Wafer clamping device, processing device and chemical mechanical polishing apparatus

Abstract

This invention provides a wafer clamping device, a processing device, and a chemical mechanical polishing (CMP) apparatus. The wafer clamping device includes: a retaining ring, a base, a base motor, and jaws. The base has a disc-shaped structure with jaws spaced apart on its front side. The retaining ring surrounds the outer periphery of the base at a certain gap. The jaws include a windward surface, an upper surface, an outer surface, an inner surface, and a leeward surface. The upper surface faces the base and is inclined towards the base from the windward side to the leeward side. The windward surface is inclined towards the leeward side from the upper surface towards the base and from the outer surface towards the inner surface. The inner surface has a groove for clamping the edge of the wafer. The base motor drives the base to rotate with the windward side in front and the leeward side behind, so that the airflow on the front side of the wafer does not overflow the retaining ring due to jaw disturbance. The clamping device of this invention guides the airflow and avoids secondary contamination of the wafer caused by jaw turbulence.

Description

Technical Field

[0001] This invention belongs to the field of chemical mechanical polishing technology and is used for processing semiconductor chips. Specifically, it relates to a wafer clamping device, a processing device, and a chemical mechanical polishing apparatus. Background Technology

[0002] The integrated circuit industry is the core of the information technology industry, playing a crucial role in promoting the digital and intelligent transformation and upgrading of the manufacturing industry. Chips are the carriers of integrated circuits, and chip manufacturing involves processes such as chip design, wafer fabrication, wafer processing, electrical measurement, dicing, packaging, and testing.

[0003] During the manufacturing process of integrated circuits, wafers come into contact with a large number of particles during multiple processes such as thin film deposition, etching, and polishing. In order to keep the wafer surface clean and eliminate particles left on the wafer surface during the process, the wafer must be cleaned / dried after each process.

[0004] To effectively remove particles from the wafer surface, the wafer is placed in a cleaning / drying chamber, held in place by grippers on a rotary clamping device, and rotated at high speed. Simultaneously, chemical liquid and / or drying gas are sprayed onto the wafer surface to complete the cleaning and / or drying process. When the rotary clamping device rotates at high speed, the protruding parts on the grippers and other parts cause severe turbulence to the airflow, preventing it from smoothly exiting along the wafer edge to the back side. The turbulent airflow carries droplets and other contaminants from the cleaning / drying process, spreading in all directions. This contamination can accumulate on the device surface within the chamber, forming a source of pollution, and may also directly contaminate the clean wafer front side, causing secondary contamination. This severely affects the cleaning / drying effect and leads to a decrease in chip yield. Summary of the Invention

[0005] In view of this, the present invention provides a wafer clamping device, a processing device, and a chemical mechanical polishing apparatus, thereby solving or at least alleviating one or more of the above-mentioned problems and other problems existing in the prior art.

[0006] A first aspect of the present invention provides a wafer clamping device comprising: a retaining ring, a base, a base motor, and a jaw;

[0007] The base has a disc-shaped structure with claws spaced apart on the front;

[0008] A retaining ring is arranged around the outer periphery of the base, and there is a gap between the retaining ring and the base;

[0009] The claw includes a windward side, a top surface, an outer surface, an inner surface, and a leeward side. The top surface faces the base and is inclined towards the base in a direction from the windward side to the leeward side.

[0010] The windward side is inclined towards the leeward side in the direction from the top surface toward the base, and also inclined towards the leeward side in the direction from the outer surface toward the inner surface. The inner surface is provided with a slot to hold the edge of the wafer.

[0011] The base motor drives the base to rotate in a direction with the windward side in front and the leeward side behind;

[0012] This allows the airflow on the front side of the wafer to be guided to flow towards the inner surface of the claw, the leeward side, and the base side, and to be discharged towards the back of the base along the gap between the retaining ring and the base, so that it will not overflow to the outside of the retaining ring due to claw disturbance.

[0013] Optionally, the outer surface is inclined toward the inner surface in the direction from the upper surface toward the base, and also in the direction from the windward side toward the leeward side toward the inner surface.

