Spindle posture regulation method and system, and thinning machine

Abstract

The application discloses a spindle posture regulation method, a system and a thinning machine. The spindle posture regulation method comprises the following steps: obtaining a fullness and a concave-convex degree that a wafer is required to reach; determining a first adjustment parameter of a posture adjustment mechanism connected to a first position of a support disc of a spindle according to the concave-convex degree; adjusting the posture adjustment mechanism connected to the first position according to the first adjustment parameter; determining a second adjustment parameter of a posture adjustment mechanism connected to a second position of the support disc and a compensation parameter of the posture adjustment mechanism connected to the first position according to the fullness; and adjusting the posture adjustment mechanism connected to the second position according to the second adjustment parameter and adjusting the posture adjustment mechanism connected to the first position according to the compensation parameter. The method of the application connects multiple posture adjustment mechanisms to the spindle, and when wafer processing with specific fullness and concave-convex degree is required, the posture of the spindle can be automatically adjusted by the posture adjustment mechanisms to meet the actual processing needs, and manual debugging is not required.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and in particular to spindle posture control methods, systems and thinning machines. Background Technology

[0002] Thinning machines are equipment used for processing semiconductor devices such as wafers.

[0003] The spindle is one of the main components of a thinning machine. During thinning, the spindle is usually longitudinally mounted on a structure that drives its translation and lifting. Of course, some existing technologies also have the ability to adjust the spindle's pitch and yaw. For example, the invention patent with authorization announcement number CN116749073B discloses a structure with corresponding functions.

[0004] In some special scenarios, such as the attached Figure 1 As shown, the surface shape of the wafer after processing needs to meet certain requirements for unevenness and fullness.

[0005] The existing structure can only be adjusted manually, which is cumbersome and difficult.

[0006] At the same time, whether the spindle is kept in a longitudinal position for machining or at a certain tilt angle for machining, it is required that the spindle's posture does not deviate significantly during machining in order to avoid affecting the thinning quality.

[0007] However, existing technologies lack the relevant techniques for real-time online detection of the spindle's attitude during operation.

[0008] At the same time, when an abnormality is found in the spindle's posture, manual adjustment is required, as there is a lack of technology for automatic adjustment based on detection. Summary of the Invention

[0009] The purpose of this invention is to solve the above-mentioned problems existing in the prior art and to provide a spindle attitude control method, system and thinning machine.

[0010] The objective of this invention is achieved through the following technical solution: The spindle attitude control method includes the following steps: S10, to obtain the desired fullness and unevenness of the wafer; S20, determine the first adjustment parameter of the attitude adjustment mechanism at the first position of the support plate connected to the main shaft according to the concavity and convexity. S30, adjust the attitude adjustment mechanism connected to the first position of the support plate according to the first adjustment parameter; S40, determine the second adjustment parameter of the attitude adjustment mechanism connected to the second position of the support plate and the compensation parameter of the attitude adjustment mechanism connected to the first position of the support plate according to the fullness. S50, adjust the attitude adjustment mechanism connected to the second position of the support plate according to the second adjustment parameter and adjust the attitude adjustment mechanism connected to the first position of the support plate according to the compensation parameter.

[0011] Preferably, the attitude adjustment mechanism includes a driver fixed above the support plate of the main shaft, the driver being connected to the adjustment shaft via a coupling, the adjustment shaft being rotatably connected to the support plate of the main shaft via a bearing, and the adjustment shaft being threadedly connected to a fixing plate. Alternatively, the attitude adjustment mechanism includes a driver fixed above a support plate on the main shaft. The driver is torque-connected to an adjustment shaft via a coupling. The adjustment shaft extends axially along the main shaft and is movable axially relative to the coupling. The adjustment shaft is threadedly connected to an adjustment sleeve fixed on the support plate. The adjustment shaft is also threadedly connected to a fixed sleeve fixed on a fixed plate. The pitch of the first threaded region connecting the adjustment shaft and the adjustment sleeve is smaller than the pitch of the second threaded region connecting the adjustment shaft and the fixed sleeve.

[0012] Preferably, the support plate and the fixing plate are further connected by support bolts; the support bolts provide an adjustment space of 5-10 microns between the support plate and the fixing plate.

[0013] Preferably, a support bolt is provided on both sides of each adjustment shaft, and the detection sensor is an annular pressure sensor sleeved on the locking screw.

