Multi-module compatible server carrier board based on selective soldering and low temperature self-adaptation

Abstract

The application relates to the technical field of server carrier plates, and discloses a multi-module compatible server carrier plate based on selective welding and low-temperature self-adaption, which comprises a shell, a main plate and an interface, the main plate is installed in the interior of the shell, the upper surface of the main plate is welded with the interface, the upper surface of the main plate is provided with a stabilizing device, the stabilizing device comprises a guide rail, the guide rail is fixedly connected with the upper surface of the main plate, the inner wall of the guide rail is slidably connected with an assembling frame, the inner wall of the assembling frame is fixedly connected with a shielding clamping plate, and square grooves are formed in the two sides of the shielding clamping plate. In the application, external forces generated in the welding process, such as welding operation force and thermal deformation stress, are transmitted to the stabilizing structure such as the guide rail through the shielding clamping plate and the assembling frame, the external forces are prevented from directly acting on the interface pin, the risk of pin bending and breaking is reduced from the source, the safety of the pin is remarkably improved, and the welding quality of the interface is improved.

Description

Technical Field

[0001] This invention relates to the field of server carrier technology, specifically to a multi-module compatible server carrier based on selective soldering and low-temperature adaptive technology. Background Technology

[0002] Multi-module compatible server carriers are key components for server systems, capable of adapting to various types of server modules. Through standardized interface design and flexible circuit layout, they can simultaneously support computing, storage, and network modules from different manufacturers, with different architectures (such as x86 and ARM), and different performance levels. Multi-module compatible server carriers are widely used in data centers, cloud computing, and edge computing scenarios, providing enterprises and institutions with flexible, scalable, and cost-effective server solutions. This helps them quickly adjust server configurations according to business needs, improve resource utilization efficiency, and adapt to ever-changing digital business requirements.

[0003] Selective soldering is a precision soldering technology for high-density and highly complex solder joints on a carrier board. It uses selectively positioned nozzles to spray molten solder onto specific solder joints (such as chip pins, connector solder joints, etc.), avoiding the thermal shock to sensitive components caused by traditional wave soldering.

[0004] Its low-temperature adaptive technology is a technical solution for the server carrier board to work stably in low-temperature environments by means of hardware design and intelligent control to address temperature fluctuations caused by high power consumption during server operation.

[0005] In existing multi-module compatible server carriers on the market, the interface needs to be initially positioned by inserting metal pins into pre-set holes on the motherboard during soldering. The pin diameter is usually only 0.3-0.8mm, and the material is mostly brass or phosphor bronze, which has limited bending resistance. When the interface relies solely on the pins for positioning, various external forces during the soldering process, such as the pushing force of the operator holding the interface to adjust its position, the contact force when applying solder paste, and the thermal stress during reflow soldering, will all be concentrated on the thin pins. Due to the lack of support for the interface, it is very easy for external forces during the soldering process to act on the pins, causing pin deformation and damage, which in turn leads to faults such as cold solder joints and short circuits. To address this, we propose a multi-module compatible server carrier based on selective soldering and low-temperature adaptive design. Summary of the Invention

[0006] (a) Technical problems to be solved

[0007] To address the shortcomings of existing technologies, this invention provides a multi-module compatible server carrier board based on selective soldering and low-temperature adaptive technology. This solves the problem that when soldering existing server carrier boards, the pushing force exerted by the operator to adjust the position of the interface, the contact force when applying solder paste, and the thermal stress during reflow soldering are all concentrated on the fine pins. Because the interface lacks support, external forces during the soldering process are easily applied to the pins, causing pin deformation and damage, which in turn leads to faults such as cold solder joints and short circuits.

[0008] (II) Technical Solution

[0009] To achieve the above objectives, the present invention is implemented through the following technical solution: a multi-module compatible server carrier board based on selective welding and low temperature adaptive, including a shell, a motherboard and an interface, wherein the motherboard is installed inside the shell, the motherboard is provided with a detection module for detecting ambient temperature, the motherboard is also provided with a low temperature heating module for adjusting the motherboard temperature, the motherboard has an interface welded to its upper surface, and the motherboard has a stabilizing device on its upper surface.

