Electronic equipment and vehicle

Abstract

The invention relates to electronic equipment and a vehicle. The electronic equipment comprises a circuit board, a connecting conductor and a shell. The circuit board is provided with an external layer; the connecting conductor is electrically connected with the external layer; the shell is provided with a shielding part which is in contact with the connecting conductor so as to be matched with the connecting conductor and form electromagnetic shielding on the circuit board; and the shielding part and the connecting conductor are nested, so that the shielding part is reused as a structure for limiting the relative displacement of the connecting conductor and the shell. According to the electronic equipment, the shielding part for electromagnetic shielding is reused as a structure for limiting the connecting conductor, movement of the connecting conductor between the circuit board and the shell is limited in the assembling process, the circuit board is prevented from being knocked to guarantee the product yield, meanwhile, the manufacturing cost of the connecting conductor is relatively low, and the manufacturing cost of the connecting conductor is reduced. And in the use process, the connection with the shielding part is stable, so that the possibility of electromagnetic shielding failure is reduced, and the electromagnetic shielding performance of the electronic equipment in long-term use is ensured.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to an electronic equipment. Background Art

[0002] In the related art, some electronic devices used in vehicles and other products (such as vehicle-mounted TBOX and vehicle-mounted smart host) use a circuit board installed in a metal casing, and copper is laid on the circuit board and overlapped with the metal casing. The metal casing is used to ground the circuit board and form an electromagnetic shield. Due to the assembly gap between the two half shells assembled into the casing, and the shaking of the equipment under long-term use, there is a gap on the electronic casing, which weakens the electromagnetic shielding effect. Some electronic devices use methods such as coating conductive glue, filling conductive foam, and setting metal shrapnel between the metal casing and the circuit board to ensure stable overlap between the metal casing and the circuit board. Among them, the conductive glue itself is expensive, and the dispensing equipment used for dispensing is expensive and cannot be generally applied. Conductive foam also has the problem of high cost itself. Metal shrapnel is low in cost, but it is easy to bump into the circuit board during the alignment with the circuit board and the casing during assembly, affecting the product yield, and with the deformation of the metal shrapnel under long-term use, it is difficult to ensure a good electromagnetic shielding effect. Summary of the Invention

[0003] An embodiment of the present application provides an electronic device, which improves the electromagnetic shielding performance of the electronic device under long-term use at a relatively low cost, so as to at least partially solve the above-mentioned technical problems.

[0004] In a first aspect, some embodiments of the present application provide an electronic device, comprising:

[0005] A circuit board having an external connection layer;

[0006] a connecting conductor, electrically connected to the external connection layer;

[0007] a housing having a shielding portion for contacting the connecting conductor to cooperate with the connecting conductor and form an electromagnetic shield for the circuit board;

[0008] The shielding portion and the connecting conductor are nested together, so that the shielding portion is reused as a structure for limiting relative displacement between the connecting conductor and the housing.

[0009] In some embodiments, the shielding portion has:

[0010] The fitting groove has an opening formed at one end along the first direction;

[0011] Wherein, at least a portion of the connecting conductor is embedded in the embedding groove from the opening.

[0012] In some embodiments, the portion of the connecting conductor embedded in the embedding groove contacts at least a portion of a groove wall of the embedding groove.

[0013] In some embodiments, the portion of the connecting conductor embedded in the embedding groove forms an interference fit with at least a portion of the groove wall of the embedding groove.

[0014] In some embodiments, the connecting conductor protrudes from the surface of the external layer along the first direction; the difference between the depth of the engaging groove along the first direction and the maximum distance between the connecting conductor and the surface of the external layer along the first direction is in the range of 0-0.8 mm.

[0015] In some embodiments, in a second direction perpendicular to the first direction, a difference between a width of the connecting conductor and a width of the fitting groove ranges from 0.05 mm to 0.8 mm.

[0016] In some embodiments, the electronic device further comprises:

[0017] The connecting layer is fixedly connected between the connecting conductor and the external connection layer along the first direction.

[0018] In some embodiments, the connection layer is at least partially embedded in the embedding groove.

