Electroplating apparatus and electroplating method

Abstract

The application provides a kind of electroplating device and electroplating method, the electroplating device of the embodiment of the application includes first storage plate assembly, second storage plate assembly, electroplating assembly, transfer assembly and control assembly, wherein, first storage plate assembly has first storage site, and first storage site is used to store circuit board;Second storage plate assembly has second storage site, and second storage site is used to store accompanying plating plate;Electroplating assembly has multiple electroplating sites, and electroplating site is used to place circuit board or accompanying plating plate, so as to electroplate circuit board and accompanying plating plate;Transfer assembly is used to transfer circuit board from first storage site to electroplating site;Control assembly is used to determine whether electroplating site is full hanging, and is used to control transfer assembly to transfer accompanying plating plate to electroplating site when electroplating site is not full hanging, and accompanying plating plate is adjacent to the circuit board located at the end position.The electroplating device of the embodiment of the application can greatly improve the intelligent degree of the process of increasing accompanying plating plate in circuit board electroplating process.

Description

Technical Field

[0001] This invention relates to the field of circuit board processing technology, and in particular to an electroplating apparatus and an electroplating method. Background Technology

[0002] Electroplating is a crucial process in circuit board manufacturing, connecting chips and circuit boards. As the first surface coating to come into contact with solder during the soldering process, the uniformity of the electroplating layer's thickness directly affects the reliability of the solder joint.

[0003] During the early processing of the substrate, some waste is generated. When the substrates from the same batch of production reach the electroplating process, the number of boards cannot meet the requirements for full plating of the electroplating components. This means that there is a problem of incomplete plating. If electroplating is carried out without full plating, the ratio of anode to cathode (substrate) will increase, resulting in uneven distribution of electric field lines during the electroplating process. This will reduce the uniformity of the electroplating layer thickness. Therefore, when the substrate is not fully plating, additional plating boards are added to improve the uniformity of the electroplating layer thickness.

[0004] The relevant technologies usually involve manual judgment to determine whether there is a problem of insufficient coating, and adding additional coating plates when insufficient coating is found, but this method has too low a level of intelligence.

[0005] Therefore, the method of adding a plating plate in related technologies suffers from a low level of intelligence. Summary of the Invention

[0006] This invention provides an electroplating apparatus to address the problem of low intelligence in the method of adding plating plates in related technologies, thereby improving the intelligence level of the method of adding plating plates.

[0007] The electroplating apparatus of this invention includes: A first board storage assembly, the first board storage assembly having a first storage position, the first storage position being used to store a circuit board; The second plate storage assembly has a second storage position for storing the plating plate; An electroplating assembly having multiple electroplating positions; A transfer component, the transfer component being used to transfer the circuit board from the first storage location to the electroplating location; A control component is provided, which is used to determine whether the electroplating position is fully loaded, and when the electroplating position is not fully loaded, the control component is used to control the transfer component to transfer the plating plate to the electroplating position, wherein the plating plate is disposed adjacent to the circuit board located at the last position.

[0008] It is understandable that "fully loaded" means that all the electroplating positions of the electroplating component are filled with circuit boards, while "not fully loaded" means that not all the electroplating positions of the electroplating component are filled with circuit boards, i.e., there are empty positions where no circuit boards are placed.

[0009] It is understandable that there are usually multiple circuit boards that need to be electroplated in the same batch. Before electroplating, multiple circuit boards are stored in the first storage position. The transfer component will transfer multiple circuit boards to the electroplating position of the electroplating component in sequence. At the same time, the circuit boards will also be placed in the electroplating position in a preset order, that is, there will be no empty space between adjacent circuit boards.

[0010] Therefore, when the number of circuit boards in the same batch is less than the number of electroplating positions of the electroplating assembly, there will be empty electroplating positions in the electroplating assembly. The control assembly can control the transfer assembly to transfer the plating board to the electroplating position through a signal connection with the transfer assembly. The plating board is set adjacent to the circuit board located at the last position. In other words, the control assembly controls the transfer assembly to transfer the plating board to the electroplating position of the adjacent circuit board located at the last position. During the electroplating process, it can avoid the increase of the ratio of anode to cathode (substrate), which would lead to uneven distribution of electric field lines during the electroplating process, thereby improving the uniformity of the electroplating layer thickness.

