一种连接器端子用铜镍锡磷合金带材及其制备方法
By optimizing the composition and process of copper-nickel-tin-phosphorus alloy strip, the problems of high cost and insufficient conductivity of existing connector terminal materials have been solved, realizing a high-strength, high-conductivity and low-cost copper alloy strip suitable for high-performance electronic connectors.
CN120738512BActive Publication Date: 2026-07-17NINGBO XINGBO HAOGUANG TECHNOLOGY DEVELOPMENT CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- NINGBO XINGBO HAOGUANG TECHNOLOGY DEVELOPMENT CO LTD
- Filing Date
- 2025-06-19
- Publication Date
- 2026-07-17
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Abstract
本发明公开了一种连接器端子用铜镍锡磷合金带材及其制备方法，属于铜合金材料技术领域。该合金按质量百分比计包含Ni：0.8‑1.2％、Sn：0.7‑1.1％、P：0.03‑0.07％、Zn：0.02‑0.1％、Fe：0.01‑0.05％，且Ni / P≥15，余量为铜及不可避免的杂质；可选添加0.1‑0.8％的Mn、Pb、Mg、Co、Cr、Ti、Si、Al中的一种或多种。制备方法包括熔铸、热轧、铣面、三次冷轧与退火协同工艺，最终获得厚度0.1‑0.3mm、宽度≥580mm的带材。本发明通过成分优化与工艺调控，显著降低Sn含量(较传统C19040合金减少30％‑50％)，导电率提升至≥35％IACS，抗拉强度达490‑540MPa，晶粒度细化至≤0.015mm，兼具高强度、高导电性及低成本优势。适用于新能源汽车、5G通信、人工智能等领域的高性能电子连接器，解决了现有合金成本高、导电性不足及加工硬化严重的问题。
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