[0019] In some embodiments, the connection layer is configured as solder fixedly connected between the connection conductor and the external connection layer.

[0020] In some embodiments, the connecting conductor is provided with an overlapping side surface in a second direction perpendicular to the first direction, and the overlapping side surface is embedded in the embedding groove and contacts the groove wall of the embedding groove;

[0021] Wherein, the overlapping side surface is configured as at least one of a plane, a conical surface, a frustum, a cylindrical surface, and a curved surface.

[0022] In some embodiments, the connecting conductor has an overlapping end surface at one end thereof away from the external connection layer along the first direction;

[0023] Wherein, on a projection surface with the straight line of the first direction as a normal line, the projection of the overlapping end surface is at least partially located outside the projection of the overlapping side surface; and / or,

[0024] On a projection surface with the straight line where the first direction is located as a normal line, the projection of the overlapping end surface overlaps with the projection of the overlapping side surface.

[0025] In some embodiments, the electronic device includes a plurality of the connecting conductors arranged at intervals.

[0026] In some embodiments, the spacing between adjacent connecting conductors is less than 5 mm.

[0027] In some embodiments, the connecting conductor is configured as a metal spring; and / or,

[0028] The external connection layer is configured as a copper material layer.

[0029] In some embodiments, a cavity is formed inside the connecting conductor.

[0030] In a second aspect, the present application also provides a vehicle comprising the electronic device as described above.

[0031] The beneficial effects of the present application are that the provided electronic device reuses the shielding part used for electromagnetic shielding as a structure for limiting the connecting conductor, which limits the movement of the connecting conductor between the circuit board and the shell during the assembly process, avoiding damage to the circuit board to ensure product yield. At the same time, the connecting conductor is relatively low in cost, and the connection with the shielding part is stable during use, thereby reducing the possibility of electromagnetic shielding failure and ensuring the electromagnetic shielding performance of the electronic equipment under long-term use.

[0032] Other features and advantages of the present application will be described in detail in the subsequent detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] To more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present application. Those skilled in the art can also derive other drawings based on these drawings without inventive effort.

[0034] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings, wherein the same drawing numbers represent the same parts in the following description.

[0035] Figure 1 is a perspective cross-sectional view of a first electronic device provided in an exemplary embodiment of the present application;

[0036] Figure 2 yes Figure 1 a planar cross-sectional view of the electronic device at a first viewing angle;

[0037] Figure 3 yes Figure 2 A partial enlarged view of point A in the middle;

[0038] Figure 4 yes Figure 2 A cross-sectional view of the middle housing near the engaging groove;

[0039] Figure 5 yes Figure 2 A schematic diagram of the matching relationship between the circuit board and the connecting conductor in the electronic device shown;

[0040] Figure 6 is a cross-sectional view of a first connecting conductor provided in an exemplary embodiment of the present application;

[0041] Figure 7 is a cross-sectional view of a second connecting conductor provided in an exemplary embodiment of the present application;

[0042] Figure 8 is a cross-sectional view of a third connecting conductor provided in an exemplary embodiment of the present application;

[0043] Figure 9 yes Figure 1 a planar cross-sectional view of the electronic device at a second viewing angle;

[0044] Figure 10 is a perspective cross-sectional view of a second electronic device provided in an exemplary embodiment of the present application.

[0045] Description of reference numerals:

[0046] 100. Electronic device; 110. Circuit board; 111. External connection layer; 120. Connecting conductor; 120a. Cavity; 121. Overlapping side surface; 122. Overlapping end surface; 130. Housing; 130a. Accommodating cavity; 131. Shielding portion; 131a. Fitting groove; 131b. Opening; 140. Connecting layer. DETAILED DESCRIPTION

[0047] The following will be combined with the accompanying drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments.

[0048] Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative work shall fall within the scope of protection of this application.

[0049] Reference Figures 1 to 10 As shown, the electronic device 100 provided in this application includes: a circuit board 110 , a connecting conductor 120 and a housing 130 .

