UV-curable solventless hot melt adhesive comprising UV-crosslinkable poly (meth) acrylates and radiation-curable radically polymerizable compounds
CN120769894APending Publication Date: 2025-10-10BASF SE
Patent Information
- Application Number
- CN202480014942.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-02-27
- Filing Date
- 2024-02-21
- Publication Date
- 2025-10-10
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Abstract
A UV curable solvoless hot melt adhesive is described, the UV curable solvoless hot melt adhesive comprising a UV cross-linkable poly (meth) acrylate and a radiation curable free radical polymerizable compound. The UV-crosslinkable poly (meth) acrylate is formed from an alkyl (meth) acrylate having 8 carbon atoms in an alkyl group, a monomer comprising at least one acid group, and a copolymerizable photoinitiator monomer, and the UV-crosslinkable poly (meth) acrylate has a specific zero viscosity at 130 DEG C and a specific weight average molecular weight prior to crosslinking. The ultraviolet curable solventless hot melt adhesives may be used to make pressure sensitive self-adhesive articles such as, for example, pressure sensitive adhesive tapes, pressure sensitive adhesive films, and pressure sensitive adhesive labels.
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Citation Information
Patent Citations
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