[0014] Optionally, the inner surface is inclined to one side of the inner surface in the direction from the upper surface toward the base.

[0015] Optionally, the junction between the windward surface and the upper surface is a sharp angle, and / or the junction between the windward surface and the inner surface is a rounded corner or has a transition surface, and / or the junction between the outer surface and the leeward surface is a rounded corner or has a transition surface.

[0016] Optionally, it also includes multiple fixing claw seats, which are spaced apart at the edge of the front of the base and do not extend beyond the edge of the base;

[0017] The jaws include fixed jaws and movable jaws.

[0018] The fixed jaws are mounted on the jaw base, and their upper surfaces are not adjacent to the fixed jaw base.

[0019] Optionally, the fixing claw seat includes a mounting surface parallel to the front of the base and a side surface perpendicular to the mounting surface;

[0020] The fixing claws are fitted and fixed to the mounting surface;

[0021] The mounting surface widens and then narrows along the direction of rotation.

[0022] Optionally, the mounting surface is a rhombus with diagonal transitions, the corner on the windward side is rounded, and the corners on the outer and inner surfaces are flat.

[0023] Optionally, at least two fixed claws are spaced apart on the mounting surface of at least one of the fixed claw seats, the fixed claws having completely identical outer contours and being arranged parallel to each other.

[0024] Optionally, the base includes an annular flange that surrounds the periphery of the base on the back side of the base, so as to enclose the movable claw on the back side of the base within the flange.

[0025] Optionally, it also includes a movable jaw seat for accommodating at least a portion of the structure in which the movable jaw is disposed;

[0026] The retaining edge is provided with a notch, and the movable claw seat is located at the notch. The outer side of the movable claw seat and the retaining edge form the annular structure.

[0027] A second aspect of the present invention provides a wafer processing apparatus for cleaning and / or drying vertical wafers, comprising: a chamber, a cleaning and drying unit, and a wafer clamping device as described in the first aspect;

[0028] The wafer clamping device is vertically arranged between the front plate and the back plate of the chamber, and the back plate is provided with exhaust holes.

[0029] The jaws are used to vertically clamp the wafer between the cleaning and drying unit and the base;

[0030] The cleaning and drying unit is used to spray cleaning liquid and / or gas onto the front side of the wafer.

[0031] A third aspect of the present invention provides a chemical mechanical polishing (CMP) apparatus, comprising a CMP device and a wafer processing device as described in the second aspect, wherein the wafer undergoes a polishing process in the CMP device, and after the polishing process is completed, a cleaning and drying process is performed in the wafer processing device.

[0032] The present invention has the following technical advantages: The wafer clamping device of the present invention causes minimal disturbance to the airflow, which is conducive to smooth airflow discharge and reduces the likelihood of chuck turbulence. The wafer processing device of the present invention does not cause secondary contamination to the wafer due to turbulence during wafer processing, and has excellent wafer cleaning and drying effects, thereby improving the yield rate of chip manufacturing. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings.

[0034] Figure 1 This is a schematic diagram of one embodiment of a wafer processing apparatus according to the present invention.

[0035] Figure 2 This is a schematic diagram of the airflow inside the wafer processing unit.

[0036] Figure 3 This is a schematic diagram of one embodiment of the wafer clamping device of the present invention.

[0037] Figures 4-7 yes Figure 3 A schematic diagram of an embodiment of the fixed jaws and fixed jaw base of the wafer clamping device.

[0038] Figure 8 yes Figure 3 A schematic diagram of the structure of the wafer clamping device from the back view.

[0039] Figure 9 yes Figure 8 A schematic diagram of the movable jaw base of the wafer clamping device.

[0040] Figure 10 This is a partial airflow diagram of the wafer processing apparatus of the present invention.

[0041] Figure label:

[0042] Wafer processing device 100;

[0043] Wafer clamping device 1; base 11; edge 111; jaw 12; fixed jaw 121; windward side 1211; upper surface 1212; outer surface 1213; inner surface 1214; leeward side 1215; movable jaw 122; fixed jaw seat 13; mounting surface 131; side 132; retaining ring 14; movable jaw seat 15;

[0044] Cleaning and drying unit 2;

[0045] Chamber 3. Detailed Implementation

[0046] To enable those skilled in the art to better understand the technical solutions in the embodiments of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art should fall within the protection scope of the present invention.

