A multi-chip packaging structure and packaging method

Abstract

This invention provides a multi-chip packaging structure and method, relating to the field of semiconductor packaging technology. It includes a substrate with a groove on it. A first chip is flip-chip mounted within the groove. A TVC conversion board is disposed on the first chip and electrically connected to it. A conductive connector is disposed on the TVC conversion board. A second chip is flip-chip mounted on the TVC conversion board and electrically connected to the conductive connector. A third chip is mounted on the second chip and electrically connected to the conductive connector. The conductive connector is electrically connected to the substrate. This invention, by using flip-chip mounted first and second chips, can effectively reduce the number of conductive lines, thereby reducing the probability of conductive lines being broken by the molding compound during encapsulation. By providing the groove, the thickness of the packaging structure can be effectively reduced, lowering the impact strength of the molding compound on the upper chip and solder joints due to gravity and flow inertia. This results in greater practicality and a higher yield rate.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, specifically to a multi-chip packaging structure and packaging method. Background Technology

[0002] Multi-chip packaging is a technology that integrates multiple chips with different functions into the same package. Signal transmission and collaborative operation between chips are achieved through metal interconnects on the packaging substrate. Its packaging forms include 2D packaging with chips arranged side by side, 2.5D packaging based on silicon interposers, and 3D packaging with chips stacked vertically. This technology has advantages such as miniaturization, high-density integration, performance improvement, cost optimization, and high flexibility, and is widely used in consumer electronics such as smartphones, AI chips, ADAS controllers, and edge computing modules, as well as data centers, automotive electronics, and the Internet of Things.

[0003] For example, patent application CN 119133167 A discloses a multi-chip packaging structure, which includes: a packaging substrate on which a first conductive line is arranged; a first chip disposed on the packaging substrate and electrically connected to the packaging substrate through the first conductive line; and a third chip disposed above and electrically connected to the second chip.

[0004] However, the aforementioned patents use a large number of conductive lines to interconnect chips. During the molding process, the flowing molding material will impact the conductive lines, which can easily break the solder joints, leading to chip electrical connection failure and a significant reduction in yield. The vertical stacking structure of three-layer chips significantly increases the overall height of the package. During the molding process, the molding material will have an increased impact on the upper chip and its solder joints due to gravity and flow inertia, further threatening the reliability of the package. Summary of the Invention

[0005] The present invention provides a multi-chip packaging structure and packaging method to solve at least one of the problems mentioned in the background art.

[0006] To address the aforementioned technical problems, this invention discloses a multi-chip packaging structure, including a substrate. A groove is formed on the substrate, and a first chip is flip-chip disposed within the groove. A TVC conversion board is disposed on the first chip and electrically connected to the first chip. A conductive connector is disposed on the TVC conversion board. A second chip is flip-chip disposed on the TVC conversion board and electrically connected to the conductive connector. A third chip is mounted on the second chip and electrically connected to the conductive connector. The conductive connector is electrically connected to the substrate.

[0007] Preferably, the top of the first chip is provided with a number of solder balls, and the first chip is flipped in the groove by the number of solder balls; the TVC conversion board is symmetrically provided with through slots, and conductive connectors are installed in the through slots. Solder blocks are provided on the conductive connectors, and the conductive connectors are electrically connected to the flipped second chip through the solder blocks.

[0008] Preferably, a third chip is mounted on the second chip, and conductive lines are symmetrically arranged on the third chip. The other end of the conductive lines is electrically connected to the solder block. A second conductive line is also arranged on the solder block and is electrically connected to the substrate. A BCB dielectric film is also coated on the TVC conversion board. A molding compound layer is also provided on the substrate.

