Packaging structure, packaging cover and electronic equipment

Abstract

The invention relates to the technical field of chips, in particular to a packaging structure, a packaging cover and electronic equipment. The packaging structure comprises a packaging body, a packaging cover, a functional assembly and a connecting piece. Wherein the packaging body is provided with a first surface and a second surface which are oppositely arranged, the packaging body comprises a substrate and an electronic device arranged on one side of the substrate, and the first surface is the surface, deviating from the electronic device, of the substrate. The packaging cover is arranged on the second surface. The packaging body is provided with at least one communication hole, and each communication hole penetrates through the packaging body and is communicated with the first surface and the second surface; the functional assembly comprises at least one device, the at least one device is arranged on the surface, deviating from the packaging body, of the packaging cover, and / or the at least one device is arranged on the first surface; according to the packaging structure, each connecting piece penetrates through one communicating hole and is used for fixing the packaging cover and at least one device, welding is not needed, various problems caused by welding are avoided, the reliability of the packaging structure is improved, and the packaging cover can play a role in controlling warping of the packaging body.

Description

Technical Field

[0001] The present application relates to the field of chip technology, and in particular to a packaging structure, a packaging cover, and an electronic device. Background Art

[0002] The package refers to the packaging form of the integrated circuit, that is, the circuit bare chip (die) is placed on a substrate that acts as a carrier, the pins are brought out, and then the package is fixed to form a whole. In many application scenarios, the package needs to be assembled with functional components such as heat sinks and connectors. The existing assembly method is usually to weld the substrate and the functional components to achieve the assembly of the package and the functional components. During the welding process, due to the difference in thermal expansion coefficients between the substrate and the package, the package may warp. The warping will cause additional stress on the welding points, resulting in the risk of welding failure. Summary of the Invention

[0003] The embodiments of the present application provide a packaging structure, a packaging cover, and an electronic device to realize the assembly of a packaging body and functional components and reduce the warping of the packaging body.

[0004] In a first aspect, the present application provides a packaging structure, which includes a packaging body, a packaging cover, a functional component and a connector. The packaging body has a first surface and a second surface arranged opposite to each other, and the packaging body includes a substrate and an electronic device arranged on one side of the substrate, and the first surface is the surface of the substrate facing away from the electronic device. The packaging body is provided with at least one connecting hole, each connecting hole passes through the packaging body and connects the first surface and the second surface, and the packaging cover is provided on the second surface. The functional component includes at least one device, at least one device is provided on the surface of the packaging cover facing away from the packaging body, and / or at least one device is provided on the first surface. Each connector is provided through a connecting hole and is used to fix the packaging cover and at least one device. The packaging cover can play a better role in controlling the warping of the packaging body.

[0005] In the above-mentioned packaging structure, the packaging cover and the functional component are connected and fixed to the packaging body through a connector. There is no need to weld the functional component to the packaging body, which can avoid the warping problem caused by welding and there is no risk of welding failure, thereby improving the reliability of the packaging structure and making the connection structure simpler and easier.

[0006] In one possible embodiment, the at least one device includes at least one type of device, the type of device is disposed on the first surface, and the connector is fixedly connected to the type of device after passing through the communication hole. For example, the type of device may be provided with a threaded hole that cooperates with the connector, and the type of device is threadedly connected to the connector.

[0007] Possibly, a type of device may also be provided with a through hole corresponding to the connecting hole, and the packaging structure also includes a first fastener, which is arranged on the side of the type of device away from the packaging body. The connecting member passes through the connecting hole and the through hole in turn and is fixedly connected to the first fastener to achieve the fixation of the connecting member and the type of device.

[0008] In one possible embodiment, the at least one component of the cover includes at least one Class II component, which is disposed on a side of the package cover facing away from the package body. A connector passes through the connecting hole and then through the package cover, whereupon the connector is connected to the Class II component. For example, the Class II component may be provided with a threaded hole that mates with the connector, and the Class II component and the connector are threadedly connected.

[0009] It is understood that the functional component may include only Class I components, only Class II components, or both Class I and Class II components. The functional component includes at least one of a heat sink, a connector, and a power module. Exemplarily, the connector and the power module may be Class I components, i.e., the connector and the power module are disposed on the first surface. Exemplarily, the heat sink may be a Class II component, i.e., the heat sink is disposed on the side of the package cover facing away from the package body.

[0010] In order to achieve the connection between the functional component and the packaging cover, the packaging cover is provided with at least one first mounting hole that cooperates with the connector, and the first mounting hole corresponds to the communication hole one by one.

[0011] In one possible implementation, the functional assembly includes only at least one type I component. The first mounting hole is a blind hole with its opening facing the package body. The inner wall of the first mounting hole is provided with a first internal thread, and the connector is provided with a first external thread for mating with the first internal thread. One end of the connector is threadedly connected to the package cover, and the other end of the connector is connected to the type I component.

[0012] In another possible implementation, the functional component includes only at least one type I device, the first mounting hole is a through hole passing through the packaging cover, the packaging structure also includes a second fastener, the second fastener is arranged on the side of the packaging cover away from the packaging body, one end of the connector is connected to the type I device, and the other end of the connector is fixedly connected to the second fastener.

[0013] In another possible implementation, the functional component includes at least one Class II component, which is disposed on a side of the package cover facing away from the package body. The first mounting hole is a through-hole extending through the package cover, and the connector sequentially passes through the connecting hole and the first mounting hole before connecting to the Class II component. Of course, when the functional component includes the Class II component, a second fastener may also be disposed on the side of the Class II component facing away from the package body. The connector may sequentially pass through the connecting hole, the first mounting hole, and the Class II component before being fixedly connected to the second fastener.