[0014] Preferably, the edge of the grinding wheel on the main shaft passes through the center of the wafer, and the third position of the support disk is connected to the attitude adjustment mechanism or the support rod. The first position, the second position and the third position are evenly distributed on the support disk. The line connecting the second position and the third position is perpendicular to the line connecting the center of the wafer and the intersection of the edge of the grinding wheel and the edge of the wafer. The first adjustment parameter is determined according to the following formula: ; in, It is the first adjustment parameter. It is the radius of the grinding wheel connected to the main shaft; It refers to the degree of concavity or convexity; It is the radius of the wafer.

[0015] Preferably, the second adjustment parameter is determined according to the following formula: ; in, It is the second adjustment parameter; It is the radius of the wafer; It's about fullness. It is the radius of the grinding wheel connected to the main shaft; The compensation parameters are determined according to the following formula. ; in, The compensation parameter is 'a', which is an empirical coefficient.

[0016] The spindle attitude control method includes the following steps: S1, acquire signals from the detection sensor used to detect the spindle's attitude in real time; S2, determine whether the posture of the spindle meets the requirements based on the signal from the detection sensor; S3, when it is determined that the spindle's posture does not meet the requirements, the posture of the spindle is adjusted to meet the requirements through a set of posture adjustment mechanisms connected around the spindle.

[0017] The spindle attitude control system includes: The control data acquisition unit is used to acquire the fullness and unevenness of the wafer to be achieved; The first parameter determination unit is used to determine the first adjustment parameter of the attitude adjustment mechanism of the support plate connected to the main shaft at the first position according to the concavity and convexity. The first adjustment unit is used to adjust the attitude adjustment mechanism connected to the first position of the support plate according to the first adjustment parameter. The second parameter determination unit is used to determine the second adjustment parameter of the attitude adjustment mechanism connected to the second position of the support plate and the compensation parameter of the attitude adjustment mechanism connected to the first position of the support plate based on the fullness. The second adjustment unit is used to adjust the attitude adjustment mechanism connected to the second position of the support plate according to the second adjustment parameter and to adjust the attitude adjustment mechanism connected to the first position of the support plate according to the compensation parameter.

[0018] The thinning machine includes a processor and a memory, the memory storing a program that can be executed by the processor, the program implementing the spindle attitude control method as described above when executed.

[0019] The thinning machine includes a spindle and control device, and also includes: A detection sensor is used to acquire the data required to determine the orientation of the spindle; A set of attitude adjustment mechanisms are connected to the spindle and distributed in a polygonal pattern on the outer periphery of the spindle. Their drivers are all connected to a control device. The control device controls the automatic adjustment drivers according to the detection signal of the detection sensor to make the attitude of the spindle meet the requirements. A mounting plate is used to install the attitude adjustment mechanism.

[0020] The advantages of the technical solution of this invention are mainly reflected in: The method of the present invention connects the spindle to multiple attitude adjustment mechanisms, so that when wafer processing requires specific fullness and unevenness, the attitude of the spindle can be automatically adjusted by the attitude adjustment mechanisms to meet the actual processing needs, without the need for manual adjustment, and with high precision and high efficiency.

[0021] The method of the present invention uses a detection sensor to detect the spindle's posture in real time. When it is determined that the spindle's posture does not meet the requirements, the posture of the spindle is adjusted by multiple adjustment devices connected to the spindle. This effectively realizes real-time online detection and automatic adjustment of the spindle's posture, which helps to ensure the desired machining quality.

[0022] The attitude adjustment mechanism of the present invention can flexibly adjust the attitude of the spindle to meet different processing requirements. When automatic adjustment is possible, the adjustment shaft is threadedly connected to the fixing sleeve on the fixing plate, which can ensure the connection stability between the adjustment shaft and the fixing plate, and help reduce the error of the adjustment shaft itself. Moreover, the fixing plate provides support, so there is no need to put pressure on the motor and other components. At the same time, it can provide reliable support for the spindle, thereby helping to ensure the overall structural stability and adjustment accuracy.