[0010] The stabilizing device includes a guide rail, which is fixedly connected to the upper surface of the motherboard. An assembly frame is slidably connected to the inner wall of the guide rail, and a shielding plate is fixedly connected to the inner wall of the assembly frame. Square grooves are formed on both sides of the shielding plate, and a rubber pad is fixedly connected to the inner wall of the shielding plate in the square groove. The rubber pad movably abuts against the surface of the interface. A fixing bolt is threaded into the internal part of the assembly frame. An anti-slip disc is fixedly connected to the upper surface of the assembly frame, and a connecting cylinder is fixedly connected to the lower surface of the fixing bolt. A connecting column is rotatably connected to the inner wall of the connecting cylinder, and a pressure plate is fixedly connected to the lower surface of the connecting column. The pressure plate movably abuts against the inner wall of the guide rail. Utilizing the detection module and low-temperature heating module on the motherboard, the low-temperature heating module is activated when the ambient temperature is detected to be below -20°C, ensuring that the module can start normally in extreme low-temperature environments. Through the intelligent control system integrated in the detection module, the heating power can be automatically adjusted according to the real-time detection data to ensure optimal working conditions. In addition, the motherboard selectively solders key components, such as HCCS link chips or PCIe controllers, to adapt to the interconnection requirements of different modules.

[0011] Preferably, the inner wall of the assembly frame is fixedly connected with a guide pin, and the arc surface of the pressure plate is provided with a groove that matches the guide pin. By utilizing the cooperation between the guide pin and the groove, the movement direction of the pressure plate can be guided to ensure that the pressure plate moves in a specified direction when it is pushed. This also reduces the probability that the pressure plate and the connecting column will rotate with the fixing bolt, thereby reducing the probability that the pressure plate will easily wear down the inner wall of the guide rail when it is in a rotating state near the inner wall of the guide rail.

[0012] Preferably, the anti-slip disc is sleeved on the surface of the fixing bolt, and the anti-slip disc movably abuts against the lower surface of the bolt head of the fixing bolt. The diameter of the connecting cylinder is adapted to the inner diameter of the threaded hole of the assembly frame. The anti-slip disc can increase the stability of the fixing bolt in the locked state, thereby enhancing the locking effect of the fixing bolt and ensuring the stability of the assembly frame in the state of being held by the shielding clamp.

[0013] Preferably, the connecting cylinder has a "T" shaped cross-section, the connecting column has an "I" shaped cross-section, and the pressure plate is slidably connected to the inner wall of the assembly frame. By utilizing the cooperation of the connecting cylinder and the connecting column, the pressure plate and the fixing bolt can be connected, thereby ensuring that the fixing bolt can push the pressure plate to move in a specified direction during the tightening process.

[0014] Preferably, the inner wall of the guide rail is provided with a limiting device, the limiting device including an assembly frame, the assembly frame being slidably connected to the inner wall of the guide rail, the inner wall of the assembly frame being threadedly connected to a positioning bolt, the inner wall of the assembly frame being fixedly connected to a spring, the spring being movably abutting against the lower surface of the bolt head of the positioning bolt, and the inner wall of the assembly frame being fixedly connected to a limit ring.

[0015] The assembly frame has sliding grooves on both the front and rear sides. A spring is fixedly connected to the inner wall of the sliding groove, and a buckle is slidably connected to the inner wall of the sliding groove. A storage groove is formed on the side surface of the buckle, and the spring is fixedly connected to the inner wall of the storage groove. The inner wall of the guide rail has a slot that matches the buckle. The assembly frame can be fixed in a designated position in the guide rail using a positioning bolt, thereby sealing the openings on both sides of the guide rail and limiting the movement distance of the assembly frame in the guide rail.

[0016] Preferably, the positioning bolt penetrates the lower surface of the assembly frame, and a locking hole is provided on the inner wall of the guide rail. The positioning bolt is threadedly connected to the inner wall of the locking hole. By utilizing the sealing effect of the assembly frame on the guide rail, the guide rail can limit the movement distance of the assembly frame, thereby ensuring that the assembly frame will not exceed the maximum guiding distance of the guide rail during movement.

[0017] Preferably, there are two buckles, which are arranged in a mirror image of the vertical axis of the assembly frame. The insertion end of the buckle is arc-shaped. By using the cooperation of the buckle, spring and slot, the position of the assembly frame can be initially locked when it moves to the designated position, and the positioning bolt can be accurately aligned with the locking hole in the guide rail, so that the user can lock the positioning bolt.

