An electromechanical hybrid ultra-low frequency MEMS vibration measurement sensor and method

Abstract

This invention discloses an electromechanical hybrid ultra-low frequency MEMS vibration measurement sensor and method, belonging to the field of vibration sensor technology. The electromechanical hybrid ultra-low frequency MEMS vibration measurement sensor of this invention includes a sensor housing, a vibration module installed inside the sensor housing, a movable disk outside the vibration module, and a first elastic vibrating plate at the lower end of the movable disk. A MEMS chip is installed below the sensor housing. A movable seat is installed inside the mounting disk, and telescopic sleeves are installed on both sides of the movable seat. This invention solves the problems of inconvenient vibration orientation determination and difficulty in adjusting the detection module, resulting in limited adaptability of vibration sensors in practical use. This invention uses a vibration spring connection to transmit vibrations. After the movable seat moves and drives the vibrating diaphragms on both sides to contact the movable rod, they quickly rebound, causing the diaphragms to vibrate, which in turn causes the air to vibrate, thus performing the measurement.

Description

Technical Field

[0001] This invention relates to the field of vibration sensor technology, specifically to an electromechanical hybrid ultra-low frequency MEMS vibration measurement sensor and method. Background Technology

[0002] The transmission method of a traditional MEMS microphone is that the MEMS chip diaphragm receives the sound transmitted through the air. The sound pressure signal passes through the sound inlet and is sensed by the high-sensitivity vibrating diaphragm of the MEMS chip, converting the sound signal into an electrical signal. The MEMS chip then converts the sound into changes in capacitance and resistance, while the ASIC chip converts these changes into electrical signals.

[0003] Chinese patent CN217389002U discloses a MEMS vibration sensor. The MEMS vibration sensor includes a housing, a PCB board, an acoustic element, a vibration module, and a baffle. The housing and PCB board are sealed together to form a first cavity. The vibration module is located within the first cavity and includes a dam, an elastic vibrating plate, and a mass block. One end of the dam is fixed to the inside of the housing, and the elastic vibrating plate is located at the other end of the dam. The housing, dam, and elastic vibrating plate together form a second cavity. The baffle is larger than the inner diameter of the first through-hole. When the elastic vibrating plate vibrates up and down, the baffle can prevent the elastic vibrating plate from moving further toward the MEMS chip and ASIC chip, protecting the normal operation of the MEMS chip and ASIC chip.

[0004] The vibration sensors described in the above patents are not convenient to determine the vibration direction in actual use, and the detection module is not easy to adjust, so their adaptability is generally limited. Therefore, they do not meet the existing needs. In response, we propose an electromechanical hybrid ultra-low frequency MEMS vibration measurement sensor and method. Summary of the Invention

[0005] The purpose of this invention is to provide an electromechanical hybrid ultra-low frequency MEMS vibration measurement sensor and method, which solves the problems mentioned in the background art that the vibration direction is inconvenient to determine and the detection module is not easy to adjust in actual use, resulting in limited adaptability of the vibration sensor.

[0006] To achieve the above objectives, the present invention provides the following technical solution: an electromechanical hybrid ultra-low frequency MEMS vibration measurement sensor, comprising a sensor housing, a vibration module installed inside the sensor housing, a movable disk arranged outside the vibration module, a first elastic vibration plate arranged at the lower end of the movable disk, and a MEMS chip installed below the sensor housing;

[0007] It also includes a mounting plate for mounting the measuring structure, which is installed below the sensor housing. A movable seat is installed inside the mounting plate, and telescopic sleeves are installed on both sides of the movable seat. A movable rod is provided on one side of the telescopic sleeve, and a vibration diaphragm is provided on both sides of the movable seat. A vibration spring is installed between the movable seat and the vibration module.

[0008] Preferably, a cover plate is installed at the upper end of the sensor housing, and a connecting plate is installed at the lower end of the sensor housing. A limit rod is installed between the cover plate and the connecting plate. A mounting box is installed below the mounting plate. The mounting box is used to install and fix the MEMS chip, and a reinforcing plate is welded between the mounting plate and the mounting box.