[0011] At the same time, the control component can determine whether the electroplating component is fully loaded, and when the electroplating component is not fully loaded, it can move the plating plate to the electroplating position of the adjacent circuit board located at the end, which greatly improves the intelligence level of the process of adding plating plates in the circuit board electroplating process.

[0012] Therefore, the electroplating apparatus of this invention can greatly improve the level of intelligence in the process of adding a plating plate in the electroplating process of circuit boards.

[0013] In some embodiments, the control component includes: The detection module is used to detect the number of circuit boards stored in the first storage location and to detect whether the first storage location contains the circuit boards. The control module determines whether the electroplating position is fully loaded based on the relationship between the number of circuit boards stored in the first storage position and the number of electroplating positions.

[0014] In some embodiments, the electroplating apparatus of the present invention further includes an electroplating generation module, which is used to generate a current for electroplating the circuit board; The control module controls the current generated by the electroplating module based on the relationship between the number of circuit boards stored in the first storage position and the number of electroplating positions.

[0015] In some embodiments, the electroplating assembly includes a plurality of electroplating racks having a plurality of electroplating positions, wherein each electroplating rack has the same number of electroplating positions.

[0016] In some embodiments, the detection module includes a CCD camera, which is positioned adjacent to the first storage location.

[0017] The present invention also provides an electroplating method.

[0018] The electroplating method of this invention includes the following steps: Step S100: Use the control component to determine whether the electroplating position is fully loaded; Step S200: If the electroplating position is not fully loaded, the control component controls the transfer component to transfer the plating plate to the electroplating position. The plating plate is arranged adjacent to the circuit board located at the last position.

[0019] It is understandable that there are usually multiple circuit boards that need to be electroplated in the same batch. Before electroplating, multiple circuit boards are stored in the first storage position. The transfer component will transfer multiple circuit boards to the electroplating position of the electroplating component in sequence. At the same time, the circuit boards will also be placed in the electroplating position in a preset order, that is, there will be no empty space between adjacent circuit boards.

[0020] Therefore, when the number of circuit boards in the same batch is less than the number of electroplating positions of the electroplating assembly, there will be empty electroplating positions in the electroplating assembly. The control assembly can control the transfer assembly to transfer the plating board to the electroplating position through a signal connection with the transfer assembly. The plating board is set adjacent to the circuit board located at the last position. In other words, the control assembly controls the transfer assembly to transfer the plating board to the electroplating position of the adjacent circuit board located at the last position. During the electroplating process, it can avoid the increase of the ratio of anode to cathode (substrate), which would lead to uneven distribution of electric field lines during the electroplating process, thereby improving the uniformity of the electroplating layer thickness.

[0021] At the same time, the control component can determine whether the electroplating component is fully loaded, and when the electroplating component is not fully loaded, it can move the plating plate to the electroplating position of the adjacent circuit board located at the end, which greatly improves the intelligence level of the process of adding plating plates in the circuit board electroplating process.

[0022] Therefore, the electroplating method of this invention can greatly improve the level of intelligence in the process of adding a plating plate in the electroplating process of circuit boards.

[0023] In some embodiments, in step S100, the detection module is used to collect the number of circuit boards stored in the first storage position; the control module is used to determine whether the electroplating position is fully loaded based on the relationship between the number of circuit boards stored in the first storage position and the number of electroplating positions.

[0024] In some embodiments, in step S100, the control module determines whether the number of circuit boards stored in the first storage position is less than the number of electroplating positions of the electroplating assembly, and determines whether the electroplating position is fully loaded.

[0025] In some embodiments, in step S100, the circuit board in the first storage position is transferred to the electroplating position using the transfer component, and the number of circuit boards stored in the first storage position is detected using the detection module. When the detection module detects that the first storage position does not store any circuit boards, it transmits the number of circuit boards stored in the first storage position detected to the control module.

[0026] In some embodiments, the electroplating method of the present invention further includes S300: using a control module to determine the number of empty electroplating positions based on the number of circuit boards stored in the first storage position and the number of electroplating positions of the electroplating component, and controlling the current generated by the electroplating generation module based on the size of the number of empty positions. Attached Figure Description

[0027] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the structure of an embodiment of the present invention.