[0014] It should be noted that the number of first mounting holes is not limited in this application and can be set according to actual needs. When there is one first mounting hole, the structure of the first mounting hole can be any of the possible implementations described above. When there are at least two first mounting holes, the structures of the two or more first mounting holes and the manner in which they cooperate with the connector can be the same or different, depending on actual needs.

[0015] It is understood that the material of the package cap includes at least one of plastic, ceramic, and metal, and the material selected is determined based on actual needs. The package cap can be made of thermally conductive materials such as copper, aluminum, ceramic, and graphene, which effectively absorb heat from the package, helping to reduce the temperature of the package and thereby improve its stability and reliability.

[0016] When the at least one device is a heat sink, the heat sink is disposed on a side of the package cover facing away from the package body. Furthermore, the package cover has a hollow portion extending through the package cover, with the orthographic projection of the hollow portion on the package body at least partially overlapping the electronic device, so that at least a portion of the electronic device can be aligned with the heat sink through the hollow portion, thereby improving the efficiency of heat transfer between the heat sink and the electronic device. Optionally, the surface of the heat sink facing the electronic device is provided with heat dissipation adhesive. The heat dissipation adhesive can fill the gap between the electronic device and the heat sink, effectively improving their fit and thereby enhancing the heat dissipation effect. Furthermore, the heat dissipation adhesive can absorb and disperse heat generated during operation of the electronic device, thereby extending the life of the electronic device.

[0017] In one possible embodiment, the package body typically has a surface-mount device protruding from the second surface. To improve space utilization, a receiving structure is provided on the surface of the package cover facing the substrate. The receiving structure is used to accommodate the surface-mount device. Specifically, the receiving structure can be a groove provided on the surface of the package cover facing the package body, or a through hole extending through the package cover along a first direction. The first direction is the axial direction of the communication hole.

[0018] In one possible embodiment, the package body includes multiple metal layers, which can not only protect the electronic devices from the influence of the external environment, but also have conductivity, which can realize the transmission of signals between different areas of the package structure. In order to avoid affecting the metal layers, the connecting holes are not connected to any metal layer.

[0019] In one possible embodiment, the packaging body includes a packaging layer, which at least circumferentially wraps the electronic device and connects the first surface and the second surface. The function of the packaging layer is to protect the electronic device. It can be an annular frame arranged on the surface of the substrate, or it can be a plastic packaging material arranged on the surface of the substrate. The connecting hole can be formed in the packaging layer.

[0020] In one possible embodiment, an adhesive is provided between the package cover and the package body to ensure a tight connection between the package cover and the package body, thereby preventing local stress concentration that might occur when the two are connected only by connectors, which could lead to breakage due to mechanical vibration or dropping. Examples of adhesives include, but are not limited to, epoxy resin, polyurethane, polystyrene, polyacrylate, and ethylene-vinyl acetate copolymer. The specific type of adhesive is selected based on actual needs.

[0021] In order to prevent the adhesive from diffusing into the first mounting hole or the communicating hole, causing the adhesive to contaminate the connector or the package body, the packaging structure also includes a blocking structure, which surrounds the connector to prevent the adhesive from entering at least one first mounting hole and / or at least one communicating hole.

[0022] In one possible implementation, the blocking structure includes an annular protrusion provided on the surface of the packaging cover facing the packaging body, and the annular protrusion surrounds the first mounting hole. The annular protrusion abuts against the packaging body, and the center hole of the annular protrusion connects the connecting hole and the first mounting hole. Exemplarily, the annular protrusion includes a first blocking portion, the first blocking portion at least partially extends into the connecting hole and the outer peripheral surface of the first blocking portion abuts against the inner wall of the connecting hole, thereby blocking the adhesive from entering the first mounting hole and the connecting hole, avoiding contamination of the connector or the packaging structure. Alternatively, the annular protrusion includes a second blocking portion, the surface of the second blocking portion facing away from the packaging cover abuts against the surface of the packaging body facing the packaging cover. The annular protrusion and the packaging cover can be integrally formed, and the two can also be connected by plugging, snapping, etc.

[0023] In another possible implementation, the blocking structure includes a first annular groove provided on a surface of the packaging cover facing the packaging body, the first annular groove surrounding the first mounting hole, and configured to store excess adhesive to prevent the adhesive from diffusing into the first mounting hole and the communication hole and contaminating the connector or the packaging structure. It will be appreciated that the radial distance between the first annular groove and the first mounting hole, as well as the dimensions of the first annular groove, need to be determined based on a balance of considerations, including the adhesive bonding area between the packaging cover and the packaging body, the adhesive volume that can be stored in the first annular groove, and the structural reliability of the packaging cover.

[0024] In another possible implementation, the blocking structure includes a second annular groove provided on the surface of the packaging body facing the packaging cover, the second annular groove surrounds the communicating hole, and the second annular groove is used to store excess adhesive to prevent the adhesive from entering the first mounting hole and the communicating hole and causing contamination to the connector or the packaging structure.

[0025] To store the diffused adhesive, a first annular groove can be provided only on the surface of the packaging cap facing the packaging body, or a second annular groove can be provided only on the surface of the packaging body facing the packaging cap. The specific arrangement depends on the diffusion direction of the adhesive. Specifically, annular grooves can be provided on one side of the adhesive diffusion direction to allow the adhesive to diffuse into the corresponding annular grooves. Of course, both the first and second annular grooves can also be provided to improve adhesive absorption efficiency.

[0026] It is understood that the blocking structure includes any one of the first blocking portion, the second blocking portion, the first annular groove, and the second annular groove, or a combination of any two or more of the first blocking portion, the second blocking portion, the first annular groove, and the second annular groove.

