Preparation method of conductive circuit

Abstract

The invention provides a preparation method of a conductive circuit. The preparation method comprises the following steps: S1, laying a release layer on one side of a base layer; s2, laying a copper layer on one side, far away from the base layer, of the release layer; s3, a hot melt adhesive layer is laid on the side, away from the release layer, of the copper layer, and a copper-plated film is obtained; and S4, after the side, provided with the hot melt adhesive, of the copper-plated film is bonded to a base material through hot stamping, the release layer and the base layer are removed, and the conductive circuit is obtained. By optimizing the process steps, the problems of environmental pollution, material waste and process complexity in the traditional photoetching method are avoided.

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