Energy storage converter, energy storage system and power utilization device

Abstract

The embodiment of the present application relates to the field of energy storage, and provides an energy storage converter, an energy storage system and an electric equipment. The energy storage converter provided by the embodiment of the present application comprises: a circuit board carrier; a power device located on the surface of one side of the circuit board carrier, the power device having device pins, the power device being connected with the circuit board carrier through the device pins, and the orthographic projection of the power device on the circuit board carrier being the surface with the largest area of the power device; and a radiator located on the side of the power device away from the circuit board carrier, the radiator having radiator pins, the radiator pins being connected with the circuit board carrier. The energy storage converter can prevent the vertical power device from blocking the air duct by welding the power device horizontally above the auxiliary power board, and the radiator is directly installed above the power device, so that the heat generated after the power device generates heat is diffused upward and directly passes through the radiator to dissipate heat, and the heat dissipation effect is better.

Description

Technical Field

[0001] This application relates to the field of energy storage, and in particular to an energy storage converter, an energy storage system, and an electrical device. Background Technology

[0002] A power conversion system (PCS), also known as an energy storage inverter, is one of the core components of an energy storage system. A PCS includes power conversion components (such as MOSFETs and diodes), control components, protection components, communication modules, and a cooling system (such as heat sinks, fans, or liquid cooling plates).

[0003] Heat dissipation is extremely important in energy storage converters because the power supply system (PCS) generates a significant amount of heat during energy conversion. Without effective management, this heat can degrade equipment performance and even cause malfunctions. However, current technologies that mount power devices and heat sinks on the PCS auxiliary power board suffer from low heat dissipation efficiency and low reliability. Summary of the Invention

[0004] This application provides an energy storage converter, an energy storage system, and an electrical device, which at least helps to improve the heat dissipation effect of power devices in the energy storage converter.

[0005] According to some embodiments of this application, one aspect of this application provides an energy storage converter, including: a circuit board carrier; a power device located on one side of the surface of the circuit board carrier, the power device having device pins, the power device being connected to the circuit board carrier through the device pins, and the orthographic projection of the power device on the circuit board carrier being the surface with the largest area of ​​the power device; and a heat sink located on the side of the power device away from the circuit board carrier, the heat sink having heat sink pins, and the heat sink pins being connected to the circuit board carrier.

[0006] In some embodiments, the device pin is a bent body including at least one bend.

[0007] In some embodiments, the circuit board carrier has a plurality of recesses on the side surface near the power device, and the device pins of the power device are located in the recesses.

[0008] In some embodiments, the device pins include a first connecting portion, a first bent portion, a second connecting portion, a second bent portion, and a third connecting portion connected in sequence, wherein the second connecting portion is perpendicular to the first connecting portion, the third connecting portion is parallel to the first connecting portion, and the third connecting portion is located in a plurality of recesses of the circuit board carrier.

[0009] In some embodiments, the length of the first connecting portion is a preset length, which is 3.3mm to 3.6mm.

[0010] In some embodiments, the bending radius of the first bending portion is 0.3mm to 0.4mm, the bending radius of the second bending portion is 0.3mm to 0.4mm, and the length of the third connecting portion is 7mm to 8mm.

[0011] In some embodiments, the power device is in contact with the circuit board carrier, or the energy storage converter further includes a first fixing member located in the gap between the power device and the circuit board carrier.

[0012] In some embodiments, the length of the pins of the heat sink is greater than the thickness of the power device in a first direction, where the first direction is the thickness direction of the circuit board carrier.

[0013] In some embodiments, the power device and the heat sink are connected by a second fastener.

[0014] In some embodiments, one of the heat sinks is connected to one of the power devices.

[0015] In some embodiments, the energy storage converter further includes an air-cooled structure, the air-cooled structure including a fan and a fan bracket, the fan being fixed to the top of the fan bracket by a third fastener, the fan bracket being connected to the heat sink by a fourth fastener, and the fan being located on the side of the heat sink away from the power device.

[0016] In some embodiments, the height of the fins of the heat sink in the first direction is 15mm to 16mm, and the thickness of the fan in the first direction is 6mm to 7mm, wherein the first direction is the thickness direction of the circuit board carrier.

[0017] In some embodiments, the energy storage converter further includes an insulating layer located between the power device and the heat sink.

[0018] According to some embodiments of this application, another aspect of this application provides an energy storage system, including: any of the described energy storage converters.

[0019] According to some embodiments of this application, another aspect of this application provides an electrical device, including: any one of the energy storage converters described in the previous application.

[0020] The technical solution provided in this application has at least the following advantages: by laying the power device flat and soldering it above the PCS auxiliary power board, the pins of the power device are subjected to less force and are less likely to be damaged, thus increasing the reliability of the entire system; it can also prevent the vertical power device from blocking the airflow, and by installing the heat sink directly above the power device, the heat will diffuse upwards after the power device heats up and be directly dissipated through the heat sink, resulting in better heat dissipation. Attached Figure Description

[0021] One or more embodiments are illustrated by way of example with reference to the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Unless otherwise stated, the drawings in the accompanying drawings do not constitute a limitation on scale. In order to more clearly illustrate the technical solutions in the embodiments of this application or in the conventional art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 A schematic diagram of the structure of an energy storage converter provided in the prior art;

[0023] Figure 2 This is a schematic diagram of the structure of an energy storage converter according to an embodiment of this application;

[0024] Figure 3 This is a schematic diagram illustrating the connection relationship between a power device and a circuit board carrier in the prior art.

[0025] Figure 4 This is a detailed structural schematic diagram of a circuit board carrier provided according to an embodiment of this application;

[0026] Figure 5 This is a schematic diagram showing the detailed structure of a power device according to an embodiment of this application;

[0027] Figure 6 This is a schematic diagram of the mounting position of a power device and a circuit board carrier according to an embodiment of this application;

[0028] Figure 7 This is a schematic diagram of another mounting position of a power device and a circuit board carrier according to an embodiment of this application;

[0029] Figure 8 This is a schematic diagram of a mounting structure for a heat sink and a power device according to an embodiment of this application;

[0030] Figure 9 This is a detailed structural schematic diagram of a heat sink according to an embodiment of this application;

[0031] Figure 10 This is a schematic diagram of the installation structure of a heat sink and air-cooled structure according to an embodiment of this application;

[0032] Figure 11 This is a schematic diagram of a heat sink and fan mounting structure according to an embodiment of this application;

[0033] Figure 12 This is a schematic diagram of another energy storage converter provided according to an embodiment of this application.

[0034] The above figures include the following reference numerals:

[0035] 10. Circuit board carrier; 11. Recess; 20. Power device; 21. First connecting part; 22. First bending part; 23. Second connecting part; 24. Second bending part; 25. Third connecting part; 26. Through hole; 30. Heat sink; 31. Circular recess; 32. Screw; 34. Substrate; 40. First fixing member; 50. Second fixing member; 60. Air-cooled structure; 61. Fan; 62. Fan bracket; 63. Third fixing member; 64. Fourth fixing member; 70. Insulating layer. Detailed Implementation

[0036] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0037] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0038] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this application described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0039] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0040] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0041] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A exists, A and B exist simultaneously, and B exists. In addition, the character " / " in this document generally indicates that the related objects before and after it have an "or" relationship.