[0018] Preferably, the surface of the shielding clamp is provided with an auxiliary device, the auxiliary device including a shielding plate, a storage cavity is formed on the upper surface of the shielding clamp, the shielding plate is slidably connected to the inner wall of the storage cavity, an installation groove is formed on the side surface of the shielding plate, a tooth is fixedly connected to the inner wall of the installation groove on the shielding plate, a restraint frame is fixedly connected to the surface of the shielding clamp, a dial wheel is fixedly connected to the inner wall of the restraint frame, a transmission gear is fixedly connected to the inner wall of the dial wheel, the tooth meshes with the tooth groove of the transmission gear, and a ratchet is fixedly connected to the surface of the dial wheel;

[0019] A positioning shaft is fixedly connected to the surface of the shielding clamp, and a top pin is rotatably connected to the surface of the positioning shaft. The top pin is inserted into the tooth groove of the ratchet. A load-bearing plate is fixedly connected to the surface of the assembly frame, and a limit spring is fixedly connected to the surface of the load-bearing plate. The limit spring is fixedly connected to the surface of the top pin. By utilizing the cooperation of the ratchet and the top pin, the rotation direction of the dial wheel can be restricted, so that the dial wheel can only drive the transmission gear to rotate in a counterclockwise direction.

[0020] Preferably, one side of the dial is located inside the storage cavity, and there are two ratchet wheels. The two ratchet wheels are arranged symmetrically about the vertical axis of the dial, and the tooth grooves of the ratchet wheels face clockwise. The dial allows the user to easily rotate the transmission gear, thereby making the transmission gear mesh with the convex teeth to push the shielding plate upward and open the shielding plate to increase the shielding area.

[0021] In summary, the technical effects and advantages of this invention are as follows:

[0022] 1. In this invention, a rigid clamping and fixing system for interface welding is constructed by setting up a stabilizing device consisting of a guide rail, an assembly frame, a shielding clamp, rubber pads, fixing bolts, a connecting cylinder, a connecting column, a pressure plate, a guide pin, and an anti-slip disc. When installing the interface, pushing the assembly frame on the guide rail moves the shielding clamp, causing the rubber pads of the shielding clamps on both sides of the interface to fit against the interface surface. Tightening the fixing bolt drives the pressure plate to move downwards along the guide pin. The locking effect of the fixing bolt and the anti-slip disc, along with the friction of the pressure plate, limits the position of the assembly frame, achieving symmetrical clamping of the interface. This clamping structure transmits external forces generated during welding, such as welding operation force and thermal deformation stress, to the stabilizing structure such as the guide rail through the shielding clamp and the assembly frame, avoiding direct external force acting on the interface pins. This reduces the risk of pin bending and breakage from the source, significantly improving pin safety and enhancing the welding quality of the interface.

[0023] 2. In this invention, a modular adjustment system for the stabilizing device is constructed by setting a limiting device consisting of a positioning bolt, spring one, guide rail, assembly frame, buckle, spring two, and slot. On the one hand, when the positioning bolt is tightened, it compresses spring one to form an axial preload, which, together with the guide rail, constrains the movement trajectory of the assembly frame, precisely limiting the movement distance of the stabilizing device and avoiding structural interference caused by excessive displacement. On the other hand, by unscrewing the positioning bolt with a tool to release the pressure of spring one, the assembly frame is pushed so that the buckle compresses spring two and disengages from the slot. The assembly frame can then be quickly removed along the guide rail opening, enabling convenient addition or removal of the assembly frame (flat plate carrier). During installation, the assembly frame resets along the guide rail, causing the buckle to engage with the slot under the rebound of spring two, completing the initial positioning. Then, tightening the positioning bolt compresses spring one to form a double lock. This design ensures the operational stability of the device through mechanical limiting and also achieves modular adjustment of the number of shielding plates, flexibly adapting to installation requirements with different numbers of interfaces, significantly improving the applicability and expandability of the stabilizing device in multiple scenarios.

[0024] 3. In this invention, an adaptive adjustment system for interface electromagnetic shielding is constructed by setting up an auxiliary device consisting of a dial wheel, a transmission gear, a ratchet, a serrated tooth, a shielding plate, a top pin, and a limiting spring. When the user turns the dial wheel counterclockwise, the transmission gear meshes with the serrated tooth to drive the shielding plate to unfold upwards. By changing the unfolded height of the shielding plate, the shielding area of ​​adjacent interface contact surfaces is precisely adjusted, ensuring that adjacent surfaces of interfaces at different heights are completely covered by the shielding plate. Simultaneously, the ratchet, as the dial wheel rotates, triggers the top pin to compress the limiting spring. When the shielding plate height matches the interface, after stopping the dialing, the limiting spring rebounds and pushes the top pin into the ratchet tooth groove. The ratchet locks the position of the transmission gear and the serrated tooth, keeping the shielding plate in a stable unfolded state. This design achieves dynamic matching between the shielding area and the interface height. By completely covering adjacent contact surfaces, it blocks electromagnetic signal leakage paths, effectively reducing electromagnetic interference between different interfaces. It is particularly suitable for electromagnetic compatibility optimization in scenarios with densely arranged multiple interfaces, improving the stability of equipment signal transmission. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the overall structure of the multi-module compatible server carrier board based on selective welding and low-temperature adaptive technology of the present invention.

