一种超精密蓝宝石晶体光学基板的加工方法

By optimizing the processing method of sapphire crystal optical substrates through rapid grinding and polishing, annealing, acid etching, flexible polishing and ion beam shaping, the problems of long processing cycle and low surface accuracy are solved, the processing efficiency and optical quality are improved, and it is suitable for high-end applications.

CN120772952BActive Publication Date: 2026-07-17SUZHOU LEIN OPTICAL TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SUZHOU LEIN OPTICAL TECHNOLOGY CO LTD
Filing Date
2025-08-29
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Existing methods for processing ultra-precision sapphire crystal optical substrates suffer from problems such as long processing cycles, difficulty in improving surface accuracy, deterioration of surface roughness after ion beam shaping, and surface distortion of square substrates, which affect optical quality, especially in high-end applications.

Method used

Rapid grinding and polishing combined with high-temperature precision annealing and acid etching processes are used to eliminate mechanical stress. Then, flexible disc polishing and ring polishing replication processes are used to improve surface shape accuracy. Finally, ion beam local shaping and chemical mechanical polishing are used to improve surface roughness.

Benefits of technology

It significantly improves the processing efficiency and surface accuracy of sapphire substrates, improves surface roughness, solves the shortcomings of existing technologies that make it difficult to balance efficiency and accuracy, improves optical quality, and is suitable for high-end fields such as high-power laser systems and semiconductor equipment.

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Abstract

本发明属于精密光学器件加工技术领域,具体涉及一种超精密蓝宝石晶体光学基板的加工方法。针对现有技术不足及蓝宝石晶体加工难点,提出优化方案:以快速研磨抛光提升效率;通过高温精密退火与酸蚀,消除快速加工产生的机械应力、材料结构应力及亚表面损伤;经柔性胶盘古典抛光修整面形,结合环抛复制工艺提升面形精度;用离子束局部修形消除古典方法残留面形误差,最后抛光改善离子束修形后的表面粗糙度。该方法融合现代快速加工与古典精细控制,保障面形稳定,平衡精度与粗糙度,解决效率、精度、质量难兼顾问题,改善基板畸变,提升光学质量,适配高功率激光、半导体设备等高端应用场景。
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Citation Information

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