[0042] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).

[0043] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0044] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0045] In the accompanying drawings corresponding to the embodiments of this application, the thickness and area of ​​the layers are enlarged for better understanding and ease of description. When describing a component (such as a layer, film, region, or substrate) on or on the surface of another component, the component may be "directly" located on the surface of the other component, or there may be a third component between the two components. Conversely, when describing a component on the surface of another component, or when another component is formed or disposed on the surface of a component, it indicates that there is no third component between the two components. Furthermore, when describing a component as being "generally" formed on another component, it means that the component is not formed on the entire surface (or front surface) of the other component, nor is it formed on a portion of the edge of the entire surface.

[0046] In the description of the embodiments of this application, when a component "includes" another component, other components are not excluded unless otherwise stated, and other components may be further included. Furthermore, when a component such as a layer, film, region, or plate is referred to as being "on / located" on another component, it can be "directly on" the other component (i.e., located on the surface of the other component with no other components between them), or another component may be present therein. Moreover, when a component such as a layer, film, region, or plate is "directly located" on another component, or when a component such as a layer, film, region, or plate is located on the surface of another component, it indicates that no other components are located therein.

[0047] The terminology used in the description of the various embodiments herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used in the description of the various embodiments and the appended claims, the term "part" is also intended to include the plural form unless the context clearly indicates otherwise. Components include layers, films, regions, or plates, etc.

[0048] As can be seen from the background technology, the existing mounting methods of power devices and heat sinks on the PCS auxiliary power board have the drawbacks of low heat dissipation efficiency and low reliability. Figure 1 This is a structural diagram illustrating the mounting positions of power devices and heat sinks in an energy storage converter, as provided in the prior art. Figure 1 As shown, in existing energy storage converters, power devices 20 are vertically mounted on a circuit board carrier 10. This circuit board carrier serves as the auxiliary power supply board for the energy storage converter. The devices mounted on the auxiliary power supply board are primarily used for power conversion and management, as well as providing necessary power for the control and protection systems. Examples include capacitors, inductors, diodes, resistors, and MOSFETs. In other words, the auxiliary power supply board contains some large-volume components (e.g., capacitors). Figure 1 As shown, Figure 1The middle arrow indicates the fan direction. In the prior art, the heatsink 30 is mounted vertically next to the power device 20 on the PCS auxiliary power board (i.e., the circuit board carrier 10). This mounting method causes the power device 20 to block the fan airflow, preventing the fan from efficiently cooling the heatsink 30. This results in low overall system cooling efficiency and poor heat dissipation. Furthermore, with the power device 20 mounted vertically on the PCS auxiliary power board, the pins of the power device 20 experience significant stress due to its own weight, making it prone to damage and leading to low system reliability.

[0049] To address the shortcomings of low heat dissipation efficiency and low reliability in the existing technology of mounting power devices and heat sinks on the PCS auxiliary power board, embodiments of this application provide an energy storage converter, an energy storage system, and an electrical device.

[0050] The embodiments of this application will now be described in detail with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details have been provided in the embodiments of this application to facilitate a better understanding of the application. However, the technical solutions claimed in this application can be implemented even without these technical details and various variations and modifications based on the following embodiments.

[0051] This application provides an energy storage converter, such as... Figure 2 As shown, the energy storage converter includes: a circuit board carrier 10; a power device 20 located on one side of the circuit board carrier 10, the power device 20 having device pins, the power device 20 being connected to the circuit board carrier 10 through the device pins, and the orthographic projection of the power device 20 on the circuit board carrier 10 being the surface with the largest area of ​​the power device 20; and a heat sink 30 located on the side of the power device 20 away from the circuit board carrier 10, the heat sink 30 having heat sink 30 pins, the heat sink 30 pins being connected to the circuit board carrier 10.

[0052] The aforementioned circuit board carrier is the auxiliary power supply board, typically a rigid printed circuit board. The auxiliary power supply board is a crucial component of the energy storage converter, primarily responsible for providing stable and reliable power to low-power circuits such as the PCS's control, protection, and detection circuits. The auxiliary power supply board usually draws power from the main power supply (e.g., DC or AC) and uses a series of power electronic conversion technologies, such as DC / DC and AC / DC conversion, to convert the voltage and current of the main power supply to voltages and currents suitable for the control circuits and other low-power modules. These conversion processes typically include rectification, filtering, and voltage regulation to ensure the purity and stability of the output power.

[0053] The components mounted on the auxiliary power board are mainly used for power conversion and management, as well as providing necessary power for control and protection systems. Examples include capacitors, inductors, diodes, resistors, and MOSFETs. Power devices generally refer to those with high heat dissipation, such as diodes and MOSFETs. Power devices can also be insulated-gate bipolar transistors (IGBTs).

[0054] In the above embodiments, by laying the power devices flat and soldering them on top of the PCS auxiliary power board, the pins of the power devices are subjected to less force and are less likely to be damaged, thus increasing the reliability of the entire system. It also prevents vertical power devices from blocking the airflow, and the heat sink is directly installed on top of the power devices. After the power devices generate heat, the heat diffuses upward and is directly dissipated through the heat sink, resulting in better heat dissipation.

[0055] In upright mounting, the pins of power devices bear not only their own weight but also the weight of the heatsink. Especially during PCS vibration and transportation, these additional loads can lead to pin fatigue or even breakage, reducing device lifespan and overall system reliability. When power devices are soldered horizontally, their pins primarily bear the contact pressure of the lateral surface, rather than the longitudinal pulling force of gravity. Due to the increased contact area, the force on individual pins is significantly reduced, greatly lowering the risk of pin damage and thus improving the overall reliability of the device.

[0056] In upright mounting, power devices and their heatsinks may obstruct airflow above the auxiliary power board, restricting airflow paths, hindering heat exchange, and reducing heat dissipation efficiency. This is especially critical in high-density, multi-layered PCS designs where maintaining good airflow within limited space is essential. Laying power devices flat reduces their projected area in the vertical direction, avoids obstructing fan airflow, and ensures free airflow. As air flows over the devices, it carries away heat more effectively, significantly improving heat dissipation efficiency.

[0057] Furthermore, when power devices generate heat, the heat naturally diffuses upwards, directly reaching the heat sink above. This direction of heat diffusion conforms to the principles of natural thermodynamics, making the heat dissipation process smoother and more efficient. The heat sink can then fit more tightly against the power devices, and its design can incorporate larger contact areas and denser or more efficient heat sink fins to meet the demands of direct heat dissipation.

[0058] In some embodiments, the device pins are bent bodies including at least one bent portion.

[0059] Figure 3 This is a schematic diagram of the mounting position of a power device and a circuit board carrier in the prior art, such as... Figure 3 As shown, in the prior art, the power device 20 is mounted upright on the circuit board carrier 10, and the device pins of the power device 20 are also upright. In the prior art, the power device 20 is directly inserted into the circuit board carrier 10 through the pins, which leads to pin fatigue or even breakage, reducing the service life of the device and the reliability of the entire system.

