Microstress constrained thermoelastic structure dual-scale topological optimization method and system

CN120766833APending Publication Date: 2025-10-10DALIAN UNIV OF TECH
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Patent Information

Application Number
CN202510872557.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-06-26
Publication Date
2025-10-10

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Abstract

The invention provides a microstress constrained thermoelastic structure dual-scale topological optimization method and system. The method comprises the following steps: firstly, establishing a thermoelastic coupling equation of a dual-scale structure to represent a coupling effect between a thermal field and a force field; in order to evaluate the thermoelastic strength of the dual-scale structure, microscopic thermoelastic stress analysis is carried out based on a microscopic characteristic stress field; the number of stress constraints is reduced by adopting an active set method, and the sensitivity of the stress constraints is deduced through an adjoint variable method. An optimization problem is solved by adopting a moving asymptote algorithm. A numerical example shows that the method successfully realizes the dual-scale structure design with high rigidity and thermoelastic strength requirements.
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