[0009] Preferably, the lower end of the vibration module is embedded inside the connecting disk and movably connected to the connecting disk, the movable disk is welded to the vibration module, and one side of the first elastic vibrating plate extends to the outside of the movable disk and is movably connected to the movable disk.

[0010] Preferably, a rotating bolt is installed at the upper end of the cover plate, an adjusting screw is installed at the lower end of the rotating bolt, a pressure plate is provided at the lower end of the adjusting screw, and the lower end of the pressure plate is in contact with the vibration module.

[0011] Preferably, the upper end of the rotating bolt is provided with a fastening sleeve, and a wire is installed inside the fastening sleeve. The wire is electrically connected to the MEMS chip, and the wire is sealed to the fastening sleeve through the fastening sleeve.

[0012] Preferably, the mounting plate has an integrally formed sliding groove inside, the movable seat has a guide wheel installed on the outside, the guide wheel is embedded in the sliding groove and slidably connected to the mounting plate, the movable rod has a limit spring installed on the outside, one end of the movable rod extends into the telescopic sleeve and is slidably connected to the telescopic sleeve, and the two ends of the limit spring are fixedly connected to the movable rod and the telescopic sleeve respectively.

[0013] Preferably, a positioning plate is installed at the lower end of the mounting box, and twelve detection segment plates surround the outside of the mounting box. A spring damper is provided at one end of each detection segment plate, and the two ends of the spring damper are fixedly connected to the mounting box and the positioning plate, respectively. A compression spring rod is provided inside the detection segment plate, and the compression spring rod extends into the interior of the mounting box and is slidably connected to the mounting box and the detection segment plates, respectively. A second elastic vibration plate is provided inside the mounting box.

[0014] Preferably, a heat sink is provided at the bottom of the mounting box for heat dissipation of the MEMS chip, and a fixing plate is installed at the lower end of the heat sink. The fixing plate has an integrally formed positioning port inside, and a connecting rod is installed between the fixing plate and the mounting box. A locking plate is installed between the connecting rod and the fixing plate.

[0015] The present invention also provides another technical solution: a measurement method for an electromechanical hybrid ultra-low frequency MEMS vibration measurement sensor, comprising the following steps:

[0016] Step 1: Quickly fix the connecting rod to the fixing plate using the locking plate, and then install the fixing plate.

[0017] Step 2: By adjusting the rotating bolt, rotate the adjusting screw to push the pressure plate and press the vibration module down. Adjust the position of the vibration module according to the testing environment.

[0018] Step 3: Connect the power supply to the MEMS chip via wires to perform the detection work. During the movement of the rotating bolt, the tight sleeve maintains the sealing effect to ensure the air pressure inside the sensor and improve the detection effect of air vibration.

[0019] Step 4: After the vibration module is subjected to pressure, the movable disk drives the first elastic vibrating plate to vibrate. The first elastic vibrating plate is equipped with a diaphragm ring on its outside. The diaphragm ring senses the first elastic vibrating plate, which compresses or pushes the air in the vibration space to vibrate, thereby measuring the vibration. After the vibration module and the movable seat are subjected to pressure, they are connected by a vibration spring and transmit the vibration to each other. When the movable seat moves, the vibrating diaphragms on both sides contact the movable rod and then quickly rebound, causing the diaphragms to vibrate and driving the air to vibrate. The MEMS chip is used to sense the amplitude of the air vibration and measure the vibration.

[0020] Step 5: During operation, the pressure on the compressed spring rod is sensed by the second elastic vibrating plate, thereby detecting the vibration of each of the twelve detection segment plates and determining the vibration direction.

[0021] Compared with the prior art, the beneficial effects of the present invention are:

[0022] 1. In this invention, when the vibration module is subjected to pressure, the movable disc drives the first elastic vibrating plate to vibrate. A diaphragm ring is provided on the outside of the first elastic vibrating plate. The diaphragm ring senses the first elastic vibrating plate, which compresses or pushes the air in the vibration space to vibrate, thereby performing measurement vibration work. When the vibration module and the movable seat are subjected to pressure, they are connected by a vibration spring and transmit vibration to each other. When the movable seat moves, the vibrating membranes on both sides contact the movable rod and quickly rebound, causing the vibrating membranes to vibrate, which in turn causes the air to vibrate, thus performing measurement work. The position of the movable rod is limited by a limit spring. After the vibrating membrane moves outside the movable rod, the elasticity of the movable rod pushes the vibrating membrane back, causing the vibrating membrane to vibrate, which in turn causes the surrounding air to vibrate, thus performing detection work.