[0060] Designing the device's leads as bent bodies with at least one bend increases the contact area between the device and the circuit board, thereby dispersing stress on the leads. This is especially beneficial when the device is subjected to external forces (such as vibration or bumps during transport), as the bend can act as a buffer, reducing the risk of lead breakage. The bending design also allows for adjustment of the device's physical position on the circuit board, making it more stable and avoiding the wobbling and uneven stress problems caused by a higher center of gravity when mounted upright. Bending the leads allows the device to lie flat on the circuit board surface, enabling direct mounting of a heatsink above the device, creating a direct heat dissipation channel and improving heat dissipation efficiency. Mounting a heatsink directly above the device reduces thermal resistance, allowing heat generated by the device to be transferred to the heatsink for dissipation more quickly and directly.

[0061] In some embodiments, such as Figure 4 As shown, the circuit board carrier 10 has a plurality of recesses 11 on the surface near the power device 20, and the device pins of the power device 20 are located in the recesses 11. The depth of the recesses is generally set to 1.5 mm.

[0062] In existing technologies, such as Figure 3 As shown, the power device 20 is directly inserted into the circuit board carrier 10 via upright pins, and the pins of the power device 20 are soldered to the circuit board carrier 10 on the back side (i.e., the side away from the power device 20). In the prior art, the pins of the power device 20 are connected to the circuit board carrier 10 via only one solder joint, and the pins of the power device 20 also need to bear the weight of the power device 20. This easily leads to pin fatigue or even breakage, reducing the lifespan of the device and the reliability of the entire system.

[0063] In the above embodiment, the design of the recess 11 can increase the contact area between the pins of the power device 20 and the circuit board carrier 10, that is, the pins of the power device 20 are soldered into the recess 11 of the circuit board carrier 10 to connect the power device 20 and the circuit board carrier 10, which can improve the durability of the device pins.

[0064] The recess 11 provides additional mechanical support for the device pins, preventing instability caused by the device relying solely on pin contact with the circuit board plane. This design reduces stress on the pins and lowers the risk of damage, especially when the device is subjected to vibration or impact. The circuit board carrier 10 with the recess 11 can better accommodate the shape and size of the device pins, resulting in more stable device mounting and improved durability and reliability of the entire system under different environmental conditions. The recess 11 allows the power device 20 to be closer to the circuit board carrier 10, reducing the height of the device pins and improving the integration of the circuit board, saving space, especially for highly sensitive applications. Furthermore, this design helps to achieve a tighter arrangement of components on the circuit board, optimizing the layout and making the circuit board design more compact and efficient.

[0065] Furthermore, the recess 11 serves as a position guide for device mounting, simplifying the positioning and installation steps of the power device 20 during assembly, and improving production efficiency and assembly accuracy. The design of the recess 11 reduces the distance between the device pins and the circuit board, which helps to reduce the parasitic inductance and resistance of the pins, thereby positively impacting the electrical performance of high-frequency circuits.

[0066] In some embodiments, such as Figure 4 and Figure 5 As shown, the device pins include a first connecting portion 21, a first bending portion 22, a second connecting portion 23, a second bending portion 24 and a third connecting portion 25 connected in sequence. The second connecting portion 23 is perpendicular to the first connecting portion 21, the third connecting portion 25 is parallel to the first connecting portion 21, and the third connecting portion 25 is located in a plurality of recesses 11 of the circuit board carrier 10.

[0067] like Figure 4 and Figure 5 As shown, the power device 20 and the circuit board carrier 10 are electrically connected by being soldered into the recess 11 via the third connecting part 25. The above structure involves two bending processes on the device leads of the power device 20, allowing the power device 20 to be placed laterally on the circuit board carrier 10, unlike in the prior art (such as...). Figure 3 The power devices 20 are placed vertically. This reduces the vertical space occupied in the energy storage converter. In particular, placing the third connection part 25 in the recess 11 of the circuit board carrier 10 can significantly reduce the space occupied by the devices in the vertical direction, which is conducive to achieving a high-density layout of the circuit board. This pin design allows the power devices 20 to be arranged more closely on the circuit board, which helps to optimize the use of space on the circuit board and may reduce the overall size and weight of the device.

[0068] Furthermore, the horizontal placement of the power device 20 allows the circuit board carrier 10 to bear part of the weight of the power device 20, effectively reducing the load on the device pins. Additionally, the third connection portion 25, soldered into the recess 11, significantly increases the contact area between the device pins and the circuit board carrier 10, compared to existing technologies (such as...). Figure 3 The upright placement of the power device 20 increases the contact area between the power device 20 and the circuit board carrier 10, resulting in less stress. Furthermore, the addition of bends in the device pins, particularly the first bend 22 and the second bend 24, disperses the stress points under gravity, reducing the stress on the pins, lowering the risk of pin breakage, and making the device pins less susceptible to damage, thus improving the overall system reliability.

[0069] And, as Figure 3 As shown, in the prior art, the power device 20 is placed upright on the circuit board carrier 10, with the pins of the power device 20 directly inserted into the back of the circuit board carrier 10. Soldering is then performed from the back (the side away from the power device 20), which adds an extra soldering step. That is, the circuit board carrier 10 is the auxiliary power board in the energy storage converter, and multiple components (such as resistors and capacitors) are soldered on its front side (the side closest to the power device 20). However, in the prior art, after soldering some components on the front of the circuit board, it is necessary to solder them from the back.

[0070] Furthermore, double-sided soldering, compared to single-sided soldering, involves additional soldering steps, resulting in higher material consumption (such as solder paste and flux) and longer production cycles, thus increasing costs. Double-sided soldering also increases the complexity of process control, particularly in ensuring the quality and consistency of the two soldering processes. Improper process parameter control can lead to problems such as open solder joints, cold solder joints, and incomplete solder joints. Subsequent back-side soldering processes may affect the solder joints already formed on the front side, for example, by melting or deforming them due to heating, impacting the reliability of the electrical connection.

[0071] For certain sensitive electronic components, repeated thermal cycling (i.e., repeated soldering processes) can affect their performance and lifespan, as high temperatures and thermal stress can lead to material fatigue, aging, or performance degradation. During double-sided soldering, the circuit board may undergo complex thermal deformation during heating and cooling, requiring the circuit board material to have good thermal stability; otherwise, the soldering quality will be affected.

[0072] Therefore, this embodiment uses only one welding process, which can effectively avoid the above problems.

[0073] In some embodiments, such as Figure 5 As shown, the length of the first connecting part 21 is a preset length, which is 3.3mm to 3.6mm.

[0074] The first connecting portion 21, with a length of 3.3mm to 3.6mm, maintains sufficient contact area to ensure the quality of heat conduction and electrical connection between the device and the circuit board. Too short a pin may lead to poor contact, affecting heat dissipation and electrical performance; too long a pin may increase mechanical stress, affecting the stability and reliability of the device. Within this preset length range, the pin receives sufficient support, reducing the risk of damage due to its own weight or external vibration. Simultaneously, the connection between the pin and the circuit board is less susceptible to excessive stress, contributing to improved mechanical stability of the entire system. In high-density circuit board layouts, controlling the length of the first connecting portion 21 to 3.3mm to 3.6mm helps reduce the lateral and longitudinal space occupied between devices, enabling a more compact circuit board design. This is crucial for electronic product designs pursuing miniaturization and high power density.