[0023] The present invention further provides support bolts that can provide additional support to the spindle, thereby reducing the stress on the adjustment shaft and minimizing changes in the spindle's posture. Attached Figure Description

[0024] Figure 1 This is a schematic diagram illustrating the unevenness and fullness that a wafer needs to achieve, as described in the background section. Figure 2 This is a side view of the main shaft of the present invention connected to the fixed plate via an attitude adjustment mechanism; Figure 3 yes Figure 2 A magnified view of a portion of the image; Figure 4 This is a cross-sectional view of the main shaft of the present invention connected to the fixed plate via the attitude adjustment mechanism; Figure 5 This is a schematic diagram of the spindle attitude control method according to Embodiment 1 of the present invention; Figure 6 This is a schematic diagram of the coordinate system established based on the characteristic parameters of the wafer's unevenness and fullness in this invention. Figure 7 This is a schematic diagram of the swing angle in this invention; Figure 8 This is a schematic diagram of the swing angle of the present invention; Figure 9 The swing angle and the attitude adjustment mechanism connected to the first position and the second position in this invention; Figure 10 This is a schematic diagram of the spindle attitude control method of the present invention. Detailed Implementation

[0025] The objectives, advantages, and features of this invention will be illustrated and explained through the following non-limiting description of preferred embodiments. These embodiments are merely typical examples of applying the technical solutions of this invention, and all technical solutions formed by equivalent substitutions or equivalent transformations fall within the scope of protection claimed by this invention.

[0026] In the description of the solution, it should be noted that the terms "center," "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience and simplification of description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0027] Example 1 The spindle attitude control method disclosed in this invention will be described below with reference to the accompanying drawings. The method is based on a thinning machine, as shown in the attached drawings. Figure 2 As shown, similar to existing thinning machines, it includes a main shaft 100 and a control device (not shown in the figure). This invention further improves upon existing thinning machines by including: The detection sensor 300 is used to acquire the data required to determine the attitude of the spindle 100; A set of attitude adjustment mechanisms 500 are connected to the spindle 100 and distributed in a polygonal pattern on the outer periphery of the spindle 100. Their drivers 510 are all connected to a control device. The control device controls the automatic adjustment drivers 510 according to the detection signal of the detection sensor 300 so that the attitude of the spindle 100 meets the requirements. A fixed plate 700 is used to install the attitude adjustment mechanism 500. The fixed plate 700 is an annular plate. The main shaft 100 passes through the fixed plate. The fixed plate 700 is connected to the moving drive structure in the thinning machine used to drive the main shaft 100 to translate and move up and down.

[0028] The number of attitude adjustment mechanisms 500 can be designed as needed, preferably three, and the three attitude adjustment mechanisms 500 are evenly distributed around the outer periphery of the main shaft 100. Of course, one of the three attitude adjustment mechanisms 500 can also be replaced by a support rod.

[0029] The specific structure of the attitude adjustment mechanism 500 can be configured as needed. In one feasible embodiment, the attitude adjustment mechanism 500 can be a device capable of linear movement, such as an electric cylinder or a hydraulic cylinder, which is fixed on the fixed plate 700 and connected to the bottom of the support plate 110 of the spindle 100. However, in this structure, the telescopic rod of the electric cylinder or hydraulic cylinder will bear the weight of the spindle 100. If the axis of the spindle 100 is not kept vertical, the force on the telescopic rod at different positions will be uneven, which may lead to deformation of the telescopic rod. This will not only affect the attitude of the spindle 100, but may even cause the electric cylinder or hydraulic cylinder to malfunction.

[0030] In a preferred embodiment, the attitude adjustment mechanism 500 includes a driver 510 fixed above a support disk 110 of the main spindle 100. The driver 510 can be a known geared motor, and it is fixed to the support disk 110 via a motor frame 520. The driver 510 is torsionally connected to an adjustment shaft 540 via a coupling 530. The adjustment shaft 540 is rotatably connected to the support disk 110 of the main spindle 100 via bearings, and passes through the support disk 110 and is threadedly connected to the fixing plate 700. During adjustment, the driver 510 drives the adjustment shaft 540 to rotate, thereby moving the adjustment shaft 540 up and down relative to the fixing plate 700, which in turn moves the corresponding position of the support disk 110 connected to the adjustment shaft 540 up and down. However, when bearings are used to connect the adjustment shaft 540 and the support disk 110, the relative position between the adjustment shaft 540 and the support disk 110 is prone to error, which will affect the attitude and adjustment accuracy of the main spindle 100.