[0047] In the description of this invention, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0048] In addition, in the description of this invention, unless otherwise specified and limited, it should be noted that the terms "installation", "connection" and "linking" should be interpreted broadly. For example, they can refer to mechanical or electrical connections, or internal connections between two components. They can be direct connections or indirect connections through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms according to the specific circumstances.

[0049] Figure 1 This is a schematic diagram of an embodiment of a wafer processing apparatus 100 according to the present invention. As shown in the figure, it includes a chamber 3, a wafer clamping device 1 within the chamber 3, and a cleaning and drying unit 2. The wafer clamping device 1 includes a base 11 and claws 12 disposed on the base, the claws 12 being used to fix the wafer to the base 11.

[0050] The wafer clamping device 1 also includes a drive motor (not shown) disposed on the back side of the base 11. The drive motor rotates to rotate the base 11 and the wafer clamped by the jaws 12. A cleaning and drying unit 2 is disposed on the front side of the base 11. The cleaning and drying unit 2 includes nozzles that can swing and vertically spray cleaning liquid and drying gas onto the front side of the wafer, so as to remove particulate matter and peel off the water film from the wafer surface while the wafer rotates. A retaining ring 14 is also disposed around the outer periphery of the base 11, with a gap between the base 11 and the retaining ring 14, and also a gap between the clamped wafer and the retaining ring 14. The retaining ring 14 protrudes from the front side of the base 11, and the cleaning liquid thrown out with the wafer rotation is caught by the outer retaining ring to reduce liquid splashing. A chamber 3 is located on the back side of the base 11 and is provided with a back plate 31 with exhaust holes. An exhaust device can be disposed behind the back plate, and an air supply device can be disposed on the front side of the base 11 to provide a clean atmosphere within the chamber. During wafer cleaning / drying, the airflow in the chamber flows from the gap between the wafer, the base 11 and the retaining ring to the back side of the wafer and is discharged through the back plate 31 with exhaust vents, thereby completing the wafer cleaning / drying process under the protection of a clean atmosphere and obtaining a wafer that meets the cleanliness requirements.

[0051] However, when using existing wafer clamping devices, the processed wafers are inevitably contaminated with droplets, organic particles, or inorganic particles, causing the wafer surface to fail to meet cleanliness requirements and even resulting in defects, thus affecting chip yield. This situation is even more pronounced in advanced processes below 7nm, and even increasing the cleaning of the chamber and continuously increasing the supply of clean airflow cannot completely improve the situation.

[0052] After repeated research, the inventor finally discovered the reason for the unsatisfactory cleaning / drying effect: such as Figure 2 As shown, during the high-speed rotation of the wafer clamping device, the structural components protruding from the base 11, especially the claws 12, cause severe turbulence to the airflow. This causes the airflow to overflow beyond the baffle ring 14, resulting in the claw turbulence shown in the figure. The droplets entrained in the claw turbulence contain a large number of contaminants from the cleaning / drying process, causing these contaminants to flow out of the baffle ring 14 and spread in all directions. It is this diffused contaminant that, under the influence of the airflow, re-contaminates the wafer surface, causing secondary contamination of the wafer.