[0075] The embodiment with a first connection length of 3.3mm to 3.6mm is based on considerations of thermal, electrical, mechanical, and manufacturing efficiency, aiming to achieve optimal connection performance between power devices and the circuit board while ensuring high system reliability and efficiency. This design detail plays a crucial role in electronic products, especially in the design of high-performance and high-density circuit boards.

[0076] In some embodiments, such as Figure 5 As shown, the bending radius of the first bending portion 22 is 0.3mm to 0.4mm, the bending radius of the second bending portion 24 is 0.3mm to 0.4mm, and the length of the third connecting portion 25 is 7mm to 8mm.

[0077] The setting of the bending radius of the first bend (0.3mm~0.4mm) reduces stress concentration on the pins during bending, thereby reducing potential microcracks or damage at the bending point and improving the mechanical strength and long-term reliability of the device. A larger bending radius also helps improve the pins' toughness under external mechanical forces, reducing the risk of pin breakage due to vibration or impact. Furthermore, the setting of the bending radius of the first bend will not affect the subsequent soldering length and soldering effect if it is too long.

[0078] During bending, the change in pin geometry directly affects the quality of the electrical connection. An appropriate bending radius helps to form a stable electrical contact, reducing contact resistance and inductance, thereby optimizing signal transmission efficiency and reducing signal attenuation and reflection. The length of the third connection part 25 is set at 7mm~8mm, which ensures a sufficient and stable electrical connection length between the pin and the board pad, further improving signal integrity and electrical performance.

[0079] In summary, by carefully designing the bending radii of the first bending portion 22 and the second bending portion 24, as well as the length of the third connecting portion 25, the mechanical strength, electrical performance, and thermal management capabilities of the device can be significantly improved, while simplifying the production process and optimizing space utilization.

[0080] In addition, power devices can be mounted on the circuit board carrier in two ways, one of which is as follows: Figure 6 As shown, the power device 20 is in contact with the circuit board carrier 10, or, as another example... Figure 7 As shown, the energy storage converter also includes a first fixing member 40, which is located in the gap between the power device and the circuit board carrier.

[0081] When the power device 20 is in direct contact with the circuit board carrier 10, the heat conduction path is shortest, effectively reducing thermal resistance and improving heat dissipation efficiency. This is particularly advantageous for high power density applications, helping to maintain the device within a safe operating temperature range and extending its lifespan. Direct contact ensures a stable electrical connection between the power device 20 and the circuit board carrier 10, reducing electrical connection problems caused by intermediate connector failures and improving the overall reliability of the system.

[0082] Furthermore, since the power device 20 is in direct contact with the circuit board carrier 10, the power device 20 can be clamped between the circuit board carrier 10 and the heat sink 30, preventing the power device 20 from shifting and improving system reliability.

[0083] The first fixing member 40 provides additional mechanical support to the power device 20, ensuring its stability under external vibration or impact, thus improving its shock resistance and long-term stability. The fixing member's design also helps distribute stress on the device pins, reducing the risk of pin damage. The first fixing member 40 can be made of insulating material, forming an insulating layer between the power device 20 and the circuit board carrier 10. This is essential in high-voltage or high-current applications to prevent electrical faults such as short circuits.

[0084] Furthermore, when the power device is in contact with the circuit board carrier, the distance between the bent edge and the power device body is 1.5 mm lower. Specifically, the distance between the side of the third connecting portion in contact with the circuit board carrier and the side of the power device in contact with the circuit board carrier in the first direction is 1.5 mm (i.e., the recess depth). The first direction refers to the thickness direction of the circuit board carrier 10. The dimensions of the second connecting portion of the power device need to be set according to the thickness of the power device body and the recess depth. When there is a first fixing member between the power device and the circuit board carrier, the dimensions of the second connecting portion of the power device also need to take into account the thickness of the first fixing member.

[0085] In some embodiments, such as Figure 8 As shown, the length of the pins of the heat sink 30 in the first direction is greater than the thickness of the power device 20, and the first direction is the thickness direction of the circuit board carrier.

[0086] Because the heatsink is located on the side of the power device furthest from the circuit board carrier, and because it connects to the carrier via pins, the heatsink pin height must be greater than the thickness of the power device. Furthermore, extending the heatsink pins beyond the power device's thickness ensures a tight contact between the heatsink and the device, creating a more direct and efficient heat conduction path. This design helps accelerate heat transfer from the power device to the heatsink, thereby improving overall heat dissipation efficiency and keeping the device within a safe operating temperature range. The extra length of the heatsink pins provides stronger physical support, making the connection between the heatsink and the circuit board carrier more secure, reducing the possibility of loosening or displacement due to external forces (such as vibration and impact), and improving the system's mechanical reliability.

[0087] Furthermore, the pins of a heatsink are typically located at the four corners of the heatsink, meaning there are four pins in total.

[0088] In some embodiments, such as Figure 8 As shown, the power device 20 and the heat sink 30 are connected by the second fastener 50.

[0089] The second fastener 50 (such as a screw, clip, or spring) ensures a secure connection between the power device 20 and the heat sink 30, reducing loosening caused by vibration, thermal expansion, or external mechanical stress, thereby improving the mechanical stability and reliability of the entire system. Using the second fastener 50 allows for the application of appropriate pressure, ensuring a tight contact between the power device 20 and the heat sink 30, reducing thermal resistance and improving heat transfer efficiency. This means that the heat generated by the power device during operation can be transferred to the heat sink more quickly and effectively, lowering the device's operating temperature and extending its lifespan. The connection via the second fastener 50 makes the installation and removal of the power device 20 and the heat sink 30 much easier than direct welding or bonding, greatly simplifying routine maintenance and equipment upgrades. If a device or heat sink needs replacement, it can be done quickly and without damage, reducing equipment downtime and maintenance costs. The second fastener 50 can be designed with some elasticity or adjustability to help absorb the thermal expansion differences between the power device 20 and the heat sink 30 at different operating temperatures, thereby reducing thermal stress and minimizing material fatigue or damage caused by thermal cycling.

[0090] Specifically, such as Figure 4 , Figure 5 and Figure 9As shown, the power device 20 includes a through hole 26, and the heat sink 30 has a circular recess 31. The inner wall of the circular recess 31 has a thread, which is used to lock a screw 32. The screw 32 is used to pass through the through hole 26 of the power device and couple with the circular recess 31 of the heat sink 30 and a nut to connect the power device 20 and the heat sink 30. The diameter of the through hole 26 is larger than the diameter of the screw 32.

[0091] In some embodiments, one of the aforementioned heat sinks is connected to one of the aforementioned power devices.

