A vacuum adsorption film peeling platform for warped wafers

Abstract

This invention relates to the field of wafer processing technology and provides a vacuum adsorption and film removal platform for warped wafers. The platform includes an elastic suction cup, an edge vacuum adsorption groove, a warped suction cup body, and a vacuum shut-off valve. The elastic suction cup is mounted on the warped suction cup body and is used for adaptive initial adsorption based on the warped shape of the wafer. The edge vacuum adsorption groove is located on the warped suction cup body near the edge of the wafer and is used for a second adsorption of the wafer edge when the film removal mechanism presses the wafer. The warped suction cup body is equipped with a vacuum air source. This invention's warped wafer adsorption platform uses an elastic suction cup for vacuum adsorption. The elastic suction cup can adaptively deform according to the warped shape of the wafer. When the warped wafer is placed on the platform, the elastic suction cup quickly conforms to the uneven contours of the wafer surface, forming a good sealing space, effectively preventing vacuum leakage and ensuring the wafer remains stable throughout the operation.

Description

Technical Field

[0001] This invention relates to the field of wafer processing technology, and more specifically to a vacuum adsorption film-peeling platform for warped wafers. Background Technology

[0002] In the semiconductor manufacturing industry, wafer processing precision plays a decisive role in product quality, with wafer film removal being one of the key processes. Traditional film removal platforms, when handling warped wafers, are prone to vacuum leakage due to the adsorption method employed, which is ill-suited to the wafer's warped shape. Once vacuum leakage occurs, the wafer will shift during subsequent operations. Furthermore, in the edge film removal stage, the wafer edge is forcefully pulled up by the film removal tape, leading to process defects, increasing the risk of wafer breakage, and severely impacting semiconductor product yield and production efficiency. This also results in raw material waste and increased production costs. Therefore, this application is hereby submitted. Summary of the Invention

[0003] This application proposes a vacuum adsorption film removal platform for warped wafers to solve the problem of vacuum leakage in existing technologies. Once vacuum leakage occurs, the wafer will move during subsequent operations, and during the edge film removal process, the wafer edge will be strongly pulled up by the film removal tape, leading to process defects and increasing the risk of wafer breakage. The above-mentioned technical objective of this invention is achieved through the following technical solution:

[0004] To achieve the above objectives, the technical solution adopted by the present invention is: a warped wafer vacuum adsorption film removal platform, comprising an elastic suction cup, an edge vacuum adsorption groove, a warped suction cup body, and a vacuum shut-off valve. The elastic suction cup is mounted on the warped suction cup body and is used for adaptive first adsorption according to the warped shape of the wafer. The edge vacuum adsorption groove is opened at the position of the warped suction cup body near the edge of the wafer and is used for second adsorption of the wafer edge when the film removal mechanism presses the wafer. The warped suction cup body is provided with a vacuum air source, and the vacuum air source is dispersed into two paths that are respectively connected to the elastic suction cup and the edge vacuum adsorption groove. The vacuum shut-off valve is located in the middle of the two vacuum air paths that are dispersed from the one vacuum air source, corresponding to the elastic suction cup and the edge vacuum adsorption groove respectively.

[0005] The elastic suction cups are arranged in two circles, with the outermost circle of elastic suction cups located near the edge of the warped suction cup body. The edge vacuum adsorption groove is located adjacent to the outermost circle of elastic suction cups.

[0006] The spacing between two adjacent elastic suction cups is equal, and the spacing ranges from 5 to 10 mm;

[0007] The edge vacuum adsorption groove has a groove depth of 0.5-1.5mm and a groove width of 1-3mm;

[0008] The number of elastic suction cups in the outer ring is 22-26, and the number of elastic suction cups in the inner ring is 10-14.

[0009] The elastic suction cup and the warped suction cup body are connected by a detachable snap-fit ​​structure;

[0010] Both vacuum circuits are equipped with vacuum pressure sensors;

[0011] The surface of the warped suction cup body is provided with an anti-slip coating;

[0012] The elastic suction cup is made of silicone.

[0013] The above-described technical solutions in the embodiments of the present invention have at least the following technical effects or advantages:

[0014] The warped wafer adsorption platform of the present invention uses an elastic suction cup for vacuum adsorption. The elastic suction cup can adaptively deform according to the warped shape of the wafer. When the warped wafer is placed on the platform, the elastic suction cup quickly conforms to the concave and convex contours of the wafer surface, forming a good sealed space, effectively avoiding the occurrence of vacuum leakage, ensuring that the wafer remains stable during the operation and will not move due to weak adsorption, greatly improving the reliability and stability of adsorption.