[0031] In a more preferred embodiment, as shown in the appendix Figure 3 , attached Figure 4As shown, the attitude adjustment mechanism 500 includes a driver 510 fixed above the support plate 110 of the main shaft 100. The driver 510 can be a known geared motor or a combination of a separate motor and a geared motor. The driver is fixed to the support plate 110 of the main shaft via a motor frame 520. The driver 510 is torque-transmittingly connected to the adjustment shaft 540 via a coupling 530. The adjustment shaft 540 extends axially along the main shaft 100 and can move axially relative to the coupling 530. That is, the upper end of the adjustment shaft 540 is inserted into the slot of the coupling 530 and can move along the slot. The slot and the upper end of the adjustment shaft 540 are shaped to match, for example, a square or hexagonal shape that can achieve torque transmission.

[0032] The adjusting shaft 540 is threadedly connected to the adjusting sleeve 550 on the support plate 110. The adjusting sleeve 550 includes a concentric tube 551 and a support ring 552. The tube 551 has a threaded hole for connecting the adjusting shaft 540 and can be fixed in the through hole of the support plate 110 by interference fit. Of course, this is not necessary. It can also be fixedly connected to the support plate by the support ring 552. The support ring 552 can be connected to the support plate by screws. The outer diameter of the support ring 552 is larger than the outer diameter of the tube 551 and it is close to the bottom of the support plate 110 to support the support plate 110.

[0033] The adjusting shaft 540 passes through the adjusting sleeve 550 and is threadedly connected to the fixing sleeve 560 fixed on the fixing plate 700. The fixing sleeve 560 includes a sleeve body 561 and an upper end plate 562. The sleeve body 561 has a threaded hole for connecting the adjusting shaft 540, and its outer wall has external threads. The sleeve body 561 is inserted into the connecting hole on the fixing plate 700 and fixed on the fixing plate 700 by a locking nut 570 connected to the external threads and the upper end plate 562.

[0034] The pitch of the first threaded region connecting the adjusting shaft 540 and the adjusting sleeve 550 is less than the pitch of the second threaded region connecting the adjusting shaft 540 and the fixed sleeve 560. Through the differential thread, the adjusting shaft can achieve a larger rotation amplitude to obtain a smaller movement distance of the adjusting sleeve, thereby improving the adjustment accuracy.

[0035] The fixed plate 700 remains stationary. When the driver 510 drives the adjusting shaft 540 to rotate, the adjusting shaft 540 moves up and down relative to the fixed plate 700. At the same time, the adjusting sleeve moves up and down along the adjusting shaft 540. Since the pitch of the first threaded area and the second threaded area are different and the thread directions are opposite, the up and down movement distance of the adjusting shaft 540 is different from that of the adjusting sleeve. Therefore, the height of the adjusting sleeve can be adjusted, thereby realizing the height adjustment of the corresponding position of the support plate 110.

[0036] The detection sensor 300 can be made of different devices as needed. In one embodiment, the detection sensor 300 can be a tilt sensor disposed on the spindle 100. In this case, the tilt sensor can be disposed at any position on the spindle 100, preferably disposed at the top center of the spindle 100.

[0037] In another embodiment, the detection sensor 300 may be a group of force sensors or distance sensors fixed between a fixing plate 700 for mounting the attitude adjustment mechanism 500 and a support plate 110.

[0038] Furthermore, to better support and limit the spindle 100, the support plate 110 and the fixing plate 700 are connected by support bolts 900. The fixing plate 700 has threaded holes matching the support bolts 900, which extend upwards from the bottom of the fixing plate 700 and are threaded to the bottom of the support plate 110. Additionally, one support bolt 900 is provided on each side of each adjustment shaft 540. The support bolts 900 are not fully tightened, allowing for a 5-10 mm adjustment space between the support plate 110 and the fixing plate 700. This satisfies the actual needs of spindle posture adjustment while effectively improving support and safety. Alternatively, during operation, when spindle posture adjustment is required, an alarm can be triggered to manually unlock the support bolts 900 from the support plate. Then, the posture adjustment mechanism will automatically adjust the spindle, and once adjusted, the support bolts will be locked back to the support plate.

[0039] Furthermore, in order to facilitate the installation and positioning of the detection sensor 300, the detection sensor 300 is preferably an annular pressure sensor, and each annular pressure sensor is sleeved on the locking screw on one side of an adjustment shaft.