[0029] In the picture: 100. Electroplating equipment; 1. First storage board assembly; 101. First storage location; 2. Second storage board assembly; 201. Second storage location; 3. Electroplating components; 301. Electroplating station; 302. Electroplating rack; 4. Transfer components; 5. Control components; 501. Detection module; 502. Control module; 6. Electroplating generation module; 7. Circuit board; 8. Plating plate. Detailed Implementation

[0030] To make the technical problems solved, the technical solutions, and the beneficial effects of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0031] In the description of this invention, it should be understood that the terms "longitudinal," "radial," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0032] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal encapsulation of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0033] To address the problem of low intelligence in the method of adding a plating plate 8 in related technologies, the present invention provides an electroplating device 100.

[0034] The electroplating apparatus 100 of this embodiment includes a first storage plate assembly 1, a second storage plate assembly 2, an electroplating assembly 3, a transfer assembly 4, and a control assembly 5. The first storage board assembly 1 has a first storage position 101, which is used to store the circuit board 7. The second storage plate assembly 2 has a second storage position 201, which is used to store the plating plate 8; The electroplating assembly 3 has multiple electroplating positions 301, which are used to place the circuit board 7 or the plating plate 8 to facilitate electroplating of the electroplating plate and the plating plate 8. Transfer component 4 is used to transfer circuit board 7 from first storage position 101 to electroplating position 301; It is understood that the transfer component 4 can be a robotic arm used to transfer the circuit board 7 from the first storage position 101 to the electroplating position 301, and at the same time, it can also transfer the plating substrate 8 from the second storage position 201 to the plating position. Specifically, the transfer component 4 can also be other components capable of performing the above-mentioned transfer actions, and can be set according to the actual transfer requirements.

[0035] The control component 5 is used to determine whether the electroplating position 301 is fully loaded, and when the electroplating position 301 is not fully loaded, it controls the transfer component 4 to transfer the plating plate 8 to the electroplating position 301. The plating plate 8 is arranged adjacent to the circuit board 7 located at the end position.

[0036] It is understandable that "fully loaded" means that all the electroplating positions 301 of the electroplating component 3 are filled with circuit boards 7, while "not fully loaded" means that not all the electroplating positions 301 of the electroplating component 3 are filled with circuit boards 7, that is, there are empty positions where circuit boards 7 are not placed.

[0037] It is understandable that there are usually multiple circuit boards 7 that need to be electroplated in the same batch. Before electroplating, multiple circuit boards 7 are stored in the first storage position 101. The transfer component 4 will transfer multiple circuit boards 7 to the electroplating position 301 of the electroplating component 3 in sequence. At the same time, the circuit boards 7 will also be placed on the electroplating position 301 in a preset order, that is, there will be no empty space between adjacent circuit boards 7.

[0038] Therefore, when the number of circuit boards 7 in the same batch is less than the number of electroplating positions 301 of the electroplating assembly 3, there will be empty positions in the electroplating positions 301 of the electroplating assembly 3. The control assembly 5 can control the transfer assembly 4 to transfer the plating plate 8 to the electroplating position 301 through a signal connection with the transfer assembly 4. The plating plate 8 is arranged adjacent to the last circuit board 7. That is to say, the control assembly 5 controls the transfer assembly 4 to transfer the plating plate 8 to the electroplating position 301 of the adjacent last circuit board 7. During the electroplating process, the ratio of anode to cathode (substrate) can be increased, which can lead to uneven distribution of electric field lines during the electroplating process, thereby improving the uniformity of the electroplating layer thickness.

[0039] Meanwhile, the control component 5 can determine whether the electroplating component 3 is fully loaded, and when the electroplating component 3 is not fully loaded, it can move the plating plate 8 to the electroplating position 301 of the adjacent circuit board 7, which greatly improves the intelligence level of the process of adding plating plate 8 in the electroplating process of circuit board 7.

[0040] Therefore, the electroplating apparatus 100 of this embodiment can greatly improve the intelligence level of the process of adding a plating plate 8 in the electroplating process of the circuit board 7.

[0041] In some embodiments, the control component 5 includes a detection module 501 and a control module 502. The detection module 501 is used to detect the number of circuit boards 7 stored in the first storage position 101 and to detect whether the first storage position 101 contains circuit boards 7. That is, the detection module 501 can detect the number of circuit boards 7 stored in the first storage position 101 based on whether the first storage position 101 contains circuit boards 7.

[0042] The control module 502 determines whether the electroplating position 301 is fully loaded based on the relationship between the number of circuit boards 7 stored in the storage position and the number of electroplating positions 301.