[0027] In a second aspect, the present application provides a packaging cover for a packaging structure, which may be the packaging structure provided in the first aspect above. The packaging structure includes a packaging body, a packaging cover, a functional component, and a connector. The packaging body has a first surface and a second surface arranged opposite to each other. The packaging body includes a substrate and an electronic device arranged on one side of the substrate. The first surface is the surface of the substrate facing away from the electronic device. The packaging body is provided with at least one connecting hole, each connecting hole passing through the packaging body and connecting the first surface and the second surface. The packaging cover is at least partially provided on the second surface. The functional component includes at least one device, at least one device is provided on the side of the packaging cover facing away from the packaging body, and / or at least one device is provided on the first surface. Each connector is provided through a connecting hole and is used to fix the packaging cover and the at least one device.

[0028] The packaging cover in the above-mentioned second aspect can be applied to the packaging structure in various possible implementation methods in the first aspect. For its specific implementation methods and the beneficial effects that can be achieved, please refer to the description of the corresponding optional implementation methods and their beneficial effects in the above-mentioned first aspect. The repetitions will not be discussed here.

[0029] In a third aspect, the present application provides an electronic device, which may include the packaging structure of the first aspect and any possible implementation thereof. The electronic devices in the present application include smartphones, tablet computers, televisions, cameras, video cameras, game consoles, and the like. Because the packaging structure of the first aspect and any possible implementation thereof is applied, in the electronic device of the present application, the packaging cover and the functional components do not need to be connected by welding, but can be connected by connectors, thereby avoiding various problems caused by welding, thereby improving the reliability of the packaging structure. Moreover, the packaging cover can play a role in controlling the warping of the package body.

[0030] To facilitate assembly and disassembly, the package cover and the functional component may be detachably connected. Exemplarily, the connecting member includes at least one of a stud, a screw, and a bolt. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to make the purpose, technical solutions and effects of the present invention clearer and more specific, the following is a description of the drawings of the present invention. It should be noted that the drawings do not represent the actual proportions and are only used to better explain the present invention, and are not used to limit the present invention.

[0032] Figure 1 It is a schematic diagram of the assembly of existing packages and functional components;

[0033] Figure 2 This is a schematic diagram of the packaging structure of an embodiment of the present application;

[0034] Figure 3 This is a schematic diagram of the connection between a connector and a packaging cover according to an embodiment of the present application;

[0035] Figure 4 This is a schematic structural diagram of a packaging structure including a type of device according to an embodiment of the present application;

[0036] Figure 5 This is a schematic structural diagram of a packaging structure including two types of devices according to an embodiment of the present application;

[0037] Figure 6 This is a schematic structural diagram of a packaging structure including two types of devices in another embodiment of the present application;

[0038] Figure 7 This is a schematic structural diagram of a packaging structure including both a type I device and a type II device according to an embodiment of the present application;

[0039] Figure 8 This is a schematic structural diagram of a packaging structure including both a type I device and a type II device according to an embodiment of the present application;

[0040] Figure 9 This is a schematic structural diagram of a packaging structure according to another embodiment of the present application;

[0041] Figure 10 This is a schematic structural diagram of a packaging structure according to another embodiment of the present application;

[0042] Figure 11 This is a schematic structural diagram of a packaging structure including a blocking structure according to an embodiment of the present application;

[0043] Figure 12 This is a schematic structural diagram of a packaging structure including a blocking structure according to another embodiment of the present application;

[0044] Figure 13 This is a schematic structural diagram of a packaging structure including a blocking structure according to another embodiment of the present application;

[0045] Figure 14This is a structural schematic diagram of a packaging structure including a blocking structure according to another embodiment of the present application;

[0046] Figure 15 This is a schematic structural diagram of a packaging structure including a surface-mount device according to an embodiment of the present application.

[0047] Reference numerals:

[0048] 100 - package body; 110 - electronic device; 120 - substrate; 130 - metal layer; 140 - packaging layer; 150 - surface mount device; 200 - packaging cover; 300 - functional component; 300a - type I device; 300b - type II device; 310 - heat sink; 311 - heat dissipation adhesive; 320 - connector; 330 - power supply module; 400 - connector; 500 - first fastener; 600 - second fastener; 700 - adhesive; 800 - blocking structure; 810 - annular protrusion; 810a - first blocking portion; 810b - second blocking portion; 820 - first annular groove; 830 - second annular groove;

[0049] 10-first surface; 20-second surface;

[0050] 01-first mounting hole; 02-connecting hole; 03-hollowing. DETAILED DESCRIPTION

[0051] In order to make the purpose, technical solutions and advantages of this application clearer, this application will be further described in detail below with reference to the accompanying drawings.

[0052] The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used in the specification and appended claims of this application, the singular expressions "a", "an", "above", "the", and "this" are intended to also include expressions such as "one or more", unless the context clearly indicates otherwise.

[0053] References to "one embodiment" or "some embodiments" in this specification mean that a particular feature, structure, or characteristic described in conjunction with that embodiment is included in one or more embodiments of the present application. Thus, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in yet other embodiments" appearing in various places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more but not all embodiments," unless otherwise specifically emphasized. The terms "including," "comprising," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0054] A package refers to an electronic device such as a chip or semiconductor die that is encapsulated in a protective housing or substrate to protect the electronic device from the influence of the external environment, such as dust, moisture, chemicals, and mechanical shock. In order to achieve functions such as heat dissipation of the package and electrical connection between the package structure and the external environment, the package needs to be assembled with functional components such as a heat sink, a connector, or a power supply module. For example, a heat sink can help the package structure dissipate heat to ensure that it will not be damaged by overheating during operation. The connector can connect different package structures or modules to achieve data or power transmission. The power supply module provides a stable operating voltage for the package structure.