[0040] During normal thinning, the spindle is kept in a vertical position (its axis extends vertically) for grinding. After adjustment, the spindle is confirmed to be in a vertical position when the pressure values ​​measured by the three detection sensors are the same. When processing wafers with special surface shapes, the desired fullness and unevenness of the wafer are manually entered. The attitude adjustment mechanism can then be used to adjust the spindle according to the determined fullness and unevenness. Furthermore, before adjustment, it is necessary to first determine whether the spindle is in a vertical position. If the spindle is not in a vertical position, it can be adjusted to a vertical position using the attitude adjustment mechanism.

[0041] As attached Figure 5 As shown, the spindle attitude control method based on the above structure includes the following steps: S10, to obtain the desired fullness and unevenness of the wafer; S20, determine the first adjustment parameter of the attitude adjustment mechanism at the first position of the support plate connected to the main shaft according to the concavity and convexity. S30, adjust the attitude adjustment mechanism connected to the first position of the support plate according to the first adjustment parameter; S40, determine the second adjustment parameter of the attitude adjustment mechanism connected to the second position of the support plate and the compensation parameter of the attitude adjustment mechanism connected to the first position of the support plate according to the fullness. S50, adjust the attitude adjustment mechanism connected to the second position of the support plate according to the second adjustment parameter and adjust the attitude adjustment mechanism connected to the first position of the support plate according to the compensation parameter.

[0042] As attached Figure 6 -Appendix Figure 9 As shown, the coordinate system established for the characteristic parameters of the wafer surface's unevenness and fullness is based on the wafer center O as the origin, the intersection of the wafer and the edge of the grinding wheel as point M, the line connecting point M and the origin as the E2 axis, the line perpendicular to the E2 axis and passing through the origin as the E1 axis, and the line perpendicular to both the E2 and E1 axes as the Z-axis. In this coordinate system, the relative angle between the grinding wheel axis and the wafer axis can be represented by two angles: the oscillation angle around the E1 axis (the angle between the grinding wheel axis and the wafer axis in the E2OZ plane) and the oscillation angle around the E2 axis (the angle between the grinding wheel axis and the wafer axis in the E1OZ plane).

[0043] The edge of the grinding wheel passes through the center of the wafer. At the same time, the adjustment shafts of the three attitude adjustment mechanisms are connected to the first position F1, the second position F2 and the third position F3 of the support plate. The first position F1, the second position F2 and the third position F3 are evenly distributed at 120° and correspond to the edge position of the grinding wheel. The line connecting the second position F2 and the third position F3 is parallel to the E1 axis.

[0044] Based on spatial relationships, the following relationship exists: (1); (2); in, It is the first adjustment parameter; It is the second adjustment parameter; It refers to the degree of concavity or convexity; It's about fullness, R S R is the radius of the grinding wheel. W R is the radius of the wafer. The unevenness and fullness can be measured on compliant wafers and stored in the system. S R is the radius of the grinding wheel. W The radius of the wafer can also be measured and stored in the system beforehand. During calculation, the corresponding parameters are read and substituted into the calculation.

[0045] From equations (1) and (2) above, it can be seen that when the radius of the wafer remains unchanged, the unevenness is determined by the position of the adjustment shaft of the attitude adjustment mechanism connected to the first position F1 of the support disk. Therefore, when the spindle is kept in a longitudinal position, adjusting the adjustment shaft of the attitude adjustment mechanism connected to the first position F1 according to the unevenness can meet the corresponding unevenness requirements. Correspondingly, the first adjustment parameter is determined according to the following formula: .

[0046] The fullness is determined by the adjustment amount of the two adjustment axes of the two attitude adjustment mechanisms connected to the first position F1 and the second position F2 of the support plate. Therefore, when the main shaft is kept in the longitudinal position, the adjustment amount of the adjustment axis of the attitude adjustment mechanism connected to the second position F2 is the second adjustment parameter, which is determined according to the following formula: .

[0047] The adjustment amount of the adjustment axis of the attitude adjustment mechanism connected to the first position F1, i.e., the compensation parameter, is determined according to the following formula: ;in, As a compensation parameter, 'a' is an empirical coefficient, and its specific value can be set according to actual experience. For example, 'a' can be between 0.15 and 0.2.