[0009] Preferably, a packaging method for a multi-chip package structure as described above includes the following steps:

[0010] S1: A groove is formed in the center of the substrate, and the first chip is flip-chip disposed in the groove;

[0011] S2: Install a TVC conversion board on the first chip, symmetrical through slots are opened on the TVC conversion board, and conductive connectors are installed in the through slots;

[0012] S3: A solder block is placed on the conductive connector, and a flip-chip second chip is electrically connected to the solder block;

[0013] S4: Install a third chip on the second chip. The third chip is electrically connected to the solder block via conductive line one; the solder block is electrically connected to the substrate via conductive line two.

[0014] S5: Use a molding device to mold the substrate to form a molding layer covering the first chip, TVC conversion board, second chip and third chip.

[0015] Preferably, the sealing device includes a mounting plate, a storage cylinder is provided on the mounting plate, several support rods are fixedly provided on the lower surface of the mounting plate, a motor is fixedly provided on the upper end of the storage cylinder, a rotating rod is fixedly connected to the lower output end of the motor, the rotating rod rotates and extends into the storage cylinder, the rotating rod is rotatably connected to the lower inner wall of the storage cylinder, a rotating plate is fixedly provided on the rotating rod, and the lower end of the storage cylinder has symmetrically opened discharge ports.

[0016] Preferably, a reciprocating screw is symmetrically rotatably connected to the rotating rod, and a gear is fixedly installed at the other end of the reciprocating screw. An annular toothed plate is fixedly installed on the inner wall of the storage cylinder, and the gear meshes with the annular toothed plate. A moving block is threadedly connected to the reciprocating screw, and a U-shaped scraper is fixedly installed at the lower end of the moving block. The U-shaped scraper cooperates with the rotating plate. An L-shaped scraper is also fixedly installed on the rotating rod, and the L-shaped scraper contacts the inner wall of the storage cylinder.

[0017] Preferably, a discharge pipe is fixedly installed at the discharge port, the discharge pipe passes through the mounting plate, the lower end of the discharge pipe is connected to a corrugated pipe, the lower end of the corrugated pipe is connected to an output pipe, a linear drive is fixedly installed on the lower surface of the mounting plate, the lower output end of the linear drive is fixedly connected to a transfer box, a hollow tube is fixedly installed inside the transfer box, several holes are opened on the hollow tube, the hollow tube extends out of the transfer box, the other end of the output pipe is fixedly connected to the transfer box, a filter screen is installed at the connection between the output pipe and the transfer box, an upper mold assembly is connected to the lower end of the hollow tube, a lower mold assembly is installed on the lower side of the upper mold assembly, a fixing block is installed on the lower side of the mounting plate, and the lower mold assembly is installed on the fixing block.

[0018] Preferably, electric push rods are symmetrically fixed on the mounting plate, and a push rod is fixedly connected to the lower output end of the electric push rod. The push rod slides through the mounting plate, and a U-shaped block is fixedly installed at the lower end of the push rod. The openings of the two U-shaped blocks are opposite each other, and the U-shaped blocks are slidably connected to the support rod.

[0019] Preferably, a cooling box is fixedly installed on one side of the two U-shaped blocks that are close to each other. A drum is rotatably installed inside the cooling box. A torsion spring is installed at the installation position of the drum and the cooling box. An L-shaped connecting rod is installed at the lower end of the U-shaped blocks. A cleaning box is fixedly installed on one side of the L-shaped connecting rod that is close to each other. Scrapers are symmetrically installed on the upper and lower parts of the cleaning box.

[0020] Preferably, an L-shaped connecting rod 2 is also provided at the lower end of the U-shaped block, and a rotating cylinder is rotatably provided on the side of the L-shaped connecting rod 2 that is close to each other; a motor 3 is fixedly provided at one end of the U-shaped block, and a threaded rod is fixedly provided at the output end of the motor 3. The threaded rod is rotatably connected to the U-shaped block, and a movable ring is threadedly connected to the threaded rod. An L-shaped connecting rod 3 is provided on the movable ring, and clamping blocks are installed on the sections of the L-shaped connecting rod 3 that are close to each other.

