Power module and power equipment

CN120809714APending Publication Date: 2025-10-17HUAWEI DIGITAL POWER TECH CO LTD
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Patent Information

Application Number
CN202410430722.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-04-10
Publication Date
2025-10-17

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Abstract

The embodiment of the invention provides a power module and power equipment. The power module comprises a substrate structure and an interconnection structure which are stacked along a first direction. The substrate structure comprises a substrate and a power chip arranged on the substrate. The interconnection structure comprises a first power electrode, a second power electrode and an output electrode. At least part of the first power electrode, at least part of the second power electrode and at least part of the output electrode are stacked in the first direction and are insulated from one another. The first power electrode is used for being electrically connected with the power chip, the second power electrode is used for being electrically connected with the conductive layer of the substrate, and the output electrode is used for being electrically connected with the power chip and the conductive layer. The interconnection structure adopts a three-dimensional structural design, magnetic flux caused by a power loop link in the power module is partially counteracted, the mutual inductance of a power loop of the power module is enhanced, and then the mutual inductance counteracting effect of the power loop link is improved, so that the overall parasitic inductance of the power module is reduced.
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