[0048] Example 2 This embodiment discloses a spindle attitude control system, including: The control data acquisition unit is used to acquire the fullness and unevenness of the wafer to be achieved; The first parameter determination unit is used to determine the first adjustment parameter of the attitude adjustment mechanism of the support plate connected to the main shaft at the first position according to the concavity and convexity. The first adjustment unit is used to adjust the attitude adjustment mechanism connected to the first position of the support plate according to the first adjustment parameter. The second parameter determination unit is used to determine the second adjustment parameter of the attitude adjustment mechanism connected to the second position of the support plate and the compensation parameter of the attitude adjustment mechanism connected to the first position of the support plate based on the fullness. The second adjustment unit is used to adjust the attitude adjustment mechanism connected to the second position of the support plate according to the second adjustment parameter and to adjust the attitude adjustment mechanism connected to the first position of the support plate according to the compensation parameter.

[0049] Example 3 This embodiment discloses a method for controlling the attitude of a spindle, as shown in the attached figure. Figure 10 As shown, it includes the following steps: S1, Real-time acquisition of the detection signal from the detection sensor 300 used to detect the attitude of the spindle 100; S2, determine whether the posture of the spindle 100 meets the requirements based on the detection signal of the detection sensor 300; S3, when it is determined that the posture of the spindle 100 does not meet the requirements, adjust a set of posture adjustment mechanisms 500 connected around the spindle 100 until the posture of the spindle 100 meets the requirements based on the detection signal of the detection sensor 300.

[0050] For example, during thinning, the spindle 100 is kept in a longitudinal position. When the spindle 100 is in a longitudinal position, the three detection sensors 300 will measure the same force or distance, or the difference will be within a certain threshold range. In this case, the posture of the spindle 100 meets the requirements. If the forces or distances measured by the three detection sensors 300 are different, or the differences between any two exceed the threshold range, it can be determined that the posture of the spindle 100 does not meet the requirements. Furthermore, the tilt direction and the posture adjustment mechanism 500 that needs to be adjusted can be determined based on the magnitude of the forces or distances measured by the three detection sensors 300. (See attached diagram) Figure 2As shown, assuming the force measured by the detection sensor 300 corresponding to the right attitude adjustment mechanism 500 is greater than the force measured by the other two detection sensors 300, or the distance measured by the right detection sensor 300 is less than the distance measured by the other two detection sensors 300, it indicates that the connection position between the right attitude adjustment mechanism 500 and the support plate 110 is lower than the connection position between the other two attitude adjustment mechanisms 500 and the support plate 110. At this time, the right attitude adjustment mechanism can be started and its adjustment sleeve 550 can be finely adjusted upward. During adjustment, the driver can be controlled by a fixed adjustment distance. In addition, during the adjustment process, the signal of the three detection sensors is used to determine whether the adjustment is in place. If the force or distance measured by the three detection sensors 300 is equal or the difference between each pair returns to the threshold range, the adjustment is considered to be in place and the adjustment is stopped.

[0051] During the adjustment process, if the distance measured by the corresponding detection sensor of the right attitude adjustment mechanism is greater than the distance measured by other detection sensors, or the force measured by the corresponding detection sensor of the right attitude adjustment mechanism is less than the force measured by other detection sensors, the adjustment of the right attitude adjustment mechanism can be stopped, and the attitude adjustment mechanism corresponding to the detection sensor with the largest real-time force or the smallest distance can be adjusted instead.

[0052] Example 4 This embodiment discloses a spindle attitude control system, including: The signal acquisition unit is used to acquire the detection signal from the detection sensor 300 used to detect the attitude of the spindle 100 in real time. An attitude determination unit is used to determine whether the attitude of the spindle 100 meets the requirements based on the detection signal from the detection sensor 300. An adjustment unit is used to adjust a set of attitude adjustment mechanisms 500 connected around the spindle 100 when it is determined that the attitude of the spindle 100 does not meet the requirements, until the attitude of the spindle 100 meets the requirements based on the detection signal of the detection sensor 300.

[0053] Example 5 This embodiment discloses a thinning machine, including a processor and a memory. The memory stores a program that can be executed by the processor. When the program is executed, it implements the spindle attitude control method as described above. This invention has many other embodiments, and all technical solutions formed by equivalent transformation or equivalent transformation fall within the protection scope of this invention.

