate 160 and the second annular partition plate 161 are coaxially arranged, and their centers are both located on the central axis of the protective cover 30. The second annular partition plate 161 surrounds the outside of the first annular partition plate 160. In this way, the first annular partition plate 160, the second annular partition plate 161, the top surface and the bottom surface of the air inlet structure 11 together form an annular space, which is circular.

[0073] When the bottom of the air intake structure 11 is open, the first annular partition plate 160, the second annular partition plate 161, the top surface of the air intake structure 11 and the top surface of the top cover 32 together form an annular space.

[0074] Please refer to a specific example in this application. Figure 8 and Figure 10 The air intake structure 11 may further include a first arc-shaped partition plate 162, a second arc-shaped partition plate 163, a first barrier plate 164, a second barrier plate 165, a third barrier plate 166, a fourth barrier plate 167, a fifth barrier plate 168, and a sixth barrier plate 169 disposed within the annular space. The top ends of each of the aforementioned partition plates and barrier plates are connected to the top surface of the air intake structure 11.

[0075] The first arc-shaped partition plate 162 is located between the first annular partition plate 160 and the second annular partition plate 161, with the center of the first arc-shaped partition plate 162 located on the central axis of the annular reflector 42. The first barrier plate 164 and the second barrier plate 165 extend radially along the annular reflector 42. The two ends of the first barrier plate 164 are connected to the first ends of the first annular partition plate 160 and the first arc-shaped partition plate 162, respectively, and the two ends of the second barrier plate 165 are connected to the second ends of the first annular partition plate 160 and the first arc-shaped partition plate 162, respectively. Thus, the first arc-shaped partition plate 162, the first barrier plate 164, the second barrier plate 165, and the first annular partition plate 160 together form a sub-channel.

[0076] The second arc-shaped partition plate 163 is located within the sub-channel, between the first arc-shaped partition plate 162 and the first annular partition plate 160. The center of the second arc-shaped partition plate 163 is located on the central axis of the annular reflector 42. The third barrier plate 166 and the fourth barrier plate 167 extend radially along the annular reflector 42. The two ends of the third barrier plate 166 are connected to the first ends of the first annular partition plate 160 and the second arc-shaped partition plate 163, respectively. The two ends of the fourth barrier plate 167 are connected to the second ends of the first annular partition plate 160 and the second arc-shaped partition plate 163, respectively. Thus, the second arc-shaped partition plate 163, the third barrier plate 166, the fourth barrier plate 167, and the top and bottom surfaces of the top cover 32 together form an inner air duct 1125, which is arc-shaped and located within the sub-channel.

[0077] The fifth barrier plate 168 and the sixth barrier plate 169 also extend radially along the annular reflector 42. One end of the fifth barrier plate 168 is connected to the side of the second arc-shaped partition plate 163 facing the first arc-shaped partition plate 162, and the other end is connected to the inner circumferential surface of the second annular partition plate 161. One end of the sixth barrier plate 169 is connected to the inner circumferential surface of the second annular partition plate 161, and there is a gap between the other end and the first annular partition plate 160.

[0078] As can be seen, the third barrier plate 166, the second arc-shaped partition plate 163, the fourth barrier plate 167, and the first annular partition plate 160 together form the inner air duct 1125. The second arc-shaped partition plate 163, the fourth barrier plate 167, a portion of the fifth barrier plate 168, the second barrier plate 165, a portion of the first arc-shaped partition plate 162, and the first annular partition plate 160 together form the first central air duct 1126. The third barrier plate 166, the second arc-shaped partition plate 163, a portion of the fifth barrier plate 168, the first barrier plate 164, the remaining portion of the first arc-shaped partition plate 162, and the first annular partition plate 160 together form the second central air duct 1127. The first arc-shaped partition plate 162, the second barrier plate 165, a portion of the fifth barrier plate 168, a portion of the second annular partition plate 161, the first annular partition plate 160, and the sixth barrier plate 169 together form the first external air duct 1128. The first arc-shaped partition plate 162, the first barrier plate 164, a portion of the fifth barrier plate 168, the remaining portion of the second annular partition plate 161, the first annular partition plate 160, and the sixth barrier plate 169 together form the second external air duct 1129. Because there is a gap between the other end of the sixth barrier plate 169 and the first annular partition plate 160, the first external air duct 1128 and the second external air duct 1129 are connected.

