面向SIP封装的嵌入式微流道散热系统及协同热管理方法

By optimizing the coolant flow rate through an embedded microfluidic heat dissipation system and a neural network model, the problems of dynamic adjustment of coolant flow rate and heat dissipation priority in traditional SIP package thermal management are solved, achieving efficient chip thermal management and system stability.

CN120709241BActive Publication Date: 2026-07-17YIXIN MICRO SEMICON TECH (SHENZHEN) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
YIXIN MICRO SEMICON TECH (SHENZHEN) CO LTD
Filing Date
2025-06-14
Publication Date
2026-07-17

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Abstract

本发明涉及芯片热管理技术领域，一种面向SIP封装的嵌入式微流道散热系统及协同热管理方法及系统，包括：确定散热流道组，采集工作芯片组的当前工作数据组，利用训练芯片数据集对神经网络模型进行训练，得到冷却效果预测模型，根据冷却效果预测模型及当前工作数据组，对初始粒子群进行迭代，得到最优冷却液流速，利用当前工作数据组，对热管理系统中的工作芯片组进行排序，得到优先芯片组，利用散热流道组及最优冷却液流速，对优先芯片组进行降温。本发明可提高SIP封装中芯片热管理的精准度及智能化水平。
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