[0050] Circuit board 110 is used to integrate electronic components and integrated circuits, such as chips and semiconductor switches. Circuit board 110 is provided with an external connection layer 111. This connection layer 111 is made of a conductive material, for example, a copper layer formed on the surface of circuit board 110. Connecting conductor 120 is electrically connected to external connection layer 111. Housing 130 includes a shielding portion 131 for contacting connecting conductor 120. Shielding portion 131 and connecting conductor 120 cooperate to provide electromagnetic shielding for circuit board 110.

[0051] Specifically, refer to Figure 1 and Figure 2 As shown, the housing 130 can be at least partially made of a conductive metal material. More specifically, the housing 130 can be a whole formed by at least two half-shells 130 fixedly connected to each other, forming a housing cavity 130a inside the housing 130 to accommodate the circuit board 110. The connecting conductor 120 is located in the housing cavity 130a and contacts the housing 130 and the external layer 111, so that the housing 130 and the external layer 111 are electrically connected through the connecting conductor 120. During use of the electronic device 100, the shielding portion 131 cooperates with the connecting conductor 120 to form an electromagnetic shield for the circuit board 110, ensuring that the circuit board 110 can function normally and is protected from interference from electromagnetic signals outside the housing 130.

[0052] In this application, reference is made to Figure 2 As shown, the shielding portion 131 and the connecting conductor 120 are nested, that is, the shielding portion 131 and the connecting conductor 120 are interlocked, so that the shielding portion 131 is reused as a structure for limiting the relative displacement of the connecting conductor 120 and the shell 130. This arrangement enables the shielding portion 131 to limit the connecting conductor 120 when the shielding portion 131 and the connecting conductor 120 are used to electromagnetically shield the circuit board 110. On the one hand, it prevents the connecting conductor 120 from shaking relative to the circuit board 110, and on the other hand, it ensures that the connecting conductor 120 is in stable contact with the external layer 111 and the shielding portion 131 respectively.

[0053] Through the above settings, the electronic device 100 provided in the present application reuses the shielding part 131 used for electromagnetic shielding as a structure for limiting the connecting conductor 120. During the assembly process, the movement of the connecting conductor 120 between the circuit board 110 and the shell 130 is restricted to avoid damaging the circuit board 110 to ensure product yield. At the same time, the connecting conductor 120 is relatively low in cost, and the connection with the shielding part 131 is stable during use, thereby reducing the possibility of electromagnetic shielding failure and ensuring the electromagnetic shielding performance of the electronic device 100 under long-term use.

[0054] As a specific illustration of the structure in which the shielding portion 131 is reused to limit the connection conductor 120, in some embodiments, the shielding portion 131 is provided with: an embedding groove 131a. The embedding groove 131a forms an opening 131b at one end along the first direction. Figure 2 and Figure 3 In the exemplary specific implementation scheme, the first direction is illustrated as the up and down direction in the figure, and at least a portion of the connecting conductor 120 is embedded in the embedding groove 131a from the opening 131b. Therefore, the connecting conductor 120 is embedded in the embedding groove 131a along the first direction to realize the combination of the connecting conductor 120 and the shielding part 131, and the groove wall of the embedding groove 131a is used to limit the range of movement of the connecting conductor 120.

[0055] For specific plans, refer to Figure 2 and Figure 3 As shown, the portion of the connecting conductor 120 embedded in the embedding groove 131a contacts at least part of the groove wall of the embedding groove 131a, preventing the connecting conductor 120 from shaking in the embedding groove 131a, and allowing the connecting conductor 120 to form an electrical connection with the shielding part 131 by contacting the groove wall of the embedding groove 131a, ensuring that the shielding part 131 and the connecting conductor 120 stably provide electromagnetic shielding to the circuit board 110.