[0053] The wafer clamping device 1 provided by this invention fully considers the disturbance of airflow caused by the claw structure. For example... Figure 3 As shown, the wafer clamping device 1 includes a disc-shaped base 11, jaws 12, fixed jaw seats 13, a base motor (not shown), and a retaining ring 14 (not shown). Multiple fixed jaw seats 13 are spaced apart along the inner circumference of the base 11 on the front side of the base 11, and the fixed jaw seats 13 do not extend beyond the edge of the base 11. The jaws 12 include multiple fixed jaws 121 and at least one movable jaw 122. The multiple fixed jaws 121 are respectively disposed on adjacent fixed jaw seats 13, and the movable jaw 122 is disposed on opposite sides of the multiple fixed jaws 121 and connected to a swinging part (not shown) capable of swinging along a hinge point disposed on the edge of the base 11. The inner surfaces of the fixed jaws 121 and the movable jaws 122 are provided with slots for supporting the edge of the wafer. The slots of the fixed jaws 121 and the movable jaws 122 clamp the edge of the wafer to fix the wafer to one side of the base 11. Understandably, the jaws 12 can also be directly mounted on the front of the base 11, but this would require a higher height to hold the wafer in the correct position and might also negatively impact the structural strength of the jaws. The jaws 12 and the fixed jaw base 13 can also be integrally molded, consisting only of two functionally different parts. A retaining ring 14 is positioned around the outer periphery of the base 11 with a certain gap, enclosing the jaws 12, the fixed jaw base 13, and the held wafer within the retaining ring 14 to block droplets sputtered as the wafer rotates.

[0054] The fixed jaw 121 and the movable jaw 122 have the same structure. The following description uses the fixed jaw 121 as an example. Figures 3-7To illustrate the specific structure of the claw 12, the solid arrows in the diagram indicate the initial airflow direction, and the dashed arrows indicate the airflow direction after being attracted.

[0055] The jaw 12 is approximately hexahedral in shape, with its lower surface fitting against the fixed jaw base 13 to secure it to the base 11. The outer contour of the jaw 12 includes a windward surface 1211, an upper surface 1212, an outer surface 1213, an inner surface 1214, and a leeward surface 1215. The upper surface 1212 is not adjacent to the fixed jaw base 13. The windward surface 1211 slopes towards the leeward surface 1215 from the upper surface 1212 toward the fixed jaw base 13, and also slopes towards the leeward surface 1215 from the outer surface 1213 toward the inner surface 1214. The upper surface 1212 slopes towards the fixed jaw base 13 from the windward surface 1211 toward the leeward surface 1215. The inner surface 1214 of the jaw has a groove for clamping the edge of the wafer.

[0056] The base motor is located on one side of the back of the base, driving the base 11 to rotate at high speed with the windward side 1211 of the claw 12 in front and the leeward side 1215 behind, preferably at a speed of 900 to 2500 rpm.

[0057] The high-speed rotating jaws 12 cut through the air, causing the airflow to be guided downwards and inwards along the windward side 1211 due to its inclined arrangement. Consequently, the airflow velocity on the side of the jaws near the inner surface 1214 and the side with the fixed jaw seat 13 is significantly faster than the airflow velocity on their opposite sides. According to Bernoulli's principle, a low-pressure region is formed on the side of the jaws near the inner surface 1214 and the side with the fixed jaw seat 13. Simultaneously, the inclined arrangement of the upper surface 1212 attracts the airflow towards the leeward side 1215 and the side with the fixed jaw seat 13.

[0058] Therefore, under the combined action of the windward surface 1211 and the upper surface 1212, the airflow is guided to flow towards the inner surface of the claw, the fixed claw seat, and the leeward side, thus smoothly discharging along the gap between the baffle ring 14 and the base 11, without overflowing to the outside of the baffle ring 14 due to the disturbance of the rotating claw. It is evident that this embodiment can significantly reduce the occurrence of claw turbulence, thereby reducing the risk of secondary contamination of the wafer by diffused contaminants, ensuring the wafer cleaning / drying effect, and improving the yield of chip manufacturing.

[0059] Preferably, the windward surface 1211 is inclined at an angle of 30° to 40° towards the leeward surface 1215 along the direction from the outer surface 1213 to the inner surface 1214, and the upper surface 1212 is inclined at an angle of 5° to 15° towards the fixed claw seat 13 along the direction from the windward surface 1211 to the leeward surface 1215, thereby improving the airflow guidance capability without affecting the wafer clamping.