[0021] Compared with the prior art, the present invention provides a multi-chip packaging structure and packaging method, which has the following beneficial effects: by using a flip-chip first chip and a second chip, the number of conductive lines can be effectively reduced, and the risk of conductive line solder joint breakage and chip electrical connection failure caused by the impact of the molding compound can be reduced; by setting a groove to support the flip-chip first chip, this design allows the chip to be partially embedded in the substrate, significantly compressing the overall thickness of the packaging structure, reducing the impact strength of the molding compound on the upper chip and solder joint due to gravity and flow inertia, enhancing the stability and reliability of the packaging structure, making it more practical and with a higher yield. Attached Figure Description

[0022] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0023] Figure 1 This is a schematic diagram of the packaging structure of the present invention;

[0024] Figure 2 For the present invention Figure 1 Enlarged view of part of the structure;

[0025] Figure 3 This is a schematic diagram of the encapsulation device of the present invention. Figure 1 ;

[0026] Figure 4 This is a schematic diagram of the encapsulation device of the present invention. Figure 2 ;

[0027] Figure 5 This is a schematic diagram of the internal structure of the storage cylinder of the present invention;

[0028] Figure 6 For the present invention Figure 3 Enlarged view of part of the structure;

[0029] Figure 7 This is a top view of the U-shaped block of the present invention;

[0030] Figure 8 For the present invention Figure 7 A partial structural side view.

[0031] In the diagram: 1. Substrate; 2. First chip; 3. Solder ball; 4. Through slot; 5. TVC conversion board; 6. Second chip; 7. Third chip; 8. Conductive wire one; 9. Conductive wire two; 10. BCB dielectric film; 11. Conductive connector; 12. Solder block; 13. Mounting plate; 14. Storage cylinder; 15. Motor one; 16. Electric push rod; 17. Discharge pipe; 18. U-shaped block; 19. Lower mold assembly; 20. Fixing block; 21. Upper mold assembly; 22. Support rod; 23. Push rod; 24. Electric... 25. Cooling box; 26. Rotating rod; 27. Rotating plate; 28. L-shaped scraper; 29. ​​Ring toothed plate; 30. Reciprocating screw; 31. Gear; 32. U-shaped scraper; 33. Linear drive component; 34. Bellows; 35. Output pipe; 36. Filter screen; 37. Hollow tube; 38. Clamping block; 39. L-shaped connecting rod three; 40. Drum; 41. Cleaning box; 42. L-shaped connecting rod one; 43. L-shaped connecting rod two; 44. Moving ring; 45. Threaded rod; 46. Scraper; 47. Rotating drum. Detailed Implementation

[0032] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0033] In the description of this invention, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0034] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0035] Example 1:

[0036] Embodiments of the present invention provide a multi-chip packaging structure, such as Figures 1-8 As shown, the system includes a substrate 1, a groove on the substrate 1, a first chip 2 flip-chip disposed in the groove, a TVC conversion board 5 disposed on the first chip 2, the TVC conversion board 5 being electrically connected to the first chip 2, a conductive connector 11 disposed on the TVC conversion board 5, a second chip 6 flip-chip disposed on the TVC conversion board 5, the second chip 6 being electrically connected to the conductive connector 11, a third chip 7 mounted on the second chip 6, the third chip 7 being electrically connected to the conductive connector 11, and the conductive connector 11 being electrically connected to the substrate 1.

[0037] The working principle and beneficial effects of the above technical solution are as follows: A groove is formed in the center of the substrate 1, a first chip 2 is flip-chip disposed in the groove, a TVC conversion board 5 is mounted on the first chip 2, a conductive connector 11 is mounted on the TVC conversion board 5, and a flip-chip 6 is electrically connected to the conductive connector 11; a third chip 7 is mounted on the second chip 6, the third chip 7 is electrically connected to the conductive connector 11, and the conductive connector 11 is electrically connected to the substrate 1; the substrate 1 is encapsulated using a molding device to form a molding layer covering the first chip 2, the TVC conversion board 5, the second chip 6, and the third chip 7.