[0026] Figure 2 This is a bottom view of the multi-module compatible server carrier board based on selective welding and low-temperature adaptive technology of the present invention.

[0027] Figure 3 This is a right view of the multi-module compatible server carrier board based on selective welding and low-temperature adaptive technology of the present invention.

[0028] Figure 4This is a partial structural diagram of the multi-module compatible server carrier board based on selective welding and low-temperature adaptive technology of the present invention;

[0029] Figure 5 This is a schematic diagram of the stabilization device structure of the multi-module compatible server carrier board based on selective welding and low-temperature adaptive technology of the present invention.

[0030] Figure 6 This is a schematic diagram of the stabilization device for a multi-module compatible server carrier board based on selective welding and low-temperature adaptive technology according to the present invention.

[0031] Figure 7 This is a schematic diagram of the limiting device structure for the multi-module compatible server carrier board based on selective welding and low-temperature adaptive technology according to the present invention.

[0032] Figure 8 This is a schematic diagram of a portion of the limiting device structure of the multi-module compatible server carrier board based on selective welding and low-temperature adaptive technology according to the present invention.

[0033] Figure 9 This is a schematic diagram of the auxiliary device structure for the multi-module compatible server carrier board based on selective welding and low-temperature adaptive technology of the present invention.

[0034] Figure 10 This is a schematic diagram of the auxiliary device structure of the multi-module compatible server carrier board based on selective welding and low temperature adaptive technology of the present invention.

[0035] Figure 11 This invention relates to a multi-module compatible server carrier board based on selective welding and low-temperature adaptive technology. Figure 10 Schematic diagram of the structure at point A in the middle;

[0036] Figure 12 This is a module logic diagram of the multi-module compatible server carrier board based on selective welding and low-temperature adaptive technology of the present invention.

[0037] Figure 13 This is the BMC logic diagram of the multi-module compatible server carrier board based on selective welding and low-temperature adaptive design of the present invention.

[0038] In the diagram: 1. Outer casing; 2. Motherboard; 3. Interface;

[0039] 4. Stabilizing device; 41. Guide rail; 42. Assembly frame; 43. Shielding clamp; 44. Rubber pad; 45. Fixing bolt; 46. Anti-slip disc; 47. Connecting cylinder; 48. Connecting column; 49. Pressure plate; 410. Guide pin; 411. Groove;

[0040] 5. Limiting device; 51. Assembly frame; 52. Positioning bolt; 53. Spring 1; 54. Limiting ring; 55. Slide groove; 56. Spring 2; 57. Buckle; 58. Slot;

[0041] 6. Auxiliary device; 61. Shielding plate; 62. Convex tooth; 63. Restraint frame; 64. Dial wheel; 65. Transmission gear; 66. Ratchet; 67. Positioning shaft; 68. Top pin; 69. Load plate; 610. Limiting spring. Detailed Implementation

[0042] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0043] refer to Figures 1-13 The multi-module compatible server carrier board shown is based on selective welding and low temperature adaptation, including a shell 1, a motherboard 2 and an interface 3. The motherboard 2 is installed inside the shell 1. The motherboard 2 is equipped with a detection module for detecting ambient temperature. The motherboard 2 is also equipped with a low temperature heating module for adjusting the motherboard temperature. The interface 3 is welded to the upper surface of the motherboard 2. The stabilizing device 4 is provided on the upper surface of the motherboard 2.

[0044] The stabilizing device 4 includes a guide rail 41, which is fixedly connected to the upper surface of the main board 2. An assembly frame 42 is slidably connected to the inner wall of the guide rail 41. A shielding clamp 43 is fixedly connected to the inner wall of the assembly frame 42. Square grooves are provided on both sides of the shielding clamp 43. A rubber pad 44 is fixedly connected to the inner wall of the shielding clamp 43 in the square groove. The rubber pad 44 movably abuts against the surface of the interface 3. A fixing bolt 45 is threadedly connected to the inside of the assembly frame 42. An anti-slip disc 46 is fixedly connected to the upper surface of the assembly frame 42. A connecting cylinder 47 is fixedly connected to the lower surface of the fixing bolt 45. A connecting element is rotatably connected to the inner wall of the connecting cylinder 47. A pressure plate 49 is fixedly connected to the lower surface of column 48. The pressure plate 49 movably abuts against the inner wall of guide rail 41. Utilizing the detection module and low-temperature heating module on the main board 2, the low-temperature heating module is activated when the ambient temperature is detected to be below -20℃, ensuring that the module can start normally in extreme low-temperature environments. Through the intelligent control system integrated in the detection module, the heating power can be automatically adjusted according to the real-time detection data to ensure optimal working conditions. In addition, the main board selectively solders key components, such as HCCS link chips or PCIe controllers, to adapt to the interconnection requirements of different modules.