[0043] After the circuit boards 7 to be electroplated in the same batch are transferred to the first storage position 101, the detection module 501 can detect the number of circuit boards 7 stored in the first storage position 101. The detection module 501 transmits the number of circuit boards 7 stored in the first storage position 101 to the control module 502 through a signal connection with the control module 502. After receiving the data, the control module 502 compares the number of circuit boards 7 stored in the first storage position 101 with the number of electroplating positions 301 of the electroplating component 3. If the number of circuit boards 7 stored in the first storage position 101 is less than the number of electroplating positions 301 of the electroplating component 3, it can be determined that the electroplating positions 301 of the electroplating component 3 are not fully loaded. If the number of circuit boards 7 stored in the first storage position 101 is equal to the number of electroplating positions 301 of the electroplating component 3, it can be determined that the electroplating positions 301 of the electroplating component 3 are fully loaded.

[0044] Optionally, the control module 502 can be an electronic device such as a microprocessor, PLC, or CPU that can process data and control the actions of corresponding devices.

[0045] Optionally, the detection module 501 is a CCD camera, which is located adjacent to the first storage position 101. Specifically, the CCD camera can count the circuit boards 7 in the first storage position 101 during the process of the transfer component 4 transferring the circuit boards 7 in the first storage position 101 to the electroplating position 301. That is, when the transfer component 4 transfers one circuit board 7 from the first storage position 101, the CCD camera counts one based on the image information it has acquired. This process is repeated until the CCD camera detects that there are no circuit boards 7 in the first storage position 101. At the same time, the CCD camera transfers the number of circuit boards 7 it has acquired in the first storage position 101 to the control module 502.

[0046] It is understandable that, in order to facilitate counting by CCD cameras, microprocessors and other data processing modules can be integrated inside CCD cameras, enabling them to count based on the image information they acquire.

[0047] In some embodiments, the electroplating apparatus 100 of the present invention further includes an electroplating generation module 6, which is used to generate a current for electroplating the circuit board 7. The control module 502 controls the current generated by the electroplating generation module 6 based on the relationship between the number of circuit boards 7 stored in the storage position and the number of electroplating positions 301. In other words, the control module 502 controls the current generated by the electroplating generation module 6 through a signal connection with the electroplating generation module 6.

[0048] As mentioned above, if the number of circuit boards 7 stored in the first storage position 101 is less than the number of electroplating positions 301 of the electroplating component 3, it can be determined that the electroplating positions 301 of the electroplating component 3 are not fully loaded.

[0049] Furthermore, the control module 502 can determine the number of empty spaces where no circuit board 7 is placed based on the difference between the number of circuit boards 7 stored in the first storage space 101 and the number of electroplating spaces 301 in the electroplating component 3, and then control the current generated by the electroplating generation module 6 based on the number of empty spaces.

[0050] In some embodiments, the electroplating assembly 3 includes a plurality of electroplating racks 302, each electroplating rack 302 having a plurality of electroplating positions 301, and each electroplating rack 302 having the same number of electroplating positions 301.

[0051] Furthermore, multiple electroplating racks 302 can be arranged in a way that allows the transfer assembly 4 to place the circuit board 7 on the electroplating position 301. At the same time, the number of electroplating positions 301 in each electroplating rack 302 is set to be the same, so that the control module 502 can determine whether the electroplating position 301 of the electroplating assembly 3 is fully loaded by whether the number of circuit boards 7 stored in the first storage position 101 is divisible by the number of electroplating positions 301 in a single electroplating rack 302.

[0052] If the number of circuit boards 7 stored in the first storage position 101 is not divisible by the number of electroplating positions 301 of a single electroplating rack 302, it is determined that the electroplating positions 301 of the electroplating assembly 3 are not fully loaded. If the number of circuit boards 7 stored in the first storage position 101 is divisible by the number of electroplating positions 301 of a single electroplating rack 302, it is determined that the electroplating positions 301 of the electroplating assembly 3 are fully loaded.

[0053] The present invention also provides an electroplating method.

[0054] The electroplating method of this invention includes the following steps: Step S100: Use control component 5 to determine whether electroplating position 301 is fully loaded; Step S200: If the electroplating position 301 is not fully loaded, the control component 5 controls the transfer component 4 to transfer the plating plate 8 to the electroplating position 301. The plating plate 8 is set adjacent to the circuit board 7 located at the last position.