[0038] The flip-chip configuration of the first chip 2 and the second chip 6 effectively reduces the number of conductive lines, lowering the risk of solder joint breakage and chip electrical connection failure caused by the impact of the molding compound. By setting a groove to support the flip-chip 2, this design allows the chip to be partially embedded in the substrate, significantly compressing the overall thickness of the package structure, reducing the impact strength of the molding compound on the upper chip and solder joints due to gravity and flow inertia, enhancing the stability and reliability of the package structure, making it more practical and yielding a higher product rate.

[0039] Example 2:

[0040] Based on the above embodiment 1, as follows Figures 1-2 As shown, the top of the first chip 2 is provided with several solder balls 3, and the first chip 2 is flipped in the groove through several solder balls 3; the TVC conversion board 5 is symmetrically provided with through slots 4, and conductive connectors 11 are installed in the through slots 4. Solder blocks 12 are provided on the conductive connectors 11, and the conductive connectors 11 are electrically connected to the flipped second chip 6 through the solder blocks 12.

[0041] Preferably, a third chip 7 is mounted on the second chip 6, and conductive lines 8 are symmetrically arranged on the third chip 7. The other end of the conductive lines 8 is electrically connected to the solder block 12. Conductive lines 9 are also arranged on the solder block 12 and are electrically connected to the substrate 1. A BCB dielectric film 10 is also coated on the TVC conversion board 5. A molding compound is also provided on the substrate 1.

[0042] The beneficial effects of the above technical solution are as follows: by setting the groove, the size of the entire packaging structure can be reduced, the impact strength of the molding compound can be reduced, and the stability of the packaging structure can be enhanced; by setting the solder block 12, the conductive connector 11 can be electrically connected to the third chip 7 through the solder block 12 and the conductive line 8; similarly, the conductive connector 11 can be electrically connected to the substrate 1 through the solder block 12 and the conductive line 9, ensuring the integrity of signal transmission; the BCB dielectric film can effectively improve the heat dissipation effect of the entire structure.

[0043] Example 3:

[0044] This embodiment provides a packaging method for the multi-chip packaging structure described above, including the following steps:

[0045] S1: A groove is formed in the center of the substrate 1, and the first chip 2 is flip-chip disposed in the groove;

[0046] S2: Install TVC conversion board 5 on the first chip 2, and symmetrically open through slots 4 on TVC conversion board 5, and install conductive connectors 11 in the through slots 4;

[0047] S3: A solder block 12 is provided on the conductive connector 11, and a flip-chip second chip 6 is electrically connected to the solder block 12;

[0048] S4: Install a third chip 7 on the second chip 6. The third chip 7 is electrically connected to the solder block 12 through conductive line 8. The solder block 12 is electrically connected to the substrate 1 through conductive line 9.

[0049] S5: The substrate 1 is encapsulated using a molding device to form a molding layer covering the first chip 2, TVC conversion board 5, second chip 6 and third chip 7.

[0050] The working principle and beneficial effects of the above technical solution are as follows: First, a groove is formed in the center of the substrate 1, and a first chip 2 is flip-chip disposed in the groove; Second, a TVC conversion board 5 is mounted on the first chip 2, and through slots 4 are symmetrically opened on the TVC conversion board 5, and conductive connectors 11 are installed in the through slots 4; Third, solder blocks 12 are provided on the conductive connectors 11, and the flip-chip 6 is electrically connected to the solder blocks 12; Fourth, a third chip 7 is mounted on the second chip 6, and the third chip 7 is electrically connected to the solder blocks 12 through conductive wire 8; the solder blocks 12 are electrically connected to the substrate 1 through conductive wire 9; Fifth, the substrate 1 is encapsulated using a molding device to form a molding layer covering the first chip 2, the TVC conversion board 5, the second chip 6, and the third chip 7.