[0045] The inner wall of the assembly frame 42 is fixedly connected with a guide pin 410, and the arc surface of the pressure plate 49 is provided with a groove 411 that matches the guide pin 410. By using the cooperation between the guide pin 410 and the groove 411, the movement direction of the pressure plate 49 can be guided to ensure that the pressure plate 49 moves in the specified direction when it is pushed. It can also reduce the probability that the pressure plate 49 and the connecting column 48 will rotate with the fixing bolt 45, thereby reducing the probability that the pressure plate 49 will be in a rotating state when it is close to the inner wall of the guide rail 41 and easily wear the inner wall of the guide rail 41.

[0046] The anti-slip disc 46 is sleeved on the surface of the fixing bolt 45. The anti-slip disc 46 is in movable contact with the lower surface of the bolt head of the fixing bolt 45. The diameter of the connecting cylinder 47 is adapted to the inner diameter of the threaded hole of the assembly frame 42. The anti-slip disc 46 can increase the stability of the fixing bolt 45 in the locked state, thereby enhancing the locking effect of the fixing bolt 45 and ensuring the stability of the assembly frame 42 in the clamping state of the shielding clamp 43.

[0047] The connecting cylinder 47 has a "T" shaped cross section, the connecting column 48 has an "I" shaped cross section, and the pressure plate 49 is slidably connected to the inner wall of the assembly frame 42. By using the cooperation of the connecting cylinder 47 and the connecting column 48, the pressure plate 49 and the fixing bolt 45 can be connected, thereby ensuring that the fixing bolt 45 can push the pressure plate 49 to move in a specified direction during the tightening process.

[0048] The inner wall of the guide rail 41 is provided with a limiting device 5, which includes an assembly frame 51. The assembly frame 51 is slidably connected to the inner wall of the guide rail 41. The inner wall of the assembly frame 51 is threadedly connected to a positioning bolt 52. The inner wall of the assembly frame 51 is fixedly connected to a spring 53. The spring 53 is in movable contact with the lower surface of the bolt head of the positioning bolt 52. The inner wall of the assembly frame 51 is fixedly connected to a limit ring 54.

[0049] The assembly frame 51 has sliding grooves 55 on both the front and rear sides. A second spring 56 is fixedly connected to the inner wall of the sliding groove 55. A buckle 57 is slidably connected to the inner wall of the sliding groove 55. A storage groove is opened on the side surface of the buckle 57. The second spring 56 is fixedly connected to the inner wall of the storage groove. The inner wall of the guide rail 41 has a slot 58 that matches the buckle 57. The positioning bolt 52 can be used to fix the assembly frame 51 in a designated position in the guide rail 41, thereby sealing the openings on both sides of the guide rail 41 and limiting the movement distance of the assembly frame 42 in the guide rail 41.

[0050] The positioning bolt 52 penetrates the lower surface of the assembly frame 51, and the inner wall of the guide rail 41 is provided with a locking hole. The positioning bolt 52 is threadedly connected to the inner wall of the locking hole. By utilizing the sealing effect of the assembly frame 51 on the guide rail 41, the guide rail 41 can limit the movement distance of the assembly frame 42, thereby ensuring that the assembly frame 42 will not exceed the maximum guiding distance of the guide rail 41 during the movement.

[0051] There are two buckles 57, which are mirror images of the vertical axis of the assembly frame 51. The insertion end of the buckle 57 is arc-shaped. The buckle 57, spring 56 and slot 58 work together to initially lock the position of the assembly frame 51 when it moves to the designated position, and make the positioning bolt 52 accurately aligned with the locking hole in the guide rail 41, so that the user can lock the positioning bolt 52.

[0052] The shielding clamp 43 is provided with an auxiliary device 6, which includes a shielding plate 61. The upper surface of the shielding clamp 43 is provided with a storage cavity. The shielding plate 61 is slidably connected to the inner wall of the storage cavity. The side surface of the shielding plate 61 is provided with an installation groove. The shielding plate 61 is fixedly connected to the inner wall of the installation groove with a tooth 62. The surface of the shielding clamp 43 is fixedly connected with a restraint frame 63. The inner wall of the restraint frame 63 is fixedly connected with a dial wheel 64. The inner wall of the dial wheel 64 is fixedly connected with a transmission gear 65. The tooth 62 meshes with the tooth groove of the transmission gear 65. The surface of the dial wheel 64 is fixedly connected with a ratchet 66.