[0079] Thus, in this embodiment, five ventilation ducts are formed, namely, an inner air duct 1125, a first middle air duct 1126, a second middle air duct 1127, a first outer air duct 1128, and a second outer air duct 1129, all arranged concentrically. Except for the inner air duct 1125, the first middle air duct 1126, the second middle air duct 1127, the first outer air duct 1128, and the second outer air duct 1129 all include a second connecting area. Along the radial direction of the annular reflector 42, portions of the inner air duct 1125, the second connecting areas of the first middle air duct 1126 and the first outer air duct 1128 are sequentially arranged from the inside of the mounting cavity to the outside of the mounting cavity; the remaining portions of the inner air duct 1125, the second connecting areas of the second middle air duct 1127 and the second connecting areas of the second outer air duct 1129 are sequentially arranged from the inside of the mounting cavity to the outside of the mounting cavity.

[0080] With this design, all five ventilation ducts are arc-shaped, with their centers located on the central axis of the annular reflector 42. In this way, the cooling air flowing out of each sub-air inlet can flow smoothly along the corresponding arc-shaped ventilation duct with low wind resistance, so as to minimize the loss of kinetic energy of the cooling air flow.

[0081] Of course, the number of ventilation ducts is not limited to the above number; the specific number can be designed according to the needs and actual working conditions.

[0082] As a further optional embodiment, please continue to refer to Figure 8 and Figure 10One of the connecting ports 321, when projected vertically, falls into the first connecting area of ​​the first external air duct 1128 and the first connecting area of ​​the second external air duct 1129. This connecting port 321 is located in the gap between the first annular partition plate 160 and the sixth barrier plate 169. With this arrangement, the first external air duct 1128 and the second external air duct 1129 are connected.

[0083] In some embodiments, all the connecting ports 321 have the same flow area. Since the air volume per unit area of ​​each connecting port 321 is the same, this embodiment designs each connecting port 321 to have the same flow area and correspondingly the same air volume. This helps to further improve the uniformity of cooling air distribution within the protective cover 30, improves the consistency of cooling air volume flowing from top to bottom to various parts of the annular reflector 42, and further improves the cooling uniformity of the annular reflector 42.

[0084] It is understandable that the number of sub-inlets and connecting ports 321 corresponding to the inflow end of each ventilation duct and the total flow area are not limited.

[0085] In one possible implementation, the total flow area of ​​the connecting ports 321 corresponding to each ventilation duct can be the same, thus the total airflow of the connecting ports 321 corresponding to each ventilation duct is the same. With the flow area of ​​each connecting port 321 being the same, the number of connecting ports 321 corresponding to each ventilation duct is also the same, and the airflow delivered to each ventilation duct is the same. For example, the inflow end of each ventilation duct is connected to one sub-inlet, and the outflow end is connected to one connecting port. Another example is that the inflow end of each ventilation duct is connected to one sub-inlet, and the outflow end is connected to multiple connecting ports 321. Based on this, taking twelve connecting ports 321 and four ventilation ducts as an example, the outflow end of each ventilation duct is connected to three of the twelve connecting ports 321, and there are four sub-inlets. The ratio of the flow area of ​​the four sub-inlets is 1:1:1:1. It should be understood that, compared to the implementation in which the outlet of each ventilation duct is connected to a single connection port 321, the number of ventilation ducts can be reduced and the structure of the ventilation ducts can be simplified, thereby simplifying the internal structure of the air intake structure 11.

[0086] In one possible implementation, the number of connecting ports 321 corresponding to the outflow ends of at least two ventilation ducts differs. For example, such as Figure 8 and Figure 10 As shown, there are twelve connecting ports 321 and five ventilation ducts. The inner air duct 1125, the first central air duct 1126, and the second central air duct 1127 are connected to three of the twelve connecting ports 321, respectively. The ventilation volume of these three ventilation ducts is, for example, 2A m. 3 / h, the first external air duct 1128 and the second external air duct 1129 are connected together with the remaining three connecting ports 321, and the ventilation volume of these two ventilation ducts is 1A m. 3 / h.