[0015] By designing a secondary vacuum adsorption device, namely the edge vacuum adsorption groove, at the wafer edge, the problem of wafer edges being pulled up by the tape during film removal in existing technologies is effectively solved. In the process, the elastic suction cup first completes the first adsorption of the entire wafer. When the film removal mechanism presses the wafer, the vacuum in the edge vacuum adsorption groove is quickly opened to achieve a second adsorption of the wafer edge. By setting up double vacuum adsorption, a strong and uniform adsorption force is formed at the wafer edge, keeping the wafer edge fixed in a fixed state during the film removal process. This eliminates the risk of being pulled up by the film removal tape, effectively avoiding product defects and wafer breakage caused by edge lifting, and significantly improving product process quality and yield. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure provided for an embodiment of the present invention;

[0018] Figure 2 This is a schematic diagram of the structure of a vacuum shut-off valve provided in an embodiment of the present invention.

[0019] In the diagram: 1. Elastic suction cup; 2. Edge vacuum adsorption groove; 3. Warped suction cup body; 4. Vacuum shut-off valve. Detailed Implementation

[0020] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0021] In the description of this invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0022] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0023] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0024] Please see the appendix Figures 1-2An embodiment of a vacuum adsorption film-tearing platform for warped wafers includes an elastic suction cup 1, an edge vacuum adsorption groove 2, a warped suction cup body 3, and a vacuum shut-off valve 4. The elastic suction cup 1 is mounted on the warped suction cup body 3 and is used for adaptive first adsorption according to the warped shape of the wafer. The edge vacuum adsorption groove 2 is located on the warped suction cup body 3 near the edge of the wafer and is used for second adsorption of the wafer edge when the film-tearing mechanism presses the wafer. The warped suction cup body 3 is provided with a vacuum air source, which is distributed into two paths that are respectively connected to the elastic suction cup 1 and the edge vacuum adsorption groove 2. The vacuum shut-off valve 4 is located in the middle of the two vacuum air paths distributed from the one vacuum air source, corresponding to the elastic suction cup 1 and the edge vacuum adsorption groove 2.

[0025] Using the above technical solution, when the warped wafer is placed on the warped suction cup body 3, the operator opens the vacuum shut-off valve 4 through the control system, opening the vacuum path to the elastic suction cup 1. Because the elastic suction cup 1 has a certain degree of flexibility and adaptability, it will make full contact with the warped wafer surface. Furthermore, the arrangement of multiple elastic suction cups 1 can adapt to wafers of different shapes, thus fixing them. As the vacuum path is opened, a negative pressure is formed inside the elastic suction cup 1, using atmospheric pressure to initially adsorb and fix the wafer on the platform. At this time, the vacuum shut-off valve 4 controls the vacuum path to the edge vacuum adsorption tank 2 to be closed. When the film-peeling mechanism moves above the wafer and presses it firmly, the control system issues another command to control the vacuum shut-off valve 4 to open the vacuum path to the edge vacuum adsorption tank 2. A negative pressure is formed inside the edge vacuum adsorption tank 2, performing secondary adsorption on the wafer edge. By using this step-by-step adsorption method, the wafer as a whole is first fixed by the adaptive adsorption of the elastic suction cup 1, and then the edge vacuum adsorption groove 2 is used to strengthen the fixation of the wafer edge, ensuring that the wafer remains stable during the film removal process and will not move or be pulled up by the film removal tape due to weak adsorption.

[0026] The elastic suction cups 1 are arranged in two circles. The outermost circle of elastic suction cups is located near the edge of the warped suction cup body 3, and the edge vacuum adsorption groove 2 is located adjacent to the outermost circle of elastic suction cups 1.

[0027] Using the above technical solution, when adsorbing a warped wafer, the two rings of elastic suction cups 1 work together. When the wafer is placed on the warped suction cup body 3, the inner ring of elastic suction cups 1 first contacts the central area of ​​the wafer, using its own elasticity to adapt to the warped shape of the central area of ​​the wafer, and fixes the central area of ​​the wafer through vacuum adsorption. At the same time, the outer ring of elastic suction cups 1 fits against the edge area of ​​the wafer, and similarly fixes the edge of the wafer through vacuum adsorption. Since the outer ring of elastic suction cups 1 is distributed near the edge, and the edge vacuum adsorption groove 2 is set close to it, when a second adsorption is performed, the edge vacuum adsorption groove 2 is opened, forming a strong negative pressure area near the edge of the wafer. At this time, the outer ring of elastic suction cups 1 and the edge vacuum adsorption groove 2 form a superimposed adsorption force field at the edge of the wafer, so that the edge of the wafer is subjected to a stronger and more uniform adsorption force. This layout not only effectively fixes the wafer edge, preventing it from being pulled up during the film removal process, but also achieves stable adsorption on the entire wafer surface through the cooperation of the inner and outer ring elastic suction cups, improving the adaptability of the adsorption platform to wafers with different degrees of warpage.