[0060] Optionally, the outer surface 1213 is inclined toward the inner surface 1214 in the direction from the upper surface 1212 toward the fixed claw seat 13, and also in the direction from the windward side 1211 toward the leeward side 1215. This reduces airflow disturbance and guides the airflow on the outer surface 1213 of the claw to flow toward the fixed claw seat and the leeward side, so that it can be smoothly discharged along the gap between the baffle ring 14 and the base 11 without overflowing to the outside of the baffle ring 14 due to the disturbance of the rotating claw.

[0061] Preferably, the outer surface 1213 is inclined at an angle of 5° to 15° towards the inner surface 1214 in the direction from the windward side 1211 to the leeward side 1215.

[0062] Optionally, the inner surface 1214 is tilted toward one side of the inner surface 1214 in the direction from the upper surface 1212 toward the fixed jaw seat 13, so as to maintain the structural strength of the jaw 12 and maintain stable clamping of the wafer without causing new disturbance to the airflow guided by the windward surface 1211 to the inner surface side of the jaw and the fixed jaw seat side.

[0063] Preferably, the inner surface 1214 and the outer surface 1213 maintain a substantially consistent shape and tilt angle.

[0064] Optionally, the windward surface 1211, the outer surface 1213 and the inner surface 1214 are tilted towards the fixed claw seat 13 at an angle of 5° to 15° to reduce the disturbance to the airflow guided to the fixed claw seat side, making it easier for the air to flow smoothly to the rear and improving airflow stability.

[0065] Optional, such as Figures 4-5 As shown, the junction between the windward surface 1211 and the upper surface 1212 is a sharp angle to reduce the disturbance of the airflow in front of the claw 12 during high-speed rotation. This prevents excessive, multi-directional, chaotic turbulence from being generated during air cutting, thereby further reducing the risk of claw turbulence. Figures 4-7 As shown, a transition surface or rounded corner is provided at the junction of the windward surface 1211 and the inner surface 1214, and a transition surface or rounded corner is provided at the junction of the outer surface 1213 and the leeward surface 1215, in order to further improve the stability of making the air flow smoothly backward.

[0066] Optionally, the fixed claw seat 13 includes a mounting surface 131 parallel to the front of the base 11 and a side surface 132 perpendicular to the mounting surface. The claw 12 is disposed on the mounting surface 131, and the side surface 132 engages with the surface of the base 11. The direction of rotation consistent with the base 11 is defined as the length direction, which is the direction of the windward side 1211 and the leeward side 1215 of the claw 12; the direction perpendicular to the length direction is defined as the width direction, which is the direction of the outer surface 1213 and the inner surface 1214 of the claw 12; the mounting surface 131 is approximately a spindle shape with a length greater than its width. The corners of the rhombus are treated with transition, wherein the two corners in the length direction are rounded, and the two corners in the width direction are flat. The design of the outer contour surface of the fixed claw seat 13 in this invention prevents the airflow guided to the gap between the baffle ring 14 and the base 11 from being disturbed by the fixed claw seat 13 and generating turbulence, making it easier for the air to flow smoothly to the rear, improving airflow stability, and thus reducing the risk of airflow overflowing to the outside of the baffle ring 14.

[0067] Optionally, at least two fixed jaws 121 are spaced apart on the mounting surface 131 of at least one fixed jaw holder 13. Each fixed jaw 121 has a completely consistent outer contour and is arranged parallel to each other to improve the stability and adaptability of wafer clamping, while also further enhancing the stability of airflow.

[0068] The inventors further discovered that although the invention significantly reduced the disturbance to airflow caused by the jaws 12 and fixed jaw base 13, and the wafer surface cleanliness was significantly improved, occasional instances of poor wafer surface cleaning still occurred. Further analysis revealed that the source of contamination remained the airflow overflowing from inside the retaining ring to the outside: the inventors found that not only the structure on the front of the base 11 affected the airflow, but the structure on the back of the base also created turbulence during high-speed rotation, affecting airflow stability and, in severe cases, causing overflow outside the retaining ring 14. The most significant impact came from the movable jaw 122, which required hinged rotation to clamp the wafer. The movable jaw 122 had a complex structure on the other side of the base, such as a return spring and limiting components, protruding from the back of the base 11, thus having the most severe and complex impact on airflow disturbance. However, modifying the shape of this part of the structure would involve a complex workload and a huge cost burden, and might also adversely affect the functional stability of the movable jaw.