[0023] 2. This invention adjusts the position of the vibration module by rotating the rotating bolt and turning the adjusting screw, which pushes the pressure plate to press down on the vibration module. This adjustment is made according to the detection environment, resulting in better adjustability and adaptability of the sensor, which is beneficial for long-term operation. Furthermore, the second elastic vibration plate can sense the pressure on the compressed spring rod, thereby detecting the vibration of each of the twelve detection segment plates and determining the vibration direction, thus improving detection accuracy, adapting to different working environments, and being easy to adjust. Attached Figure Description

[0024] Figure 1 This is an isometric view of the front view of the present invention;

[0025] Figure 2 This is an axonometric view of the invention from below;

[0026] Figure 3 This is a top-view axonometric view of the present invention;

[0027] Figure 4 This is a diagram of the internal structure of the present invention;

[0028] Figure 5 For the present invention Figure 4 Enlarged view of a portion of area A in the middle;

[0029] Figure 6 This is a diagram showing the internal structure of the mounting box of the present invention.

[0030] In the diagram: 1. Sensor housing; 101. Cover plate; 102. Connecting plate; 103. Vibration module; 1031. Movable plate; 1032. First elastic vibrating plate; 1033. Vibration spring; 104. Adjusting screw; 2. Rotating bolt; 201. Fastening sleeve; 202. Wire; 3. Mounting plate; 301. Reinforcing plate; 302. Movable seat; 303. Telescopic sleeve; 304. Movable rod; 305. Limiting spring; 306. Guide wheel; 307. Vibrating diaphragm; 308. Sliding groove; 4. Mounting box; 401. Positioning plate; 402. Detection segment plate; 403. Spring damper; 404. Heat sink; 405. Compression spring rod; 406. Second elastic vibrating plate; 5. Fixed plate; 501. Positioning port; 502. Locking plate; 503. Connecting rod; 6. MEMS chip. Detailed Implementation

[0031] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0032] To address the issues of inconvenient vibration orientation determination, difficulty in adjusting the detection module, and limited adaptability in existing systems, please refer to [link to relevant documentation]. Figure 1 , Figure 4 - Figure 5 This embodiment provides the following technical solution:

[0033] An electromechanical hybrid ultra-low frequency MEMS vibration measurement sensor includes a sensor housing 1. A vibration module 103 is installed inside the sensor housing 1. A movable disk 1031 is provided outside the vibration module 103. A first elastic vibrating plate 1032 is provided at the lower end of the movable disk 1031. When the vibration module 103 is subjected to pressure, the movable disk 1031 drives the first elastic vibrating plate 1032 to vibrate. A diaphragm ring is provided outside the first elastic vibrating plate 1032. The diaphragm ring senses the first elastic vibrating plate 1032. The first elastic vibrating plate 1032 compresses or pushes the air in the vibration space to vibrate, thereby measuring the vibration. A MEMS chip 6 is installed at the bottom of the sensor housing 1. The MEMS chip 6 is used to sense the amplitude of air vibration and measure the vibration.

[0034] It also includes a mounting plate 3, which is used to install the measuring structure. The mounting plate 3 is installed below the sensor housing 1. A movable seat 302 is installed inside the mounting plate 3. Telescopic sleeves 303 are installed on both sides of the movable seat 302. A movable rod 304 is provided on one side of the telescopic sleeve 303. Vibrating diaphragms 307 are provided on both sides of the movable seat 302. A vibration spring 1033 is installed between the movable seat 302 and the vibration module 103. When the vibration module 103 and the movable seat 302 are subjected to pressure, they are connected through the vibration spring 1033 and transmit vibration to each other. When the movable seat 302 moves, it drives the vibrating diaphragms 307 on both sides to contact the movable rod 304 and then quickly rebound, causing the vibrating diaphragms 307 to vibrate, which drives the air to vibrate and perform the measurement work.