[0055] It is understandable that there are usually multiple circuit boards 7 that need to be electroplated in the same batch. Before electroplating, multiple circuit boards 7 are stored in the first storage position 101. The transfer component 4 will transfer multiple circuit boards 7 to the electroplating position 301 of the electroplating component 3 in sequence. At the same time, the circuit boards 7 will also be placed on the electroplating position 301 in a preset order, that is, there will be no empty space between adjacent circuit boards 7.

[0056] Therefore, when the number of circuit boards 7 in the same batch is less than the number of electroplating positions 301 of the electroplating assembly 3, there will be empty positions in the electroplating positions 301 of the electroplating assembly 3. The control assembly 5 can control the transfer assembly 4 to transfer the plating plate 8 to the electroplating position 301 through a signal connection with the transfer assembly 4. The plating plate 8 is arranged adjacent to the last circuit board 7. That is to say, the control assembly 5 controls the transfer assembly 4 to transfer the plating plate 8 to the electroplating position 301 of the adjacent last circuit board 7. During the electroplating process, the ratio of anode to cathode (substrate) can be increased, which can lead to uneven distribution of electric field lines during the electroplating process, thereby improving the uniformity of the electroplating layer thickness.

[0057] Meanwhile, the control component 5 can determine whether the electroplating component 3 is fully loaded, and when the electroplating component 3 is not fully loaded, it can move the plating plate 8 to the electroplating position 301 of the adjacent circuit board 7, which greatly improves the intelligence level of the process of adding plating plate 8 in the electroplating process of circuit board 7.

[0058] Therefore, the electroplating method of this invention can greatly improve the intelligence level of the process of adding a plating plate 8 in the electroplating process of circuit board 7.

[0059] In some embodiments, in step S100, the detection module 501 collects the number of circuit boards 7 stored in the storage position and detects whether the first storage position 101 contains circuit boards 7; the control module 502 determines whether the electroplating position 301 is fully loaded based on the relationship between the number of circuit boards 7 stored in the storage position and the number of electroplating positions 301.

[0060] After the same batch of circuit boards 7 that need to be electroplated are transferred to the first storage position 101, the detection module 501 can detect the number of circuit boards 7 stored in the first storage position 101. The detection module 501 transmits the number of circuit boards 7 detected in the first storage position 101 to the control module 502 through a signal connection with the control module 502. After receiving the data, the control module 502 determines whether the electroplating position 301 is fully loaded based on the relationship between the number of circuit boards 7 stored in the storage position and the number of electroplating positions 301.

[0061] Furthermore, in step S100, the control module 502 can be used to determine whether the number of circuit boards 7 stored in the first storage position 101 is less than the number of electroplating positions 301 of the electroplating component 3, and whether the electroplating positions 301 are fully loaded.

[0062] After receiving the number of circuit boards 7 stored in the first storage position 101, the control module 502 compares the number of circuit boards 7 stored in the first storage position 101 with the number of electroplating positions 301 of the electroplating component 3. If the number of circuit boards 7 stored in the first storage position 101 is less than the number of electroplating positions 301 of the electroplating component 3, it can be determined that the electroplating positions 301 of the electroplating component 3 are not fully loaded. If the number of circuit boards 7 stored in the first storage position 101 is equal to the number of electroplating positions 301 of the electroplating component 3, it can be determined that the electroplating positions 301 of the electroplating component 3 are fully loaded.

[0063] In some embodiments, in step S100, the circuit board 7 in the first storage position 101 can be transferred to the electroplating position 301 using the transfer component. At the same time, the detection module 501 detects the number of circuit boards 7 stored in the storage position during this process. When the detection module 501 detects that the first storage position 101 does not store any circuit boards 7, it transmits the number of circuit boards 7 it has detected stored in the storage position to the control module 502.

[0064] For example, the detection module 501 is set as a CCD camera, and the CCD camera is positioned adjacent to the first storage position 101. Specifically, the CCD camera can count the circuit boards 7 in the first storage position 101 during the process of the transfer component 4 transferring the circuit boards 7 in the first storage position 101 to the electroplating position 301. That is, when the transfer component 4 transfers one circuit board 7 from the first storage position 101, the CCD camera counts one based on the image information it has acquired. This process is repeated until the CCD camera detects that there are no circuit boards 7 in the first storage position 101. At the same time, the CCD camera transfers the number of circuit boards 7 it has acquired in the first storage position 101 to the control module 502.

