一种手机套的耐磨测试装置

CN120801083BActive Publication Date: 2026-07-173P M SHENZHEN MFG LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
3P M SHENZHEN MFG LTD
Filing Date
2025-09-12
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

The pressure applied to the surface of the phone case by the abrasive in the existing tumbler test method is uneven, and it is particularly unable to effectively simulate the wear effect of high-frequency contact parts such as cameras and buttons, resulting in poor representativeness of the test results.

Method used

Design a wear resistance testing device for mobile phone cases. The device uses a rotating cylinder to drive a push plate to rotate, and a sliding component moves between the first and second zones at different heights. The push plate is squeezed inside the cylinder to simulate wear performance under different conditions and achieve non-uniform distribution of abrasive pressure.

Benefits of technology

It improves the realism of wear testing on vulnerable parts of phone cases, enhances the wear effect on vulnerable parts, avoids the deviation caused by constant pressure in traditional testing, and simulates the wear performance of phone cases under different usage scenarios.

✦ Generated by Eureka AI based on patent content.

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Abstract

本发明公开了一种手机套的耐磨测试装置,涉及测试设备领域,包括自转的筒体以及从上至下依次连接的推板、滑动件以及突出组件;所述推板卡接在筒体内,所述推板上方在筒体内形成有测试区;所述滑动件与推板以筒体为轴心可旋转设置,且突出组件位于滑动件的旋转路径上,所述突出组件的顶面与底面对应滑动件的旋转路径分别形成有第一区与第二区,且突出组件顶面与滑动件连接;当所述滑动件由第二区位移至第一区时,所述滑动件让推板水平高度升高,且推板挤压测试区,当所述滑动件由第一区位移至第二区时,所述滑动件让推板水平高度降低,且推板令测试区复原。本发明通过对测试区进行挤压,使磨料施加不同的压力在手机壳上,以模拟不同场景。
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