A laser battery assembly based on micro-channel heat dissipation

Abstract

The application discloses a laser battery assembly based on micro-channel heat dissipation, which comprises a laser battery array composed of a plurality of laser battery monomers attached to a substrate, a protective layer fixedly arranged above the laser battery array, a micro-channel heat sink arranged below the laser battery array and attached to a first surface of the laser battery array, and a power management system fixedly arranged on a second surface of the micro-channel heat sink, wherein the laser battery array is electrically connected to the power management system through a pluggable component. The application has the advantages of compact structure, high heat dissipation efficiency and easy maintenance.

Description

Technical Field

[0001] This invention relates to the field of laser batteries, and in particular to a laser battery assembly based on microfluidic heat dissipation. Background Technology

[0002] With the development of photovoltaic technology, the manufacturing technology of laser cells has matured. However, in long-distance energy transfer applications such as remote charging for drones and space-based solar power stations, the lasers received by laser cells are generally high-power and large-area. Therefore, designing a reasonably large-area laser cell array is crucial to ensure efficient energy conversion. Secondly, large-area, high-power lasers generate a significant amount of heat. One of the drawbacks of laser cells is their significant temperature effect; their output power gradually decreases as the operating temperature rises. Currently, commonly used laser cell heat sinks are small-area, making it essential to design a microchannel heat sink that matches the size of the laser cell array. Furthermore, in traditional laser cell conversion circuits, the laser cell solder strips are typically soldered to the circuit board, making it difficult to replace series-parallel designs.

[0003] The statements herein provide only background information in relation to this invention and do not necessarily constitute prior art. Summary of the Invention

[0004] The purpose of this invention is to provide a laser battery assembly based on microfluidic heat dissipation, so as to reduce the temperature of the laser battery assembly during operation, and at the same time reduce the difficulty of replacing the series and parallel boards, and realize convenient replacement of the series and parallel design.

[0005] To achieve the above objectives, the present invention provides a laser battery assembly based on microchannel heat dissipation, comprising: a laser battery array composed of multiple laser battery cells attached to a substrate; a protective layer fixedly covering the laser battery array; a microchannel heat sink disposed below the laser battery array and attached to the laser battery array on a first side facing the laser battery array; and a power management system fixedly disposed on a second side of the microchannel heat sink; the laser battery array is electrically connected to the power management system via a pluggable component.

[0006] Optionally, the microchannel radiator includes an inlet, an outlet, and multiple parallel channels, with the inlet and outlet connected to the inlet and outlet of the chiller, respectively.

[0007] Optionally, the width of each flow channel ranges from 50 μm to 200 μm.

[0008] Optionally, the pluggable component includes: a welding plate having multiple welding slots for connecting welding strips led out from the laser cell; a first wire having a first end and a second end, the first end being connected to the welding slots and the second end being connected to an adapter plate; the adapter plate having a pluggable wiring slot; and a series-parallel connection plate connected to the pluggable wiring slot via a second wire, both ends of the second wire being pluggable interfaces for replacing the series-parallel connection plate.

[0009] Optionally, multiple welding slots are connected in series and then connected to the first end of the first wire.

[0010] Optionally, the laser cell array adopts a hybrid layout of multi-sized laser cell units, wherein the size of the laser cell unit includes at least two of the following: 1cm×1cm, 2cm×2cm, and 3cm×4cm.

[0011] Optionally, the protective layer, the laser battery array, and the microchannel heat sink are each provided with a first mounting hole, and the positions of each first mounting hole are corresponding. A first fastener passes through each first mounting hole to fix the protective layer, the laser battery array, and the microchannel heat sink in place.

[0012] Optionally, the laser battery array and the microchannel heat sink are further provided with a second mounting hole that is opposite to the first mounting hole. The second mounting hole is offset from the first mounting hole, and the second fastener passes through the second mounting hole to fix the laser battery array and the microchannel heat sink together.