[0065] Understandably, to facilitate counting in CCD cameras, microprocessors and other data processing modules can be integrated inside the camera, enabling it to count based on the image information it acquires. In some embodiments, the electroplating method of the present invention further includes S400: using the control module 502 to determine the number of empty electroplating positions 301 based on the number of circuit boards 7 stored in the first storage position 101 and the number of electroplating positions 301 of the electroplating component 3, and controlling the current generated by the electroplating generation module 6 according to the number of empty positions.

[0066] Furthermore, the control module 502 can determine the number of empty spaces where no circuit board 7 is placed based on the difference between the number of circuit boards 7 stored in the first storage space 101 and the number of electroplating spaces 301 in the electroplating component 3. Then, it controls the current generated by the electroplating generation module 6 based on the number of empty spaces. This enables the electroplating generation module 6 to provide a suitable current during the electroplating process of the circuit board 7, thereby greatly improving the electroplating effect of the circuit board 7 and also improving the intelligence of circuit size control during the electroplating process.

[0067] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. An electroplating apparatus, characterized in that, include: The first storage board assembly (1) has a first storage position (101) for storing a circuit board (7). The second storage plate assembly (2) has a second storage position (201) for storing the plating plate (8); Electroplating assembly (3) having a plurality of electroplating sites (301); Transfer component (4), the transfer component (4) is used to transfer the circuit board (7) from the first storage position (101) to the electroplating position (301). Control component (5), the control component (5) is used to determine whether the electroplating position (301) is fully loaded, and the control component (5) is used to control the transfer component (4) to transfer the plating plate (8) to the electroplating position (301) when the electroplating position (301) is not fully loaded. The plating plate (8) is arranged adjacent to the circuit board (7) located at the end. The control component (5) includes: The detection module (501) is used to detect the number of circuit boards (7) stored in the first storage position and to detect whether the first storage position (101) contains the circuit boards (7). The detection module (501) includes a CCD camera, which is located adjacent to the first storage position (101). The control module (502) determines whether the electroplating position (301) is fully loaded based on the relationship between the number of circuit boards (7) stored in the first storage position and the number of electroplating positions (301). The electroplating apparatus further includes an electroplating generation module (6), which is used to generate a current for electroplating the circuit board (7); The control module (502) controls the current generated by the electroplating generation module (6) according to the relationship between the number of circuit boards (7) stored in the first storage position (101) and the number of electroplating positions (301).

2. The electroplating apparatus according to claim 1, characterized in that, The electroplating assembly (3) includes a plurality of electroplating racks (302), each electroplating rack (302) having a plurality of electroplating positions (301), and each electroplating rack (302) having the same number of electroplating positions (301).

3. An electroplating method using the electroplating apparatus as described in any one of claims 1-2, characterized in that, Includes the following steps: Step S100: Use the control component (5) to determine whether the electroplating position (301) is fully loaded; Step S200: If the electroplating position (301) is not fully loaded, the control component (5) controls the transfer component (4) to transfer the plating plate (8) to the electroplating position (301). The plating plate (8) is arranged adjacent to the circuit board (7) located at the end.

4. The electroplating method according to claim 3, characterized in that, In step S100, the detection module (501) collects the number of circuit boards (7) stored in the first storage position (101); the control module (502) determines whether the electroplating position (301) is fully loaded based on the relationship between the number of circuit boards (7) stored in the first storage position (101) and the number of electroplating positions (301).

5. The electroplating method according to claim 3, characterized in that, In step S100, the control module (502) determines whether the number of circuit boards (7) stored in the first storage position (101) is less than the number of electroplating positions (301) of the electroplating component (3) and determines whether the electroplating position (301) is fully loaded.

6. The electroplating method according to claim 3, characterized in that, In step S100, the circuit board (7) in the first storage position (101) is transferred to the electroplating position (301) using the transfer component (4). At the same time, the detection module (501) detects the number of circuit boards (7) stored in the first storage position (101). When the detection module (501) detects that the first storage position (101) does not store the circuit board (7), it transmits the number of circuit boards (7) stored in the first storage position (101) to the control module (502).

7. The electroplating method according to claim 3, characterized in that, It also includes S300: using the control module (502) to determine the number of empty electroplating positions (301) based on the number of circuit boards (7) stored in the first storage position (101) and the number of electroplating positions (301) of the electroplating component (3), and controlling the current generated by the electroplating generation module (6) according to the size of the number of empty positions.

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