[0035] A cover plate 101 is installed on the upper end of the sensor housing 1, and a connecting plate 102 is installed on the lower end of the sensor housing 1. A limiting rod is installed between the cover plate 101 and the connecting plate 102. The limiting rod supports the connecting plate 102 and the cover plate 101, improving the positional stability of the cover plate 101 for maintenance and subsequent use. A mounting box 4 is installed below the mounting plate 3. The mounting box 4 is used to install and fix the MEMS chip 6. A reinforcing plate 301 is welded between the mounting plate 3 and the mounting box 4. The reinforcing plate 301 limits the position of the mounting plate 3 and the mounting box 4 to improve the working effect.

[0036] The mounting plate 3 has an integrally formed sliding groove 308 inside. The movable seat 302 is equipped with a guide wheel 306 on the outside. The guide wheel 306 is embedded in the sliding groove 308 and slidably connected to the mounting plate 3. The movable rod 304 is equipped with a limit spring 305 on the outside. One end of the movable rod 304 extends into the telescopic sleeve 303 and is slidably connected to the telescopic sleeve 303. The two ends of the limit spring 305 are fixedly connected to the movable rod 304 and the telescopic sleeve 303 respectively. The position of the movable rod 304 is limited by the limit spring 305. After the vibrating diaphragm 307 moves to the outside of the movable rod 304, the elasticity of the movable rod 304 pushes the vibrating diaphragm 307 back, causing the vibrating diaphragm 307 to vibrate, which drives the surrounding air to vibrate, thus performing the testing work.

[0037] Specifically, when the vibration module 103 is subjected to pressure, the movable disc 1031 drives the first elastic vibrating plate 1032 to vibrate. A diaphragm ring is provided on the outside of the first elastic vibrating plate 1032. The diaphragm ring senses the first elastic vibrating plate 1032, which compresses or pushes the air in the vibration space to vibrate, thereby performing the measurement vibration work. When the vibration module 103 and the movable seat 302 are subjected to pressure, they are connected by the vibration spring 1033 and transmit vibration to each other. When the movable seat 302 moves, the vibrating diaphragms 307 on both sides come into contact with the movable rod 304 and quickly rebound, causing the vibrating diaphragms 307 to vibrate, driving the air to vibrate, and performing the measurement work. The position of the movable rod 304 is limited by the limiting spring 305. After the vibrating diaphragm 307 moves to the outside of the movable rod 304, the elasticity of the movable rod 304 pushes the vibrating diaphragm 307 back, causing the vibrating diaphragm 307 to vibrate, driving the surrounding air to vibrate, and performing the detection work.

[0038] To address the technical problem that the sealing effect of existing vibration sensors is generally poor, affecting their long-term use, please refer to [link / reference needed]. Figure 1 - Figure 4 The following technical solutions are provided:

[0039] The lower end of the vibration module 103 is embedded inside the connecting plate 102 and is movably connected to the connecting plate 102. The movable plate 1031 is welded to the vibration module 103. One side of the first elastic vibrating plate 1032 extends to the outside of the movable plate 1031 and is movably connected to the movable plate 1031. The movable plate 1031 drives the first elastic vibrating plate 1032 to vibrate, and the first elastic vibrating plate 1032 causes the air to vibrate, thus performing the detection work.

[0040] A rotating bolt 2 is installed at the upper end of the cover plate 101, and an adjusting screw 104 is installed at the lower end of the rotating bolt 2. A pressure plate is provided at the lower end of the adjusting screw 104, and the lower end of the pressure plate is in contact with the vibration module 103. By adjusting the rotating bolt 2, the adjusting screw 104 is rotated, causing the adjusting screw 104 to push the pressure plate and press down on the vibration module 103, thereby adjusting the position of the vibration module 103. The adjustment is carried out according to the detection environment, so that the sensor has better adjustability and adaptability, which is conducive to long-term operation.