[0051] By using the flip-chip configuration of the first chip 2 and the second chip 6, the number of conductive lines can be effectively reduced, lowering the risk of solder joint breakage and chip electrical connection failure caused by the impact of the molding compound. By setting a groove to support the flip-chip 2, this design allows the chip to be partially embedded in the substrate, significantly compressing the overall thickness of the package structure, reducing the impact strength of the molding compound on the upper chip and solder joints due to gravity and flow inertia, enhancing the stability and reliability of the package structure, making it more practical and with a higher yield.

[0052] Example 4:

[0053] Based on the above embodiment 3, such as Figures 3-5 As shown, the sealing device includes a mounting plate 13, on which a storage cylinder 14 is provided. Several support rods 22 are fixedly provided on the lower surface of the mounting plate 13. A motor 15 is fixedly provided at the upper end of the storage cylinder 14. A rotating rod 26 is fixedly connected to the lower output end of the motor 15. The rotating rod 26 extends rotatably into the storage cylinder 14. The rotating rod 26 is rotatably connected to the lower inner wall of the storage cylinder 14. A rotating plate 27 is fixedly provided on the rotating rod 26. The lower end of the storage cylinder 14 has symmetrically opened discharge ports.

[0054] Preferably, a reciprocating screw 30 is symmetrically rotatably connected to the rotating rod 26, and a gear 31 is fixedly installed at the other end of the reciprocating screw 30. An annular toothed plate 29 is fixedly installed on the inner wall of the storage cylinder 14, and the gear 31 meshes with the annular toothed plate 29. A moving block is threadedly connected to the reciprocating screw 30, and a U-shaped scraper 32 is fixedly installed at the lower end of the moving block. The U-shaped scraper 32 cooperates with the rotating plate 27. An L-shaped scraper 28 is also fixedly installed on the rotating rod 26, and the L-shaped scraper 28 contacts the inner wall of the storage cylinder 14.

[0055] In the molding process, the molding compound is generally epoxy resin, silicone resin, etc., which needs to be melted before injection molding. However, when it enters the temporary storage container, air bubbles are prone to occur, which may eventually lead to poor local heat dissipation. In addition, the molding compound will stick to the inner wall of the container, resulting in loss of molding compound. Furthermore, after molding is completed, the molding layer is at a high temperature, and transferring it at this time may cause personnel injury. Therefore, this molding device is specially designed to effectively solve the above problems.

[0056] The working principle and beneficial effects of the above technical solution are as follows: Starting motor 15 drives rotating rod 26 to rotate, which in turn drives rotating plate 27 to rotate, initially preventing the molding compound from clumping. During the rotation of rotating rod 26, it drives reciprocating screw 30 to revolve. Through the meshing of gear 31 and ring toothed plate 29, gear 31 rotates, driving reciprocating screw 30 to rotate. The moving block on reciprocating screw 30 moves linearly, thereby driving U-shaped scraper 32 to reciprocate and scrape rotating plate 27, removing the molding compound adhering to rotating plate 27 and preventing it from accumulating and solidifying on the surface of rotating plate 27. Furthermore, the L-shaped scraper 28 fixed on rotating rod 26 continuously contacts and scrapes the inner wall of storage cylinder 14 as rotating rod 26, preventing molding compound from clumping and remaining on the cylinder wall, ensuring that the molding compound in storage cylinder 14 always maintains good fluidity.

[0057] The triple action of stirring by the rotating plate 27, cleaning of the rotating plate 27 by the U-shaped scraper 32, and cleaning of the cylinder wall by the L-shaped scraper 28 effectively prevents the molding compound from clumping in the temporary storage container. Continuous stirring and scraping help to disperse the air mixed in with the molding compound, reduce the formation of bubbles, and enhance the reliability and stability of the package.