[0028] The spacing between two adjacent elastic suction cups 1 is equal, and the spacing ranges from 5 to 10 mm.

[0029] The uniform spacing in the above technical solution ensures a uniform distribution of the adsorption force of the elastic chucks 1 on the wafer surface. When the vacuum system is activated and negative pressure is formed inside each elastic chuck 1, the distribution of the adsorption force points on the wafer surface is relatively uniform due to the consistent spacing between adjacent elastic chucks 1. Uneven spacing may lead to excessively strong adsorption forces in some areas of the wafer surface, causing local deformation or even damage; while other areas may have insufficient adsorption forces, failing to effectively fix the wafer and causing it to move during operation. By setting a spacing range of 5-10mm, it is possible to ensure that each elastic chuck 1 has sufficient adsorption area to contact the wafer surface, guaranteeing the strength of the adsorption force, while also allowing the adsorption forces between adjacent elastic chucks 1 to complement and synergize, forming a stable and uniform adsorption force field. This ensures that the wafer experiences balanced forces throughout the adsorption process, maintaining good flatness and stability, and providing a reliable foundation for subsequent film removal operations. The depth of the edge vacuum adsorption groove 2 is 0.5-1.5mm, and the width is 1-3mm.

[0030] Using the above technical solution, when the vacuum shut-off valve 4 opens the vacuum path to the edge vacuum adsorption tank 2, air is quickly extracted from the tank, creating a negative pressure environment. The tank depth is set at 0.5-1.5mm, which can create a highly efficient vacuum area within the tank. If the tank depth is too shallow, air cannot be fully expelled, failing to create sufficient negative pressure, resulting in insufficient adsorption force. If the tank depth is too deep, the air expulsion path becomes longer, increasing the evacuation time and affecting adsorption efficiency. A tank width within the range of 1-3mm ensures a suitable contact area between the wafer edge and the adsorption tank, allowing the adsorption force to be evenly distributed across the wafer edge. This ensures that all parts of the wafer edge receive similar and stable adsorption force, avoiding problems such as wafer edge deformation and lifting due to localized adsorption force differences. This guarantees the stability and integrity of the wafer edge during the film removal process, thereby improving the quality and success rate of the film removal operation.

[0031] The outer ring has 22-26 elastic suction cups, and the inner ring has 10-14 elastic suction cups.

[0032] The above technical solution employs a reasonable number of elastic suction cups to balance adsorption force and efficiency, adapting to wafers of different sizes and warpage degrees. The outer ring of a larger number of elastic suction cups provides strong and dense adsorption force at the wafer edge, ensuring that the wafer edge is not easily pulled up during the film removal process. The edge area experiences greater tension from the film removal tape during film removal, and the larger number of elastic suction cups can disperse this tension, making the force on the wafer edge more even. The inner ring of 10-14 elastic suction cups focuses on fixing the central area of ​​the wafer. This area is relatively small, and an appropriate number of elastic suction cups can ensure effective adsorption of the central area without causing excessive concentration of adsorption force and deformation of the central part of the wafer due to an excessive number of cups.

[0033] The elastic suction cup 1 and the warp suction cup body 3 are connected by a detachable snap-fit ​​structure.

[0034] By adopting the above technical solution, during long-term operation of the equipment, the elastic chuck 1 will inevitably experience wear and aging due to frequent contact with the wafer, vacuum pressure, and elastic deformation, resulting in a decrease in adsorption performance. When it is necessary to replace the elastic chuck 1, this detachable connection method enables the rapid replacement of the elastic chuck 1 without affecting other components and the overall structure of the warp chuck body 3, which greatly shortens the downtime of the equipment and improves the efficiency of the equipment.

[0035] Both vacuum circuits are equipped with vacuum pressure sensors.