[0053] A positioning shaft 67 is fixedly connected to the surface of the shielding clamp 43. A top pin 68 is rotatably connected to the surface of the positioning shaft 67. The top pin 68 is engaged with the toothed groove of the ratchet 66. A load-bearing plate 69 is fixedly connected to the surface of the assembly frame 42. A limit spring 610 is fixedly connected to the surface of the load-bearing plate 69. The limit spring 610 is fixedly connected to the surface of the top pin 68. By utilizing the cooperation of the ratchet 66 and the top pin 68, the rotation direction of the dial wheel 64 can be restricted, so that the dial wheel 64 can only drive the transmission gear 65 to rotate in the counterclockwise direction.

[0054] One side of the dial 64 is located inside the storage cavity. There are two ratchet wheels 66, which are symmetrically arranged about the vertical axis of the dial 64. The tooth grooves of the ratchet wheels 66 face clockwise. The dial 64 allows the user to easily rotate the transmission gear 65, which meshes with the convex tooth 62 to push the shielding plate 61 upward and open the shielding plate 61 to increase the shielding area.

[0055] The working principle of this invention is as follows: When using a server carrier board, the server carrier board is assembled according to the user's needs. After the overall assembly is completed, the server carrier board is installed in the server chassis and connected to power cords, network cables and other cables. The carrier board installation of the entire chassis can be completed in sequence according to the above steps.

[0056] When soldering the server carrier board interface 3, the interfaces 3 are installed sequentially on the motherboard 2 according to the design specifications. When installing the first interface 3, the assembly frame 42 on the guide rail 41 is pushed according to the position of the interface 3. The assembly frame 42 moves the shielding clamp 43. During the movement of the shielding clamp 43, ensure that one shielding clamp 43 is left on one side of the interface 3. Then, the interface 3 is initially installed on the motherboard 2. The assembly frame 42 on the side of the interface 3 with the shielding clamp 43 is pushed. The assembly frame 42 moves the shielding clamp 43, and the shielding clamp 43 moves the rubber in the specified direction. The rubber pad 44 moves, and when the rubber pad 44 contacts the interface 3, the assembly frame 42 stops moving. The fixing bolt 45 is rotated with a tool, and the fixing bolt 45 is gradually tightened. During the tightening process, the fixing bolt 45, together with the connecting cylinder 47 and the connecting column 48, pushes the pressure plate 49 downward. The pressure plate 49 moves in the specified direction under the guidance of the guide pin 410 and the groove 411. When the fixing bolt 45 is fully tightened, the fixing bolt 45 contacts the anti-slip plate 46 and locks the position of the pressure plate 49. In the locked state, the pressure plate 49 limits the position of the assembly frame 42 through friction.

[0057] Then select the first assembly frame 42 on the other side of interface 3 and operate according to the above steps. After locking the assembly frame 42 on the other side, the two assembly frames 42 can clamp the interface 3. By setting the stabilizing device 4, the external forces generated during the welding process, such as welding operation force and thermal deformation stress, are transmitted to the guide rail 41 and other stabilizing structures through the shielding clamp 43 and the assembly frame 42. This avoids the external forces acting directly on the pins of interface 3, reduces the risk of pin bending and breakage from the root, significantly improves pin safety, and improves the welding quality of interface 3.

[0058] Additionally, when the user needs to increase or decrease the number of shielding plates 43 according to the number of interfaces 3, before installing interfaces 3, the positioning bolt 52 is rotated with the help of a tool. The positioning bolt 52 is gradually unscrewed. During the unscrewing process, the positioning bolt 52 loses the pressure applied to the spring 1. The spring 1 53 loses the pressure and gradually rebounds. During the rebound process, it applies a vertical thrust to the positioning bolt 52. When the positioning bolt 52 is unscrewed from the guide rail 41, the assembly frame 51 is pushed along the opening direction of the guide rail 41. The assembly frame 51 is pushed by force to push the buckle 57. The buckle 57 is pressed by force and squeezes the spring 2 56 under the action of the guide rail 41. The spring 2 56 is squeezed and deformed. At this time, the buckle 57 loses the constraint of the spring 2 56 and disengages from the slot 58. The assembly frame 51 is pushed to remove the assembly frame 51 from the guide rail 41. After removing the assembly frame 51, the assembly frame 42 is installed or removed along the open opening of the guide rail 41.