[0058] Example 5:

[0059] Based on the above embodiment 4, such as Figure 3 , Figure 6As shown, a discharge pipe 17 is fixedly installed at the discharge port. The discharge pipe 17 passes through the mounting plate 13. The lower end of the discharge pipe 17 is connected to a corrugated pipe 34. The lower end of the corrugated pipe 34 is connected to an output pipe 35. A linear drive component 33 is fixedly installed on the lower surface of the mounting plate 13. The lower output end of the linear drive component 33 is fixedly connected to a hollow pipe 37. The other end of the output pipe 35 is fixedly connected to the hollow pipe 37. A filter screen 36 is installed at the junction of the output pipe 35 and the hollow pipe 37. An upper mold assembly 21 is connected to the lower end of the hollow pipe 37. A lower mold assembly 19 is installed on the lower side of the upper mold assembly 21. A fixing block 20 is installed on the lower side of the mounting plate 13. The lower mold assembly 19 is installed on the fixing block 20.

[0060] The working principle and beneficial effects of the above technical solution are as follows: During molding, the molding material is fed into the hollow tube 37 through the outlet, outlet pipe 17, corrugated pipe 34 and output pipe 35 via an external delivery pump (pressure pump). When flowing through the filter screen 36, particulate impurities or incompletely melted clumps are intercepted, ensuring the purity of the molding material entering the subsequent mold assembly. Then, it enters the cavity of the lower mold assembly 19 through the upper mold assembly 21. The corrugated pipe 34 allows the hollow tube 37 to be flexibly adjusted in height to adapt to the mold closing requirements of different mold specifications, improving the versatility of the device. The filter screen 36 effectively intercepts impurities and reduces air bubbles, preventing them from entering the molding layer and causing poor local heat dissipation or decreased mechanical properties, thus effectively improving the yield rate.

[0061] Example 6:

[0062] Based on the above embodiment 5, such as Figures 3-4 , Figures 7-8 As shown, electric push rods 16 are symmetrically fixed on the mounting plate 13. A push rod 23 is fixedly connected to the lower output end of the electric push rod 16. The push rod 23 slides through the mounting plate 13. A U-shaped block 18 is fixedly installed at the lower end of the push rod 23. The openings of the two U-shaped blocks 18 are opposite each other. The U-shaped blocks 18 are slidably connected to the support rod 22.

[0063] Preferably, a cooling box 25 is fixedly installed on one side of the two U-shaped blocks 18 that are close to each other. A drum 40 is rotatably installed inside the cooling box 25. A torsion spring is installed at the installation position of the drum 40 and the cooling box 25. An L-shaped connecting rod 42 is provided at the lower end of the U-shaped blocks 18. A cleaning box 41 is fixedly installed on one side of the L-shaped connecting rod 42 that are close to each other. Scrapers 46 are symmetrically installed on the upper and lower parts of the cleaning box 41.

[0064] Preferably, the lower end of the U-shaped block 18 is also provided with an L-shaped connecting rod 43, and a rotating cylinder 47 is rotatably provided on the side of the L-shaped connecting rod 43 that is close to each other; a motor 24 is fixedly provided at one end of the U-shaped block 18, and a threaded rod 45 is fixedly provided at the output end of the motor 24. The threaded rod 45 is rotatably connected to the U-shaped block 18, and a moving ring 44 is threadedly connected to the threaded rod 45. An L-shaped connecting rod 39 is provided on the moving ring 44, and a clamping block 38 is installed on the section of the L-shaped connecting rod 39 that is close to each other.

[0065] Cooling cotton is provided on the drum 40.

[0066] The roller 40, cleaning box 41, rotating drum 47 and clamping block 38 are arranged sequentially from right to left or from left to right.

[0067] The cooling box 25 is equipped with cooling blocks (similar to those in a refrigerator).