[0013] Optionally, the protective layer is a cover plate with a cavity formed from a transparent acrylic sheet.

[0014] Optionally, the power management system is an MPPT circuit board for partitioned management of the laser battery array.

[0015] Compared with existing technologies, the laser battery assembly based on microfluidic heat dissipation provided by this invention achieves integrated heat dissipation of the laser battery array and power management system by setting up a microfluidic heat sink. Furthermore, the series-parallel circuit board is easily replaceable by using a pluggable component replacement welding method, enabling the series-parallel circuit to be replaced at any time. At the same time, this invention also has the advantages of compact structure, high heat dissipation efficiency, and easy maintenance. Attached Figure Description

[0016] Figure 1 A side view of a laser battery assembly based on microchannel heat dissipation; Figure 2 A top view of the laser cell array in a laser cell assembly based on microchannel heat dissipation; Figure 3A cross-sectional view of a microchannel heat sink in a laser battery assembly based on microchannel heat dissipation; Figure 4 A front view of a microchannel heat sink in a laser battery assembly based on microchannel heat dissipation; Figure 5 A schematic diagram of the pluggable component in a laser battery assembly based on microfluidic heat dissipation; Figure 6 This is a schematic diagram of the protective layer in a laser battery assembly based on microfluidic heat dissipation. Detailed Implementation

[0017] The laser battery assembly based on microchannel heat dissipation proposed in this invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of this invention will become clearer from the following description. It should be noted that the drawings are in a very simplified form and use non-precise proportions, only for the purpose of conveniently and clearly illustrating the embodiments of this invention. Please refer to the drawings to make the objectives, features, and advantages of this invention more apparent and understandable. It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the implementation conditions of this invention. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportional relationships, or adjustments to the size, without affecting the effects and objectives achieved by this invention, should still fall within the scope of the technical content disclosed in this invention.

[0018] To reduce the operating temperature of the laser battery assembly and facilitate replacement of series-parallel designs, such as Figure 1 As shown, an embodiment of the present invention provides a laser battery assembly 100 based on microfluidic heat dissipation. The laser battery assembly 100 includes: a laser battery array 102, which is composed of multiple laser battery cells 121 attached to a substrate; a protective layer 101, which is fixedly disposed above the laser battery array 102; a microfluidic heat sink 103, which is disposed below the laser battery array 102 and is attached to the laser battery array on its first side facing the laser battery array 102, for removing heat generated by the laser battery array 102 when in operation, thereby reducing the operating temperature of the laser battery array 102; and a power management system 105, which is fixedly disposed on the second side of the microfluidic heat sink 103. The laser battery array 102 is electrically connected to the power management system 105 through a pluggable component 104. By using the pluggable component 104 to replace the soldering method, the series-parallel circuit board used to realize the series-parallel design of the laser battery array is easier to replace, and the series-parallel circuit can be replaced at any time, improving the control of the laser battery array.

[0019] Among them, such as Figure 2 As shown, since the laser cell unit has a rectangular structure, in order to improve the array coverage, the laser cell array 102 adopts a hybrid layout of laser cell units 121 with multiple sizes. The size of the laser cell unit 121 includes at least two of the following: 1cm×1cm, 2cm×2cm, and 3cm×4cm. For example... Figure 2 The central laser cell unit 121 measures 3cm x 4cm. Figure 2 The edge laser unit 121 adopts a size of 1cm×1cm, and the single-cell spacing is designed to be about 1mm. While ensuring reliability, it increases the cell coverage of the laser cell module 100, while reducing welding process losses and substrate processing difficulty, and greatly increasing the area of ​​the module that receives lasers.