[0055] Figure 1 This is a schematic diagram of the assembly of existing packages and functional components. Figure 1 The package 100 and the functional component 300 are connected by soldering. Specifically, the package 100 includes a substrate 120 and an electronic device 110 disposed on the surface of the substrate 120. The surface of the substrate 120 facing away from the electronic device 110 can be soldered to the functional component 300 via solder balls. During the soldering process, due to the difference in thermal expansion coefficients between the functional component 300 and the package 100, the package 100 may warp. This warping can cause additional stress on the solder joints, leading to solder failure.

[0056] In view of this, an embodiment of the present application provides a packaging structure. Figure 2 This is a schematic diagram of the packaging structure of an embodiment of the present application, referring to Figure 2 , the packaging structure includes a packaging body 100 and a packaging cover 200. The packaging body 100 includes a substrate 120, an electronic device 110 provided on one side of the substrate 120, and a plastic encapsulation material that at least circumferentially wraps the electronic device 110. The packaging body 100 has a first surface 10 and a second surface 20 that are arranged opposite to each other, and the first surface 10 and the second surface 20 are opposite to each other along the thickness direction of the packaging body. The first surface 10 is the surface of the substrate 120 that is away from the electronic device 110. The substrate 120 can play the role of supporting the electronic device 110 and the plastic encapsulation material. Possibly, the substrate 120 can be a printed circuit board (PCB) for constructing an electrical interconnection channel between the electronic device 110 and the external electronic circuit.

[0057] It is understood that the molding compound at least circumferentially wraps around the electronic device 110. Of course, the molding compound may also simultaneously cover the surface of the electronic device 110 facing away from the substrate 120 to better protect the electronic device 110 from the external environment. The packaging cover 200 is provided on the second surface 20 of the package body 100 to prevent the package body from warping. The substrate 120, molding compound, and packaging cover 200 together integrate the electronic devices 110 into a compact and reliable structure, while ensuring stable and reliable electrical connections between the electronic devices 110. For example, the electronic device 110 may be at least one of a chip and a semiconductor die.

[0058] The material of the package cover 200 includes at least one of plastic, ceramic, and metal, and the material is selected based on actual needs. For example, the package cover 200 can be made of a thermally conductive material such as copper, aluminum, ceramic, or graphene, which can effectively absorb heat from the package body 100, helping to reduce the temperature of the package body 100 and thereby improve its stability and reliability.

[0059] Continue to refer to Figure 2 The packaging structure also includes a functional component 300 and a connector 400. The functional component 300 includes at least one device. For example, the at least one device may include at least one type-I device 300a. Here, one type-I device 300a is used as an example. The type-I device 300a is provided on the first surface 10 of the package body. The package body 100 is provided with at least one connecting hole 02. Each connecting hole 02 passes through the package body 100 and connects the first surface 10 and the second surface 20. Each connector 400 is provided in a connecting hole 02 and is used to fix the package cover 200 and the type-I device 300a, thereby realizing the connection between the package body 100, the package cover 200, and the functional component 300 to form a compact and firmly connected packaging structure. For the existing welding connection between the substrate 120 and the functional component 300, the packaging structure in the present application can reduce or avoid the problem of package warping that may occur during the welding process, and the assembly is more convenient.

[0060] To allow the connector 400 to pass through, the radial dimension of the communication hole 02 is larger than the radial dimension of the connector 400, so that the connector 400 does not contact the inner wall of the communication hole 02, that is, there is no contact between the connector 400 and the package 100. The communication hole 02 is preferably arranged away from the functional area of ​​the package 100 as much as possible to avoid affecting the functional performance of the package 100.

[0061] exist Figure 2In the illustrated package structure, the connector 400 and the first type of device 300a can be threadedly connected. Specifically, the outer peripheral surface of the connector 400 is provided with external threads, and the first type of device 300a can be provided with a threaded hole with internal threads that mates with the connector 400. The first type of device 300a is threadedly connected to the connector 400. When the functional component 300 includes multiple devices, each device can be connected to the package cover 200 via a connector 400 that passes through the package body 100, or only some of the devices can be connected to the package cover 200 via the connector 400.

[0062] In order to achieve the connection between the connector and the package cover, such as Figure 3 As shown, the package cover 200 is provided with at least one first mounting hole 01, and the first mounting hole 01 corresponds one-to-one with the communication hole 02. For example, the first mounting hole 01 is a blind hole with its opening facing the package body. The inner wall of the first mounting hole 01 is provided with a first internal thread, and the connector 400 is provided with a first external thread for mating with the first internal thread to achieve a threaded connection between the connector 400 and the package cover 200.

[0063] In another possible embodiment, Figure 4 As shown, the device 300a of the type I may also be provided with a through hole (not shown in the figure) corresponding to the connecting hole 02, and the through hole may be passed through by the connector 400. The packaging structure further includes a first fastener 500, which is provided on the side of the device 300a of the type I away from the package body 100. The end of the connector 400 away from the device 300a of the type I is connected to the package cover 200, and along the direction of the package cover 200 pointing to the device 300a of the type I, the connector 400 passes through the connecting hole 02 and the through hole in sequence and is fixedly connected to the first fastener 500. Here, how the connector 400 is connected to the package body 100 and how the connector 400 is connected to the package cover 200 are similar to the embodiment of the present invention. Figure 2 The structures shown are similar.

[0064] It should be understood that the connection between the connector and the functional component may be achieved by other means such as bonding, snapping, etc., which will not be described in detail here.

[0065] In another possible embodiment, Figure 5As shown, at least one device of the functional component 300 includes at least one Class II device 300b, with one Class II device 300b being used as an example. The Class II device 300b is disposed on the side of the package cover 200 facing away from the package body 100. At this time, in order to achieve a connection between the Class II device 300b and the package cover 200, the first mounting hole 01 is a through hole that penetrates the package cover 200, and the connector 400 can pass through the connecting hole 02 and the first mounting hole 01 in sequence and then be fixedly connected to the Class II device 300b. In this structure, the end of the connector 400 away from the Class II device 300b passes through the connecting hole 02 and then protrudes from the first surface 10 of the package body 100, and the first fastener 500 secures this end of the connector 400.

