Copper plating and cold drawing preparation method of high-strength tungsten alloy wire

Abstract

The invention relates to a copper plating and cold drawing preparation method of a high-strength tungsten alloy wire, which comprises the following steps: by taking W and La2O3 powder as raw materials, pressing the ball-milled mixed raw materials into a rod-shaped tungsten blank strip by adopting a cold isostatic pressing process, and sintering to obtain a sintered tungsten rod; forging cogging, rotary swaging and drawing are conducted on the sintered tungsten rod, and a tungsten filament with the diameter of 0.06 mm is obtained; the method comprises the following steps: cleaning the surface of a tungsten filament, then sequentially carrying out nickel pre-plating and copper plating treatment to obtain a copper-plated tungsten filament, cleaning and drying the copper-plated tungsten filament, and drawing the copper-plated tungsten filament to the diameter of 0.033 mm at room temperature by adopting multi-mode wire drawing to obtain the high-strength tungsten alloy wire. According to the copper plating cold drawing technology, the high-temperature drawing frequency is reduced, drawing can be conducted at the room temperature, energy consumption is saved, the production cost is reduced, the grain growth phenomenon of the tungsten filament in the hot working process can be avoided, growth of cracks on the surface of the tungsten filament is avoided, and the copper plating cold drawing technology is uniform in sample structure, small in grain, free of obvious pores, high in tensile strength and not prone to breakage in the drawing process; the comprehensive performance is excellent.

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