Heat dissipation device based on phase change heat storage and active heat dissipation and intelligent watch

CN120812892APending Publication Date: 2025-10-17GUANGDONG TECHN COLLEGE OF WATER RESOURCES & ELECTRIC ENG
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Patent Information

Application Number
CN202510818178.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-06-18
Publication Date
2025-10-17

AI Technical Summary

Technical Problem

In the existing technology, the heat dissipation device of smartwatches has problems such as low thermal conductivity, long thermal response time, decay of heat storage capacity of phase change material during long-term use, high fan power consumption, and electromagnetic interference affecting sensor accuracy.

Method used

A composite phase change thermal storage material layer consisting of hydrophilic modified graphene, dipotassium hydrogen phosphate dodecahydrate, and disodium hydrogen phosphate trihydrate is used, combined with multiple heat dissipation fins and a fan. A circulating heat dissipation system is formed through a thermal interface material coating and heat exchange pores, and the fan controls the airflow circulation for cooling.

Benefits of technology

It improves thermal conductivity and long-term reliability, reduces chip temperature, extends battery life, ensures sensor accuracy, reduces internal component aging, and enhances user comfort.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to the technical field of heat conduction temperature control, in particular to a heat dissipation device based on phase change heat storage and active heat dissipation and an intelligent watch. The device comprises a shell, a mainboard layer, a phase change heat storage material layer, cooling fins, a fan and a temperature sensor. Wherein the mainboard layer is fixedly connected with the shell, the phase change heat storage material layer is arranged below the mainboard layer, the multiple heat dissipation fins are connected with the phase change heat storage material layer, the fan is arranged below the multiple heat dissipation fins and connected with the shell, the fan is in communication connection with the mainboard layer, and the temperature sensor is in communication connection with the mainboard layer. Wherein a plurality of heat exchange holes are formed in the portion, between the main board layer and the phase change heat storage material layer, of the shell, and a thermal interface material coating is arranged on the phase change heat storage material layer. The device can keep the heat storage capacity of the phase change material in long-term use, and the heat conduction efficiency, the energy consumption control and the long-term reliability are improved.
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