[0036] Using the above technical solution, the vacuum pressure sensor monitors the vacuum pressure changes in the vacuum paths corresponding to the elastic suction cup 1 and the edge vacuum adsorption tank 2 in real time. At the beginning of the adsorption operation, when the elastic suction cup 1 performs its first adsorption, the vacuum pressure sensor transmits the real-time vacuum pressure data in the vacuum path of the elastic suction cup 1 to the control system. The control system compares the received data with the preset standard pressure range. If the pressure value is lower than the standard range, it indicates that there may be problems such as air leakage or insufficient pumping. The control system will immediately issue an alarm and automatically adjust the parameters of the vacuum system, such as increasing the pumping power of the vacuum pump to increase the vacuum pressure and ensure that the elastic suction cup 1 effectively adsorbs the wafer. When the edge vacuum adsorption tank 2 performs its second adsorption, the vacuum pressure sensor also monitors its vacuum pressure in real time and feeds the data back to the control system. During the film removal process, if the vacuum pressure fluctuates due to factors such as uneven wafer surface or incomplete sealing, the vacuum pressure sensor can quickly detect the changes and feed the information back to the control system. Based on the feedback information, the control system will adjust the opening and closing degree of the vacuum shut-off valve 4 or the working state of the vacuum pump in a timely manner to keep the vacuum pressure within a suitable range, ensuring that the wafer is always subjected to a stable and sufficient adsorption force throughout the entire film removal process, effectively improving the reliability and stability of the adsorption platform.

[0037] The surface of the warped suction cup body 3 is provided with an anti-slip coating.

[0038] Using the above technical solution, during the process of placing the warped wafer onto the warped suction cup body 3, the wafer is prone to sliding on the platform surface due to its warped shape and the slight shaking that may occur during placement. This not only affects the initial adsorption and positioning of the wafer by the elastic suction cup 1, but may also cause the wafer to shift position and fail to achieve effective adsorption. The anti-slip coating can counteract the wafer's sliding tendency by increasing the friction between the wafer and the surface of the warped suction cup body 3.

[0039] The elastic suction cup 1 is made of silicone.

[0040] Using the above technical solutions, the high elasticity and good flexibility of silicone can ensure that the elastic suction cup 1 deforms rapidly when it comes into contact with the warped wafer, closely conforming to the uneven contours of the wafer surface, thereby forming a good sealing space between the two.

[0041] It should be understood that the specific embodiments described above are merely illustrative or explanatory of the principles of the invention and do not constitute a limitation thereof. Therefore, any modifications, equivalent substitutions, improvements, etc., made without departing from the spirit and scope of the invention should be included within the protection scope of the invention. Furthermore, the appended claims are intended to cover all variations and modifications falling within the scope and boundaries of the appended claims, or equivalent forms of such scope and boundaries.

Claims

1. A vacuum adsorption film-peeling platform for warped wafers, characterized in that, The device includes an elastic suction cup (1), an edge vacuum adsorption groove (2), a warped suction cup body (3), and a vacuum shut-off valve (4). The elastic suction cup (1) is installed on the warped suction cup body (3) and is used for adaptive first adsorption according to the warped shape of the wafer. The edge vacuum adsorption groove (2) is opened on the warped suction cup body (3) near the edge of the wafer and is used for second adsorption of the wafer edge when the wafer is pressed by the film-tearing mechanism. The warped suction cup body (3) is provided with a vacuum air source. The vacuum air source is dispersed into two paths and is connected to the elastic suction cup (1) and the edge vacuum adsorption groove (2) respectively. The vacuum shut-off valve (4) is set in the middle of the two vacuum air paths that are dispersed from the one vacuum air source and correspond to the elastic suction cup (1) and the edge vacuum adsorption groove (2) respectively. The elastic suction cups (1) are arranged in two circles. The outer circle of elastic suction cups (1) is located near the edge of the warped suction cup body (3). The edge vacuum adsorption groove (2) is arranged adjacent to the outer circle of elastic suction cups (1). The spacing between two adjacent elastic suction cups (1) is equal, and the spacing ranges from 5 to 10 mm; The edge vacuum adsorption groove (2) has a groove depth of 0.5-1.5 mm and a groove width of 1-3 mm; The number of elastic suction cups (1) in the outer ring is 22-26, and the number of elastic suction cups (1) in the inner ring is 10-14; The elastic suction cup (1) and the warped suction cup body (3) are connected by a detachable snap-fit ​​structure; Both vacuum circuits are equipped with vacuum pressure sensors; The surface of the warped suction cup body (3) is provided with an anti-slip coating; The elastic suction cup (1) is made of silicone.

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