[0056] It is understandable that under long-term use, if there is a large gap between the connecting conductor 120 and the wall of the interlocking groove 131a, then in the presence of external environmental factors such as vibration, the connecting conductor 120 may be separated from the wall of the interlocking groove 131a, causing the connecting conductor 120 to be unable to stably contact the shielding portion 131. In some schemes of the present application, the portion of the connecting conductor 120 embedded in the embedding groove 131a forms an interference fit with at least part of the groove wall of the embedding groove 131a. The interference fit further hinders the shaking of the connecting conductor 120 relative to the shielding part 131. In this way, under the action of external force, the possibility of the connecting conductor 120 and the shielding part 131 being separated is reduced, and the connection between the connecting conductor 120 and the shielding part 131 is more stable. At the same time, the possibility of failure of the connection between the connecting conductor 120 and the external layer 111 caused by collisions between the connecting conductor 120 and the groove wall of the embedding groove 131a due to repeated separation and contact is also reduced accordingly, further ensuring that the components in the electronic device 100 that provide electromagnetic shielding function for the circuit board 110 can function stably.

[0057] When in use, the connecting conductor 120 is at least partially embedded in the embedding groove 131 a , so the size of the connecting conductor 120 needs to match the size of the embedding groove 131 a , which may be beneficial for stabilizing the electromagnetic shielding effect in some usage scenarios.

[0058] As an example, see Figure 3 、 Figure 4 and Figure 5 As shown, the connecting conductor 120 protrudes from the surface of the external layer 111 along a first direction, and the corresponding shielding portion 131 of the housing 130 is located at one end of the circuit board 110 near the external layer 111 along the first direction. In order to enable the connecting conductor 120 to adapt to changes in external environmental factors and to maintain a stable connection between the housing 130 and the circuit board 110, the connecting conductor 120 may be made of some deformable material or configured into a deformable shape or structure. For example, the connecting conductor 120 may be configured as a metal spring connected between the circuit board 110 and the housing 130. The deformability of the connecting conductor 120 means that the connecting conductor 120 may deform during use due to factors such as external temperature and vibration. By setting some dimensions of the engaging groove 131a slightly larger than the dimensions of the connecting conductor 120, the normal use of the connecting conductor 120 is facilitated.

[0059] However, the size of the fitting groove 131a should not be too large, because it may cause the connecting conductor 120 to shake, affecting the electromagnetic shielding performance of the electronic device 100. Figure 4 and Figure 5 As shown, the difference between the depth a of the fitting groove 131a along the first direction and the maximum distance b between the connecting conductor 120 and the surface of the external connection layer 111 along the first direction is in the range of 0-0.8 mm. Figure 4 As shown, the distance between the bottom of the fitting groove 131a in the up and down directions relative to the surface of the shielding part 131 forming the opening 131b defines the depth of the fitting groove 131a along the first direction. Correspondingly, the distance from the upper end of the connecting conductor 120 in the up and down directions to the upper surface of the external layer 111 defines the maximum distance between the connecting conductor 120 and the surface of the external layer 111 along the first direction. By matching the dimensions of the connecting conductor 120 and the fitting groove 131a in the first direction, a margin is provided for the normal deformation of the connecting conductor 120, while avoiding the connection between the connecting conductor 120 and the shielding part 131 being unstable due to the excessive spacing between the connecting conductor 120 and the groove wall of the fitting groove 131a, thereby further ensuring that the connecting conductor 120 is stably connected between the shell 130 and the circuit board 110.

[0060] In some embodiments, reference Figure 4 and Figure 5 As shown, in the second direction perpendicular to the first direction, the difference between the width c of the connecting conductor 120 and the width d of the fitting groove 131a ranges from 0.05 to 0.8 mm. Figure 4 and Figure 5 In the exemplary embodiment, the second direction is indicated as the left-right direction in the figure.

[0061] Specifically, in Figure 5In the specific embodiment of the example, at least a portion of the connecting conductor 120 is cylindrical, and the cylindrical portion defines the maximum size of the connecting conductor 120 in the left-right direction. In this case, the width of the connecting conductor 120 can be regarded as the diameter of the cylindrical portion. In other embodiments, the width of the connecting conductor 120 may be defined by two relatively arranged planes or curved surfaces, so that in the second direction, the width of the connecting conductor 120 is defined by the distance between the two relatively arranged surfaces on the connecting conductor 120. Accordingly, the fitting groove 131a can be configured into a variety of shapes, such as a cylindrical groove and a polygonal groove. By limiting the width of the connecting conductor 120 to be slightly larger than the width of the fitting groove 131a, it is ensured that the connecting conductor 120 can maintain contact with the groove wall of the fitting groove 131a.

