Manufacturing method of package substrate

Abstract

The invention provides a manufacturing method of a package substrate. Specifically, the manufacturing method comprises the following steps: providing a frame substrate with an embedded mouth frame; wherein the frame substrate comprises a first surface and a second surface which are opposite to each other; the embedded opening frame penetrates through the first surface and the second surface; providing a carrier film; wherein the bearing film comprises an uncured glass-fiber-free medium adhesive film and a copper foil bonded on the surface of the glass-fiber-free medium adhesive film; the glass fiber-free medium adhesive film is attached to the first surface of the frame substrate; a component is attached to the portion, in the embedded opening frame, of the non-glass-fiber medium adhesive film; forming a dielectric layer on the second surface of the frame substrate; forming a first circuit layer on the surface of the dielectric layer; and the first circuit layer is connected with a terminal of the component in a conducting manner. A temporary bearing adhesive film is replaced by a glass fiber-free medium adhesive film, and a component is directly attached to the glass fiber-free medium adhesive film, so that the problem of adhesive residue of the temporary bearing adhesive film in the related technology is fundamentally solved.

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