[0068] The working principle and beneficial effects of the above technical solution are as follows: The electric push rod 16 is activated, which drives the push rod 23 to move. The push rod 23 drives the U-shaped block 18 to slide downwards along the support rod 22. After reaching the designated position (the cooling cotton is positioned exactly on the upper end of the lower mold assembly 19), the motor 24 is activated. The motor 24 drives the threaded rod 45 to rotate, which in turn drives the moving ring 44 to move. The moving ring 44 then drives the L-shaped connecting rod 39 and the clamping block 38 to move (the clamping block 38 pre-clamps one end of the cooling cotton). The clamping block 38 drives the cooling cotton past the upper end of the lower mold assembly 19, thereby performing a certain process on the encapsulated chip. The cooling process involves multiple cooling methods (cooling is achieved by the downward movement of cold air, i.e., indirect cooling through heat conduction). The cooling cotton must not directly contact the encapsulated chip to prevent cracking of the encapsulating material due to alternating hot and cold temperatures. During its movement, the cooling cotton passes through two scrapers 46 and a rotating drum 47. When the motor 24 drives the threaded rod 45 to reset, the cooling cotton returns to the cooling box 25 under the action of a torsion spring. The scrapers 46 then remove any impurities or dust that may have adhered to the cooling cotton (e.g., through electrostatic adsorption). This integrated design of cooling, cleaning, and clamping functions replaces the traditional multi-device, step-by-step operation mode, resulting in better performance.

[0069] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention.

Claims

1. A packaging method for a multi-chip package structure, characterized in that, Includes the following steps: S1: A groove is formed in the center of the substrate (1), and the first chip (2) is flip-chip disposed in the groove. S2: Install TVC conversion board (5) on the first chip (2), symmetrically open through slots (4) on the TVC conversion board (5), and install conductive connectors (11) in the through slots (4). S3: A solder block (12) is provided on the conductive connector (11), and a flip-chip (6) is electrically connected to the solder block (12). S4: Install a third chip (7) on the second chip (6). The third chip (7) is electrically connected to the solder block (12) through conductive line one (8). The solder block (12) is electrically connected to the substrate (1) through conductive line two (9). S5: The substrate (1) is encapsulated using a molding device to form a molding layer covering the first chip (2), TVC conversion board (5), second chip (6) and third chip (7); The sealing device includes a mounting plate (13), a storage cylinder (14) is provided on the mounting plate (13), a number of support rods (22) are fixedly provided on the lower surface of the mounting plate (13), a motor (15) is fixedly provided on the upper end of the storage cylinder (14), a rotating rod (26) is fixedly connected to the lower output end of the motor (15), the rotating rod (26) rotates and extends into the storage cylinder (14), the rotating rod (26) is rotatably connected to the lower inner wall of the storage cylinder (14), a rotating plate (27) is fixedly provided on the rotating rod (26), and a discharge port is symmetrically opened at the lower end of the storage cylinder (14); The packaging structure includes a substrate (1), a groove is formed on the substrate (1), a first chip (2) is flip-chip disposed in the groove, a TVC conversion board (5) is disposed on the first chip (2), the TVC conversion board (5) is electrically connected to the first chip (2), a conductive connector (11) is disposed on the TVC conversion board (5), a second chip (6) is flip-chip disposed on the TVC conversion board (5), the second chip (6) is electrically connected to the conductive connector (11), a third chip (7) is mounted on the second chip (6), the third chip (7) is electrically connected to the conductive connector (11), and the conductive connector (11) is electrically connected to the substrate (1).

2. The packaging method for a multi-chip package structure according to claim 1, characterized in that, The top of the first chip (2) is provided with several solder balls (3), and the first chip (2) is flipped in the groove through several solder balls (3); the TVC conversion board (5) is symmetrically provided with through slots (4), and a conductive connector (11) is installed in the through slot (4). A solder block (12) is provided on the conductive connector (11), and the conductive connector (11) is electrically connected to the flipped second chip (6) through the solder block (12).