[0069] Figure 8 yes Figure 3 The schematic diagram of the wafer clamping device 1 shown is from the back view, as follows: Figure 3 and Figure 8As shown, the base 11 also includes a ring-shaped baffle 111, which surrounds the circumference of the base 11 and is disposed on the back side of the base 11. The baffle 111 has a certain extension height toward the side of the base motor, so as to surround the structure of the movable claw 122 on the back side of the base 11 inside the baffle 111 while maintaining a sufficient gap with the back plate of the chamber 3. That is, the airflow passes through the gap formed between the baffle ring 14 and the wafer, the claw 12, the fixed claw seat 13 and the baffle 111, flows from the front side of the wafer to the back side of the wafer, and is discharged from the exhaust hole of the back plate, thereby completely eliminating the influence of the structure on the back side of the base 11 on the airflow disturbance, ensuring that the air flows smoothly to the rear, and significantly reducing the risk of secondary contamination of the wafer surface caused by turbulence.

[0070] Optional, such as Figures 8 to 9 As shown, the wafer clamping device 1 also includes a movable jaw holder 15, which is disposed on the back side of the base 11 and is used to accommodate at least part of the structure in which the movable jaw is disposed, for example... Figure 9 The reset spring and limiting components are shown. A notch is provided on the flange 111, and the movable claw seat 15 is positioned at the notch. The outer surface of the movable claw seat 15 just fills the notch, forming a complete ring with the flange 111. The inner surface of the movable claw seat has a transition surface, preferably an arc-shaped surface. It can be seen that the outer surface of the movable claw seat 15 and the flange 111 together form the side opposite to the retaining ring 14. The inner surface of the movable claw seat 15 has a transition surface, thereby further reducing the impact of the structure of the movable claw protruding from the back of the base 11 on the back of the base 11 and the airflow between the base 11 and the retaining ring 14, improving the ability for stable airflow.

[0071] like Figure 1 As shown, the wafer processing apparatus 100 provided by the present invention is used for cleaning and drying vertical wafers. The chamber 3 is surrounded by multiple chamber wall panels. An opening is provided on the top plate of the chamber for a robotic arm to pick up and place wafers. A gas supply device for supplying clean airflow is provided at the front plate of the chamber. The cleaning and drying unit 2 is disposed between the wafer clamping device 1 and the front plate. The wafer clamping device 1 clamps and fixes the wafer with its front face facing the front plate and drives the wafer to rotate. The cleaning and drying unit 2 oscillates around a fixed axis and sprays cleaning liquid and drying gas onto the front face of the wafer to remove particulate matter on the wafer surface and peel off the water film on the wafer surface, thereby realizing the wafer cleaning and drying process.

[0072] Figure 10This is a simulation diagram of the airflow in a portion of the baffle ring 14 and base 11 of the wafer processing apparatus 100 of the present invention. The wafer rotates in the direction indicated by the arrow in the figure. It can be seen that due to the guiding effect of the outer contour of the claw 12, the airflow direction near the claw is relatively consistent, mainly flowing towards the leeward side of the claw and the back plate side along the guided direction. By further setting the outer contour surface of the fixed claw base 13 and by setting the baffle edge 111 to surround the back of the claw base, the turbulence of the airflow guided to the gap between the baffle ring 14 and the base 11 is reduced, thereby improving the airflow stability. At the same time, it can be seen that the airflow near the baffle ring has a significantly consistent flow direction towards the inside of the baffle ring and towards the back plate side, without any airflow crossing the baffle ring outward. This indicates that the present invention can significantly reduce the occurrence of claw turbulence, eliminate the risk of airflow overflowing to the outside of the baffle ring 14 and causing secondary contamination to the wafer, thereby ensuring the cleaning and drying effect of the wafer and improving the yield of chip manufacturing.

[0073] The present invention also provides a chemical mechanical polishing (CMP) apparatus, including a CMP device and a wafer processing device 100, wherein the wafer undergoes a polishing process in the CMP device and a cleaning and drying process is performed in the wafer processing device after the polishing process is completed.