[0066] In some embodiments, as Figure 6 As shown, the package structure includes at least one Class II device 300b and at least one second fastener 600. Here, one Class II device 300b and one second fastener 600 are used as an example. The second fastener 600 is disposed on the side of the Class II device 300b facing away from the package body 100. The first mounting hole 01 is a through hole that penetrates the package cover 200. The connector 400 passes through the connecting hole 02, the first mounting hole 01, and the Class II device 300b in sequence, and is then fixedly connected to the second fastener 600. When the Class II device 300b or the second fastener 600 is disposed on the side of the package cover 200 facing away from the package body 100, the first mounting hole 01 is a through hole. The through hole may or may not have an internal thread that mates with the connector 400, depending on the actual situation.

[0067] It can be understood that the functional component 300 can simultaneously include at least one Class I device 300a and at least one Class II device 300b, wherein the connection method between the Class I device 300a and the packaging cover, and the connection method between the Class II device 300b and the packaging cover can refer to the various possible implementation methods of the above-mentioned packaging structure including the Class I device 300a, and the various possible implementation methods of the packaging structure including the Class II device 300b, and the repetitive parts will not be repeated.

[0068] like Figure 7 As shown, the functional component 300 includes both a Class I device 300a and a Class II device 300b. A first fastener 500 is provided on the side of the Class I device 300a facing away from the package body 100, and a second fastener 600 is provided on the side of the Class II device 300b facing away from the package body 100. The first mounting hole 01 is a through hole passing through the package cover 200. One end of the connector 400 is fixedly connected to the first fastener 500, and the other end of the connector 400 is fixedly connected to the second fastener 600, thereby firmly assembling the Class I device 300a, the package body 100, the package cover 200, and the Class II device 300b to form a compact and firmly connected package structure.

[0069] like Figure 8 As shown, when the functional assembly 300 includes both a Class I device 300a and a Class II device 300b, to reduce the number of parts, one end of the connector 400 can be fixedly connected to the Class I device 300a, while the other end of the connector 400 is fixedly connected to the Class II device 300b. This eliminates the need for the first fastener 500 and the second fastener 600, thereby reducing the space occupied by the packaging structure. Alternatively, the Class I device 300a and the connector 400 can be fixedly connected using the first fastener 500, with the end of the connector 400 remote from the Class I device 300a fixedly connected to the Class II device 300b, eliminating the need for the second fastener 600. Alternatively, the Class II device 300b and the connector 400 can be fixedly connected using the second fastener 600, with the end of the connector 400 remote from the Class II device 300b fixedly connected to the Class I device 300a, eliminating the need for the first fastener 500.

[0070] It should be understood that the present application does not limit the number of first mounting holes 01. For example, when the number of first mounting holes 01 is one, the structure of the first mounting hole 01 can be the structure of any of the possible implementation methods described above; for example, when the number of first mounting holes 01 is at least two, the structures of two or more first mounting holes 01 can be the same or different. In addition, the first mounting hole 01 can be a circular hole, an elliptical hole, a square hole, etc., and can be set according to actual needs.

[0071] When the connector 400 has external threads, the first fastener 500 and the second fastener 600 can both be bolts or nuts, which can tightly connect the functional component 300 and the packaging cover 200 to prevent loosening. Moreover, the functional component 300 and the packaging cover 200 are detachably connected, making assembly and disassembly simple and improving maintenance efficiency.

[0072] Figure 9 This is a schematic diagram of the packaging structure of another embodiment of the present application, referring to Figure 9 The package body 100 includes a packaging layer 140, which at least circumferentially wraps the electronic device 110 and connects the first surface 10 and the second surface 20. The packaging layer 140 is used to protect the electronic device 110. It can be an annular frame provided on the surface of the substrate 120, or it can be a plastic packaging material provided on the surface of the substrate 120. The connecting hole 02 is formed in the packaging layer 140, which is convenient for processing and avoids affecting the electrical performance of the electronic device 110 and the package body 100.

[0073] Among them, the package body 100 includes multiple metal layers 130. The metal layers 130 can not only protect the electronic device 110 from the influence of the external environment, but also have conductivity, which can realize the transmission of signals between different areas of the package structure. In order to avoid interference with the function of the metal layer 130, the connecting hole 02 is not connected to any metal layer 130.

[0074] In practical applications, the functional components provided in the embodiments of the present application may include at least one of a heat sink, a connector, or a power supply module. In some embodiments, such as Figure 9 As shown, the functional component 300 includes a heat sink 310, a connector 320, and a power supply module 330. The connector 320 and the power supply module 330 are generally located on the side of the package body 100 facing away from the package cover 200. The connector 320 is provided with a through hole. The end of the connector 400 facing away from the package cover 200 passes through the connector 320 and is fixedly connected to the first fastener 500. The connection method between the power supply module 330 and the connector 400 can refer to the connection method between the connector 320 and the connector 320. It is understood that the power supply module 330 and the package body 100 can also be connected by bonding or other methods.

