一种具有双尺度异质层状结构的钨材料及其制备方法
By forming an alternating distribution of fine and coarse grain layers in tungsten materials, combined with powder metallurgy, hot deformation processes, and two-stage heat treatment, the room temperature brittleness problem of tungsten materials was solved, achieving a balance between high strength and high ductility.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- NORTHWEST INSTITUTE FOR NONFERROUS METAL RESEARCH
- Filing Date
- 2025-08-26
- Publication Date
- 2026-07-17
AI Technical Summary
Existing tungsten materials are brittle at room temperature, making it difficult to achieve both high strength and high ductility. Traditional improvement methods have the drawback of increasing strength but reducing ductility.
By forming fine-grained and coarse-grained layers that are periodically alternating along the thickness direction in tungsten material, the fine-grained layers are composed of equiaxed recrystallized and deformed grains, and the coarse-grained layers are composed of elongated recovery grains. By combining powder metallurgy with hot deformation processes and precise two-stage heat treatment, a dual-scale layered heterogeneous structure is formed.
It significantly improves the room temperature brittleness of tungsten materials, enhances their strength and ductility, and expands their application range.
Smart Images
Figure CN120715211B_ABST