[0092] The one-to-one connection ensures the heatsink is directly attached to the power device, forming the most direct heat conduction path. This design reduces thermal resistance, accelerates heat transfer, and effectively lowers the operating temperature of the power device, improving heat dissipation efficiency. Each power device has its own independent heatsink, simplifying thermal design and layout on the circuit board and avoiding space constraints and uneven heat distribution issues that can occur when multiple devices share a heatsink. Since each power device has its own heatsink, replacement or maintenance of a particular device or heatsink can be performed selectively without affecting other components. This not only simplifies the maintenance process but also improves the upgradeability and maintainability of the equipment. The one-to-one heatsink design allows each power device to select the most suitable heatsink type and specification based on its thermal characteristics, size, and location requirements. This flexibility helps optimize system performance and meet the needs of complex circuit designs.

[0093] Furthermore, this arrangement of one heat sink per power device allows for more flexible placement of the power device on the circuit board carrier.

[0094] Alternatively, by mounting the heat sink above the power devices, some power devices can use one heat sink while others use another, or a single heat sink can be placed above all power devices.

[0095] Some power devices use one heat sink, while others use another. This design allows multiple power devices with similar heat output to share a single heat sink, which can save on heat sink costs to some extent.

[0096] Using a single large heatsink to cover all power devices can save space in some cases, simplify circuit board layout, and avoid the space and layout complexity of individual heatsinks for each device, resulting in a more compact circuit board design. A single large heatsink may also offer economies of scale compared to multiple smaller heatsinks, meaning lower production and installation costs. This is because mass-producing and installing a large heatsink is generally more economical than installing multiple smaller heatsinks, reducing waste in materials and manufacturing processes.

[0097] Additionally, large shared heatsinks may require stronger structural support to ensure stability under their own weight and potential external mechanical stresses. This may necessitate adding extra structural support points to the circuit board design or using more robust fasteners. In other words, the heatsink may need multiple (>4) pins to maintain structural stability.

[0098] The radiator can be a direct-insertion radiator or a pin-type radiator.

[0099] In-line heat sinks typically consist of a series of pin-shaped heat sinks that are vertically inserted into a circuit board or directly fixed to heat-generating electronic components. These heat sinks are often closely spaced to form a heat dissipation array perpendicular to the circuit board surface, directly contacting the power devices and relying on the thermal conductivity of the metal to absorb heat.

[0100] Pin-type heatsinks have long, thin, and densely packed fins that point vertically towards the air. While their structure is similar to in-wall heatsinks in that the fins are also arranged vertically, pin-type heatsinks typically have thinner, longer, and denser fins than in-wall heatsinks.

[0101] Pin-type heatsinks, due to their high fin density and large surface area, generally offer higher heat dissipation efficiency and are more suitable for high-heat-load environments. In-wall heatsinks may occupy less space in certain situations, especially when the fins are inserted vertically into the circuit board. While pin-type heatsinks offer better heat dissipation efficiency, they may require more lateral space, particularly with high fin density. In-wall heatsinks are relatively simple to manufacture, while pin-type heatsinks can be more complex, especially when manufacturing long, densely packed fins, requiring higher precision and strength in the materials. Therefore, the choice of heatsink type should be based on the specific application requirements.

[0102] In some embodiments, such as Figure 10 As shown, the energy storage converter also includes an air-cooled structure 60, which includes a fan 61 and a fan bracket 62. The fan 61 is fixed to the top of the fan bracket 62 by a third fastener, and the fan bracket 62 is connected to the heat sink 30 by a fourth fastener. The fan 61 is located on the side of the heat sink 30 away from the power device 20.

[0103] The fan 61 is located directly on the side of the heatsink 30 furthest from the power device 20, allowing for immediate forced air cooling of the heatsink 30 and accelerating the heat dissipation process from the heatsink 30 to the environment, thus improving heat dissipation efficiency. This design ensures that the heat dissipation surface of the heatsink can be cooled rapidly, effectively reducing the temperature of the power device. The fan bracket 62 not only supports the fan 61 but also acts as an airflow guide, ensuring that the air blown by the fan is directly directed at the heatsink 30, avoiding airflow dispersion or obstruction by other components, thereby optimizing the airflow path and improving the cooling effect.

[0104] like Figure 10 As shown, using the third fastener 63 and the fourth fastener 64 to fix the fan 61 and fan bracket 62 respectively enhances the stability of the air-cooled structure, reduces vibration and noise during operation, and prevents components from loosening or falling off due to prolonged operation, thus improving the overall system reliability. The third fastener 63 and the fourth fastener 64 can be screws, clips, or springs, etc. The fan 61 and fan bracket 62 are separately connected to the heat sink 30 via the fasteners, meaning that the fan and bracket can be disassembled and replaced independently of the heat sink, simplifying the maintenance process, especially when the fan malfunctions or needs cleaning, allowing for more convenient operation. Placing the fan 61 above the heat sink 30, rather than within the circuit board plane, maximizes the use of three-dimensional space, reduces the circuit board area occupied by the cooling system, and facilitates the design of a more compact and efficient energy storage converter. The independent fan and bracket design means that the fan performance parameters (such as speed and airflow direction) and the heat sink geometry can be flexibly adjusted to meet the cooling needs of different power devices, achieving the best cooling effect.

[0105] The aforementioned air-cooled structure is generally connected in conjunction with a pin-type heatsink. For example... Figure 11 As shown, in addition to the air-cooling structure described above, the fan 61 can also be directly mounted on the base plate 34 of the heat sink 30, which eliminates the need for a fan bracket and saves vertical space, but will occupy more horizontal space. If the heat sink is a direct-flow heat sink, the fan is generally mounted on the heat sink base plate (side), while if it is a pin-type heat sink, both mounting methods are applicable.

[0106] Specifically, in a direct-flow heatsink, the heatsink fins are arranged vertically, eliminating the need for a fan bracket. The fan is directly mounted on the side of the heatsink base plate, typically secured with rails or screws, thus reducing the need for an additional fan bracket and minimizing vertical space usage. Furthermore, the fan directs airflow towards the heatsink, with the airflow flowing directly along the fins to efficiently remove heat. Due to the direct-flow structure, the airflow direction aligns with the fin arrangement, resulting in high cooling efficiency. This design is particularly effective in space-constrained environments, such as energy storage converters installed in server racks. The direct fan blowing ensures that heat is quickly dissipated by the airflow, improving cooling efficiency. Simultaneously, the elimination of a fan bracket reduces the overall height of the equipment, making it more suitable for deployment in confined spaces.

[0107] In some embodiments, the fan may not be connected to the heat sink; instead, it can be mounted independently on the side wall of the energy storage converter. In this case, to improve the heat sink's cooling performance, the power devices and heat sink structure are typically mounted close to the fan to prevent other large components (e.g., capacitors) from obstructing the fan's airflow. This requires corresponding modifications to the wiring on the circuit board carrier.