[0074] The above embodiments are only used to illustrate the embodiments of the present invention, and are not intended to limit the embodiments of the present invention. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the embodiments of the present invention. Therefore, all equivalent technical solutions also fall within the scope of the embodiments of the present invention, and the patent protection scope of the embodiments of the present invention should be defined by the claims.

Claims

1. A wafer clamping device, characterized in that, include: Retaining ring, base, base motor and clamping claw; The base has a disc-shaped structure with claws spaced apart on the front; A retaining ring is arranged around the outer periphery of the base, and there is a gap between the retaining ring and the base; The claw includes a windward side, an upper surface, an outer surface, an inner surface, and a leeward side. The inner surface faces the center of the base, and the outer surface faces the outer periphery of the base. The inner and outer surfaces are arranged opposite each other. The windward side is located in front of the inner and outer surfaces, and the leeward side is located behind the inner and outer surfaces. The upper surface is located above the windward side, outer surface, inner surface, and leeward side. The inner surface is provided with slots to hold the edge of the wafer; The upper surface is opposite to the base and is inclined toward the base in the direction from the windward side to the leeward side; the windward side is inclined toward the leeward side in the direction from the upper surface to the base and in the direction from the outer surface to the inner surface. The outer surface is inclined towards the inner surface in the direction from the top surface to the base, and also inclined towards the inner surface in the direction from the windward side to the leeward side. The base motor drives the base to rotate in a direction with the windward side in front and the leeward side behind; This allows the airflow on the front side of the wafer to be guided to flow towards the inner surface of the claw, the leeward side, and the base side, and to be discharged towards the back of the base along the gap between the retaining ring and the base, so that it will not overflow to the outside of the retaining ring due to claw disturbance.

2. The wafer clamping device as described in claim 1, characterized in that, The junction between the windward surface and the upper surface is a sharp angle, and / or the junction between the windward surface and the inner surface is a rounded corner or has a transition surface, and / or the junction between the outer surface and the leeward surface is a rounded corner or has a transition surface.

3. The wafer clamping device as described in claim 1, characterized in that, It also includes multiple fixed claw seats, which are spaced apart at the edge of the front of the base and do not extend beyond the edge of the base; The jaws include fixed jaws and movable jaws. The fixed jaw is mounted on the fixed jaw seat, and the upper surface of the fixed jaw is not adjacent to the fixed jaw seat.

4. The wafer clamping device as described in claim 3, characterized in that, The fixed claw seat includes a mounting surface parallel to the front of the base and a side surface perpendicular to the mounting surface; The fixing claws are fitted and fixed to the mounting surface; The mounting surface widens and then narrows along the direction of rotation.

5. The wafer clamping device as described in claim 3, characterized in that, The base includes a ring-shaped retaining edge, which surrounds the circumference of the base and is disposed on the back side of the base, so as to enclose the structure of the movable claw on the back side of the base inside the retaining edge.

6. The wafer clamping device as described in claim 5, characterized in that, It also includes a movable jaw seat for accommodating at least a portion of the structure in which the movable jaw is disposed; The retaining edge is provided with a notch, and the movable claw seat is located at the notch. The outer side of the movable claw seat and the retaining edge form a ring structure.

7. A wafer processing apparatus for cleaning and drying wafers, characterized in that, include: The chamber, the cleaning and drying unit, and the wafer clamping device as described in any one of claims 1-6; The wafer clamping device is vertically arranged between the front plate and the back plate of the chamber, and the back plate is provided with exhaust holes. The jaws are used to vertically clamp the wafer between the cleaning and drying unit and the base; The cleaning and drying unit is used to spray cleaning liquid and / or gas onto the front side of the wafer.

8. A chemical mechanical polishing apparatus, characterized in that, The device includes a chemical mechanical polishing apparatus and a wafer processing apparatus as described in claim 7, wherein the wafer undergoes a polishing process in the chemical mechanical polishing apparatus, and after the polishing process is completed, a cleaning and drying process is performed in the wafer processing apparatus.

Images