Claims

1. A spindle attitude control method, based on a thinning machine, the thinning machine comprising a spindle and a control device, characterized in that, The thinning machine also includes: A detection sensor is used to acquire the data required to determine the orientation of the spindle; A set of attitude adjustment mechanisms are connected to the spindle and distributed in a polygonal pattern on the outer periphery of the spindle. Their drivers are all connected to a control device. The control device controls the automatically adjusting drivers according to the detection signal of the detection sensor to make the attitude of the spindle meet the requirements. The attitude adjustment mechanism includes a driver fixed above the support plate of the main shaft. The driver is connected to the adjustment shaft via a coupling. The adjustment shaft is rotatably connected to the support plate of the main shaft via a bearing. The adjustment shaft is threadedly connected to a fixing plate. Alternatively, the attitude adjustment mechanism may include a driver fixed above a support plate on the main shaft. The driver is torsionally connected to an adjustment shaft via a coupling. The adjustment shaft extends axially along the main shaft and is movable axially relative to the coupling. The adjustment shaft is threadedly connected to an adjustment sleeve fixed on the support plate. The adjustment shaft is also threadedly connected to a fixed sleeve fixed on a fixed plate. The pitch of the first threaded region connecting the adjustment shaft and the adjustment sleeve is smaller than the pitch of the second threaded region connecting the adjustment shaft and the fixed sleeve. A fixed plate is used to install the attitude adjustment mechanism. The fixed plate is an annular plate. The main shaft passes through the fixed plate. The fixed plate is connected to a moving drive structure in the thinning machine used to drive the main shaft to translate and move up and down. The spindle attitude control method includes the following steps: S10, to obtain the desired fullness and unevenness of the wafer; S20, determine the first adjustment parameter of the attitude adjustment mechanism at the first position of the support plate connected to the main shaft according to the concavity and convexity. S30, adjust the attitude adjustment mechanism connected to the first position of the support plate according to the first adjustment parameter; S40, determine the second adjustment parameter of the attitude adjustment mechanism connected to the second position of the support plate and the compensation parameter of the attitude adjustment mechanism connected to the first position of the support plate according to the fullness. S50, adjust the attitude adjustment mechanism connected to the second position of the support plate according to the second adjustment parameter and adjust the attitude adjustment mechanism connected to the first position of the support plate according to the compensation parameter; The edge of the grinding wheel on the main shaft passes through the center of the wafer. The third position of the support plate is connected to the attitude adjustment mechanism or the support rod. The first position, the second position and the third position are evenly distributed on the support plate. The line connecting the second position and the third position is perpendicular to the line connecting the center of the wafer and the intersection of the edge of the grinding wheel and the edge of the wafer. The first adjustment parameter is determined according to the following formula: ； in, It is the first adjustment parameter. It is the radius of the grinding wheel connected to the main shaft; It refers to the degree of concavity or convexity; It is the radius of the wafer; The second adjustment parameter is determined according to the following formula: ； in, It is the second adjustment parameter; It is the radius of the wafer; It's about fullness. It is the radius of the grinding wheel connected to the main shaft; The compensation parameters are determined according to the following formula. ； in, The compensation parameter is 'a', which is an empirical coefficient.

2. The spindle attitude control method according to claim 1, characterized in that: The support plate and the fixed plate are also connected by support bolts; the support bolts provide an adjustment space of 5-10 microns between the support plate and the fixed plate.

3. The spindle attitude control method according to claim 2, characterized in that: Each of the adjustment shafts is provided with a support bolt on both sides, and the detection sensor is an annular pressure sensor sleeved on the locking screw.

4. The spindle attitude control method according to claim 3, characterized in that, The spindle attitude control method includes the following steps: S1, acquire signals from the detection sensor used to detect the spindle's attitude in real time; S2, determine whether the posture of the spindle meets the requirements based on the signal from the detection sensor; S3, when it is determined that the spindle's posture does not meet the requirements, the posture of the spindle is adjusted to meet the requirements through a set of posture adjustment mechanisms connected around the spindle.

5. A spindle attitude control system, characterized in that, Used to implement the spindle attitude control method as described in any one of claims 1-4.

6. A thinning machine, comprising a processor and a memory, wherein the memory stores a program executable by the processor, characterized in that: When the program is executed, it implements the spindle attitude control method as described in any one of claims 1-4.

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