[0041] The upper end of the rotating bolt 2 is provided with a fastening sleeve 201. A wire 202 is installed inside the fastening sleeve 201. The wire 202 is electrically connected to the MEMS chip 6, and the wire 202 is sealed to the fastening sleeve 201 through the fastening sleeve 201. During operation, the power supply is connected to the power supply of the MEMS chip 6 through the wire 202 to perform detection work. During the movement of the rotating bolt 2, the fastening sleeve 201 maintains the sealing effect, ensuring the air pressure inside the sensor and improving the detection effect of air vibration.

[0042] Specifically, before use, adjust the rotating bolt 2 and rotate the adjusting screw 104 to push the pressure plate, causing the pressure plate to press down on the vibration module 103. Adjust the position of the vibration module 103 according to the detection environment to make the sensor more adjustable and adaptable, which is beneficial for long-term operation. During operation, the MEMS chip 6 is powered by the power supply connected to the wire 202 to perform detection. During the movement of the rotating bolt 2, the sealing effect is maintained by the fastening sleeve 201 to ensure the air pressure inside the sensor and improve the detection effect of air vibration.

[0043] To address the technical problem in existing technologies where the sensor's detection range is inaccurate, affecting judgment and hindering use, please refer to [link / reference needed]. Figure 1 , Figure 6 The following technical solutions are provided:

[0044] A positioning plate 401 is installed at the lower end of the mounting box 4, and twelve detection segment plates 402 are arranged around the outside of the mounting box 4. A spring damper 403 is provided at one end of the detection segment plate 402, and the two ends of the spring damper 403 are fixedly connected to the mounting box 4 and the positioning plate 401 respectively. A compression spring rod 405 is provided inside the detection segment plate 402. The compression spring rod 405 extends into the interior of the mounting box 4 and is slidably connected to the mounting box 4 and the detection segment plate 402 respectively. A second elastic vibration plate 406 is provided inside the mounting box 4. The second elastic vibration plate 406 senses the pressure on the compression spring rod 405, thereby detecting the vibration of the twelve detection segment plates 402 respectively, determining the vibration direction, thereby improving the detection accuracy and adapting to different working environments.

[0045] A heat sink 404 is located at the bottom of the mounting box 4. The heat sink 404 is used for heat dissipation of the MEMS chip 6. A fixing plate 5 is installed at the lower end of the heat sink 404. The fixing plate 5 has an integrally formed positioning port 501 inside. A connecting rod 503 is installed between the fixing plate 5 and the mounting box 4. A locking plate 502 is installed between the connecting rod 503 and the fixing plate 5. The locking plate 502 quickly fixes the connecting rod 503 to the fixing plate 5, which facilitates the installation of the fixing plate 5. The fixing screws are fixed through the positioning port 501, which enables the sensor to be installed quickly.

[0046] Specifically, the second elastic vibrating plate 406 senses the pressure on the compression spring rod 405, thereby detecting the vibration of each of the twelve detection segment plates 402, determining the vibration direction, thus improving detection accuracy, adapting to different working environments, being easy to adjust, and having strong adaptability.

[0047] To better demonstrate the measurement process of the electromechanical hybrid ultra-low frequency MEMS vibration measurement sensor, this embodiment proposes a measurement method for the electromechanical hybrid ultra-low frequency MEMS vibration measurement sensor, including the following steps:

[0048] Step 1: Quickly fix the connecting rod 503 to the fixing plate 5 using the locking plate 502, and install the fixing plate 5 by fixing the screws through the positioning port 501 to quickly install the sensor.

[0049] Step 2: By adjusting the rotating bolt 2, rotate the adjusting screw 104 to push the pressure plate and press down the vibration module 103. Adjust the position of the vibration module 103 according to the detection environment to make the sensor more adjustable, more adaptable, and conducive to long-term operation.

[0050] Step 3: Connect the power supply through wire 202 to power the MEMS chip 6 for detection. During the movement of the rotating bolt 2, the fastening sleeve 201 maintains a sealing effect to ensure the air pressure inside the sensor and improve the detection effect of air vibration.

