Housing, method of manufacturing a housing, and electronic device
By designing recessed corrosion zones and adjacent zones in the thinned portion of the shell, and combining protective bags and masks to protect the edge areas, the reliability risk caused by the overall thinning of the shell is solved, achieving both lightness and strength improvement, while reducing manufacturing costs.
CN120751635BActive Publication Date: 2026-06-26HONOR DEVICE CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HONOR DEVICE CO LTD
- Filing Date
- 2024-06-20
- Publication Date
- 2026-06-26
Smart Images
Figure CN120751635B_ABST
Abstract
The application provides a shell, a preparation method of the shell and an electronic device. The shell comprises an edge portion and a thinning portion. The edge portion is arranged around the circumference of the thinning portion. The thinning portion comprises a corrosion area and an adjacent area adjacent to the corrosion area. In the thickness direction of the shell, the corrosion area is recessed relative to the adjacent area. The shell provided by the application can reduce the weight of the shell on the basis of ensuring the strength of the shell, reduce the reliability risk of the electronic device formed by assembly, and has a better application prospect.
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