[0062] It can be understood that due to the setting of the opening 131b, only one end of the connecting conductor 120 in the first direction may contact the groove wall of the fitting groove 131a, while the connecting conductor 120 has more parts that can be selected to contact the fitting groove 131a in the second direction. Therefore, by limiting the size of the connecting conductor 120 in the second direction to be slightly larger than the size of the fitting groove 131a, and at the same time the size of the connecting conductor 120 in the first direction to be slightly smaller than the size of the fitting groove 131a, while ensuring that the connecting conductor 120 is fully in contact with the fitting groove 131a to ensure the electromagnetic shielding effect on the circuit board 110, sufficient margin is provided for the deformation of the connecting conductor 120 itself. The size coordination of the connecting conductor 120 and the fitting groove 131a can adapt well to the complex external environment, which is conducive to the long-term and stable use of the electronic device 100.

[0063] The stable connection between the connecting conductor 120 and the circuit board 110 is equally important. If the connecting conductor 120 is loosely connected to the external layer 111, it may also cause an unstable connection between the housing 130 and the circuit board 110, thereby limiting the electromagnetic shielding performance of the electronic device 100. In some embodiments, referring to Figure 2 and Figure 4 As shown, electronic device 100 further includes a connecting layer 140. Connecting layer 140 is fixedly connected between connecting conductor 120 and external layer 111 along a first direction. In actual applications, connecting conductor 120 and external layer 111 may be made of different materials. By selecting the material of connecting layer 140, connecting conductor 120 can be stably connected to external layer 111, thereby improving the stability of the connection between the conductor 120 and external layer 111.

[0064] In a specific solution, the connection layer 140 is configured as, for example, a solder fixedly connected between the connection conductor 120 and the external connection layer 111 , that is, the connection layer 140 is fixedly connected to the external connection layer 111 by welding.

[0065] It is understood that the arrangement of the connecting layer 140 between the external layer 111 and the connecting conductor 120 may require that the dimension of the connecting layer 140 along the first direction be included when measuring or calculating the dimension of the connecting conductor 120 protruding from the surface of the connecting layer 140 along the first direction. That is, because the connecting layer 140 is disposed to separate the connecting conductor 120 and the external layer 111 through the connecting layer 140, the dimension of the connecting conductor 120 protruding from the surface of the connecting layer 140 along the first direction should be the sum of the dimension of the connecting conductor 120 itself along the first direction and the dimension of the connecting layer 140 along the first direction.

[0066] In some embodiments, reference Figure 2 As shown, the connecting layer 140 is at least partially embedded in the embedding groove 131a. This arrangement is conducive to limiting the connecting layer 140 through the groove wall of the embedding groove 131a, limiting the displacement of the connecting layer 140 when it undergoes small displacements such as creeping relative to the circuit board 110 in some scenarios such as heating, and further helps to stably connect the connecting conductor 120 between the shielding layer and the external layer 111.

[0067] In the present application, the shape of the connecting conductor 120 should be adapted to the shape of the fitting groove 131a, so that the fitting groove 131a can maintain stable contact with the connecting conductor 120. However, the present application does not limit the specific shapes of the connecting conductor 120 and the fitting groove 131a. In some embodiments, the connecting conductor 120 is provided with an overlapping side surface 121 in a second direction perpendicular to the first direction. The overlapping side surface 121 is embedded in the fitting groove 131a and contacts the groove wall of the fitting groove 131a. Specifically, the overlapping side surface 121 is configured as at least one of a plane, a conical surface, a frustum, a cylindrical surface, and a curved surface. The above configuration makes the projection of one overlapping side surface 121 on the projection surface with the straight line in the first direction as the normal line be a straight line / arc / curve, etc. At the same time, the connecting conductor 120 can have more than one overlapping side surface 121. For example, if the overlapping side surface 121 is cylindrical, the connecting conductor 120 can be provided with only one cylindrical overlapping side surface 121, but in other embodiments, if the overlapping side surface 121 is planar, the connecting conductor 120 can be provided with multiple overlapping side surfaces 121 connected in sequence so that the connecting conductor 120 has sufficient contact area with the interlocking groove 131a.