[0051] Step 4: After the vibration module 103 is subjected to pressure, the movable disk 1031 drives the first elastic vibrating plate 1032 to vibrate. The first elastic vibrating plate 1032 is provided with a diaphragm ring on its outside. The diaphragm ring senses the first elastic vibrating plate 1032. The first elastic vibrating plate 1032 compresses or pushes the air in the vibration space to vibrate, thereby performing vibration measurement. After the vibration module 103 and the movable seat 302 are subjected to pressure, they are connected by the vibration spring 1033 and transmit vibration to each other. After the movable seat 302 moves and drives the vibrating diaphragms 307 on both sides to contact the movable rod 304, they quickly rebound, causing the vibrating diaphragms 307 to vibrate, driving the air to vibrate. The MEMS chip 6 is used to sense the amplitude of the air vibration and measure the vibration.

[0052] Step 5: During operation, the pressure on the compression spring rod 405 is sensed by the second elastic vibrating plate 406, thereby detecting the vibration of each of the twelve detection segment plates 402, determining the vibration direction, thus improving detection accuracy and adapting to different working environments.

[0053] Working principle: The connecting rod 503 is quickly fixed to the fixed plate 5 by the locking plate 502. The fixed plate 5 is then installed by fixing screws through the positioning port 501, allowing the sensor to be installed quickly. Before use, adjust the rotating bolt 2 and rotate the adjusting screw 104 to push the pressure plate, causing the pressure plate to press down on the vibration module 103. Adjust the position of the vibration module 103 according to the detection environment to improve the adjustability and adaptability of the sensor, which is beneficial for long-term operation. During operation, the power supply is connected to the MEMS chip 6 through the wire 202 for detection. During the movement of the rotating bolt 2, the sealing effect is maintained by the fastening sleeve 201 to ensure the air pressure inside the sensor and improve the detection effect of air vibration. During operation, the second elastic vibrating plate 406 senses the pressure on the compressed spring rod 405, thereby... The vibration of each of the twelve detection segment plates 402 is detected to determine the vibration direction, thereby improving detection accuracy. It is adaptable to different working environments, easy to adjust, and highly adaptable. After the vibration module 103 is subjected to pressure, the movable disk 1031 drives the first elastic vibration plate 1032 to vibrate. The first elastic vibration plate 1032 is provided with a diaphragm ring on its outside. The diaphragm ring senses the first elastic vibration plate 1032. The first elastic vibration plate 1032 compresses or pushes the air in the vibration space to vibrate, thereby measuring the vibration. After the vibration module 103 and the movable seat 302 are subjected to pressure, they are connected by the vibration spring 1033 and transmit the vibration to each other. The movable seat 302 moves and drives the vibration diaphragms 307 on both sides to contact the movable rod 304 and then quickly rebound, causing the vibration diaphragms 307 to vibrate, which in turn drives the air to vibrate. The MEMS chip 6 is used to sense the amplitude of the air vibration and measure the vibration.