[0108] Specifically, the fan is independently mounted on the side wall of the energy storage converter and is not directly connected to the heat sink. However, the relative position between the fan and the heat sink is considered during the design phase to ensure that the heat sink can receive sufficient airflow for heat dissipation. By optimizing the wiring layout on the circuit board, large capacitors and other components are prevented from obstructing the airflow, ensuring that the airflow generated by the fan can directly blow onto the heat sink, thereby improving heat dissipation efficiency. In addition, the independent fan mounting position can be flexibly adjusted according to the internal layout of the equipment, optimizing the overall airflow path. This setting increases design flexibility and can be optimized according to the internal spatial layout and component arrangement of the energy storage converter. The independent fan is not limited by the heat sink position and can be installed in a location that is more conducive to overall heat dissipation, such as near the air inlet or far from other heat sources, avoiding the recirculation of hot airflow. At the same time, the adjustment of the wiring layout ensures unobstructed airflow, allowing the heat sink to receive sufficient air volume, thereby improving heat dissipation efficiency and the thermal stability of the equipment.

[0109] When a fan is independently mounted on the side wall of an energy storage converter, the routing on the circuit board must follow a specific set of design principles and processes to ensure that the power devices and heatsink structure are closer to the fan and to optimize the heat dissipation path. First, determine the optimal installation position of the fan, typically directly facing the main heat source to ensure that airflow is directed directly to the heatsink and power devices. Next, identify high-power, high-heat-generating devices on the circuit board, such as MOSFETs and diodes; these are the primary targets for heat dissipation and must be ensured that the fan airflow can directly reach them.

[0110] During the circuit board design phase, re-plan the routing paths to ensure that signal and power lines avoid areas in front of high-power devices and heatsinks, preventing obstruction of fan airflow. For example, the routing can be designed to circle around or bypass these areas. Using a multi-layer circuit board design, distribute the traces across different layers, with the layers containing power devices and heatsinks as close as possible to the fan mounting surface to reduce the distance between heat sources and the fan. Other layers can be used to route signal lines and control circuitry to reduce electromagnetic interference (EMI). Adding shielding layers or ground planes to certain layers of the circuit board, especially near high-power devices, reduces EMI generated by fan and heatsink operation and protects sensitive circuitry.

[0111] Adjust the density and direction of traces to balance heat dissipation requirements and circuit layout. Reduce trace density around power devices to avoid obstructing airflow, while traces on the back of heatsinks and power devices can be densified appropriately, ensuring sufficient insulation and thermal clearance. Ensure good thermal contact between power devices and heatsinks, which can be achieved by adding thermal pads or improving pad design. Simultaneously, insulation requirements must be considered, ensuring sufficient insulation distance and material between heatsinks and sensitive components on the circuit board. Move secondary heat-generating components and large capacitors to the far ends or sides of the circuit board to prevent them from obstructing the airflow path from the fan directly to the heatsinks.

[0112] Taking a typical energy storage converter circuit board as an example, assume the MOSFETs are located in the center, the heatsink is attached to them, and the fan is independently mounted on one side of the board. During the design, the signal and power lines of the MOSFETs are routed along the edge of the circuit board, avoiding direct contact with the MOSFETs and heatsink to ensure unobstructed airflow. A ground plane is added above the MOSFETs and heatsink for electromagnetic shielding, while traces are routed on the lower layer to reduce interference. The layout of other components on the circuit board is adjusted, such as moving large capacitors to the sides to prevent them from obstructing the fan airflow. Thermally conductive materials, such as thermal grease or gaskets, are used between the heatsink and the circuit board to enhance heat conduction. Airflow is simulated using CFD software to optimize the design and ensure that airflow effectively covers the heatsink and MOSFETs.

[0113] This carefully tailored wiring strategy significantly improves heat dissipation efficiency, reduces heat-related failures, and maintains circuit board functionality and signal quality. The optimized energy storage converter can maintain stable operation under higher loads, extending equipment lifespan and reducing maintenance costs.

[0114] The installation location of the fans should be carefully designed based on the type of radiator (direct-flow or pin-mount) and the internal space layout of the equipment. Fans mounted on the side of a direct-flow radiator save vertical space, while fans mounted on the top of a pin-mount radiator provide better cooling when there is sufficient horizontal space. Independently mounted fans improve design flexibility and the overall efficiency of the cooling system. Through these synergistic mechanisms, energy storage converters with different fan installation configurations can optimize the spatial layout of the equipment, reduce thermal management costs, and improve equipment reliability and lifespan while ensuring cooling efficiency.

[0115] In some embodiments, such as Figure 10 As shown, the height of the fins of the heat sink 30 in the first direction is 15mm to 16mm, and the thickness of the fan 61 in the first direction is 6mm to 7mm. The first direction is the thickness direction of the circuit board carrier.

[0116] The aforementioned heatsink is a pin-type heatsink, with fins measuring 15mm-16mm in height to provide ample surface area for enhanced heat exchange efficiency. The taller fins more effectively conduct heat from the power devices to the heatsink, which is then dissipated into the environment via air convection. This significantly improves cooling efficiency, especially when combined with the forced convection of fan 61. The fan 61, with a thickness of 6mm-7mm, ensures a tight fit between the fan and the heatsink without occupying excessive vertical space. This design allows the airflow generated by the fan to directly and effectively impact the heatsink fins, optimizing airflow direction and avoiding wasted space during airflow, thereby further improving cooling efficiency.

[0117] Ensuring that the dimensions of the heatsink and fan remain within a certain range along the thickness of the circuit board helps maintain the stability of the system structure. Simultaneously, controlling the dimensions of the fins and fan in the first direction effectively utilizes space, avoiding excessive occupation of planar area on the circuit board and allowing for more flexible layout of other electronic components and circuits. This dimensional design combines comprehensive considerations of heat dissipation, airflow path, structural stability, and space utilization, contributing to the overall optimization of thermal management of the electronic system. By improving heat dissipation efficiency and space utilization efficiency, the performance degradation and failure risk caused by overheating of the entire system can be reduced.

[0118] By setting the fin height of the heat sink 30 to 15mm-16mm and the thickness of the fan 61 to 6mm-7mm, this design achieves a balance between efficient heat dissipation, optimized airflow path, structural stability, and space utilization in the thickness direction of the circuit board carrier. It reduces noise and power consumption, optimizes thermal management, and also considers cost-effectiveness, providing a more refined and high-performance solution for the heat dissipation system of electronic devices. This design is particularly suitable for high-density electronic devices that require efficient heat dissipation within limited space, such as energy storage systems, servers, and high-performance computing devices.

[0119] In some embodiments, copper tubes can be used to connect the fins of the heat sink, where the fins are aluminum fins. The copper tubes are strung on the aluminum fins, and these multiple copper tubes are designed to run through the center of the fins, forming a closed fluid circulation system. This method fully utilizes the high thermal conductivity of copper and the efficient heat exchange capacity of liquid cooling. The copper tubes are precision-machined to match the shape of the heat sink fins and are securely embedded into the fins using brazing or other welding techniques, ensuring a seamless connection and reducing thermal resistance. Due to the high thermal conductivity of copper, the copper tubes allow heat from the power devices to be conducted to the heat sink fins more quickly.

[0120] Specifically, firstly, based on the layout and heat dissipation requirements of heat-generating components such as IGBTs, the structure of the heat sink fins and copper pipes is designed. The fin spacing and thickness need to take into account airflow efficiency and the feasibility of copper pipe layout to ensure optimal matching between the two. The path and penetration pattern of the copper pipes are clearly defined to ensure that the copper pipes can cover as many fins as possible and make close contact with the heat-generating components to improve heat conduction efficiency.