[0020] Among them, such as Figure 1 , Figure 4 and Figure 6 As shown, the protective layer 101, the laser cell array 102, and the microchannel heat sink 103 are all provided with first mounting holes. The positions of each first mounting hole correspond to the others. A first fixing member 151 passes through each first mounting hole to fix the protective layer 101, the laser cell array 102, and the microchannel heat sink 103 together. Specifically, as... Figure 6 As shown, the protective layer 101 is a cover plate with a cavity 111 formed from a transparent acrylic sheet. The cavity 111 is used to accommodate the laser battery array 102. The edge of the cover plate 111 is provided with a first mounting hole 112.

[0021] Furthermore, such as Figure 4 As shown, the laser battery array 102 and the microchannel heat sink 103 are provided with nine evenly distributed through holes. The through holes at the four corners are first mounting holes 134, corresponding to the first mounting holes 112 on the edge of the cover plate 111. The remaining through holes are second mounting holes 135, which are offset from the first mounting holes 134. A first fixing member 151 passes through the first mounting holes on the protective layer 101, the laser battery array 102, and the microchannel heat sink 103 in sequence, fixing them together. A second fixing member 106 passes through the second mounting holes 135 to fix the laser battery array 102 and the microchannel heat sink 103 together, improving the connection stability. If the laser battery array 102 is damaged, it can be directly disassembled, replaced with a new laser battery array 102, and reinstalled, resulting in low maintenance costs.

[0022] It should be noted that the first and second mounting holes of the microchannel radiator 103 are grooves and do not penetrate into the flow channel of the microchannel radiator 103, so there is no risk of cooling fluid leakage.

[0023] Among them, such as Figure 3 As shown, the microchannel radiator 103 adopts a parallel channel layout design. Specifically, the microchannel radiator 103 includes an inlet 131, an outlet 132, and multiple parallel channels 133. The inlet 131 and the outlet 132 are respectively connected to the inlet and outlet of a chiller (not shown in the figure). As an optional embodiment, the width of each channel 133 ranges from 50 μm to 200 μm. Due to the small size of the channel 133, the cooling fluid (e.g., cooling water) is more likely to enter a laminar flow state. In laminar flow, the flow of the cooling fluid is more regular, which is conducive to the orderly transfer of heat. The microchannel radiator 103 with parallel channel layout design is composed of a large number of closely arranged microchannels 133. Due to the large number and small spacing of the microchannels 133, the contact area between the radiator and the cooling fluid is greatly increased, which greatly improves the rate of heat transfer from the solid surface to the cooling fluid, resulting in better heat dissipation efficiency.

[0024] To achieve pluggable laser cell arrays, such as Figure 1 and 5 As shown, the pluggable component 104 includes: a welding plate 141 with multiple welding slots 1411, each laser cell 121 having positive and negative electrode solder strips 122 leading out, the solder strips 122 bypassing the microchannel heat sink 103 and connecting to the welding plate 141, the welding slots 1411 being used to connect the solder strips 122 leading out from the laser cell 121; a first wire 142, including a first end and a second end, the first end being connected to the welding slots 1411, and the second end being connected to an adapter plate 143; the adapter plate 143 having a pluggable wiring slot 1431; and a series-parallel connection plate 145, which is connected to the pluggable wiring slot 1431 via a second wire 144, both ends of the second wire 144 being pluggable interfaces for replacing the series-parallel connection plate 145. When the series-parallel design of the laser cell array 102 changes, it needs to be replaced by replacing the series-parallel board 145. Since both ends of the second wire 144 are pluggable interfaces, compared with soldering, only the second wire 144 needs to be plugged in and unplugged to replace the series-parallel board 145, which helps to improve the efficiency of changing the series-parallel design.

[0025] In this embodiment, as Figure 5As shown, multiple welding slots 1411 are connected in series and then connected to the first end of the first wire 142, which can reduce the number of first wires 142 and reduce the structural complexity of the laser battery assembly. As an optional embodiment, the power management system 105 is an MPPT (maximum power point tracking) circuit board to perform zoned management of the laser battery array 102. The MPPT circuit board detects the output voltage and current of the laser battery array 102 in real time through a DC / DC converter circuit, calculates the power, and adjusts the duty cycle according to changes in environmental conditions, changes the equivalent impedance of the load, so that the operating voltage of the laser battery array 102 is close to the maximum power point voltage, thereby achieving maximum power output and realizing maximum power tracking and stable control of energy.