[0075] exist Figure 9 In the embodiment, the heat sink 310 is usually arranged on the side of the packaging cover 200 away from the packaging body 100, so as to dissipate heat for the electronic device 110. The heat sink 310 can be a structure such as an air-cooled heat sink, a copper plate, a temperature equalizing plate, etc. The connector 400 passes through the connecting hole 02 and the first mounting hole 01 and is threadedly connected to the heat sink 310. In order to improve the heat dissipation efficiency of the electronic device 110, the packaging cover 200 has a hollow 03 that passes through the packaging cover 200 along the thickness direction of the packaging cover 200. The orthographic projection of the hollow 03 on the packaging body 100 at least partially overlaps with the electronic device 110, so that at least part of the electronic device 110 can be aligned with the heat sink 310 through the above-mentioned hollow 03, so as to improve the efficiency of heat transfer between the heat sink 310 and the electronic device 110. Illustratively, a heat dissipation adhesive 311 is provided on the surface of the heat sink 310 facing the electronic device 110. The heat dissipation adhesive 311 can fill the gap between the electronic device 110 and the heat sink 310, effectively improving their close fit and thus enhancing the heat dissipation effect. In addition, the heat dissipation adhesive 311 can absorb and disperse the heat generated during the operation of the electronic device 110, thereby extending the life of the electronic device 110. It is understood that when the thermal conductivity of the packaging cover 200 is high, the packaging cover 200 may not be provided with the hollow 03.

[0076] Reference Figure 10 The packaging structure further includes a second fastener 600 provided on the side of the heat sink 310 away from the packaging body 100. The heat sink 310 is provided with a through hole. The connecting member 400 passes through the through hole of the heat sink 310 and is fixedly connected to the second fastener 600.

[0077] Refer to Figure 9 and Figure 10 An adhesive 700 is provided between the packaging cover 200 and the packaging body 100, which can ensure a tight connection between the packaging cover 200 and the packaging body 100 and optimize the warping stress of the packaging body 100, thereby avoiding the risks of mechanical vibration, falling, etc. caused by local stress concentration when the two are connected only by the connector 400, thereby improving the reliability of the connection between the packaging cover 200 and the packaging body 100.

[0078] The adhesive 700 serves to bond the package body 100 and the package cover 200. Adhesive 700 includes, but is not limited to, epoxy resin, polyurethane, polystyrene, polyacrylate, and ethylene-vinyl acetate copolymer. The specific type of adhesive 700 is selected based on actual needs. Adhesive 700 is applied to the surface of the package body 100 or the surface of the package cover 200. Adhesive 700 spreads under the pressure of the package body 100 and the package cover 200, potentially spreading into the first mounting hole 01 and / or the communication hole 02, thereby contaminating the connector 400 or the package body 100.

[0079] In view of this, the packaging structure provided in the embodiment of the present application also includes a blocking structure, which surrounds the connector and is used to limit the adhesive from entering the at least one first mounting hole and / or the at least one connecting hole. The specific structure of the blocking structure is not limited in this application, as long as it can prevent the adhesive from entering the at least one first mounting hole and / or the at least one connecting hole without interfering with the function of the package. The following takes a packaging structure that includes a Class I device, a Class II device, a first fastener, and a second fastener as an example, and describes the shape and structure of the blocking structure in detail in conjunction with the accompanying drawings.

[0080] In one possible embodiment, Figure 11 and Figure 12 As shown, the blocking structure 800 includes an annular protrusion 810, which surrounds the first mounting hole 01. The annular protrusion 810 abuts against the package body 100, and the annular protrusion 810 has a central hole that can connect the connecting hole 02 and the first mounting hole 01. Figure 11As shown, the annular protrusion 810 includes a first blocking portion 810a. The first blocking portion 810a at least partially extends into the communicating hole 02, and the outer peripheral surface of the first blocking portion 810a abuts against the inner wall of the communicating hole 02, thereby preventing the adhesive 700 from entering the communicating hole 02. In addition, in order to prevent the adhesive 700 from entering the first mounting hole 01, the end of the first blocking portion 810a close to the package cover 200 is connected to the package cover 200. Specifically, the first blocking portion 810a and the package cover 200 can be integrally formed or connected by bonding, plugging, snapping, etc.; exemplarily, the end of the first blocking portion 810a close to the package cover 200 can abut against the surface of the package cover 200 facing the package body 100; exemplarily, the end of the first blocking portion 810a close to the package cover 200 can extend into the first mounting hole 01, and the outer peripheral surface of the first blocking portion 810a abuts against the inner wall of the first mounting hole 01. Among them, when the end of the first blocking portion 810a close to the packaging cover 200 is assembled with the packaging cover 200 in the above-mentioned various assembly methods, it can play a role in blocking the adhesive 700 from entering the first mounting hole 01. The specific method to be selected needs to be set according to actual conditions such as the aperture size of the first mounting hole 01 and the connecting hole 02.

[0081] The inner wall of the central hole of the first blocking portion 810a is provided with an internal thread, and the outer wall of the connector 400 is provided with a corresponding external thread. The connector 400 is threadedly connected to the first blocking portion 810a, and the first blocking portion 810a abuts against the package body 100, thereby tightly connecting the connector 400 and the package body 100. It is understood that in order to reduce stress, the volume of the annular protrusion 810 can be appropriately increased.

[0082] like Figure 12 As shown, the annular protrusion 810 includes a second blocking portion 810b provided on the surface of the packaging cover 200. The surface of the second blocking portion 810b facing away from the packaging cover 200 abuts against the surface of the packaging body 100 facing the packaging cover 200, thereby preventing the adhesive 700 from entering the at least one first mounting hole 01 and / or the at least one connecting hole 02. The second blocking portion 810b and the packaging cover 200 can be integrally formed, or the two can be connected by plugging, snapping, etc. The annular protrusion 810 can include only the first blocking portion 810a, or the annular protrusion 810 can include only the second blocking portion 810b, or the annular protrusion 810 can include both the first blocking portion 810a and the second blocking portion 810b. The first blocking portion 810a and the second blocking portion 810b can be integrally formed or can be two independent components.