[0121] The appropriate copper tube diameter and material are selected based on factors such as thermal conductivity, pressure resistance, and cost. Common copper tube materials include oxygen-free copper and phosphorus-deoxidized copper; the former has higher thermal conductivity, while the latter has better oxidation resistance. Aluminum alloy fins are usually used because of their good thermal conductivity and low cost, but copper fins may be chosen in high-end applications to further improve thermal conductivity.

[0122] Fins are manufactured using processes such as stamping, cutting, and extrusion to ensure that the dimensional accuracy and surface roughness of the fins meet design requirements. The copper tubes undergo precision machining, including bending and cutting, to adapt to the specific shape and spatial layout of the radiator. The ends of the copper tubes are treated in preparation for connection to the cooling system or liquid circulation system. Brazing, laser welding, or ultrasonic welding techniques are used to firmly connect the copper tubes to the fins. Brazing is the most commonly used method because it achieves a uniform and strong bond between the copper tubes and fins, while having minimal impact on the overall structure of the radiator.

[0123] Both ends of the copper tubing must be connected to the inlet and outlet of the cooling system. In high-power applications, the copper tubing may need to be connected to complex cooling devices such as pumps, heat exchangers, or cooling towers. After assembly, a leak test should be performed on the connection between the copper tubing and the cooling system to ensure there are no leaks, preventing the loss of cooling medium or contamination of internal components.

[0124] In addition, it is necessary to ensure that there are appropriate insulation measures between the copper pipes and the circuit board or other conductive components to avoid the risk of short circuits. Considering the dust or impurities that may accumulate during long-term operation, the structure should be designed for easy disassembly and cleaning, and the cooling system should be inspected and maintained regularly to keep it in optimal operating condition.

[0125] In some embodiments, the heat sink consists of multiple rows of fins, with thin-diameter copper tubes running between each row to form a continuous cooling channel. The fins and copper tubes are tightly bonded using precision brazing technology, with strict temperature and pressure control during the welding process to ensure minimal thermal resistance at the interface. The copper tubes are connected at both ends to the server's cooling circulation system, which includes a coolant container, a water pump, and an external heat exchanger. The coolant absorbs heat during circulation and then dissipates it into the environment through the heat exchanger. CFD simulations are used to optimize the fluid flow path within the copper tubes, ensuring an optimal balance between heat dissipation efficiency and pressure loss. Finally, rigorous thermal and pressure tests are conducted to confirm the reliability and effectiveness of the system operation.

[0126] Copper, as a commonly used metallic material, plays an extremely important role in the thermal management of power electronic devices. This is because copper has a very high thermal conductivity, approximately 401 W / (m·K), which means it can transfer heat very efficiently, superior to most other metallic materials.

[0127] In traditional power device (e.g., IGBT) heat dissipation designs, heat is typically transferred through an aluminum substrate or a heat sink in direct contact with the power device (e.g., IGBT), and then diffused into the environment through the fins of the heat sink. However, the thermal conductivity of aluminum is approximately 237 W / (m·K), lower than that of copper, which means that the efficiency of heat transfer is limited.

[0128] In the "copper pipe penetrating the heat sink fins" structure, the copper pipe is in direct contact with the heat source of the power device (e.g., IGBT), acting as a thermal bridge. The heat generated by the power device (e.g., IGBT) is first transferred to the copper pipe. Due to copper's high thermal conductivity, the heat can quickly diffuse along the copper pipe, rather than being confined to the contact point, thus greatly improving the heat dissipation capability of the heat source. Subsequently, the heat is transferred through the copper pipe to the heat sink fins, and then carried away by airflow or coolant circulation, achieving efficient heat dissipation.

[0129] Because the copper tube is in direct contact with the power device (e.g., IGBT), heat can be rapidly diffused through the copper tube to the fins of the heat sink, reducing thermal resistance and improving overall heat dissipation efficiency. The presence of the copper tube makes the temperature more uniform throughout the heat sink, preventing localized overheating and extending the lifespan of the IGBT and its surrounding components. The copper tube allows for higher heat flux densities, which is particularly important for high-power-density IGBTs, ensuring that the IGBT operates within a safe temperature range even under high current or high-voltage drop conditions.

[0130] In summary, the "copper tube penetrating the heat sink fins" design utilizes copper's high thermal conductivity to achieve efficient and rapid heat transfer from power devices (e.g., IGBTs). This design is particularly suitable for power electronic equipment that needs to operate stably under high power and high heat load conditions. By optimizing thermal management, it extends the equipment's lifespan and improves operational safety and efficiency. In practical applications, this structure has proven to be an effective solution for improving heat dissipation efficiency, achieving thermal equilibrium, and increasing heat flux density, especially demonstrating its superiority in high power density applications such as energy storage inverters and electric vehicle drive systems.

[0131] In addition, a self-cleaning design can be added to the heat sink fins. By specially designing the shape of the heat sink fins, such as using serrated edges or a special coating, they can acquire self-cleaning capabilities under the action of fan airflow, reducing the impact of dust accumulation on heat dissipation performance. The self-cleaning design extends the maintenance cycle of the heat sink, reduces maintenance costs, and maintains long-term stable heat dissipation performance, which is particularly beneficial for energy storage converters deployed in dusty environments.

[0132] The fins are designed with serrated edges to utilize wind resistance and airflow vortices, helping to capture and expel dust adhering to the fin surface. The angle and size of the serrations are determined through fluid dynamics simulation analysis to achieve optimal self-cleaning performance. By tilting the fins, gravity and airflow work together to promote dust sliding down the fins and falling off, reducing dust accumulation. The tilt angle can be optimized and adjusted according to the equipment's placement and airflow direction.

[0133] Alternatively, a superhydrophobic material, such as fluorinated silane or silica nanoparticles, can be coated onto the fin surface, making it difficult for moisture and dust to adhere. Even if dust settles, it can be naturally washed away by rainwater or condensation. Photocatalysts (such as titanium dioxide, TiO2) can be used to generate strong oxidation under light conditions, decomposing organic dirt on the fin surface, thereby reducing the likelihood of dust adhesion and improving self-cleaning properties. A coating with electrostatic repulsion can be used to reduce the electrostatic adsorption of dust particles on the fin surface, lowering the probability of dust deposition. Simultaneously, by designing a specific electric field distribution, it actively repels approaching dust particles.

[0134] The self-cleaning fin design maintains stable heat dissipation efficiency for a longer period in dusty environments, reducing increased thermal resistance and decreased heat dissipation performance caused by dust accumulation. By reducing dust adhesion and simplifying the cleaning process, the frequency of regular radiator maintenance is significantly reduced, saving maintenance time and costs. Maintaining good heat dissipation performance helps prevent equipment overheating, reduces hardware failures, and extends the lifespan of the entire system. The enhanced self-cleaning capability allows the radiator to maintain high efficiency even in harsh environments, broadening the application range and environmental adaptability of energy storage converters.

[0135] In some embodiments, such as Figure 12 As shown, the energy storage converter also includes an insulating layer 70, which is located between the power device 20 and the heat sink 30.