[0087] Figure 11 This is a schematic diagram of the air inlet of the air inlet structure of an air-cooled device provided in one embodiment of this application. Please refer to it as well. Figures 8 to 11 In one embodiment, five ventilation ducts are provided: an inner air duct 1125, a first middle air duct 1126, a second middle air duct 1127, a first outer air duct 1128, and a second outer air duct 1129. In another embodiment, twelve connecting ports 321 are provided. The air inlet is equipped with a first diverter plate 111, and parallel to each other, a second diverter plate 112 and a third diverter plate 113. One end of the first diverter plate 111 is connected to the inner wall of the air inlet, and the other end is connected to the second diverter plate 112. The first diverter plate 111 and the third diverter plate 113 are cross-connected.

[0088] In this example, the air inlet 1122 is divided into five sub-air inlets 1122a, 1122b, 1122c, 1122d, and 1122e. The flow areas of the sub-air inlet 1122a corresponding to the inner air duct 1125, the sub-air inlet 1122b corresponding to the first middle air duct 1126, and the sub-air inlet 1122c corresponding to the second middle air duct 1127 are equal, for example, all are B m. 2 Correspondingly, the flow areas of a sub-inlet 1122d corresponding to the first external air duct 1128 and a sub-inlet 1122e corresponding to the second external air duct 1129 are equal and both are 0.5 μm. 2 .

[0089] In other words, such as Figure 11 As shown, the sum of the flow areas of a sub-inlet 1122a corresponding to the inner air duct 1125, a sub-inlet 1122b corresponding to the first middle air duct 1126, a sub-inlet 1122c corresponding to the second middle air duct 1127, a sub-inlet 1122d corresponding to the first outer air duct 1128, and a sub-inlet 1122e corresponding to the second outer air duct 1129 is 1:1:1:1. Thus, the ratio of the total flow area of ​​the connecting opening 321 corresponding to each ventilation duct to the ratio of the total flow area of ​​its corresponding sub-inlet is the same.

[0090] As an optional embodiment, please continue to refer to Figure 9Each sub-inlet can also have a guide slope 1124 formed inside it, which extends downwards from the top to the bottom of the air inlet structure 11. The guide slope 1124 can be implemented by a guide block or guide plate fixedly installed inside the sub-inlet, as long as the guide block or guide plate does not block the sub-inlet.

[0091] With this design, the guide slope 1124 can play a guiding role, so as to guide the cooling air to flow into the ventilation duct along the guide slope 1124.

[0092] In some embodiments, please continue reading Figure 4 The orthographic projection of each connection port 321 on the top surface of the air inlet structure 11 is located between the orthographic projections of two adjacent heating lamps 41 on the top surface of the air inlet structure 11. Therefore, the cooling air entering the mounting cavity through each connection port 321 flows between the two adjacent heating lamps 41. The cooling air flowing between the two adjacent heating lamps 41 carries part of the heat of the heating lamps 41 and then diffuses downwards to the second space, thus achieving the cooling of each heating lamp 41.

[0093] It should be noted that in embodiments where the orthographic projection of each connection port 321 on the top surface of the air inlet structure 11 lies between the orthographic projections of two adjacent heating lamps 41 on the top surface of the air inlet structure 11, and all connection ports 321 have the same flow area, the airflow and heat of the cooling air flowing through all parts of the upper dome 21 are basically the same. Therefore, the cooling effect is consistent throughout the upper dome 21, improving the uniformity of the thin film grown on the lower surface of the upper dome 21, which in turn helps to promote the uniform distribution of infrared light passing through the upper dome 21. Thus, when performing epitaxial processes on the substrate 200 using this semiconductor device 100, the uniformity of the epitaxial process is high.