[0083] In another possible embodiment, Figure 13As shown, the blocking structure 800 includes a first annular groove 820 provided on the surface of the package cover 200 facing the package body 100. The first annular groove 820 surrounds the first mounting hole 01 and is used to store excess adhesive 700 to prevent the adhesive 700 from diffusing into at least one first mounting hole 01 and / or at least one communicating hole 02 and causing contamination to the connector 400 or the package body 100. It is understood that the distance between the first annular groove 820 and the first mounting hole 01 along the radial direction of the first mounting hole 01, as well as the size of the first annular groove 820, need to be set to take into account the area where the adhesive 700 can be bonded between the package cover 200 and the package body 100, the volume of the adhesive 700 that can be stored in the first annular groove 820, and the structural reliability of the package cover 200.

[0084] In another possible embodiment, Figure 14 As shown, the blocking structure 800 includes a second annular groove 830 provided on the surface of the package body 100 facing the package cover 200. The second annular groove 830 surrounds the connecting hole 02. The second annular groove 830 is used to store excess adhesive 700 to prevent the adhesive 700 from entering the first mounting hole 01 and / or the connecting hole 02 and causing contamination to the connector 400 or the package body 100.

[0085] To store the diffused adhesive 700, a first annular groove 820 can be provided on the surface of the package cover 200 facing the package body 100, or a second annular groove 830 can be provided on the surface of the package body 100 facing the package cover 200. The specific arrangement needs to be based on the diffusion direction of the adhesive 700. That is, an annular groove can be provided on one side of the diffusion direction of the adhesive 700 to allow the adhesive 700 to diffuse into the corresponding annular groove. Of course, the first annular groove 820 and the second annular groove 830 can also be provided simultaneously to improve the absorption efficiency of the adhesive 700.

[0086] It can be understood that the blocking structure 800 includes any one of the first blocking portion 810a, the second blocking portion 810b, the first annular groove 820 and the second annular groove 830, or the blocking structure 800 includes a combination of any two or more structures of the first blocking portion 810a, the second blocking portion 810b, the first annular groove 820 and the second annular groove 830.

[0087] Figure 15 This is a schematic diagram of a packaging structure including a surface mount device according to an embodiment of the present application, with reference to Figure 15The package body 100 has a surface-mount device 150 protruding from the second surface. In order to improve space utilization, a receiving structure is provided on the surface of the package cover 200 facing the substrate 120. The receiving structure is used to receive the surface-mount device 150. Specifically, the receiving structure can be a groove provided on the surface of the package cover 200 facing the package body 100, or a through-hole penetrating the package cover 200 along the thickness direction of the package cover. The package cover 200 can also have a hollow 03 penetrating the package cover 200 along the thickness direction of the package cover 200, the orthographic projection of the hollow 03 on the package body 100 at least partially overlapping with the electronic device 110, wherein the through-hole can coincide with the hollow 03 penetrating the package cover 200, or the through-hole and hollow 03 can be independently provided on the package cover 200.

[0088] Based on the same technical concept, embodiments of the present application also provide a package cap 200 for a package body 100. The package structure includes the package body 100, the package cap 200, a functional component 300, and a connector 400. The package body 100 has a first surface 10 and a second surface 20 disposed opposite each other. The package body 100 includes a substrate 120 and an electronic device 110 disposed on one side of the substrate 120. The first surface 10 is the surface of the substrate 120 facing away from the electronic device 110. The package cap 200 is at least partially disposed on the second surface 20 to control warpage of the package body. The functional component 300 includes at least one device, the at least one device being disposed on the side of the package cap 200 facing away from the package body 100, or the at least one device being disposed on the first surface 10. Alternatively, the functional component 300 includes both the at least one device disposed on the side of the package cap 200 facing away from the package body 100 and the at least one device disposed on the first surface 10. In order to achieve the connection between the packaging cover 200 and the functional component 300, the packaging body 100 is provided with at least one connecting hole 02, each connecting hole 02 passes through the packaging body 100 and connects the first surface 10 and the second surface 20, and each connecting member 400 is passed through a connecting hole 02 and is used to fix the packaging cover 200 and at least one device.

[0089] The packaging cover 200 may be a cover plate that only covers the second surface 20, or the packaging cover 200 may be a packaging groove that covers the second surface 20 and the outer peripheral surface of the packaging body 100. In addition, an adhesive 700 is provided between the packaging cover 200 and the packaging body 100, which can ensure a tight connection between the packaging cover 200 and the packaging body 100 and optimize the warping stress of the packaging body 100. In order to prevent the adhesive 700 from entering the at least one first mounting hole 01 and / or the at least one connecting hole 02, the packaging cover 200 is provided with a blocking structure 800, which surrounds the connector 400. Exemplarily, the blocking structure 800 includes an annular protrusion 810 provided on the surface of the packaging cover 200 facing the packaging body 100, the annular protrusion 810 surrounds the first mounting hole 01; the annular protrusion 810 abuts against the packaging body 100, and the annular protrusion 810 has a central hole that can connect the connecting hole 02 and the first mounting hole 01. Exemplarily, the blocking structure includes a first annular groove 820 provided on the surface of the packaging cover 200 facing the packaging body 100, the first annular groove 820 surrounds the first mounting hole 01, and the first annular groove 820 is used to store excess adhesive 700 to prevent the adhesive 700 from diffusing into at least one first mounting hole 01 and / or at least one connecting hole 02, thereby contaminating the connector 400 or the packaging body 100.

[0090] For the specific structure of the packaging cover and its beneficial effects, please refer to the description of the structural form of the packaging cover in the packaging structure and the corresponding beneficial effects in various possible embodiments of this application, and the repeated parts will be omitted.

[0091] Based on the same technical concept, an embodiment of the present application further provides an electronic device, which includes a packaging structure in various possible embodiments of the present application. The electronic devices in the present application include mobile phones, computers, cameras, printers, scanners, etc. Because the packaging structure in various possible implementations of the present application is applied, the electronic devices here also have a connection between the package body and the functional components through a connector, without the need for welding, which can avoid various problems caused by welding. Moreover, the packaging cover can play a role in controlling the warping of the package body.