[0059] After the assembly frame 42 is installed or disassembled, the assembly frame 51 is reinstalled into the guide rail 41. As the assembly frame 51 moves within the guide rail 41, it drives the buckle 57 to approach the slot 58. When the buckle 57 coincides with the slot 58, the buckle 57 loses the restriction of the guide rail 41 and stops applying pressure to the second spring 56. The second spring 56 rebounds after losing pressure, pushing the buckle 57 into the slot 58. When the buckle 57 is inserted into the slot 58, the buckle 57 initially restricts the assembly frame 51. Then, the user can tighten the positioning bolt 52 with the help of tools. During the tightening process, the positioning bolt 52 will press down on the first spring 53. The first spring 53 is compressed and deformed, and applies an upward thrust to the positioning bolt 52 to improve the stability of the positioning bolt 52 in the tightened state. By setting the limiting device 5, the mechanical limit ensures the stability of the device operation and realizes the modular adjustment of the number of shielding plates 43. It can flexibly adapt to the installation requirements of different numbers of interfaces 3, significantly improving the applicability and expansion capability of the stabilizing device 4 in multiple scenarios.

[0060] After completing the clamping operation of all interfaces 3, turn the dial 64 counterclockwise. The dial 64 drives the transmission gear 65 and ratchet 66 to rotate. During the rotation, the transmission gear 65 meshes with the convex tooth 62 and, together with the convex tooth 62, pushes the shielding plate 61 upward to unfold. During the unfolding process, the shielding plate 61 gradually increases the obstruction of the contact surface of the adjacent interfaces 3. During the rotation, the ratchet 66 moves the top pin 68. Under the action of the ratchet 66, the top pin 68 pushes the limiting spring 610, and the limiting spring 610 is deformed. When the unfolded height of the shielding plate 61 is suitable for the height of the interfaces 3, stop turning the dial 64. The dial 64 stops rotating the transmission gear 65 and ratchet 66. The ratchet 66 stops moving the top pin 68. The top pin 68 stops pressing the limiting spring 610, and the limiting spring 610 loses its function. The force applied to the top pin 68 rebounds and pushes the top pin 68 back to its original position. The top pin 68 then engages in the tooth groove of the ratchet 66, and under the action of the limiting spring 610, the position of the ratchet 66 is locked. The ratchet 66 then locks the positions of the dial wheel 64 and the transmission gear 65. In the locked state, the transmission gear 65 can cooperate with the convex tooth 62 to limit the position of the unfolded shielding plate 61, thereby completing the unfolding operation of the auxiliary device 6. By setting the auxiliary device 6, the dynamic matching of the shielding area and the height of the interface 3 is achieved. By completely covering the adjacent contact surface and blocking the electromagnetic signal leakage path, the electromagnetic interference between different interfaces 3 is effectively reduced. It is especially suitable for electromagnetic compatibility optimization in scenarios with dense arrangement of multiple interfaces 3, and improves the stability of equipment signal transmission.

[0061] All electrical components mentioned in this article are connected to an external main controller and 220V AC mains power. The main controller can be a conventional known device such as a computer for control. At the same time, its low temperature adaptive technology can be implemented by hardware design and intelligent control through the server carrier board to address temperature fluctuations caused by high power consumption during server operation. The implementation scheme is existing technology and will not be elaborated here.

[0062] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A multi-module compatible server carrier board based on selective welding and low-temperature adaptive design, comprising a housing (1), a motherboard (2), and interfaces (3), characterized in that: The motherboard (2) is installed inside the outer casing (1), and an interface (3) is welded to the upper surface of the motherboard (2). A stabilizing device (4) is provided on the upper surface of the motherboard (2). The stabilizing device (4) includes a guide rail (41), which is fixedly connected to the upper surface of the main board (2). An assembly frame (42) is slidably connected to the inner wall of the guide rail (41). A shielding clamp (43) is fixedly connected to the inner wall of the assembly frame (42). Square grooves are provided on both sides of the shielding clamp (43). A rubber pad (44) is fixedly connected to the inner wall of the shielding clamp (43) in the square groove. The rubber pad (44) is in movable contact with the surface of the interface (3). A fixing bolt (45) is threaded inside the assembly frame (42). An anti-slip disc (46) is fixedly connected to the upper surface of the assembly frame (42). A connecting cylinder (47) is fixedly connected to the lower surface of the fixing bolt (45). A connecting column (48) is rotatably connected to the inner wall of the connecting cylinder (47). A pressure plate (49) is fixedly connected to the lower surface of the connecting column (48). The pressure plate (49) is in movable contact with the inner wall of the guide rail (41).

