A soldering method and a soldering substrate capable of controlling a tilt angle of the substrate

Abstract

This invention discloses a welding method for a controllable substrate tilt angle and a welding substrate, belonging to the field of hybrid integrated circuit packaging technology. The method involves: placing a solder assembly on the inner surface of the substrate's housing; the solder assembly includes a first solder, a second solder, and a third solder, with the first solder having a solder cavity; adjusting the corresponding position of the first solder to the required thickness according to a preset angle; placing two layers of second solder and one layer of third solder within the solder cavity, with the third solder positioned between the two layers of second solder; placing the substrate to be welded on the upper surface of the first solder, placing the chip to be welded on the upper surface of the substrate, and then welding the entire assembly to obtain the welding substrate. This invention enables welding at a tilt angle, ensuring that the solder at the bottom of the substrate is not uncontrollably squeezed out, ensuring the consistency of the tilt angle when welding multiple substrates to the housing, and significantly improving the feasibility of subsequent bonding and the yield rate of the workpiece.

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