[0136] The presence of the insulating layer 70 ensures electrical isolation between the power device 20 and the heat sink 30, preventing electrical short circuits caused by direct contact. This is crucial for ensuring the safe operation of the equipment, especially in high-voltage or high-current applications. Although the primary function of the insulating layer 70 is electrical isolation, it is typically made of materials with good thermal conductivity (such as ceramics or specially formulated composite materials). These materials can efficiently transfer heat from the power device 20 to the heat sink 30 while remaining non-conductive, thereby improving heat dissipation efficiency. As an intermediate layer, the insulating layer 70 provides additional mechanical support, reducing the mechanical stress that may result from direct contact between the power device and the heat sink, especially when the heat sink is subjected to vibration during operation. This helps extend the lifespan of the devices and improve the overall reliability of the system.

[0137] Introducing an insulating layer between power devices and heat sinks not only ensures the electrical safety of the equipment but also optimizes heat conduction paths, improves mechanical stability and heat dissipation, making it an indispensable part of modern high-density, high-performance electronic devices. In devices such as energy storage converters, the use of insulating layers helps to achieve a more efficient, safe, and reliable thermal management system.

[0138] An insulating layer, typically a ceramic substrate, is placed between the power device and the heat sink. Thermally conductive silicon is placed between the ceramic substrate and the heat sink, and also between the power device and the ceramic substrate. Thermally conductive silicon is used because its dielectric constant is high enough.

[0139] Ceramic substrates can be mounted one on a power device, or one layer on a row of power devices, one layer on a column of power devices, or one layer on all power devices, depending on the actual situation.

[0140] It is preferable to mount a ceramic substrate on a power device, because ceramic substrates are relatively brittle and are prone to breakage if they are too large. Therefore, mounting a ceramic substrate on a power device has higher reliability.

[0141] In addition, the material of the insulating layer is not limited to ceramic substrates and thermally conductive silicon; any material with a high dielectric constant can be selected.

[0142] Embodiments of this application also provide an energy storage system, including any of the above-described energy storage converters.

[0143] The optimized heat dissipation design and spatial layout of the above embodiments enable easier integration of the energy storage converter into the energy storage system, reducing system-level design challenges, decreasing the likelihood of failures due to high temperatures, and enhancing the safety and stability of the entire energy storage system. The advantages of this design are particularly evident in high-temperature or harsh environments, improving the system's ability to withstand severe conditions. Furthermore, the more efficient heat dissipation design means that less heat dissipation material or a smaller heat sink can be used, thereby reducing manufacturing costs. Simultaneously, due to the improved heat dissipation efficiency, fan operating time and energy consumption are correspondingly reduced, contributing to lower operating costs and energy conservation and emission reduction.

[0144] An embodiment of this application also provides an electrical device, including the above-described energy storage converter.

[0145] The above embodiments integrate an optimized energy storage system (including a flat-mounted heating element and a directly mounted heat sink) into the electrical equipment, significantly improving the equipment's performance and operating efficiency. The optimized energy storage converter design improves energy conversion efficiency and reduces energy losses during conversion and transmission, making the equipment more energy-efficient and reducing overall energy consumption. The flat mounting of the heating element saves vertical space, allowing for more flexible internal structure design and optimized spatial layout, suitable for space-constrained environments such as electric vehicles, small data centers, or smart home systems. The heat sink is directly mounted above the heating element, simplifying the thermal management system and reducing maintenance complexity and costs. Simultaneously, improved heat dissipation efficiency reduces the frequency of heat dissipation component replacement, lowering long-term maintenance costs. For end-user-oriented equipment, such as electric vehicle charging stations and home energy storage devices, optimized thermal management reduces noise and heat emissions during operation, providing a more comfortable and safer user experience. Improved heat dissipation efficiency enables electrical equipment to maintain good operating conditions in a wider range of environments. Whether in high-temperature outdoor environments or enclosed spaces, the equipment can effectively control the internal temperature and ensure high-performance operation.

[0146] Those skilled in the art will understand that the above embodiments are specific examples of implementing this application, and in practical applications, various changes in form and detail can be made without departing from the spirit and scope of this application. Any person skilled in the art can make various alterations and modifications without departing from the spirit and scope of this application; therefore, the scope of protection of this application should be determined by the scope defined in the claims.

Claims

1. An energy storage converter, characterized in that, include: Circuit board carrier; A power device is located on one side of the circuit board carrier. The power device has device pins and is connected to the circuit board carrier through the device pins. The orthographic projection of the power device on the circuit board carrier is the surface with the largest area of ​​the power device. A heat sink is located on the side of the power device away from the circuit board carrier, and the heat sink has heat sink pins that are connected to the circuit board carrier. The circuit board carrier, the power device, and the heat sink are arranged sequentially from bottom to top. A capacitor is installed on the circuit board carrier, which is an auxiliary power board. The power device and the heat sink are connected by a second fastener. The energy storage converter also includes an air-cooled structure, which includes a fan and a fan bracket. The fan is fixed to the top of the fan bracket by a third fastener. The fan bracket is connected to the heat sink by a fourth fastener. The fan is located on the side of the heat sink away from the power device.

2. The energy storage converter according to claim 1, characterized in that, The device pins are bent bodies including at least one bent portion.

3. The energy storage converter according to claim 1, characterized in that, The circuit board carrier has multiple recesses on the side surface near the power device, and the device pins of the power device are located in the recesses.

4. The energy storage converter according to claim 1, characterized in that, The device pins include a first connecting portion, a first bent portion, a second connecting portion, a second bent portion, and a third connecting portion connected in sequence, wherein the second connecting portion is perpendicular to the first connecting portion, the third connecting portion is parallel to the first connecting portion, and the third connecting portion is located in multiple recesses of the circuit board carrier.

5. The energy storage converter according to claim 4, characterized in that, The length of the first connecting part is a preset length, which is 3.3mm to 3.6mm.

6. The energy storage converter according to claim 4, characterized in that, The bending radius of the first bending part is 0.3mm~0.4mm, the bending radius of the second bending part is 0.3mm~0.4mm, and the length of the third connecting part is 7mm~8mm.

7. The energy storage converter according to claim 1, characterized in that, The power device is in contact with the circuit board carrier, or the energy storage converter further includes a first fixing member located in the gap between the power device and the circuit board carrier.

8. The energy storage converter according to claim 1, characterized in that, The length of the pins of the heat sink is greater than the thickness of the power device in a first direction, where the first direction is the thickness direction of the circuit board carrier.

9. The energy storage converter according to claim 1, characterized in that, One of the heat sinks is connected to one of the power devices.

10. The energy storage converter according to claim 1, characterized in that, The height of the fins of the heat sink in the first direction is 15mm~16mm, and the thickness of the fan in the first direction is 6mm~7mm, where the first direction is the thickness direction of the circuit board carrier.

11. The energy storage converter according to claim 1, characterized in that, The energy storage converter also includes: An insulating layer is located between the power device and the heat sink.

12. An energy storage system, characterized in that, include: The energy storage converter according to any one of claims 1 to 11.

13. An electrical appliance, characterized in that, include: The energy storage converter according to any one of claims 1 to 11.

Images