[0068] In some embodiments, reference Figure 5 and Figure 6 As shown, the end of the connecting conductor 120 away from the external connection layer 111 along the first direction is provided with a lap end surface 122. Figure 6In the exemplary embodiment, the overlapping end surface 122 is an arcuate surface. Of course, the overlapping end surface 122 can also be configured as a flat surface. On a projection plane with the straight line in the first direction as the normal, the projection of the overlapping end surface 122 is at least partially located outside the projection of the overlapping side surface 121, i.e., the width of the connecting conductor 120 at the overlapping end surface 122. Alternatively, the projection of the overlapping end surface 122 can overlap with the projection of the overlapping side surface 121 on a projection plane with the straight line in the first direction as the normal, or the projection of the overlapping end surface 122 partially overlaps with the projection of the overlapping side surface 121 on a projection plane with the straight line in the first direction as the normal, and a portion of the projection is located outside the projection of the overlapping side surface 121. This configuration ensures that the width of the connecting conductor 120 at the end near the external contact layer 111 is less than or equal to the width at the end near the bottom of the slot 131a, which helps prevent the connecting conductor 120 from escaping from the slot 131a and further maintains stable contact between the connecting conductor 120 and the shielding portion 131.

[0069] The connecting conductor 120 may be configured as a strip structure so as to provide complete electromagnetic shielding protection on one side of the circuit board 110 .

[0070] In other optional embodiments, the connecting conductor 120 may be shorter, and a greater number of connecting conductors 120 may be provided to ensure the electromagnetic shielding effect on the circuit board 110. Figure 9 As shown, the electronic device 100 includes a plurality of spaced connection conductors 120 . The arrangement of the plurality of connection conductors 120 can relatively reduce the material cost of the connection conductors 120 , and can also achieve a better electromagnetic shielding effect by controlling the spacing between adjacent connection conductors 120 .

[0071] In the related art, when there is a gap greater than 5mm in length between the two half shells of the housing 130, the housing 130 may form a slot antenna at the gap, thereby increasing the risk of electromagnetic leakage, external interference coupling, etc., and the electromagnetic shielding effect of the electronic device 100 is poor, affecting the normal use of the electronic components on the circuit board 110. In the solution of setting multiple connecting conductors 120 in this application, refer to Figure 9 As shown, the spacing e between adjacent connecting conductors 120 can be limited to less than 5 mm, so as to save the material used for the connecting conductors 120 and reduce the possibility of forming a slot antenna, thereby ensuring the electromagnetic shielding performance of the electronic device 100 and enabling the electronic components on the circuit board 110 to operate normally and stably.

[0072] The shape of the connecting conductor 120 may not be limited. In some embodiments, Figure 3As shown, a cavity 120 a is formed inside the connecting conductor 120 , making the connecting conductor 120 a hollow structure, which is beneficial to reducing the material cost of the connecting conductor 120 and is also beneficial to the deformation of the connecting conductor 120 so as to maintain a closer contact between the connecting conductor 120 and the shielding portion 131 .

[0073] As an example of the shape of the connection conductor 120, refer to Figure 7 As shown, the connecting conductor 120 can be configured to be a U-shaped structure, and when in use, at least part of the surface of the connecting conductor 120 contacts the groove wall of the fitting groove 131a. Figure 8 As shown, the connecting conductor 120 can also be configured as a hollow cylindrical structure as a whole. When in use, the cylindrical side surface of the connecting conductor 120 maintains contact with the groove wall of the fitting groove 131a.

[0074] The connection conductor 120 may be provided on only one side of the circuit board and connected to the housing 130, but this is not the only limitation. Figure 10 As shown, in some embodiments, an external layer 111 can be provided on both opposite sides of the circuit board 110, and accordingly, a connecting conductor 120 can be respectively connected to the opposite sides of the circuit board, and correspondingly, an embedding groove 131a is respectively provided at the corresponding positions of the shell on the opposite sides of the circuit board 110 for the different connecting conductors 120 on the opposite sides of the circuit board 110 to be respectively embedded.