[0092] Obviously, those skilled in the art may make various changes and modifications to the present application without departing from the scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include these modifications and variations.

Claims

1. A packaging structure, characterized in that: include: A package body having a first surface and a second surface arranged opposite to each other, the package body including a substrate and an electronic device arranged on one side of the substrate, the first surface being a surface of the substrate facing away from the electronic device; the package body having at least one communication hole, each of the communication holes penetrating the package body and connecting the first surface and the second surface; a packaging cover, wherein the packaging cover is at least partially disposed on the second surface; a functional component, the functional component comprising at least one device, the at least one device being disposed on a side of the package cover facing away from the package body, and / or the at least one device being disposed on the first surface; At least one connecting member, each of the connecting members is arranged through one of the communicating holes and is used to fix the packaging cover and at least one of the components.

2. The packaging structure according to claim 1, wherein: The at least one device includes at least one device of the first type, the device of the first type is arranged on the first surface, and the connecting member is fixedly connected to the device of the first type after passing through the communicating hole.

3. The packaging structure according to claim 2, wherein: The packaging structure further includes a first fastener, which is disposed on a side of the device of the type facing away from the packaging body and is fixedly connected to a connector that passes through the device of the type.

4. The packaging structure according to any one of claims 1 to 3, wherein: The packaging cover is provided with at least one first mounting hole, the first mounting hole and the communicating hole correspond one to one, the first mounting hole is a blind hole and the opening of the blind hole faces the packaging body, the inner wall of the first mounting hole is provided with a first internal thread, and the connecting piece is provided with a first external thread for cooperating with the first internal thread.

5. The packaging structure according to any one of claims 1 to 3, wherein: The packaging cover is provided with at least one first mounting hole, and the first mounting hole corresponds to the communicating hole one by one; The packaging structure further includes a second fastener, which is disposed on a side of the packaging cover facing away from the packaging body and fixedly connected to the connector passing through the first mounting hole.

6. The packaging structure according to claim 5, wherein: The at least one device includes at least one type II device, and the type II device is provided on a side of the package cover away from the package body; The connecting member passes through the communicating hole, the first mounting hole, and the second type of components in sequence and is fixedly connected to the second fastener.

7. The packaging structure according to any one of claims 1 to 3, wherein: The packaging cover is provided with at least one first mounting hole, and the first mounting hole corresponds to the communicating hole one by one; The at least one device includes at least one type II device, and the type II device is provided on a side of the package cover away from the package body; The connecting member passes through the communicating hole and the first mounting hole in sequence and is connected to the second type of device.

8. The packaging structure according to any one of claims 1 to 7, wherein: The functional component includes at least one of a heat sink, a connector and a power module.

9. The packaging structure according to any one of claims 1 to 8, wherein: The package cover has a hollow extending through the package cover, and an orthographic projection of the hollow on the package body at least partially overlaps with the electronic device.

10. The packaging structure according to any one of claims 1 to 9, wherein: The package body includes a surface-mount device protruding from the second surface. The surface of the package cover facing the substrate is provided with a receiving structure, and the receiving structure is used to receive the surface-mount device.

11. The packaging structure according to any one of claims 1 to 10, wherein: The package body includes a plurality of metal layers, and the communication hole is not connected to any of the metal layers.

12. The packaging structure according to any one of claims 1 to 11, wherein: The packaging body includes a packaging layer, which at least circumferentially wraps the electronic device and connects the first surface and the second surface. The communication hole is formed in the packaging layer.

13. The packaging structure according to any one of claims 1 to 12, wherein: The packaging cover is provided with at least one first mounting hole, and the first mounting hole corresponds to the communicating hole in a one-to-one manner so as to be matched with the connecting member; An adhesive is provided between the packaging cover and the packaging body. The packaging structure further comprises a blocking structure, which surrounds the connector to prevent the adhesive from entering the at least one communicating hole and / or the at least one first mounting hole.

14. The packaging structure according to claim 13, wherein: The blocking structure includes an annular protrusion provided on a surface of the packaging cover facing the packaging body, and the annular protrusion surrounds the first mounting hole; The annular protrusion abuts against the packaging body and connects the communicating hole and the first mounting hole.

15. The packaging structure according to claim 14, wherein: The annular protrusion includes a first blocking portion, the first blocking portion at least partially extends into the communicating hole, and an outer peripheral surface of the first blocking portion abuts against an inner wall of the communicating hole.

16. The packaging structure according to claim 14 or 15, characterized in that: The annular protrusion includes a second blocking portion, wherein a surface of the second blocking portion facing away from the package cover abuts against a surface of the package body facing the package cover.

17. The packaging structure according to any one of claims 13 to 16, wherein: The blocking structure includes a first annular groove provided on a surface of the packaging cover facing the packaging body, wherein the first annular groove surrounds the first mounting hole.

18. The packaging structure according to any one of claims 13 to 17, wherein: The blocking structure includes a second annular groove provided on a surface of the packaging body facing the packaging cover, and the second annular groove surrounds the communicating hole.

19. A packaging cover for a packaging structure, characterized in that: The package structure includes a package body, a package cover, a functional component and a connector. The package body has a first surface and a second surface arranged opposite to each other. The package body includes a substrate and an electronic device arranged on one side of the substrate. The first surface is the surface of the substrate facing away from the electronic device. The package body is provided with at least one communicating hole, each communicating hole passes through the package body and connects the first surface and the second surface; The packaging cover is at least partially disposed on the second surface; The functional component includes at least one device, at least one of the devices is provided on a side of the package cover facing away from the package body, and / or at least one of the devices is provided on the first surface; Each of the connecting members is passed through one of the communicating holes and is used to fix the packaging cover and at least one of the components.

20. An electronic device, characterized in that: The packaging structure comprises the packaging structure according to any one of claims 1 to 18.

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