[0054] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0055] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An electromechanically hybrid ultra-low frequency MEMS vibration measurement sensor comprising a sensor housing (1), characterized in that, A vibration module (103) is installed inside the sensor housing (1), and a movable disk (1031) is provided outside the vibration module (103). A first elastic vibrating plate (1032) is provided at the lower end of the movable disk (1031). A MEMS chip (6) is installed below the sensor housing (1). It also includes a mounting plate (3), which is used to install the measuring structure. The mounting plate (3) is installed below the sensor housing (1). A movable seat (302) is installed inside the mounting plate (3). Telescopic sleeves (303) are installed on both sides of the movable seat (302). A movable rod (304) is provided on one side of the telescopic sleeve (303). Vibration diaphragms (307) are provided on both sides of the movable seat (302). A vibration spring (1033) is installed between the movable seat (302) and the vibration module (103). The mounting plate (3) has an integrally formed sliding groove (308) inside. The movable seat (302) is equipped with a guide wheel (306) on the outside. The guide wheel (306) is embedded in the sliding groove (308) and slidably connected to the mounting plate (3). The movable rod (304) is equipped with a limit spring (305) on the outside. One end of the movable rod (304) extends into the telescopic sleeve (303) and slidably connected to the telescopic sleeve (303). The two ends of the limit spring (305) are fixedly connected to the movable rod (304) and the telescopic sleeve (303) respectively. A positioning plate (401) is installed at the lower end of the mounting box (4), and twelve detection segment plates (402) surround the outside of the mounting box (4). A spring damper (403) is provided at one end of the detection segment plate (402), and the two ends of the spring damper (403) are fixedly connected to the mounting box (4) and the positioning plate (401) respectively. A compression spring rod (405) is provided inside the detection segment plate (402), and the compression spring rod (405) extends into the mounting box (4) and slides in connection with the mounting box (4) and the detection segment plate (402) respectively. A second elastic vibration plate (406) is provided inside the mounting box (4). When the vibration module (103) is subjected to pressure, it drives the first elastic vibrating plate (1032) to vibrate through the movable plate (1031). The first elastic vibrating plate (1032) is provided with a diaphragm ring on the outside. The diaphragm ring senses the first elastic vibrating plate (1032). The first elastic vibrating plate (1032) compresses or pushes the air in the vibration space to vibrate, thereby measuring the vibration. When the vibration module (103) and the movable seat (302) are subjected to pressure, they are connected through the vibration spring (1033) and transmit vibration to each other. When the movable seat (302) moves, it drives the vibrating membranes (307) on both sides to contact the movable rod (304) and then quickly rebounds, causing the vibrating membranes (307) to vibrate, which drives the air to vibrate. The MEMS chip (6) is used to sense the amplitude of the air vibration and measure the vibration. During operation, the pressure on the compression spring rod (405) is sensed by the second elastic vibrating plate (406), thereby detecting the vibration of the twelve detection segment plates (402) and determining the vibration direction.

2. The electromechanical hybrid ultra-low frequency MEMS vibration measurement sensor according to claim 1, characterized in that: A cover plate (101) is installed on the upper end of the sensor housing (1), and a connecting plate (102) is installed on the lower end of the sensor housing (1). A limit rod is installed between the cover plate (101) and the connecting plate (102). A mounting box (4) is installed below the mounting plate (3). The mounting box (4) is used to install and fix the MEMS chip (6). A reinforcing plate (301) is welded between the mounting plate (3) and the mounting box (4).

3. The electromechanical hybrid ultra-low frequency MEMS vibration measurement sensor according to claim 2, characterized in that: The lower end of the vibration module (103) is embedded inside the connecting plate (102) and is movably connected to the connecting plate (102). The movable plate (1031) is welded to the vibration module (103). One side of the first elastic vibrating plate (1032) extends to the outside of the movable plate (1031) and is movably connected to the movable plate (1031).

4. The electromechanical hybrid ultra-low frequency MEMS vibration measurement sensor according to claim 3, characterized in that: The upper end of the cover plate (101) is equipped with a rotating bolt (2), the lower end of the rotating bolt (2) is equipped with an adjusting screw (104), the lower end of the adjusting screw (104) is provided with a pressure plate, and the lower end of the pressure plate is in contact with the vibration module (103).

5. The electromechanically mixed ultra-low frequency MEMS vibration measurement sensor according to claim 4, characterized in that: The upper end of the rotating bolt (2) is provided with a fastening sleeve (201), and a wire (202) is installed inside the fastening sleeve (201). The wire (202) is electrically connected to the MEMS chip (6), and the wire (202) is sealed to the fastening sleeve (201) through the fastening sleeve (201).

6. The electromechanically mixed ultra-low frequency MEMS vibration measurement sensor according to claim 5, characterized in that: A heat sink (404) is provided below the mounting box (4). The heat sink (404) is used for heat dissipation of the MEMS chip (6). A fixing plate (5) is installed at the lower end of the heat sink (404). An integrally formed positioning port (501) is provided inside the fixing plate (5). A connecting rod (503) is installed between the fixing plate (5) and the mounting box (4). A locking plate (502) is installed between the connecting rod (503) and the fixing plate (5).

Images