[0026] In summary, the laser battery assembly based on microfluidic heat dissipation provided by the present invention achieves integrated heat dissipation of the laser battery array 102 and the power management system 105 by setting up a microfluidic heat sink 103; furthermore, by replacing the welding method with pluggable component 104, the series-parallel board 145 is easy to replace, realizing the ability to replace the series-parallel circuit at any time. At the same time, the present invention also has the advantages of compact structure, high heat dissipation efficiency and easy maintenance.

[0027] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0028] In the description of this invention, it should be understood that the terms "center," "height," "thickness," "upper," "lower," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0029] In the description of this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0030] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0031] Although the present invention has been described in detail through the preferred embodiments above, it should be understood that the above description should not be considered as a limitation of the present invention. Various modifications and substitutions to the present invention will be apparent to those skilled in the art after reading the above description. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims

1. A laser battery assembly based on microfluidic heat dissipation, characterized in that, include: A laser cell array, which consists of multiple laser cell units attached to a substrate; A protective layer is fixedly installed above the laser cell array; A microchannel heat sink is disposed below the laser cell array, and its first side facing the laser cell array is in contact with the laser cell array; A power management system is fixedly installed on the second side of the microchannel heat sink; The laser battery array is electrically connected to the power management system via a pluggable component; The pluggable component includes: A welding plate having multiple welding slots for connecting welding strips drawn from the laser cell; The first conductor includes a first end and a second end, the first end being connected to the welding groove and the second end being connected to the adapter plate; the adapter plate is provided with a pluggable wiring groove. The series-parallel connection board is connected to the pluggable wiring slot via a second wire, both ends of which are pluggable interfaces to facilitate replacement of the series-parallel connection board.

2. The laser battery assembly based on microchannel heat dissipation as described in claim 1, characterized in that, The microchannel radiator includes an inlet, an outlet, and multiple parallel channels. The inlet and outlet are connected to the inlet and outlet of the chiller, respectively.

3. The laser battery assembly based on microchannel heat dissipation as described in claim 2, characterized in that, The width of each of the aforementioned channels ranges from 50 μm to 200 μm.

4. The laser battery assembly based on microchannel heat dissipation as described in claim 1, characterized in that, The multiple welding slots are connected in series and then connected to the first end of the first wire.

5. The laser battery assembly based on microchannel heat dissipation as described in claim 1, characterized in that, The laser cell array adopts a hybrid layout of multiple-sized laser cell units, and the size of the laser cell unit includes at least two of the following: 1cm×1cm, 2cm×2cm, and 3cm×4cm.

6. The laser battery assembly based on microchannel heat dissipation as described in claim 1, characterized in that, The protective layer, the laser battery array, and the microchannel heat sink are all provided with first mounting holes, and the positions of each first mounting hole are corresponding. A first fastener passes through each first mounting hole to fix the protective layer, the laser battery array, and the microchannel heat sink in place.

7. The laser battery assembly based on microchannel heat dissipation as described in claim 6, characterized in that, The laser battery array and the microchannel heat sink are also provided with a second mounting hole that is opposite to the first mounting hole. The second mounting hole is offset from the first mounting hole, and the second fastener passes through the second mounting hole to fix the laser battery array and the microchannel heat sink in place.

8. The laser battery assembly based on microchannel heat dissipation as described in claim 1, characterized in that, The protective layer is a cover plate with cavities formed from a transparent acrylic sheet.

9. The laser battery assembly based on microchannel heat dissipation as described in claim 1, characterized in that, The power management system is an MPPT circuit board used to manage the laser battery array in zones.

Images