[0075] Based on the integrated use of the electronic device 100, the second aspect of the present application further provides a vehicle, which includes the above-mentioned electronic device 100. The vehicle has the beneficial effects of the above-mentioned electronic device 100, which will not be described in detail in this application.

[0076] As an example, the vehicle may be a fuel vehicle, a plug-in hybrid vehicle, or a new energy vehicle, etc., and this application does not make any specific limitations on this.

[0077] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0078] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0079] The embodiments, implementation methods and related technical features of the present application can be combined and replaced with each other without conflict.

[0080] The above are merely preferred embodiments of the present application and do not constitute any form of limitation to the present application. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application are still within the scope of the technical solution of the present application.

Claims

1. An electronic device, characterized in that: include: A circuit board having an external connection layer; a connecting conductor, electrically connected to the external connection layer; a housing having a shielding portion for contacting the connecting conductor to cooperate with the connecting conductor and form an electromagnetic shield for the circuit board; The shielding portion and the connecting conductor are nested together, so that the shielding portion is reused as a structure for limiting relative displacement between the connecting conductor and the housing.

2. The electronic device according to claim 1, wherein The shielding portion includes: The fitting groove has an opening formed at one end along the first direction; Wherein, at least a portion of the connecting conductor is embedded in the embedding groove from the opening.

3. The electronic device according to claim 2, wherein: The portion of the connecting conductor embedded in the embedding groove contacts at least a portion of a groove wall of the embedding groove.

4. The electronic device according to claim 3, wherein: The portion of the connecting conductor embedded in the embedding groove forms an interference fit with at least a portion of the groove wall of the embedding groove.

5. The electronic device according to claim 2, wherein: The connecting conductor protrudes from the surface of the external layer along the first direction; the difference between the depth of the fitting groove along the first direction and the maximum distance between the connecting conductor and the surface of the external layer along the first direction is in the range of 0-0.8 mm.

6. The electronic device according to claim 2, wherein: In a second direction perpendicular to the first direction, a difference between a width of the connecting conductor and a width of the fitting groove ranges from 0.05 mm to 0.8 mm.

7. The electronic device according to claim 2, wherein: The electronic device further comprises: The connecting layer is fixedly connected between the connecting conductor and the external connection layer along the first direction.

8. The electronic device according to claim 7, wherein: The connecting layer is at least partially embedded in the embedding groove.

9. The electronic device according to claim 7, wherein: The connection layer is configured as solder fixedly connected between the connection conductor and the external connection layer.

10. The electronic device according to claim 2, wherein: The connecting conductor is provided with an overlapping side surface in a second direction perpendicular to the first direction, the overlapping side surface being embedded in the embedding groove and contacting with the groove wall of the embedding groove; Wherein, the overlapping side surface is configured as at least one of a plane, a conical surface, a frustum, a cylindrical surface, and a curved surface.

11. The electronic device according to claim 10, characterized in that An end of the connecting conductor away from the external connection layer along the first direction is provided with an overlapping end surface; Wherein, on a projection surface with the straight line of the first direction as a normal line, the projection of the overlapping end surface is at least partially located outside the projection of the overlapping side surface; and / or, On a projection surface with the straight line where the first direction is located as a normal line, the projection of the overlapping end surface overlaps with the projection of the overlapping side surface.

12. The electronic device according to any one of claims 1 to 11, characterized in that: The electronic device includes a plurality of the connecting conductors arranged at intervals.

13. The electronic device according to claim 12, wherein: The distance between adjacent connecting conductors is less than 5 mm.

14. The electronic device according to any one of claims 1 to 11, characterized in that: The connecting conductor is configured as a metal spring; and / or, The external connection layer is configured as a copper material layer.

15. The electronic device according to any one of claims 1 to 11, characterized in that: A cavity is formed inside the connecting conductor.

16. A vehicle, characterized in that: The electronic device comprises the electronic device according to any one of claims 1 to 15.

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