[0094] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. An air-cooling device for semiconductor equipment, characterized in that, The semiconductor device includes a heating module and a protective cover. The protective cover includes an annular housing and a top cover that covers the top of the housing. The inner circumferential surface of the housing and the bottom surface of the top cover together form a mounting cavity for accommodating the heating module. The top cover has multiple communication ports that communicate with the mounting cavity. The multiple communication ports are spaced apart and evenly distributed around the central axis of the protective cover. The housing has an air outlet. The air-cooling device includes an air inlet structure disposed above the protective cover. The air intake structure includes: an air inlet on the top surface of the air intake structure and multiple independent ventilation ducts located inside the air intake structure; the air inlet includes multiple sub-air inlets, and the inflow end of each ventilation duct is connected to at least one sub-air inlet and the outflow end is connected to at least one connecting port. The ratio of the total flow area of ​​the connecting openings corresponding to each of the ventilation ducts to the total flow area of ​​their corresponding sub-air inlets is the same; The heating module includes a ring-shaped reflector and multiple heating lamps; the multiple heating lamps are spaced apart and evenly distributed around the central axis of the protective cover.

2. The air-cooling device according to claim 1, characterized in that, The air intake structure has an annular space defined within it, and the annular space is divided into a plurality of ventilation ducts. Each ventilation duct includes at least a first connecting area, and the first connecting areas of each ventilation duct are distributed sequentially around the central axis of the protective cover. The vertical projection of the connecting opening of each ventilation duct falls into the first connecting area of ​​the ventilation duct. The ventilation duct having a first connecting area that is not directly opposite the corresponding sub-air inlet also includes a second connecting area connected to the first connecting area of ​​the ventilation duct, the second connecting area extending circumferentially along the annular space to the corresponding sub-air inlet.

3. The air-cooling device according to claim 2, characterized in that, The air intake structure includes a first annular partition plate and a second annular partition plate arranged coaxially in an internal hollow cavity. The second annular partition plate is arranged around the outside of the first annular partition plate. The first annular partition plate, the second annular partition plate, the top surface and the bottom surface of the air intake structure together form the annular space.

4. The air-cooling device according to claim 2, characterized in that, The ventilation duct is provided in five parts, which are respectively an inner air duct, a first middle air duct, a second middle air duct, a first outer air duct and a second outer air duct arranged concentrically; except for the inner air duct, the first middle air duct, the second middle air duct, the first outer air duct and the second outer air duct all include a second connecting area; The inner air duct portion, the second connecting area of ​​the first middle air duct, and the second connecting area of ​​the first outer air duct are arranged sequentially from inside the mounting cavity to outside the mounting cavity, and the remaining portion of the inner air duct, the second connecting area of ​​the second middle air duct, and the second connecting area of ​​the second outer air duct are arranged sequentially from inside the mounting cavity to outside the mounting cavity.

5. The air-cooling device according to claim 4, characterized in that, The vertical projection of one of the connecting ports falls into the first connecting area of ​​the first external air duct and the first connecting area of ​​the second external air duct.

6. The air-cooling device according to claim 4, characterized in that, The air inlet is provided with a first diverter plate, as well as a second diverter plate and a third diverter plate that are parallel to each other; One end of the first diverter plate is connected to the inner wall of the air inlet, and the other end is connected to the second diverter plate. The first diverter plate and the third diverter plate are cross-connected. The air inlet is divided into five sub-air inlets, and the five sub-air inlets are connected to the five ventilation ducts one by one.

7. The air-cooling device according to claim 1, characterized in that, The total flow area of ​​the connecting openings corresponding to each of the ventilation ducts is the same; or, the total flow area of ​​the connecting openings corresponding to at least two of the ventilation ducts is different.

8. The air-cooling device according to claim 1, characterized in that, Each of the sub-inlets has a guide slope formed therein, the guide slope extending downwards at an angle from the top surface to the bottom surface of the air inlet structure; and / or, The flow area of ​​each of the aforementioned connecting ports is the same.

9. A semiconductor device, characterized in that, include: Process chambers; Protective shield; The heating module is disposed within the mounting cavity of the protective cover; as well as The air-cooling device as described in any one of claims 1 to 8, wherein the air inlet structure of the air-cooling device is disposed above the protective cover.

10. The semiconductor device according to claim 9, characterized in that, The orthographic projection of each of the connecting ports on the top surface of the air intake structure lies between the orthographic projections of two adjacent heating lamps on the top surface of the air intake structure.

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