3. The packaging method for a multi-chip package structure according to claim 2, characterized in that, The second chip (6) is mounted with a third chip (7), and the third chip (7) is symmetrically provided with a first conductive line (8). The other end of the first conductive line (8) is electrically connected to the solder block (12). The solder block (12) is also provided with a second conductive line (9), which is electrically connected to the substrate (1). The TVC conversion board (5) is also coated with a BCB dielectric film (10). The substrate (1) is also provided with a plastic encapsulation layer.

4. The packaging method for a multi-chip package structure according to claim 1, characterized in that, A reciprocating screw (30) is symmetrically connected to the rotating rod (26). A gear (31) is fixedly installed at the other end of the reciprocating screw (30). An annular toothed plate (29) is fixedly installed on the inner wall of the storage cylinder (14). The gear (31) meshes with the annular toothed plate (29). A moving block is threadedly connected to the reciprocating screw (30). A U-shaped scraper (32) is fixedly installed at the lower end of the moving block. The U-shaped scraper (32) cooperates with the rotating plate (27). An L-shaped scraper (28) is also fixedly installed on the rotating rod (26). The L-shaped scraper (28) contacts the inner wall of the storage cylinder (14).

5. The packaging method for a multi-chip package structure according to claim 1, characterized in that, A discharge pipe (17) is fixedly installed at the discharge port. The discharge pipe (17) passes through the mounting plate (13). The lower end of the discharge pipe (17) is connected to a corrugated pipe (34). The lower end of the corrugated pipe (34) is connected to an output pipe (35). A linear drive component (33) is fixedly installed on the lower surface of the mounting plate (13). The lower output end of the linear drive component (33) is fixedly connected to a hollow pipe (37). The other end of the output pipe (35) is fixedly connected to the hollow pipe (37). A filter screen (36) is installed at the point where the output pipe (35) and the hollow pipe (37) pass through. An upper mold assembly (21) is connected to the lower end of the hollow pipe (37). A lower mold assembly (19) is installed on the lower side of the upper mold assembly (21). A fixing block (20) is installed on the lower side of the mounting plate (13). The lower mold assembly (19) is installed on the fixing block (20).

6. The packaging method for a multi-chip package structure according to claim 1, characterized in that, Electric push rods (16) are symmetrically fixed on the mounting plate (13). A push rod (23) is fixedly connected to the lower output end of the electric push rod (16). The push rod (23) slides through the mounting plate (13). A U-shaped block (18) is fixedly installed at the lower end of the push rod (23). The openings of the two U-shaped blocks (18) are opposite each other. The U-shaped blocks (18) are slidably connected to the support rod (22).

7. The packaging method for a multi-chip package structure according to claim 6, characterized in that, A cooling box (25) is fixedly installed on one side of the two U-shaped blocks (18) that are close to each other. A drum (40) is rotatably installed inside the cooling box (25). A torsion spring is installed at the installation position of the drum (40) and the cooling box (25). An L-shaped connecting rod (42) is installed at the lower end of the U-shaped block (18). A cleaning box (41) is fixedly installed on one side of the L-shaped connecting rod (42) that are close to each other. Scrapers (46) are symmetrically installed on the upper and lower sides of the cleaning box (41).

8. The packaging method for a multi-chip package structure according to claim 7, characterized in that, The lower end of the U-shaped block (18) is also provided with an L-shaped connecting rod two (43), and a rotating cylinder (47) is rotatably provided on the side of the L-shaped connecting rod two (43) that is close to each other; a motor three (24) is fixedly provided at one end of the U-shaped block (18), and a threaded rod (45) is fixedly provided at the output end of the motor three (24). The threaded rod (45) is rotatably connected to the U-shaped block (18), and a moving ring (44) is threadedly connected on the threaded rod (45). An L-shaped connecting rod three (39) is provided on the moving ring (44), and a clamping block (38) is installed on the section of the L-shaped connecting rod three (39) that is close to each other.

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