2. The multi-module compatible server carrier board based on selective welding and low-temperature adaptive technology according to claim 1, characterized in that: The inner wall of the assembly frame (42) is fixedly connected with a guide pin (410), and the arc surface of the pressure plate (49) is provided with a groove (411) that matches the guide pin (410).

3. The multi-module compatible server carrier board based on selective welding and low-temperature adaptive technology according to claim 1, characterized in that: The anti-slip disc (46) is sleeved on the surface of the fixing bolt (45), and the anti-slip disc (46) is in movable contact with the lower surface of the bolt head of the fixing bolt (45). The diameter of the connecting cylinder (47) is adapted to the inner diameter of the threaded hole of the assembly frame (42).

4. The multi-module compatible server carrier board based on selective welding and low-temperature adaptive technology according to claim 1, characterized in that: The connecting cylinder (47) has a "T" shaped cross section, the connecting column (48) has an "I" shaped cross section, and the pressure plate (49) is slidably connected to the inner wall of the assembly frame (42).

5. The multi-module compatible server carrier board based on selective welding and low-temperature adaptive technology according to claim 1, characterized in that: The inner wall of the guide rail (41) is provided with a limiting device (5), the limiting device (5) includes an assembly frame (51), the assembly frame (51) is slidably connected to the inner wall of the guide rail (41), the inner wall of the assembly frame (51) is threadedly connected with a positioning bolt (52), the inner wall of the assembly frame (51) is fixedly connected with a spring (53), the spring (53) is movably abutting against the lower surface of the bolt head of the positioning bolt (52), and the inner wall of the assembly frame (51) is fixedly connected with a limit ring (54). The assembly frame (51) has sliding grooves (55) on both the front and rear sides. The assembly frame (51) is fixedly connected to the inner wall of the sliding groove (55) with a spring (56). The assembly frame (51) is slidably connected to the inner wall of the sliding groove (55) with a buckle (57). The side surface of the buckle (57) has a storage groove. The spring (56) is fixedly connected to the inner wall of the storage groove. The inner wall of the guide rail (41) has a slot (58) that matches the buckle (57).

6. The multi-module compatible server carrier board based on selective welding and low-temperature adaptive technology according to claim 5, characterized in that: The positioning bolt (52) penetrates the lower surface of the assembly frame (51), and the inner wall of the guide rail (41) is provided with a locking hole, and the positioning bolt (52) is threadedly connected to the inner wall of the locking hole.

7. The multi-module compatible server carrier board based on selective welding and low-temperature adaptive technology according to claim 5, characterized in that: The number of the buckles (57) is two, and the two buckles (57) are arranged in a mirror image with the vertical axis of the assembly frame (51) as the mirror axis. The insertion end of the buckle (57) is arranged in an arc shape.

8. The multi-module compatible server carrier board based on selective welding and low-temperature adaptive technology according to claim 1, characterized in that: The shielding clamp (43) is provided with an auxiliary device (6), which includes a shielding plate (61). The upper surface of the shielding clamp (43) is provided with a storage cavity. The shielding plate (61) is slidably connected to the inner wall of the storage cavity. The side surface of the shielding plate (61) is provided with an installation groove. The shielding plate (61) is fixedly connected to the inner wall of the installation groove with a tooth (62). The surface of the shielding clamp (43) is fixedly connected with a restraint frame (63). The inner wall of the restraint frame (63) is fixedly connected with a dial wheel (64). The inner wall of the dial wheel (64) is fixedly connected with a transmission gear (65). The tooth (62) meshes with the tooth groove of the transmission gear (65). The surface of the dial wheel (64) is fixedly connected with a ratchet (66). The surface of the shielding clamp (43) is fixedly connected to a positioning shaft (67), and the surface of the positioning shaft (67) is rotatably connected to a top pin (68). The top pin (68) is inserted into the tooth groove of the ratchet (66). The surface of the assembly frame (42) is fixedly connected to a load-bearing plate (69), and the surface of the load-bearing plate (69) is fixedly connected to a limit spring (610). The limit spring (610) is fixedly connected to the surface of the top pin (68).

9. The multi-module compatible server carrier board based on selective welding and low-temperature adaptive technology according to claim 8, characterized in that: One side of the dial (64) is located inside the storage cavity. There are two ratchet wheels (66). The two ratchet wheels (66) are arranged symmetrically about the vertical axis of the dial (64). The tooth grooves of the ratchet wheels (66) face clockwise.

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